CN104810360A - 电源模块封装以及制造电源模块封装的方法 - Google Patents

电源模块封装以及制造电源模块封装的方法 Download PDF

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CN104810360A
CN104810360A CN201410405979.0A CN201410405979A CN104810360A CN 104810360 A CN104810360 A CN 104810360A CN 201410405979 A CN201410405979 A CN 201410405979A CN 104810360 A CN104810360 A CN 104810360A
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Prior art keywords
resin bed
lead frame
power module
glycidyl ether
conducting strip
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CN201410405979.0A
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金洸洙
蔡埈锡
郭煐熏
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of CN104810360A publication Critical patent/CN104810360A/zh
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Abstract

本发明公开了一种电源模块封装和制造该电源模块封装的方法。根据本发明的优选实施方式，所述电源模块封装包括：引线框架，该引线框架上安装有电源装置和与所述电源装置电连接且控制所述电源装置的控制集成电路；和导热片，该导热片粘接在所述引线框架的一个表面上，其中，所述导热片包括第一树脂层和第二树脂层以及散热装置，所述第一树脂层和第二树脂层包括热导性的无机填料并且添加有苯基缩水甘油醚(PGE)和烷基缩水甘油醚(烷基(C12-C14)缩水甘油醚)的混合物，且金属材料的所述散热装置布置在所述第一树脂层和第二树脂层之间形成的接合界面处。因此，通过散热装置导致的散热效果可容易地提高电源模块封装的热性能。

Description

电源模块封装以及制造电源模块封装的方法
相关申请的交叉引用
本申请要求申请日为2014年1月28日，名称为“电源模块封装以及制造电源模块封装的方法(Power Module Package and Method of Manufacturing the Same)”的韩国专利申请10-2014-0010456的优先权，该申请在此通过引用全部合并于本申请。
技术领域
本发明涉及一种电源模块封装以及制造该电源模块封装的方法。
背景技术
通常，电源模块是一种安装在引线框架上的电子元件，其已经采用一种结构，在该结构中，电源装置和控制集成电路(control IC)相对固定然后模塑封装。因此，由于电源装置的散热主要通过引线框架来实现，并且环氧模塑封装材料(EMC)的导热性低，电源模块所要求的热性能可能不能满足。
同时，根据专利文件1公布的电源模块封装，专利文件1公开了可通过在引线框架上粘接陶瓷基片来提高电源模块封装的热性能。然而，该结构的问题是所有的装置都安装在引线框架上，所以热性能被限制并且热性能完全依赖于陶瓷基片的热性能。即，由于材料性能，陶瓷基片的可用厚度受到限制。
另一方面，根据专利文件2公布的电源模块封装，专利文件2公开了装置被固定在具有优异热性能的直接覆铜(DBC)基板上以实现高散热性。但是，DBC基板通常比热基板更昂贵，因此，DBC基板的价格与热性能的改进成比例提高。
[现有技术文件]
[专利文件]
专利文件1：KR2002-0095053A
专利文件2：KR2006-0017711A
发明内容
本发明致力于提高电源模块的热性能，以提高电源模块的效率和可靠性。
另外，本发明致力于提供一种能够容易地提高热性能的电源模块封装。
除此之外，本发明致力于提供一种制造电源模块封装的方法，该方法中可应用嵌入工艺(in-line process)。
根据本发明的优选实施方式，提供一种电源模块封装，包括：引线框架，该引线框架上安装有电源装置和与所述电源装置电连接且控制所述电源装置的控制集成电路；和导热片，该导热片粘接在所述引线框架的一个表面上，其中，所述导热片包括第一树脂层和第二树脂层以及散热装置，所述第一树脂层和第二树脂层包括热导性的无机填料并且添加有苯基缩水甘油醚(PGE)和烷基缩水甘油醚(烷基(C12至C14)缩水甘油醚)的混合物，且金属材料的所述散热装置布置在所述第一树脂层和第二树脂层之间形成的接合界面处。
所述无机填料可选自下述物质：氧化铝(Al2O3)、氮化铝(AlN)、氮化硅(SiN)、二氧化硅(SiO2)、碳化硅(SiC)，或者上述物质的组合。
所述混合物可包括由苯基缩水甘油醚和烷基缩水甘油醚以2：1的混合比混合成的混合物。
所述散热装置可包括金属丝、金属管或金属网。
所述电源模块封装可进一步包括：金属层，该金属层设置在所述导热片 的一个表面。
所述电源模块封装可进一步包括：封装部，该封装部通过模塑所述电源装置、所述控制集成电路、所述引线框架和所述导热片以使所述金属层的一个表面和所述引线框架的端头暴露于外部而形成。
根据本发明的另一个优选实施方式，提供一种制造电源模块封装的方法，包括：(a)准备第一树脂层，所述第一树脂层包括热传导性的无机填料，并且加入苯基缩水甘油醚(PGE)和烷基缩水甘油醚(烷基(C12-C14)缩水甘油醚)的混合物；(b)将由金属材料制成的散热装置布置在所述第一树脂层的一个表面；(c)在所述散热装置的一个表面布置第二树脂层，所述第二树脂层包括热传导性的无机填料，并且加入苯基缩水甘油醚(PGE)和烷基缩水甘油醚(烷基(C12-C14)缩水甘油醚)的混合物；(d)对所述第一树脂层和所述第二树脂层进行层压，以压紧和粘合所述第一树脂层和所述第二树脂层；(e)将电源装置和控制集成电路安装到引线框架上，通过粘合所述第一树脂层和所述第二树脂层形成的导热片粘接在所述引线框架的一个表面，并且通过引线连接所述引线框架、所述电源装置和所述控制集成电路；(f)将所述导热片设置在所述引线框架的一个表面，并在所述导热片的一个表面设置金属箔；以及(g)用环氧模塑封装材料进行封装，以使所述金属箔的一个表面和所述引线框架的端头暴露于外部。
所述无机填料可选自下述物质：氧化铝(Al2O3)、氮化铝(AlN)、氮化硅(SiN)、二氧化硅(SiO2)、碳化硅(SiC)，或者上述物质的组合。
所述混合物可包括由苯基缩水甘油醚和烷基缩水甘油醚以2：1的混合比混合成的混合物。
所述散热装置可包括金属丝、金属管或金属网。
附图说明
本发明的上述和其他目的，特征和优点将通过以下结合附图的详细说明来更清楚地理解，其中：
图1是根据本发明的优选实施方式的电源模块封装的剖视图；
图2是所述电源模块封装沿线A-A’的剖视图；
图3是根据本发明的优选实施方式的导热片的局部放大剖视图；
图4和图5是图3中的线B-B’的平面图；
图6至图11是根据本发明的优选实施方式的连续说明电源模块封装的制造工序的剖视图。
图12是显示根据金属管或金属网厚度的导热片的导热率的曲线图。
图13是显示根据加入的混合物的树脂和金属之间粘接强度的曲线图。
具体实施方式
本发明的目的、特征和优点将从以下结合附图对优选实施方式进行的详细描述中更清楚地理解。在所有附图中，相同的参考数字用于标示相同或者相似的部件，并且省略其多余的描述。另外，在下面的描述中，术语“第一”、“第二”、“一侧”、“另一侧”等用于将某一部件与其他部件区分，但是这样的部件的构造不应解释为受术语限制。另外，在本发明的描述中，当确定相关技术的详细描述会混淆本发明的主旨时，将省略该描述。
在下文中，本发明的优选实施方式将参照附图详细描述。
根据本发明的优选实施方式的电源模块封装包括：引线框架和导热片，所述引线框架上安装有电源装置和控制集成电路，所述导热片粘接在所述引线框架的一个表面，其中，所述导热片包括第一树脂层和第二树脂层，所述第一树脂层和第二树脂层包括导热性的无机填料，并混合有混合物，且具有布置在接合界面的散热装置。
换句话说，市场对高集成度/高容量/小型化的电源模块的需求增加，但是电子部件的发热问题可能导致所述模块的总性能降低。因此，在根据本发明的优选实施方式中的电源模块封装中，所述导热片包括散热装置，所述散 热装置包括布置在由有机材料等制成的第一树脂层和第二树脂层之间的接合界面的金属丝、金属管或金属网以提高热性能，所述有机材料包括预浸材料(prepreg)、环氧树脂(epxoy)、聚酰亚胺(polyimide)、液晶聚合物(liquid crystal polymer)等，其中，所述散热装置通过嵌入工序粘接到所述第一树脂层和第二树脂层。
所述电源模块封装与引线框架或者引线框架粘接到陶瓷基片上的结构相比具有更优异的热性能。即，所述电源模块封装可由于所述导热片的高导热率(3至30W/Mk)而提高热性能。具体的，所述导热片包括具有优异导热性的无机填料，并且由于所述散热装置的热扩散效果，所述电源模块封装的热性能可提高。
在此，所述导热片的导热率可与构成散热装置的金属管或金属网的厚度成比例的调整至30W/Mk或者更大，参见图12所示。
另外，所述电源模块封装包括用于将电源装置的热量传递到导热片的短的热通道、设置在所述导热片上的金属层和粘接在所述金属层上的吸热装置，从而进一步提高了热性能。
同时，根据本发明的优选实施方式的制造电源模块封装的方法在制造工序中，在所述第一树脂层和第二树脂层之间进行粘合，并在所述引线框架、导热片和金属层之间进行粘合，从而节约封装成本，并且大大有助于改进生产率的管理。即，在环氧模塑封装材料(EMC)封装的工序中，所述引线框架、所述导热片和金属薄片相互嵌入粘接，从而节约成本且改进生产率的管理。
[第一优选实施方式]
如图1至3所示，根据本发明的优选实施方式的电源模块封装100可包括安装有电源装置101和用于控制所述电源装置101的控制电路102的引线框架110、粘接在所述引线框架110的一个表面上的导热片120、粘接在所述导热片120上的金属层130和封装(mold)上述装置的封装部(molding part)140。
导热片120由包括预浸材料、环氧树脂、聚酰亚胺、液晶聚合物的有机材料制成，并且包括第一树脂层121、第二树脂层122和散热装置123，第一树脂层121和第二树脂层122包括热传导的无机填料120a且添加有提高粘接强度的混合物120b，使得第一和第二树脂层121和122具有高热传导性和粘合性，散热装置123由金属材料制成，并布置在所述第一和第二树脂层121和122之间的接合界面124处。
在这里，所述无机填料120a可选自下述的一组物质，例如，氧化铝(Al2O3)、氮化铝(AlN)、氮化硅(SiN)、二氧化硅(SiO2)、碳化硅(SiC)或者它们的组合，但其并不限制于此。另外，无机填料120a的导热性可随着上述物质含量(85％或者更多)的增加而很容易地提高。
另外，对于混合物120b，可以选取例如以2：1的混合比例来混合苯基缩水甘油醚(PGE)和烷基缩水甘油醚(Alkyl(C12to C14)glycidyl ether)准备的混合物。也就是说，混合物120b可定义为苯基缩水甘油醚：烷基缩 水甘油醚＝2：1。
在这里，加入混合物120b是为了提高树脂和金属之间的粘接强度，并且粘结的改进效果可从图13的实验数据证明。因此，由于在制造电源模块封装100时加入该混合物120b，能够容易地防止树脂与金属之间的粘接不良。
同时，引线框架110可加工以具有满足设计需求的厚度和形状，并且根据目的，可以选择地使用具有下端装置(down-set)或者不具有下端装置形状的引线框架。在附图中，引线框架110上安装有电源装置101，所述电源装置包括绝缘栅门极晶体管(Insulated Gate Bipolar Translator)、二极管、金属氧化物半导体场效应晶体管(Metallic oxide semiconductor field effect transistor)等等，控制集成电路102安装在引线框架110的一部分上，且控制集成电路102通过引线结合法与电源装置101电连接。
另外，在附图中，金属层130通过将金属箔粘接在第二树脂层122的下部来安装在导热片120的一个表面上，并且金属层130的下部与普通的吸热装置粘接，以使热量从电源装置101中发散到外部。
封装部140通过使用环氧模塑封装材料(EMC)封装电源装置101、控制集成电路102、引线框架110和导热片120来形成，以露出一个表面，即，金属层130的底面露在外面。这种情况下，引线框架110的顶端也露在封装部140的外面，从而用作外部连接触点。
因此，根据本发明的优选实施方式的电源模块封装100包括用于将电源装置101的热量传递到导热片120的短的热通道、设置在所述导热片120上的金属层130和粘接在所述金属层130上的吸热装置，从而进一步提高了热性能。
如图3至图5所示，散热装置123布置在第一树脂层121和第二树脂层122之间形成的接合界面124上，用于从电源装置101传递热量。散热装置123可具有一种形式，在该形式中，金属丝或金属管以线性的形式布置在第一树脂层121和第二树脂层122之间，所述金属丝或金属管由包括比无机填料120a具有更高导热性的铜(Cu)、铝(Al)、铁(Fe)、钛(Ti)、银(Ag)、金(Au)等的金属材料制成，或者散热装置123可具有另一种形式，在该另一种形式中，具有网格形状的金属网布置在所述接合界面124上。
在这里，除了金属丝、金属管或金属网之外，散热装置123还可被设计成使用金属材料的任意的形状。另外，控制所述金属丝、金属管或金属网的厚度，以使得导热片120的导热性可调节至30W/mK或者更大。
因此，根据本发明优选实施方式的电源模块封装100，由于散热装置123影响散热效果，能够容易地提高电源模块封装100的热性能，从而可以提高电源模块封装100的性能，并确保散热的高可靠性。
第二实施方式 
如图6至图11所示，根据本发明的具体实施方式的制造电源模块封装的方法主要包括准备导热片120和使用导热片120制造电源模块封装100。
导热片120包括由有机材料等制成的第一树脂层121和第二树脂层122， 所述有机材料包括预浸材料、环氧树脂、聚酰亚胺、液晶聚合物等等。
在这里，第一树脂层121和第二树脂层122包括80％或者更高的具有导热性的无机填料，所述无机填料可选自下述一组物质，例如，氧化铝(Al2O3)、氮化铝(AlN)、氮化硅(SiN)、二氧化硅(SiO2)、碳化硅(SiC)或者它们的组合，并且添加有以2：1的混合比例混合的苯基缩水甘油醚(PGE)和烷基缩水甘油醚的混合物120b以提高树脂和金属之间的粘合强度。
在由金属材料制成的散热装置123设置在第一树脂层121和第二树脂层122之间形成的接合界面124的状态下，通过对第一树脂层121和第二树脂层122进行层压以压紧和粘合所述第一树脂层和第二树脂层来制造导热片120。
换句话说，由包括铜(Cu)、铝(Al)、铁(Fe)、钛(Ti)、银(Ag)、金(Au)等的金属材料制成的金属丝、金属管或金属网布置在第一树脂层121和第二树脂层122之间形成的接合界面124处，然后受到层压，这样由于散热装置123的特性而具有高导热性的导热片120就被制成。
同时，在制造电源模块封装100中，完成准备导热片120时，引线框架110也被预先机加工至要求厚度和形状，包括IGBT、二极管、MOSFET等的电源装置101和控制电源装置101的控制集成电路102安装到引线框架110的一个表面，并且电源装置101和控制集成电路102通过引线接合法与引线框架110电连接，电源装置101和控制集成电路102也通过引线接合法相互连接。
如上所述，当引线框架110上的装置粘接和引线连接完成时，除了将预先准备的导热片120布置在引线框架110的下部后，金属箔布置在导热片120的下部，使用环氧模塑封装材料(EMC)进行密封这些装置的封装，以形成封装部140。
在这里，封装通过以下方法来实现，该方法为：对除了引线框架110的 上端的部位在高温(～250℃)下施加压力(～10MPa)以形成由金属箔构成的金属层130的底面和外部连接触点，这样引线框架110、导热片120和金属层130之间的粘接可形成，并且在粘接后，可以保持粘接形态。
因此，根据本发明具体实施方式的制造电源模块封装的方法，在封装工序中用于实现导热片120、金属层130和引线框架110之间粘接的嵌入工序是可行的，因此，与根据现有技术的用液体粘合剂将引线框架粘合到陶瓷基片或者制造单独的导热基片后焊接到引线框架上的制造工艺相比，根据本发明的优选实施方式的制造电源模块封装的方法可更节约封装成本和进一步改进生产率的管理。
虽然本发明的实施方式为了说明的目的已公开，但应当理解的是，本发明并不限于此，并且本领域技术人员应当理解的是，各种修改，增加和替换都是可能的，而这并不脱离本发明的范围和精神。
因此，任何和所有修改，变型或等同布置都应被认为属于本发明的范围之内，并且本发明的具体范围由所附的权利要求公开。

Claims (10)

1.一种电源模块封装，包括：
引线框架，该引线框架上安装有电源装置和与所述电源装置电连接且控制所述电源装置的控制集成电路；和
导热片，该导热片粘接在所述引线框架的一个表面上，
其中，所述导热片包括第一树脂层和第二树脂层以及散热装置，所述第一树脂层和第二树脂层包括热导性的无机填料并且添加有苯基缩水甘油醚和烷基缩水甘油醚(烷基(C12-C14)缩水甘油醚)的混合物，且
金属材料的所述散热装置布置在所述第一树脂层和第二树脂层之间形成的接合界面处。
2.根据权利要求1所述的电源模块封装，其中，所述无机填料选自下述物质：氧化铝、氮化铝、氮化硅、二氧化硅、碳化硅、或者上述物质的组合。
3.根据权利要求1所述的电源模块封装，其中，所述混合物包括由苯基缩水甘油醚和烷基缩水甘油醚以2：1的混合比混合成的混合物。
4.根据权利要求1所述的电源模块封装，其中，所述散热装置包括金属丝、金属管或金属网。
5.根据权利要求1所述的电源模块封装，其中，进一步包括：
金属层，该金属层设置在所述导热片的一个表面上。
6.根据权利要求5所述的电源模块封装，其中，进一步包括：
封装部，该封装部通过模塑所述电源装置、所述控制集成电路、所述引线框架和所述导热片以使所述金属层的一个表面和所述引线框架的端头暴露于外部而形成。
7.一种制造电源模块封装的方法，包括：
(a)制备第一树脂层，所述第一树脂层包括热导性的无机填料，并且加入苯基缩水甘油醚和烷基缩水甘油醚(烷基(C12-C14)缩水甘油醚)的混合物；
(b)将由金属材料制成的散热装置布置在所述第一树脂层的一个表面；
(c)在所述散热装置的一个表面布置第二树脂层，所述第二树脂层包括热导性的无机填料，并且加入苯基缩水甘油醚和烷基缩水甘油醚(烷基(C12至C14)缩水甘油醚)的混合物；
(d)对所述第一树脂层和所述第二树脂层进行层压，以压紧和粘合所述第一树脂层和所述第二树脂层；
(e)将电源装置和控制集成电路安装到引线框架上，并且通过引线连接所述引线框架、所述电源装置和所述控制集成电路，所述引线框架具有粘合通过所述第一树脂层和所述第二树脂层粘合形成的导热片的一个表面；
(f)将所述导热片设置在所述引线框架的一个表面，并在所述导热片的一个表面设置金属箔；以及
(g)用环氧模塑封装材料进行封装，以使所述金属箔的一个表面和所述引线框架的端头暴露于外部。
8.根据权利要求7所述的方法，其中，所述无机填料选自下述物质：氧化铝、氮化铝、氮化硅、二氧化硅、碳化硅、或者上述物质的组合。
9.根据权利要求7所述的方法，其中，所述混合物包括由苯基缩水甘油醚和烷基缩水甘油醚以2：1的混合比混合成的混合物。
10.根据权利要求7所述的方法，其中，所述散热装置包括金属丝、金属管或金属网。
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