CN100492666C - 高密度finfet集成方案 - Google Patents
高密度finfet集成方案 Download PDFInfo
- Publication number
- CN100492666C CN100492666C CNB2004800241873A CN200480024187A CN100492666C CN 100492666 C CN100492666 C CN 100492666C CN B2004800241873 A CNB2004800241873 A CN B2004800241873A CN 200480024187 A CN200480024187 A CN 200480024187A CN 100492666 C CN100492666 C CN 100492666C
- Authority
- CN
- China
- Prior art keywords
- fin
- source electrode
- drain region
- field effect
- effect transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000010354 integration Effects 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000005669 field effect Effects 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 230000004224 protection Effects 0.000 claims description 6
- 238000000059 patterning Methods 0.000 abstract 2
- 125000006850 spacer group Chemical group 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
Abstract
Description
Claims (29)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/604,077 | 2003-06-25 | ||
US10/604,077 US6894326B2 (en) | 2003-06-25 | 2003-06-25 | High-density finFET integration scheme |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1839483A CN1839483A (zh) | 2006-09-27 |
CN100492666C true CN100492666C (zh) | 2009-05-27 |
Family
ID=33539877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800241873A Active CN100492666C (zh) | 2003-06-25 | 2004-06-25 | 高密度finfet集成方案 |
Country Status (7)
Country | Link |
---|---|
US (2) | US6894326B2 (zh) |
EP (1) | EP1644988B1 (zh) |
KR (1) | KR100734997B1 (zh) |
CN (1) | CN100492666C (zh) |
AT (1) | ATE461526T1 (zh) |
DE (1) | DE602004026063D1 (zh) |
WO (1) | WO2005001905A2 (zh) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7253650B2 (en) | 2004-05-25 | 2007-08-07 | International Business Machines Corporation | Increase productivity at wafer test using probe retest data analysis |
US7183142B2 (en) * | 2005-01-13 | 2007-02-27 | International Business Machines Corporation | FinFETs with long gate length at high density |
US7316148B2 (en) * | 2005-02-15 | 2008-01-08 | Boston Scientific Scimed, Inc. | Protective sheet loader |
US7265013B2 (en) * | 2005-09-19 | 2007-09-04 | International Business Machines Corporation | Sidewall image transfer (SIT) technologies |
CN100449783C (zh) * | 2005-11-29 | 2009-01-07 | 台湾积体电路制造股份有限公司 | 具有体接触窗的鳍状场效应晶体管及其制造方法 |
US7754560B2 (en) * | 2006-01-10 | 2010-07-13 | Freescale Semiconductor, Inc. | Integrated circuit using FinFETs and having a static random access memory (SRAM) |
US7723805B2 (en) * | 2006-01-10 | 2010-05-25 | Freescale Semiconductor, Inc. | Electronic device including a fin-type transistor structure and a process for forming the electronic device |
US7709303B2 (en) * | 2006-01-10 | 2010-05-04 | Freescale Semiconductor, Inc. | Process for forming an electronic device including a fin-type structure |
US7301210B2 (en) * | 2006-01-12 | 2007-11-27 | International Business Machines Corporation | Method and structure to process thick and thin fins and variable fin to fin spacing |
US7560798B2 (en) * | 2006-02-27 | 2009-07-14 | International Business Machines Corporation | High performance tapered varactor |
KR100838378B1 (ko) * | 2006-09-29 | 2008-06-13 | 주식회사 하이닉스반도체 | 핀트랜지스터의 제조 방법 |
JP5525127B2 (ja) * | 2007-11-12 | 2014-06-18 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及びその製造方法 |
US7927938B2 (en) | 2007-11-19 | 2011-04-19 | Micron Technology, Inc. | Fin-JFET |
US7829951B2 (en) * | 2008-11-06 | 2010-11-09 | Qualcomm Incorporated | Method of fabricating a fin field effect transistor (FinFET) device |
EA026275B1 (ru) * | 2008-11-25 | 2017-03-31 | Джастин В. Пэйдж | Сварочный аппарат для сварки труб, способ сварки труб и зажимной узел трубы для сварочного аппарата |
US8633076B2 (en) * | 2010-11-23 | 2014-01-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for adjusting fin width in integrated circuitry |
US8513131B2 (en) | 2011-03-17 | 2013-08-20 | International Business Machines Corporation | Fin field effect transistor with variable channel thickness for threshold voltage tuning |
US8586482B2 (en) | 2011-06-29 | 2013-11-19 | International Business Machines Corporation | Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation |
US8580692B2 (en) | 2011-06-29 | 2013-11-12 | International Business Machines Corporation | Film stack including metal hardmask layer for sidewall image transfer fin field effect transistor formation |
US8637930B2 (en) * | 2011-10-13 | 2014-01-28 | International Business Machines Company | FinFET parasitic capacitance reduction using air gap |
US8569125B2 (en) * | 2011-11-30 | 2013-10-29 | International Business Machines Corporation | FinFET with improved gate planarity |
US8569152B1 (en) | 2012-06-04 | 2013-10-29 | International Business Machines Corporation | Cut-very-last dual-epi flow |
US8697515B2 (en) | 2012-06-06 | 2014-04-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of making a FinFET device |
US8617961B1 (en) * | 2012-07-18 | 2013-12-31 | International Business Machines Corporation | Post-gate isolation area formation for fin field effect transistor device |
US8741701B2 (en) | 2012-08-14 | 2014-06-03 | International Business Machines Corporation | Fin structure formation including partial spacer removal |
US9142548B2 (en) | 2012-09-04 | 2015-09-22 | Qualcomm Incorporated | FinFET compatible capacitor circuit |
US20140167162A1 (en) | 2012-12-13 | 2014-06-19 | International Business Machines Corporation | Finfet with merge-free fins |
US8813016B1 (en) * | 2013-01-28 | 2014-08-19 | Taiwan Semiconductor Manufacturing Company Limited | Multiple via connections using connectivity rings |
US9190419B2 (en) | 2013-02-07 | 2015-11-17 | International Business Machines Corporation | Diode structure and method for FINFET technologies |
US8927397B2 (en) | 2013-02-07 | 2015-01-06 | International Business Machines Corporation | Diode structure and method for gate all around silicon nanowire technologies |
US9006087B2 (en) | 2013-02-07 | 2015-04-14 | International Business Machines Corporation | Diode structure and method for wire-last nanomesh technologies |
US9704880B2 (en) * | 2013-11-06 | 2017-07-11 | Taiwan Semiconductor Manufacturing Company Limited | Systems and methods for a semiconductor structure having multiple semiconductor-device layers |
US9224654B2 (en) | 2013-11-25 | 2015-12-29 | International Business Machines Corporation | Fin capacitor employing sidewall image transfer |
US9633906B2 (en) | 2014-01-24 | 2017-04-25 | International Business Machines Corporation | Gate structure cut after formation of epitaxial active regions |
US9252243B2 (en) | 2014-02-07 | 2016-02-02 | International Business Machines Corporation | Gate structure integration scheme for fin field effect transistors |
US10475886B2 (en) | 2014-12-16 | 2019-11-12 | International Business Machines Corporation | Modified fin cut after epitaxial growth |
US9748364B2 (en) * | 2015-04-21 | 2017-08-29 | Varian Semiconductor Equipment Associates, Inc. | Method for fabricating three dimensional device |
US10381465B2 (en) | 2015-04-21 | 2019-08-13 | Varian Semiconductor Equipment Associates, Inc. | Method for fabricating asymmetrical three dimensional device |
EP3136446A1 (en) * | 2015-08-28 | 2017-03-01 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Tft device and manufacturing method |
US9768272B2 (en) | 2015-09-30 | 2017-09-19 | International Business Machines Corporation | Replacement gate FinFET process using a sit process to define source/drain regions, gate spacers and a gate cavity |
US9530890B1 (en) | 2015-11-02 | 2016-12-27 | International Business Machines Corporation | Parasitic capacitance reduction |
US9966338B1 (en) * | 2017-04-18 | 2018-05-08 | Globalfoundries Inc. | Pre-spacer self-aligned cut formation |
US10276718B2 (en) | 2017-08-31 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | FinFET having a relaxation prevention anchor |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0214578A (ja) * | 1988-07-01 | 1990-01-18 | Fujitsu Ltd | 半導体装置 |
US5391506A (en) * | 1992-01-31 | 1995-02-21 | Kawasaki Steel Corporation | Manufacturing method for semiconductor devices with source/drain formed in substrate projection. |
JPH09293793A (ja) * | 1996-04-26 | 1997-11-11 | Mitsubishi Electric Corp | 薄膜トランジスタを有する半導体装置およびその製造方法 |
FR2799305B1 (fr) * | 1999-10-05 | 2004-06-18 | St Microelectronics Sa | Procede de fabrication d'un dispositif semi-conducteur a grille enveloppante et dispositif obtenu |
US6355532B1 (en) * | 1999-10-06 | 2002-03-12 | Lsi Logic Corporation | Subtractive oxidation method of fabricating a short-length and vertically-oriented channel, dual-gate, CMOS FET |
US6252284B1 (en) * | 1999-12-09 | 2001-06-26 | International Business Machines Corporation | Planarized silicon fin device |
US6483156B1 (en) * | 2000-03-16 | 2002-11-19 | International Business Machines Corporation | Double planar gated SOI MOSFET structure |
US20020062170A1 (en) * | 2000-06-28 | 2002-05-23 | Skunes Timothy A. | Automated opto-electronic assembly machine and method |
JP4044276B2 (ja) * | 2000-09-28 | 2008-02-06 | 株式会社東芝 | 半導体装置及びその製造方法 |
US7163864B1 (en) * | 2000-10-18 | 2007-01-16 | International Business Machines Corporation | Method of fabricating semiconductor side wall fin |
US6413802B1 (en) * | 2000-10-23 | 2002-07-02 | The Regents Of The University Of California | Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture |
US6580150B1 (en) * | 2000-11-13 | 2003-06-17 | Vram Technologies, Llc | Vertical junction field effect semiconductor diodes |
US6475869B1 (en) * | 2001-02-26 | 2002-11-05 | Advanced Micro Devices, Inc. | Method of forming a double gate transistor having an epitaxial silicon/germanium channel region |
US6458662B1 (en) * | 2001-04-04 | 2002-10-01 | Advanced Micro Devices, Inc. | Method of fabricating a semiconductor device having an asymmetrical dual-gate silicon-germanium (SiGe) channel MOSFET and a device thereby formed |
US6492212B1 (en) * | 2001-10-05 | 2002-12-10 | International Business Machines Corporation | Variable threshold voltage double gated transistors and method of fabrication |
US6433609B1 (en) * | 2001-11-19 | 2002-08-13 | International Business Machines Corporation | Double-gate low power SOI active clamp network for single power supply and multiple power supply applications |
US6657252B2 (en) * | 2002-03-19 | 2003-12-02 | International Business Machines Corporation | FinFET CMOS with NVRAM capability |
US6635909B2 (en) * | 2002-03-19 | 2003-10-21 | International Business Machines Corporation | Strained fin FETs structure and method |
US6995412B2 (en) * | 2002-04-12 | 2006-02-07 | International Business Machines Corporation | Integrated circuit with capacitors having a fin structure |
US6664582B2 (en) * | 2002-04-12 | 2003-12-16 | International Business Machines Corporation | Fin memory cell and method of fabrication |
US6833556B2 (en) * | 2002-08-12 | 2004-12-21 | Acorn Technologies, Inc. | Insulated gate field effect transistor having passivated schottky barriers to the channel |
US6770516B2 (en) * | 2002-09-05 | 2004-08-03 | Taiwan Semiconductor Manufacturing Company | Method of forming an N channel and P channel FINFET device on the same semiconductor substrate |
US6706571B1 (en) * | 2002-10-22 | 2004-03-16 | Advanced Micro Devices, Inc. | Method for forming multiple structures in a semiconductor device |
US7214991B2 (en) * | 2002-12-06 | 2007-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMOS inverters configured using multiple-gate transistors |
US6909147B2 (en) * | 2003-05-05 | 2005-06-21 | International Business Machines Corporation | Multi-height FinFETS |
-
2003
- 2003-06-25 US US10/604,077 patent/US6894326B2/en not_active Expired - Fee Related
-
2004
- 2004-06-25 DE DE602004026063T patent/DE602004026063D1/de active Active
- 2004-06-25 KR KR1020057022470A patent/KR100734997B1/ko not_active IP Right Cessation
- 2004-06-25 WO PCT/US2004/020553 patent/WO2005001905A2/en active Application Filing
- 2004-06-25 CN CNB2004800241873A patent/CN100492666C/zh active Active
- 2004-06-25 EP EP04777137A patent/EP1644988B1/en active Active
- 2004-06-25 AT AT04777137T patent/ATE461526T1/de not_active IP Right Cessation
- 2004-11-09 US US10/984,578 patent/US6987289B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20060009015A (ko) | 2006-01-27 |
US6894326B2 (en) | 2005-05-17 |
ATE461526T1 (de) | 2010-04-15 |
EP1644988A4 (en) | 2007-04-11 |
WO2005001905A2 (en) | 2005-01-06 |
US6987289B2 (en) | 2006-01-17 |
WO2005001905A3 (en) | 2006-02-23 |
US20050082578A1 (en) | 2005-04-21 |
KR100734997B1 (ko) | 2007-07-04 |
US20040262698A1 (en) | 2004-12-30 |
CN1839483A (zh) | 2006-09-27 |
EP1644988A2 (en) | 2006-04-12 |
DE602004026063D1 (de) | 2010-04-29 |
EP1644988B1 (en) | 2010-03-17 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171103 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171103 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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TR01 | Transfer of patent right |