CN100521126C - 具有碳纳米管基填料的集成电路芯片配置 - Google Patents

具有碳纳米管基填料的集成电路芯片配置 Download PDF

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Publication number
CN100521126C
CN100521126C CNB2005800456738A CN200580045673A CN100521126C CN 100521126 C CN100521126 C CN 100521126C CN B2005800456738 A CNB2005800456738 A CN B2005800456738A CN 200580045673 A CN200580045673 A CN 200580045673A CN 100521126 C CN100521126 C CN 100521126C
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CN
China
Prior art keywords
integrated circuit
circuit chip
carbon nanotube
arrangement
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB2005800456738A
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English (en)
Chinese (zh)
Other versions
CN101095219A (zh
Inventor
克里斯·怀兰德
亨德里克斯·约翰尼斯·乔卡巴斯·托仑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
NXP BV
Koninklijke Philips Electronics NV
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Publication of CN101095219A publication Critical patent/CN101095219A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CNB2005800456738A 2004-11-04 2005-11-04 具有碳纳米管基填料的集成电路芯片配置 Expired - Lifetime CN100521126C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62545204P 2004-11-04 2004-11-04
US60/625,452 2004-11-04

Publications (2)

Publication Number Publication Date
CN101095219A CN101095219A (zh) 2007-12-26
CN100521126C true CN100521126C (zh) 2009-07-29

Family

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Family Applications (1)

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CNB2005800456738A Expired - Lifetime CN100521126C (zh) 2004-11-04 2005-11-04 具有碳纳米管基填料的集成电路芯片配置

Country Status (7)

Country Link
US (1) US20110156255A1 (https=)
EP (2) EP1810324A1 (https=)
JP (1) JP4901745B2 (https=)
KR (1) KR101183754B1 (https=)
CN (1) CN100521126C (https=)
TW (1) TWI393226B (https=)
WO (1) WO2006048844A1 (https=)

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US20070145097A1 (en) 2005-12-20 2007-06-28 Intel Corporation Carbon nanotubes solder composite for high performance interconnect
US7781260B2 (en) * 2007-09-11 2010-08-24 Intel Corporation Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
US9041228B2 (en) 2008-12-23 2015-05-26 Micron Technology, Inc. Molding compound including a carbon nano-tube dispersion
JP4913853B2 (ja) * 2009-08-31 2012-04-11 Ｓｍｋ株式会社 微細コネクタ
US20110309481A1 (en) * 2010-06-18 2011-12-22 Rui Huang Integrated circuit packaging system with flip chip mounting and method of manufacture thereof
TWI452960B (zh) * 2010-11-25 2014-09-11 光宏精密股份有限公司 具有熱傳導性質的模塑互連組件及其製造方法
CN103311195A (zh) * 2012-03-15 2013-09-18 南亚科技股份有限公司 散热结构
US20150045478A1 (en) * 2012-03-21 2015-02-12 Applied Nanotech Holdings, Inc. Polymer Composites with Silicon Dioxide Particles
US9321245B2 (en) 2013-06-24 2016-04-26 Globalfoundries Inc. Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion
US20170141007A1 (en) * 2015-11-17 2017-05-18 Advanced Semiconductor Engineering, Inc. Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages
US20250364360A1 (en) * 2024-05-23 2025-11-27 Micron Technology, Inc. Method of forming stacked semiconductor devices with carbon nanofiber structures and associated systems and methods

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EP1186689A1 (en) * 2000-09-12 2002-03-13 Polymatech Co., Ltd. Thermally conductive polymer composition and thermally conductive molded article
EP1256856A2 (en) * 2001-05-11 2002-11-13 Seiko Instruments Inc. Composite main plate structure and electronic timepiece using the same
EP1384567A1 (en) * 2002-07-22 2004-01-28 Polymatech Co., Ltd. Thermally conductive polymer molded article and method for producing the same
US20040110010A1 (en) * 2002-12-05 2004-06-10 Buchwalter Stephen Leslie Reworkable b-stageable adhesive and use in waferlevel underfill
US20040122153A1 (en) * 2002-12-20 2004-06-24 Hua Guo Thermoset composite composition, method, and article

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US6156256A (en) * 1998-05-13 2000-12-05 Applied Sciences, Inc. Plasma catalysis of carbon nanofibers
EP1186689A1 (en) * 2000-09-12 2002-03-13 Polymatech Co., Ltd. Thermally conductive polymer composition and thermally conductive molded article
EP1256856A2 (en) * 2001-05-11 2002-11-13 Seiko Instruments Inc. Composite main plate structure and electronic timepiece using the same
EP1384567A1 (en) * 2002-07-22 2004-01-28 Polymatech Co., Ltd. Thermally conductive polymer molded article and method for producing the same
US20040110010A1 (en) * 2002-12-05 2004-06-10 Buchwalter Stephen Leslie Reworkable b-stageable adhesive and use in waferlevel underfill
US20040122153A1 (en) * 2002-12-20 2004-06-24 Hua Guo Thermoset composite composition, method, and article

Also Published As

Publication number Publication date
CN101095219A (zh) 2007-12-26
KR20070084429A (ko) 2007-08-24
JP2008519453A (ja) 2008-06-05
US20110156255A1 (en) 2011-06-30
WO2006048844A1 (en) 2006-05-11
EP2302669A1 (en) 2011-03-30
TW200633158A (en) 2006-09-16
TWI393226B (zh) 2013-04-11
JP4901745B2 (ja) 2012-03-21
EP1810324A1 (en) 2007-07-25
KR101183754B1 (ko) 2012-09-17

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