CN100481455C - 具有不全接触通孔栈的密封环结构 - Google Patents
具有不全接触通孔栈的密封环结构 Download PDFInfo
- Publication number
- CN100481455C CN100481455C CN200510111999.8A CN200510111999A CN100481455C CN 100481455 C CN100481455 C CN 100481455C CN 200510111999 A CN200510111999 A CN 200510111999A CN 100481455 C CN100481455 C CN 100481455C
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- CN
- China
- Prior art keywords
- hermetically
- metal trace
- sealed construction
- hole
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (28)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510111999.8A CN100481455C (zh) | 2005-12-22 | 2005-12-22 | 具有不全接触通孔栈的密封环结构 |
US11/611,391 US7479699B2 (en) | 2005-12-22 | 2006-12-15 | Seal ring structures with unlanded via stacks |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510111999.8A CN100481455C (zh) | 2005-12-22 | 2005-12-22 | 具有不全接触通孔栈的密封环结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1988155A CN1988155A (zh) | 2007-06-27 |
CN100481455C true CN100481455C (zh) | 2009-04-22 |
Family
ID=38184870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510111999.8A Active CN100481455C (zh) | 2005-12-22 | 2005-12-22 | 具有不全接触通孔栈的密封环结构 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7479699B2 (zh) |
CN (1) | CN100481455C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105870069A (zh) * | 2015-01-22 | 2016-08-17 | 中芯国际集成电路制造(上海)有限公司 | 用于芯片切割过程的保护结构 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5117791B2 (ja) * | 2007-08-22 | 2013-01-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8643147B2 (en) * | 2007-11-01 | 2014-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Seal ring structure with improved cracking protection and reduced problems |
JP2009182181A (ja) * | 2008-01-31 | 2009-08-13 | Toshiba Corp | 半導体装置 |
US8124448B2 (en) * | 2009-09-18 | 2012-02-28 | Advanced Micro Devices, Inc. | Semiconductor chip with crack deflection structure |
US9059191B2 (en) * | 2011-10-19 | 2015-06-16 | International Business Machines Corporation | Chamfered corner crackstop for an integrated circuit chip |
TWI495074B (zh) | 2012-11-30 | 2015-08-01 | Ind Tech Res Inst | 減能結構 |
US9142507B1 (en) * | 2014-02-28 | 2015-09-22 | Freescale Semiconductor, Inc. | Stress migration mitigation utilizing induced stress effects in metal trace of integrated circuit device |
US9455220B2 (en) | 2014-05-31 | 2016-09-27 | Freescale Semiconductor, Inc. | Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures |
US9466569B2 (en) | 2014-11-12 | 2016-10-11 | Freescale Semiconductor, Inc. | Though-substrate vias (TSVs) and method therefor |
CN105977226B (zh) * | 2016-07-27 | 2019-07-23 | 上海华虹宏力半导体制造有限公司 | 密封环及防止芯片于切割时损伤的方法 |
US10153232B2 (en) * | 2017-04-26 | 2018-12-11 | Globalfoundries Inc. | Crack stop with overlapping vias |
CN115084039B (zh) * | 2021-03-12 | 2023-06-27 | 长鑫存储技术有限公司 | 保护环结构、半导体结构及其制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4972253A (en) * | 1988-06-27 | 1990-11-20 | Digital Equipment Corporation | Programmable ceramic high performance custom package |
US6028347A (en) * | 1996-12-10 | 2000-02-22 | Digital Equipment Corporation | Semiconductor structures and packaging methods |
US6412786B1 (en) * | 1999-11-24 | 2002-07-02 | United Microelectronics Corp. | Die seal ring |
US6362524B1 (en) * | 2000-07-26 | 2002-03-26 | Advanced Micro Devices, Inc. | Edge seal ring for copper damascene process and method for fabrication thereof |
US6509622B1 (en) * | 2000-08-23 | 2003-01-21 | Intel Corporation | Integrated circuit guard ring structures |
US6537849B1 (en) * | 2001-08-22 | 2003-03-25 | Taiwan Semiconductor Manufacturing Company | Seal ring structure for radio frequency integrated circuits |
US6943063B2 (en) * | 2001-11-20 | 2005-09-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | RF seal ring structure |
US6951801B2 (en) * | 2003-01-27 | 2005-10-04 | Freescale Semiconductor, Inc. | Metal reduction in wafer scribe area |
JP4360881B2 (ja) * | 2003-03-24 | 2009-11-11 | Necエレクトロニクス株式会社 | 多層配線を含む半導体装置およびその製造方法 |
-
2005
- 2005-12-22 CN CN200510111999.8A patent/CN100481455C/zh active Active
-
2006
- 2006-12-15 US US11/611,391 patent/US7479699B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105870069A (zh) * | 2015-01-22 | 2016-08-17 | 中芯国际集成电路制造(上海)有限公司 | 用于芯片切割过程的保护结构 |
CN105870069B (zh) * | 2015-01-22 | 2018-07-24 | 中芯国际集成电路制造(上海)有限公司 | 用于芯片切割过程的保护结构 |
Also Published As
Publication number | Publication date |
---|---|
CN1988155A (zh) | 2007-06-27 |
US20070145567A1 (en) | 2007-06-28 |
US7479699B2 (en) | 2009-01-20 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111128 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111128 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |