CN100539145C - 电阻电路 - Google Patents
电阻电路 Download PDFInfo
- Publication number
- CN100539145C CN100539145C CNB2005100885612A CN200510088561A CN100539145C CN 100539145 C CN100539145 C CN 100539145C CN B2005100885612 A CNB2005100885612 A CN B2005100885612A CN 200510088561 A CN200510088561 A CN 200510088561A CN 100539145 C CN100539145 C CN 100539145C
- Authority
- CN
- China
- Prior art keywords
- resistor
- metal line
- resistance circuit
- district
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012535 impurity Substances 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 33
- 229920005591 polysilicon Polymers 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/40—Resistors
- H10D1/47—Resistors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
- Y10S257/904—FET configuration adapted for use as static memory cell with passive components,, e.g. polysilicon resistors
Landscapes
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004228587A JP4723827B2 (ja) | 2004-08-04 | 2004-08-04 | 抵抗回路 |
| JP228587/04 | 2004-08-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1734768A CN1734768A (zh) | 2006-02-15 |
| CN100539145C true CN100539145C (zh) | 2009-09-09 |
Family
ID=35756603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100885612A Expired - Fee Related CN100539145C (zh) | 2004-08-04 | 2005-08-04 | 电阻电路 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7485933B2 (https=) |
| JP (1) | JP4723827B2 (https=) |
| CN (1) | CN100539145C (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6956277B1 (en) * | 2004-03-23 | 2005-10-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Diode junction poly fuse |
| US7616089B2 (en) * | 2007-09-28 | 2009-11-10 | Cirrus Logic, Inc. | Compensation of field effect on polycrystalline resistors |
| JP2010182954A (ja) * | 2009-02-06 | 2010-08-19 | Seiko Instruments Inc | 半導体装置 |
| US9825141B2 (en) | 2015-05-26 | 2017-11-21 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Three dimensional monolithic LDMOS transistor |
| JP6764692B2 (ja) * | 2016-05-24 | 2020-10-07 | Koa株式会社 | シャント抵抗器およびシャント抵抗器の実装構造 |
| JP7361567B2 (ja) * | 2019-10-25 | 2023-10-16 | ローム株式会社 | 電子部品 |
| KR102747221B1 (ko) * | 2020-11-30 | 2024-12-31 | 삼성전기주식회사 | 칩 저항기 |
| JP7732354B2 (ja) * | 2021-12-28 | 2025-09-02 | 富士電機株式会社 | 半導体装置 |
| CN117810223B (zh) * | 2024-02-29 | 2024-05-10 | 成都本原聚能科技有限公司 | 一种多晶硅电阻电路、制备方法及音频差分电路 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2864576B2 (ja) * | 1988-11-22 | 1999-03-03 | セイコーエプソン株式会社 | 半導体装置 |
| JP2664793B2 (ja) * | 1990-04-06 | 1997-10-22 | 株式会社東芝 | 半導体装置の製造方法 |
| JPH0669427A (ja) * | 1992-08-17 | 1994-03-11 | Nec Corp | 半導体集積装置 |
| JPH06188371A (ja) * | 1992-12-21 | 1994-07-08 | Hitachi Ltd | 半導体集積回路装置 |
| JP3526701B2 (ja) * | 1995-08-24 | 2004-05-17 | セイコーインスツルメンツ株式会社 | 半導体装置 |
| JPH09289290A (ja) * | 1996-04-19 | 1997-11-04 | S I I R D Center:Kk | 半導体装置 |
-
2004
- 2004-08-04 JP JP2004228587A patent/JP4723827B2/ja not_active Expired - Lifetime
-
2005
- 2005-07-29 US US11/193,837 patent/US7485933B2/en not_active Expired - Fee Related
- 2005-08-04 CN CNB2005100885612A patent/CN100539145C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1734768A (zh) | 2006-02-15 |
| US7485933B2 (en) | 2009-02-03 |
| JP2006049581A (ja) | 2006-02-16 |
| JP4723827B2 (ja) | 2011-07-13 |
| US20060027894A1 (en) | 2006-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160317 Address after: Chiba County, Japan Patentee after: SEIKO INSTR INC Address before: Chiba County, Japan Patentee before: Seiko Instruments Inc. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Chiba County, Japan Patentee after: EPPs Lingke Co. Ltd. Address before: Chiba County, Japan Patentee before: SEIKO INSTR INC |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20200804 |