CN100459191C - 发光体用电路基板的制造方法、发光体用电路基板前体及发光体用电路基板以及发光体 - Google Patents

发光体用电路基板的制造方法、发光体用电路基板前体及发光体用电路基板以及发光体 Download PDF

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Publication number
CN100459191C
CN100459191C CNB200580008026XA CN200580008026A CN100459191C CN 100459191 C CN100459191 C CN 100459191C CN B200580008026X A CNB200580008026X A CN B200580008026XA CN 200580008026 A CN200580008026 A CN 200580008026A CN 100459191 C CN100459191 C CN 100459191C
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circuit
recess
luminous element
liquid crystal
substrate
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Expired - Fee Related
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Chinese (zh)
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CN1930696A (zh
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芦贺原治之
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Japan Gore Tex Inc
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Japan Gore Tex Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CNB200580008026XA 2004-03-17 2005-03-08 发光体用电路基板的制造方法、发光体用电路基板前体及发光体用电路基板以及发光体 Expired - Fee Related CN100459191C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004076204 2004-03-17
JP076204/2004 2004-03-17

Publications (2)

Publication Number Publication Date
CN1930696A CN1930696A (zh) 2007-03-14
CN100459191C true CN100459191C (zh) 2009-02-04

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ID=34975873

Family Applications (1)

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CNB200580008026XA Expired - Fee Related CN100459191C (zh) 2004-03-17 2005-03-08 发光体用电路基板的制造方法、发光体用电路基板前体及发光体用电路基板以及发光体

Country Status (5)

Country Link
JP (1) JP4163228B2 (ko)
KR (1) KR101062935B1 (ko)
CN (1) CN100459191C (ko)
TW (1) TW200534513A (ko)
WO (1) WO2005088736A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108884984A (zh) * 2016-03-15 2018-11-23 飞利浦照明控股有限公司 细长引线框架和制造细长引线框架的方法

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JP4913459B2 (ja) * 2006-03-28 2012-04-11 電気化学工業株式会社 金属ベース回路基板およびその製法、ならびにｌｅｄモジュール
JP2007173791A (ja) * 2005-11-22 2007-07-05 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法並びにそれを用いたバックライト装置
JP4833683B2 (ja) * 2006-02-17 2011-12-07 株式会社 日立ディスプレイズ 光源モジュールの製造方法及び液晶表示装置の製造方法
JP2008210891A (ja) * 2007-02-23 2008-09-11 Fujikura Ltd フレキシブルプリント基板
TWI348229B (en) * 2007-07-19 2011-09-01 Advanced Optoelectronic Tech Packaging structure of chemical compound semiconductor device and fabricating method thereof
EP2048918A1 (en) * 2007-10-09 2009-04-15 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Manufacture of a conductive pattern on a plastic component
WO2009069741A1 (ja) * 2007-11-29 2009-06-04 Mitsubishi Plastics, Inc. 金属積層体、ｌｅｄ搭載基板、および、白色フィルム
KR100957218B1 (ko) * 2007-12-27 2010-05-11 삼성전기주식회사 발광 다이오드 유니트
KR101023942B1 (ko) * 2009-03-09 2011-03-28 유명기 조명장치
JP5427884B2 (ja) * 2009-04-09 2014-02-26 日本発條株式会社 金属ベース回路基板およびその製造方法
DE102009019412A1 (de) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
JP5354018B2 (ja) * 2009-08-11 2013-11-27 株式会社村田製作所 多層基板
US8071401B2 (en) * 2009-12-10 2011-12-06 Walsin Lihwa Corporation Method of forming vertical structure light emitting diode with heat exhaustion structure
TWI481071B (zh) * 2012-01-12 2015-04-11 Light-emitting device LED 3D surface lead frame
JP5609925B2 (ja) * 2012-07-09 2014-10-22 日亜化学工業株式会社 発光装置
KR101597612B1 (ko) * 2013-11-25 2016-02-25 주식회사 토바 롤투롤을 활용한 플렉시블 모듈 제작 시스템 및 방법
JP6480673B2 (ja) * 2014-06-03 2019-03-13 東レ・デュポン株式会社 導電パターンを備えた立体基板の製造方法及び立体基板
CN104363534B (zh) * 2014-10-20 2019-03-29 佳禾智能科技股份有限公司 一种新型耳机线控及其制备方法
DE202015104272U1 (de) * 2015-08-13 2016-11-15 Zumtobel Lighting Gmbh Leiterplatte mit mindestens zwei Bereichen zum Bestücken mit Bauteilen
JP7062261B2 (ja) * 2017-06-27 2022-05-06 積水ポリマテック株式会社 回路シート
CN108601228B (zh) * 2018-05-11 2020-12-01 日照亿铭科技服务有限公司 下压式褶皱柔性pcb电子器件制备机构
CN114746484A (zh) * 2019-11-29 2022-07-12 电化株式会社 电路基板用lcp膜的制造方法、及电路基板用t模熔融挤出lcp膜
DE102020134205A1 (de) * 2020-12-18 2022-06-23 Te Connectivity Germany Gmbh Elektrisches Bauteil, Verfahren zur Vorbereitung eines elektrischen Bauteils auf einen Lötschritt, und Vorrichtung zur Vorbereitung eines elektrischen Bauteils auf einen Lötschritt

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JPS5293965A (en) * 1976-01-31 1977-08-08 Koito Mfg Co Ltd Printed circuit board and method of producing same
JPS62291195A (ja) * 1986-06-11 1987-12-17 ポリプラスチックス株式会社 電気部品基板
JPS6322764U (ko) * 1986-07-29 1988-02-15
JPH0738154A (ja) * 1993-07-16 1995-02-07 Sharp Corp Ｍｉｄチップ型発光素子
JPH10294335A (ja) * 1997-02-19 1998-11-04 Japan Gore Tex Inc Ｉｃチップ実装用インターポーザ及びｉｃチップパッケージ
JPH1154863A (ja) * 1997-08-06 1999-02-26 Mitsubishi Plastics Ind Ltd 窪み付きメタルコア印刷回路基板及びこれを用いた照明具
JPH11163418A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd 発光ダイオードを用いた光源
JPH11204904A (ja) * 1998-01-16 1999-07-30 Mitsubishi Plastics Ind Ltd 窪み付きメタルコア印刷回路基板、これを製造するための金型およびこれを用いた照明具
JPH11307904A (ja) * 1998-04-22 1999-11-05 Kuraray Co Ltd 成形回路部品およびその製造方法
JP2001036200A (ja) * 1999-07-22 2001-02-09 Yamaichi Electronics Co Ltd 印刷配線板、印刷配線板の製造方法、および小形プラスチック成型品の製造方法

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JPS5293695A (en) 1976-02-04 1977-08-06 Kureha Chem Ind Co Ltd Electrolytic production of caustic alkali
JPH1079558A (ja) * 1996-09-04 1998-03-24 Toshiba Corp プリント配線基板用シート
JP2000101149A (ja) 1998-09-25 2000-04-07 Rohm Co Ltd 半導体発光素子

Patent Citations (10)

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Publication number Priority date Publication date Assignee Title
JPS5293965A (en) * 1976-01-31 1977-08-08 Koito Mfg Co Ltd Printed circuit board and method of producing same
JPS62291195A (ja) * 1986-06-11 1987-12-17 ポリプラスチックス株式会社 電気部品基板
JPS6322764U (ko) * 1986-07-29 1988-02-15
JPH0738154A (ja) * 1993-07-16 1995-02-07 Sharp Corp Ｍｉｄチップ型発光素子
JPH10294335A (ja) * 1997-02-19 1998-11-04 Japan Gore Tex Inc Ｉｃチップ実装用インターポーザ及びｉｃチップパッケージ
JPH1154863A (ja) * 1997-08-06 1999-02-26 Mitsubishi Plastics Ind Ltd 窪み付きメタルコア印刷回路基板及びこれを用いた照明具
JPH11163418A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd 発光ダイオードを用いた光源
JPH11204904A (ja) * 1998-01-16 1999-07-30 Mitsubishi Plastics Ind Ltd 窪み付きメタルコア印刷回路基板、これを製造するための金型およびこれを用いた照明具
JPH11307904A (ja) * 1998-04-22 1999-11-05 Kuraray Co Ltd 成形回路部品およびその製造方法
JP2001036200A (ja) * 1999-07-22 2001-02-09 Yamaichi Electronics Co Ltd 印刷配線板、印刷配線板の製造方法、および小形プラスチック成型品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108884984A (zh) * 2016-03-15 2018-11-23 飞利浦照明控股有限公司 细长引线框架和制造细长引线框架的方法

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KR101062935B1 (ko) 2011-09-08
WO2005088736A1 (ja) 2005-09-22
TW200534513A (en) 2005-10-16
JP4163228B2 (ja) 2008-10-08
KR20070026393A (ko) 2007-03-08
JPWO2005088736A1 (ja) 2008-01-31
CN1930696A (zh) 2007-03-14

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