CN100474521C - 温控热边缘环组件，包含该组件的装置及其用途 - Google Patents

温控热边缘环组件，包含该组件的装置及其用途 Download PDF

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Publication number
CN100474521C
CN100474521C CNB2004800414213A CN200480041421A CN100474521C CN 100474521 C CN100474521 C CN 100474521C CN B2004800414213 A CNB2004800414213 A CN B2004800414213A CN 200480041421 A CN200480041421 A CN 200480041421A CN 100474521 C CN100474521 C CN 100474521C
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China
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ring
assembly
substrate
plasma
electrode
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Expired - Lifetime
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Chinese (zh)
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CN1914712A (zh
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安德莱斯·费舍
彼得·罗文哈特
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
CNB2004800414213A 2003-12-17 2004-12-10 温控热边缘环组件，包含该组件的装置及其用途 Expired - Lifetime CN100474521C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/736,666 2003-12-17
US10/736,666 US7244336B2 (en) 2003-12-17 2003-12-17 Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift

Publications (2)

Publication Number Publication Date
CN1914712A CN1914712A (zh) 2007-02-14
CN100474521C true CN100474521C (zh) 2009-04-01

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CNB2004800414213A Expired - Lifetime CN100474521C (zh) 2003-12-17 2004-12-10 温控热边缘环组件，包含该组件的装置及其用途

Country Status (7)

Country Link
US (1) US7244336B2 (https=)
EP (1) EP1706898B1 (https=)
JP (1) JP4913603B2 (https=)
KR (1) KR101131022B1 (https=)
CN (1) CN100474521C (https=)
TW (1) TWI368274B (https=)
WO (1) WO2005059962A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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