TW200534513A - Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body - Google Patents

Abstract

The object of the invention is to provides a circuit board precursor for light emitting body capable of forming a recess having a bottom face including a part for mounting a light emitting element while reducing the weight and thickness, a circuit board for light emitting body in which a recess is formed, a method for producing the same, and a light emitting body having a board in which a recess is formed. The method for produce a circuit board for light emitting body is characterized by comprising a step for forming, on the surface of a liquid crystal polymer film, a metal circuit pattern having at least a pair of the scheduled electrode parts of the light emitting element each connected with other circuits in the board through a conductive circuit, and a step for forming, at a part including the scheduled electrode parts, a recess having a bottom part where the scheduled electrode parts and the conductive circuit should exist, and a wall face where the conductive circuit should exist.

Description

2 ^ 0534513 IX. Description of the invention: [Technical field to which the invention belongs] Precursor of circuit substrate for body "The present invention relates to a method for manufacturing a light-emitting element as a circuit substrate for mounting a light-emitting body, a circuit substrate precursor, the A circuit board and a light emitting body. In addition, in this specification, "the circuit base 2 for a light-emitting body" refers to a circuit board for forming a light-emitting body by mounting a light-emitting element, and "light-emitting refers to mounting a light-emitting element by three-dimensional molding."

The concave portion is used to make a light-emitting circuit board. "Light-emitting element" means a light-emitting substance (semiconductor substance) such as GaAlAs, and "light-emitting body" means that the light-emitting element mold is bonded to an electrode portion of a circuit board and the obtained material (light-emitting diode or LED) is sealed with a transparent resin. . In addition, an LED chip means an LED that is made into a chip part. [Prior Art] A method for manufacturing a so-called LED chip mounted with a light emitting device has the following methods. (1) Punching, etching, etc. are used to pierce holes in various parts of a continuous lead frame, and an injection molding method (insert molding method) is used to form a heat-resistant thermoplastic resin. (Ii) In this part, a mold is used to attach a light-emitting element to the light-emitting element, and a light-emitting element is connected to other electrodes by wiring to connect with an external circuit, and the light-emitting element is insulated from the environment with a transparent sealing resin. . (I i i) It is made into individual LED chip pieces which are separated from each other. In addition, in order to make the handleability good, a plastic tape-shaped box that has been embossed and recessed is prepared separately, and the LED chips are inserted one by one in order to win. After this process, it is also rolled into

2226-6928-PF 5 20,0534513 For the use of counterfeit products in subsequent and continuous production lines. In the above-mentioned production method, the adhesion between the lead frame and the thermoplastic tree g is not good, and there is a problem that the sealing resin leaks from these interfaces. In addition, since the injection molding is performed, the manufacturing steps are complicated, and the productivity is not good. Furthermore, when the product is manufactured by injecting it into the gull-shaped knuckle in the manner described above, the e will be discarded, and there are problems of wasted cost and waste generation. To solve the above-mentioned problems related to the manufacture of LED wafers, various technologies have been proposed. For example, in the Japanese Patent Publication No. Hei-Pingburu, it is disclosed that a power electrode electrode portion having a three-dimensional pattern is provided on the concave surface of a concave anti-dragon. 'And a tritium wafer of a light emitting element is mounted on the electrode portion. In this publication, 'as in the related art', it is possible to reduce the manufacturing cost more than the LED chip based on the previous injection molding method, and it is also possible to solve the problems such as leakage of the sealing resin between the lead frame and the reflector box. In addition, Japanese Patent Laid-Open No. 6-35002206 proposes a method for forming a surface of a secondary body including an interface between the secondary body and a secondary body in which the secondary body is injection-molded and integrated. The surface is formed of a conductive material. In the circuit pattern, a three-dimensional circuit board having a part of the circuit pattern exposed in a part without a secondary formed body. This Japanese Patent Gazette No. 6_35〇2 06 points out that the technology of the above-mentioned Japanese Patent Gazette No. Heibu No. 6 'is generally electroplated on the surface side of the circuit board, so it depends on the plating area ratio. The manufacturing cost tends to increase, and in the finished product after mounting the light-emitting element, the electrode pattern of the part not covered by the sealing resin is exposed, so injuries may occur during processing or when mounting the light-emitting element 2226-6928-PF 6 200534513 Traces may cause electrode patterns to be disconnected. Therefore, according to the technology disclosed in No. Hei 6-3_, because the main part of the secondary formed body is used, it is possible to avoid disconnection of the electrode pattern, etc. 1; The problem also: The hunter will use the resin of the secondary formed body to form a specific structure and solve it. Another aspect of the dagger is to use metal ... as a circuit board for LEDs (for example, Japanese Patent Laid-Open No. 1 1 5486-3, JP-A U-Han 04 and JP-A U-298005). ^ Circuits After the substrate is formed on the surface of the insulating plastic resin layer provided on the metal core, a printed circuit is formed, and then a male type is used: female = = to form a pothole (the above concave portion). In these publications, it is necessary to prevent the damage of the printed circuit when the pothole is formed, and to focus on the forming angle and other aspects of the technology to prevent the circuit from being broken during the formation. No. According to this technology, the pressure of the solar cell element and element is deformed when the battery module and the element are connected with internal wires to absorb and deform too much of the battery module. In addition, Japanese Patent Laid-Open No. 5_283849 discloses a technique for a method for manufacturing a formed circuit board, which prevents conductive circuit cutting during bump formation. To be specific, "formed on a thermoplastic resin transfer circuit, after forming a circuit board", after heating the deformed portion, or before cooling the molded sub-molded circuit board, molding unevenness is performed. 7 Furthermore, it is described in Japanese Patent Gazette No. U_3〇79〇4: the wiring sheet forming the wiring pattern is formed in a three-dimensional form of a resin.

2226-6928-PF 7 200534513 The method of integration when forming the shape of the body [Content of the invention] However, according to the above-mentioned Japanese patent public hearing technology, because of the use of injection (two: JP-A " 5_ 的 术 a (rt) The molding method must integrate the primary molded body and the molded body, so it does not solve the problem of improving the productivity of the Japanese Patent Publication No. Hei 28, No. 28. Japanese Unexamined Patent Publication No. 3 5 0 2 0 6 Technically common question Every J ^ Bi Bei is the stage where the circuit pattern is set on the substrate on which the component is installed β ^ Lai ^ Nine lines are formed after the substrate is formed. As a result, = mating formation After the complicated shape to form a circuit diagram t, this operation is very difficult. In addition, although there are such ..., ^ ^ ^, q A reported electroless plating method (electroless plating method), there is no use of transfer Circuit pattern formation method, but after all: formation: it is not easy to form a circuit pattern on a subsequent substrate, and it is particularly difficult to form a pattern with a high degree of precision in a fine circuit. On the other hand, Japanese Patent Gazette No. 1158863 and other technologies in Because it is used to form the recess after forming the electrical pattern, it is possible to form a high-accuracy figure I—.…, And the circuit substrates not disclosed in these documents are provided with a metal substrate with an insulating layer. The problem is that the thickness or weight of the rhenium wafer is increased because the thickness of the metal core used in these bulletin technologies is 〇6: 1 · 2. In addition, even ”” YANG Cheng, because the metal core is thick, so Can not be formed into small and sharp-shaped recesses. In addition, Japanese Patent Publication No. 5_28384; the technology is also 2226-6928-PF 8 200534513 in polybutylene terephthalate (PBT: p〇butylbutyl terephthalate ) And other thermoplastic resins are molded before the circuit is transferred. However, this technology is not applicable to liquid crystal polymer films. This technology prevents the circuit during bump molding by heating the deformed part or molding before the resin is cooled. However, it is not only necessary to increase the cost required for the heating means, but for the liquid crystal polymer film, it is necessary to maintain the overall shape and may change It is extremely difficult to perform the molding in a certain degree of time. In fact, the circuit board material exemplified in this publication is only PBT, and there is no description of liquid crystal polymers and films. Japanese Patent Publication No. 3-2040979 Technology is to connect components to components with internal wires to prevent disconnection during deformation, etc., but because 2 requires a step-by-step step of connecting components, this method is not suitable for large-scale, large-scale, large-scale, large-scale The synthesis is the goal, and the circuit should be printed on a flat board. The technique of Japanese Patent Laid-Open No. 1 307904 is formed after the wiring pattern of the liquid crystal polymer film is formed, but it is captured after the wiring SI case is included. Problems such as broken lines are not known at all. Refer to the publication, the figure of the antenna, the pattern of the inch 'wiring pattern exists only in the position without accompanying deformation. 2. In recent years, the use of LED light-emitting bodies has been required to be miniaturized (the back of mobile phone LCD monitors, dedicated to the first month). However, in a circuit board such as Japanese Patent Laid-Open No. 1 1-54863 of a metal substrate (a metal substrate), the weight or the degree of the LED chip increases, and even the formability of the recessed portion ( Formability of sharp shapes) ^ In terms of temples, it cannot fully cope with miniaturization.

2226-6928-PF 9 200534513 = Furthermore, it is not possible to roll it into a roll to improve the handleability, and make it into a tape-like product. # ′ Is extremely disadvantageous compared to a film resin as a substrate.

In addition, from the viewpoint of improving the efficiency of circuit board production, continuous production of a long-sized circuit board having a plurality of positions where light-emitting elements should be mounted can be applied to a long-sized circuit pattern rather than a circuit pattern. In addition, even if the circuit pattern is being manufactured, In the case of a short size, it can be used after being continuously manufactured and cut. In the case of manufacturing a long-size light-emitting body, it is possible to continuously mount light-emitting elements to a design position on a board to improve productivity. ': Yes' At this time, long-sized circuit boards are required to be rolled into a roll to be processed.' However, the circuit boards disclosed in Japanese Patent Laid-Open No. Hei-54863, etc .: Because they have a metal plate core with a thickness of nearly 1 mm, It lacks flexibility and cannot be rolled into a drum shape under the bending degree of the visibility. Even with the technique of Japanese Patent Laid-Open No. 5-283849, continuous manufacturing is difficult in a method in which a circuit board has to be formed to have a certain thickness in addition to injection molding to form uneven portions. The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a recessed portion of a circuit board precursor for a light-emitting body capable of being formed with a bottom surface including a portion of an f-loaded light-emitting element, and capable of achieving a reduction in weight and thickness. A circuit board for a light emitting body, a method for manufacturing the same, and a light emitting body having a substrate having a recess formed thereon. The method for manufacturing a light-emitting body according to the present invention that achieves the above-mentioned object is characterized in that it includes: a circuit board

A step of forming a metal electrode circuit pattern having at least one pair of light-emitting elements 2226-6928-PF 10 2CT0534513 on the surface of the liquid crystal polymer film, and the electrode electrode predetermined portions are connected to other circuits in the substrate through conductive circuits, respectively. (Hereinafter referred to as "circuit pattern forming step"); and a step of forming the electrode predetermined portion and a recessed portion having a bottom portion where the conductive circuit should be and a wall surface where the conductive circuit should be formed at a portion including the electrode predetermined portion (hereinafter , Referred to as "recess formation step"). Here, "connecting to other circuits in the substrate" includes a type that is connected to a portion that can be connected to an external circuit. In addition, the circuit substrate precursor for a light-emitting body of the present invention is characterized in that: a metal circuit pattern is formed on the surface of the liquid crystal polymer film; and the circuit pattern includes at least one pair of electrode predetermined portions where a light-emitting element should be mounted. The predetermined portion is respectively connected to other circuits in the substrate through the conductive circuit; and the portion including the electrode predetermined portion is used to form the electrode predetermined portion and have a bottom portion that should have the conductive circuit and a wall surface that should have the conductive circuit. The recess. The definition of "connecting with other circuits in the substrate" is the same as above. The circuit board for a light-emitting body of the present invention is characterized in that a recessed portion where a light-emitting element is to be mounted is formed at a portion of the circuit board precursor for the light-emitting body that includes the predetermined electrode portion, and the conductive circuit exists in the recessed portion. Bottom surface and wall surface.

The luminous body of the present invention is characterized by having the above-mentioned circuit board for a luminous body. 2226-6928-PF 200534513 In the present invention, the term "film" also includes the concept of a so-called thin plate. [Embodiment] According to the method for manufacturing a circuit board for a light emitter according to the present invention, formation of a fine and highly accurate circuit pattern can be achieved, and formation of a recessed portion having a light emitting element should be formed, thereby achieving a circuit for a light emitter. Lightweight and thinner substrate. In addition, the circuit board precursor system for a light-emitting body is useful as a manufacturing method related to the present invention and an intermediate for manufacturing a circuit board for a light-emitting body. In addition, since the circuit board for a luminous body of the present invention can be made into a tape-like substrate, the luminous body can be continuously manufactured, the productivity of the luminous body can be improved, and it can be obtained that α can easily perform the luminous inspection of each luminous body. It also facilitates the manufacture of planar light-emitting bodies or display devices. In addition, as described above, the light-emitting body of the present invention can easily form a planar light-emitting body or a display device, and has a circuit substrate of the present invention composed of a thin liquid crystal polymer film. A heat dissipation device is provided on the opposite side of the circuit pattern forming surface, and the liquid crystal polymer film is used to efficiently remove heat generated from the light emitting body. In the present invention, the largest feature of obtaining a circuit board for a light emitting body having a recessed portion including a bottom surface of a portion where a light emitting element should be mounted (hereinafter also referred to as "light emitting element mounting portion") is a liquid crystal polymer film. 'A recessed portion is formed here using a circuit board precursor for a flat-plate light-emitting body in which a metal circuit pattern is formed in advance. In response to the above-mentioned Japanese Patent Publication No. Hei ^ 283883, as described above, the method of forming a circuit pattern on a substrate having a recessed portion must be highly accurate.

2226-6928-PF 200534513 It is difficult to form fine circuit patterns. Therefore, in the present invention, a circuit pattern # is formed on a flat substrate in advance, and by forming this, a fine and precise circuit pattern can be formed. In addition, the substrate is formed of a liquid crystal polymer film instead of using a metal plate for reinforcement, such as a metal core of a circuit substrate disclosed in Japanese Patent Laid-Open No. Hei-54863, etc. It is a metal plate with a thickness of about 0.6 to several ㈣), and it can be formed after the circuit pattern is formed (concave portion formation). As described above, the circuit board using a thick-walled metal core such as Japanese Patent Application Laid-Open No. U_54863 has disadvantages in that the weight is increased and the moldability is deteriorated. Further, an increase in thickness may cause a long-size person to be rolled into a bundle. Roller-like Wangli is impossible. On the other hand, the thickness of the resin portion 纟 of the resin substrate before the circuit such as Japanese Patent Laid-Open No. 1 283883 is not suitable for molding after the circuit pattern is formed. In the semiconductor field, as a thin-film substrate (for example, TAB (Tape Automated Bonding) substrate), a polyimide substrate is known, but this is composed of a thermosetting polyimide hardened, so it is accompanied by It is practically impossible to perform an extended deformation process, that is, plastic deformation, which is formed by the concave portion of the substrate of the present invention. In addition, when the substrate is made of a thermoplastic resin film, there may be a problem that the substrate is deformed due to the heat of the solder when the light-emitting element is mounted. In the present invention, the liquid crystal polymer having excellent heat resistance can be selected. Solve the related issues. Furthermore, in other heat-resistant thermoplastic resins such as polyetheretherketone resin (PEEK resin), the linear expansion coefficient of the resin monomer is large, and warping is likely to occur in the field of bonding with metal 2226-6928-PF 13 200534513. To prevent this, attempts have been made to fill fibers or polymer alloys. However, even these improved resins have the disadvantage of having poor microformability. On the other hand, the liquid crystal polymer used in the present invention has an excellent fine moldability in addition to a low linear expansion ratio. Hereinafter, each structure of the substrate of the present invention and the light-emitting body of the present invention will be described in detail. <Liquid crystal polymer film>

The liquid crystal polymer of heat-resisting liquid crystals of the Nissan knife film is a thermoplastic that is heat-resistant. For example, a thermally-interchangeable liquid crystal high-knife that exhibits liquid crystallinity in a molten state is suitable for thermally-interchangeable liquid crystal polymers More specifically,…, intermai solution B is poly I or thermal interconversion liquid crystal polyacetamide is preferred. Thermally-interchangeable liquid crystal polyester (hereinafter, for example, a monomer such as dicarboxic acid, didiol, or hydroxy carboxylic acid) A synthetic substance which is aromatic and shows liquid crystallinity when melted. Representative examples include p-hydroxybenzoic acid (PHB), terephthalic acid, and 4,4, -diphenylbenzene. , Type I synthesized [Formula (1)], Type II synthesized from PHB 2, 6-hydroxynaphthoic acid [Formula (2)], Type III synthesized from PHB, terephthalic acid, and ethylene glycol [Formula (3)].

2226-6928-PF 14 (2) (1) 200534513

In terms of thermal properties and dimensional stability, fully aromatic polyesters (types 丨 and j) are preferred, and lead-free soldering can be performed (for example, at 260t), and recess formability is also good. From a viewpoint, the liquid crystal polyester in which α f is changed is particularly preferable. In addition, as the liquid crystal polymer related to the present invention, if the liquid crystal polymer exhibits liquid crystallinity (especially, thermal interconversion liquid crystallinity), for example, a unit represented by the above-mentioned ⑴ ~ ⑺ 1 dagger formula is used as a main body (for example, a liquid crystal polymer The total composition = medium, 50 mol (nK) le)% or more), a polymer of the same type as other units may also be used. As other units, for example: a unit with a mysterious bond, a unit with amidamine bond , A unit having an amine bond, and the like. "ΓΓ liquid crystal polymer film 'can use various methods that are known in accordance with the resin constituting this. In addition, the above-exemplified liquid crystal polygl is suitable for use in the present invention. In addition, the liquid crystal poly is specifically intended to have y. The above-mentioned liquid crystal polyacetate bonded with an amide is, for example, a compound having a structure of, for example, a chemical formula (4) t and a s unit 1 (_4), which is known. The molar ratio is 70/15/15. Early Fan and U Unit

2226-6928-PF 200534513 ⑷ In addition, for the liquid crystal polymer bond knife on the 4 film, a polymer alloy including the above liquid crystal polymer can also be used. In this field, Bayi ° is a high-grade knife for alloys that are mixed with liquid crystal south molecules or chemically bonded. The melting point is 220t: above, preferably 280 ~ 360 ° C polymer, 々 丨

For example, polyether ether ketone, polyether maple, polyamine, polyetherimine, polyacrylamide, ammonium amine, polyamide amide, polyarylate, etc., of course, it is not limited herein. The mixing ratio of the ancient Bacheng day to day and the macromolecules for alloys is not particularly limited. For example, the ratio of mass to mass is preferably 1: 0: 90 to 90:10, and 30..70. ~ U 70 · 30 is better. Polymer alloys including liquid crystal polymers can also retain the excellent properties of liquid crystal polymers. In the above-mentioned liquid crystal polymer film, the linear expansion coefficient in a direction parallel to the film plane is adjusted to 25 Ppm / t: or less. Below 21ppm / ^

better. In addition, the lower limit of the linear expansion coefficient of the crystalline polymer film is preferably 8 cm, C. The linear expansion coefficient of the liquid crystal polymer film is set by the machine cryo analysis (TMA) method. The width of the test piece is set to 45, the distance between the chucks is 15 mm, and the weight is lg. The temperature is raised from room temperature to 200. t: after (temperature increase rate: 5000 / min), and temperature decrease rate: 5. 〇 / minutes; human jin / ～~ 4, from the measured size of the test piece between 160 ° C to 25 ° C, the value obtained by the Panhua Office For example, one of the linear expansion coefficients of the MD direction of the film (the direction of the rod during the production of the film and the cardio) and the TD direction (the direction orthogonal to the MD direction) can satisfy the above range. In the circuit board of the present invention, it is connected to a flat plate provided with a circuit pattern. 16

2226-6928-PF 200534513 A recess is formed. When a thermoplastic film is combined with a metal circuit bonded thereto to perform two-dimensional molding, when the difference between the linear expansion coefficients is large, the metal circuit portion on the film is prone to warping, twisting, and pitting. Furthermore, in this case, the film is also affected by the thickness of the metal, the elastic modulus, and the like, and there is a possibility that the film may curl or warp even when the film is bonded to the metal. For example, instead of a liquid crystal polymer film that satisfies the above-mentioned linear expansion coefficient, a polyether-imide film having a linear expansion coefficient of 56 ppm / ° C is used, and a circuit board having the same structure as the present invention is used. Temperature == Metal circuit on the polyetherimide film when the recess is formed below: The knife will have the above-mentioned part of the tune, distortion, and depression #, which was confirmed by the inventor of this case. The linear expansion of the metal forming the used metal layer; number? ... ~ 3. Qingguang c (for example, copper series 162 _ said / due @ 'If it is a liquid with a linear expansion coefficient below the above upper limit value

In other words, the difference between the linear expansion coefficient of the sub-film and the metal layer when the recess is formed, the occurrence of the situation in the exposed portion of the liquid crystal polymer film will be suppressed as described above. However, in the metal used in the present invention, it is preferable that the linear expansion coefficient is as close as possible to the liquid crystal polymer film. In the liquid crystal polymer film, as above, it is only necessary to make the polymer molecular chain in the film in the film = secondary alignment. Cheng Shi, Ik machine, plane-oriented film, two cores, using the melt extrusion method to make high-axis M ... and V; :: This method extends in the TD direction-axis, or, extends in one axis. Adjust linear expansion in this way

2226-6928-PF 17 200534513 The method for producing a liquid crystal polymer film with an expansion coefficient is disclosed in detail in Japanese Patent Laid-Open No. 10-294335. Further, the liquid crystal polymer film of the present invention has a function as a box of a light emitting body, and therefore it is preferable to have a structure that improves the reflectance of light and efficiently extracts light that is emitted outside. Specifically, it is recommended that the liquid crystal polymer film be made into a color such as white or silver to improve the reflectance of light. The liquid crystal polymer film is attached with colors accordingly. For example, a method of mixing the liquid crystal polymer with a coloring pigment (titanium oxide powder, etc.), etc., and then thinning it can be used. The thickness of the liquid crystal polymer film may be appropriately selected according to the required size of the luminous body. For example, the thickness is more than 10 #m, more preferably 50 #m or more, most preferably 3 mm or less, and 1 mm or less. When the thickness is too thin, the recessed portion is likely to be punctured or creased by the circuit board when the recess is formed, reducing practicality. On the other hand, the thickness is too thick. After the light emitting body is made, a heat dissipation device is provided (details, ', and Tian are described later), because the heat dissipation efficiency will be reduced when the heat emitted by the light emitting element is eliminated through the liquid crystal polymer film. As the thickness of the film increases, the effect obtained (increased mechanical strength, etc.) will saturate, so it will waste material and become disadvantageous in terms of cost or weight. For example, for small luminous bodies such as LED chips, which have been widely used since March, among the above-mentioned thicknesses, it can also support thin liquid crystal polymer films (for example, about 200 # π or less). On the other hand, in the case where the light-emitting element mounting portion is applied to a LED having a relatively large diameter or larger, it is recommended to use a slightly thick liquid crystal polymer film even in the above range. 2226-6928-PF 18 200534513 <Circuit pattern> The circuit substrate precursor of the present invention or a circuit pattern related to a circuit substrate is formed in a recessed portion that becomes a light-emitting element mounting portion, and has at least one pair of electrode predetermined portions. Other circuits connected to the electrode predetermined portion. Here, the "inside the board #Leihanmen other circuits" refers to the part of the board that can be connected to external circuits. In the other circuits described above, a part for mounting electronic parts other than the light emitting element can also be provided. In the present invention, since a three-dimensional formation is performed after a circuit pattern is formed on a flat liquid crystal polymer film, the former can more easily form a complex and finer circuit than the prior art in which a circuit pattern is formed after a second erbium formation. pattern. The circuit pattern is made of metal. For example, a metal layer is provided on the surface of a liquid crystal polymer film, and the metal layer is formed by applying etching. As the method of forming the metal layer, in addition to the method of bonding the liquid crystal polymer film and the metal (including metal edges, metal films, etc.), the surface of the liquid crystal polymer film can also be used by vacuum evaporation or sputtering. Plating method, ion plating

Plating), plating method, CVD method and the like. As a method for bonding the liquid crystal local molecular film and the metal plate, a thermal fusion method is preferred. As the hot-melt method, it is possible to use a thermoplastic 'activated liquid crystal polymer' to soften the laminated surface of the film, and then laminate a metal plate on this surface and apply a cold section, or overlap the liquid crystal polymer film and the metal plate. A method of passing heat through a heated pair of rollers and then cooling it. In addition, if you use a roughened surface of a metal plate such as a metal foil on at least the side connected to the liquid crystal polymer film, you can go one step further.

2226-6928-PF 19 200534513 Improve the adhesion between liquid crystal polymer film and circuit pattern. In other words, if inks such as metal foils with roughened surfaces are connected to the liquid crystal polymer film and circuits are formed by silver engraving, the surfaces of the removed parts such as metal foils will also be roughened. As a result, the adhesiveness with the sealing resin can be improved, and product defects can be reduced. The degree of roughening of the metal plate used to form the circuit or the surface of the liquid crystal polymer film is unspecialized. For example, Rz can be used to make ^ # m or so, and RZ to the right of i # m or more can be expected to have an effect, especially Yes, if it is 8 ... on ', it will be demonstrated in Example 8' described later because the adhesion force exceeding the surface of the copper pig will be exerted. The metal constituting the metal layer is not particularly limited, and examples thereof include copper, 2: tin, silver, gold, platinum, zinc, iron, and even a steel alloy including these metals), or a copper-based alloy for a lead frame. 1 alloy (42: layering = gold) η and the like. The metal layer may have a single-layer structure, or a layered structure of two or more kinds of metals ::. The method of lamination is also ^^^ For example, the liquid crystal polymer film and the metal plate can be used: the metal plate surface can be vacuum vapor deposition method or sputtering method, ionization = gold Γ method, and other methods, A method of providing a metal layer composed of a metal plate different from the metal plate: = gold 2 and the like. The constitution of the metal layer may be appropriately selected according to the purpose. For example, a linear expansion coefficient of a linear expansion coefficient of a liquid crystal south molecular film is preferred from the viewpoint of moldability. In the present invention, the electronic circuit used in the present invention is made of, for example, W or more, ^ U is better 7 degrees, and 疋 cn, / m person is less than 50000 // m or less, and the following is better. When the thickness is too thin,

2226-6928-PF 200534513 In addition to the reliability, when the substrate recess is formed, * slight tension may break. On the other hand, only a small amount of surface is applied, and the metal tends to make it difficult to form a circuit pattern by etching or the like. When the thickness is too thick, the moldability tends to be formed when the recess is formed. It is also detrimental to removing a part of the metal layer on the substrate and forming the electrical method, and the surname method known as f is preferred. As _ go, as the other way to expose the removed part of the metal layer by the conventional photoresist method = set the photoresist film of Li on the surface of the metal layer, and form a pattern, such as ^. Use ^. Dissolving the metal layer, and the liquid storage (for example, the alloy layer of copper rhenium is an aqueous solution of ferrous chloride, etc. = after removing the exposed portion of the metal layer, &lt; net) specifically dissolves and removes the photoresist film. Ancient and earthy photoresist resins, or metal layer dissolution liquid removal solution, photoresist film formation conditions or metal layer dissolution = system, can be adapted to the material of the metal layer or the circuit pattern formed The circuit pattern is a structure in which at least the M electrode predetermined portion is provided on the light-emitting element mounting portion, and the electrode predetermined portion is made through a conductive circuit and is inserted into the substrate, and other circuits (including connection terminals for connecting with external circuits) are connected. . In the case of forming a circuit having such a connection terminal, in order to increase the mechanical strength of the connection terminal portion of the substrate of the present invention: as necessary, a stiffener may be attached to a part of the circuit and reinforced. As the material of the rigid element, a liquid crystal polymer or polyimide can be used. Fig. I shows an example of a precursor of a circuit board for a light-emitting body of the present invention. 1 series of circuit board precursors for light emitters, 2 is an electrode scheduled portion, 3 is a conductive circuit, 4 is another circuit in the substrate,

2226-6928-PF 200534513 5 is a liquid crystal polymer film. The circuit board precursor for a light emitting body shown in FIG. 丨 has a plurality of i-pair electrode predetermined portions 2, 2 (that is, light emitting element mounting portions). The electrode pre-determined sections 2 and 2 are divided into the material conducting f circuit and the circuit 3 and are connected to other circuits 4 and 4 in the substrate. The boundary between the electrode planned portion 2 and the conductive circuit 3 is not necessarily clear, and a place where a light emitting element should be mounted on the end of the conductive circuit 3 may be referred to as the electrode planned portion. In Fig. 1, the broken line is a planned cutting line when a light-emitting body is individually used, and an optical element is used to make a final product, and the necessary portion is cut based on the money. In addition, a sprocket for '6 series substrate delivery (details will be described later). The circuit board precursor for the luminous body of the recess T1 I 2 is formed in each -Γ circuit: two electrode-predetermined parts on which the light-emitting element is mounted, and when the number of consecutive light-emitting element mounting parts is formed, the method can be continuously manufactured. Since the recessed body is formed in each finger, and it can be cut, the circuit board for the body can even be a light-emitting electrode (see FIG. 19 and FIG. 23). In the case, the light-emitting element mounted on the recessed part can be used. In the case of i Ueno and Y light emitting elements (for example: two: the recess is equipped with two so that three red, blue, and green, etc., "all three primary colors of light" are in the recess, it is necessary to mount 70 to In the case of one recessed portion, etc.), the electrode predetermined portion (for example, two electrode scheduled portions with the number of light emitting elements mounted, and two pairs of electric portions in the case of two light emitting elements). In the case of a light emitting element, it is scheduled for 3 pairs of electrodes

2226-6928-PF 22 200534513 Eight percent of the units are equipped with light-emitting it parts, and the electrode in the pole-predetermining part is scheduled to be electrically connected with other wires. In the case where the electrode predetermined part 2 and the light emitting part are elements, they are used for straight piles, and a plurality of light emitting elements corresponding to the number of light emitting elements mounted in a recess are provided in advance. Wiring, etc. ^ ^ There may be occasions where a plurality of light emitting elements are used. Therefore, this input, L 仟 /, can also be used ^, in the recess, the light-emitting element and wiring

Destroyed specifically? The pole predetermined portion may be smaller than the number of components that should be mounted in the concave portion. In other words, the number of "predetermined electrodes can be equipped with one hairpin, and the pre-set mouth P is called the" predetermined electrode preliminaries "", instead of the number of components in the field, two light-emitting diodes in one recess. It is possible to provide four electrode predetermined portions, but in most cases, one electrode predetermined portion can be shared by two light-emitting elements. Therefore, three electrode predetermined portions may be provided for each recessed portion forming predetermined portion. Similarly, when three light emitting elements are mounted in one recessed portion, four electrode predetermined portions may be provided for each recessed portion formation predetermined portion. For circuit patterns, it is best to design in a way that maximizes the remaining area of the metal layer. The larger the remaining area of the metal layer is, the higher the strength of the substrate becomes, and the stronger the substrate becomes. In addition, as described later, since the light emitting element emits light and emits heat, it is better to exclude this, and the larger the remaining area of the metal layer, the higher the heat dissipation effect of the heat generated by the metal layer (circuit). In addition, when a metal layer is left in advance in the sprocket portion used in continuous production, the strength is also increased, and it is preferable from the viewpoint of stable continuous production. In this way, the processing of parts other than the circuit, 222 6-6928-PF 23 200534513 is very advantageous because it can be used to form the road pattern at the same time. It is extremely advantageous. Make the liquid crystal polymer exposed: that is, when the remaining area of the metal layer is large, a light-reflecting body of light reflection 22: can be obtained. On the other hand, with the formation of the recess: the proportion of the circuit part is large At this time, there is a risk of circuit breakage. Here, the circuit substrate precursor before forming the recessed portion, and the area occupied by the metal circuit pattern that should be the wall surface of the recessed portion, is 20 to 90%. Method (more than 45%, better than ⑽)-The second circuit pattern is better, because within this range, the light body can be redundant: it can be partially supplemented by the high reflectivity of the metal circuit surface, and it can suppress the In addition, the conductive circuit t used to connect the electrode predetermined portion and other circuits in the substrate has taken into account that the liquid crystal polymer film is deformed as it is stretched, and the deformation I has a planar shape with a stretching allowance. Circuit pattern Under the condition that the recessed part is formed, the stretched metal is very poor in stretchability compared to the liquid crystal polymer film. Therefore, it is located in a circuit that is required to deform when the recessed part is formed. (Conductive circuit), easy to break. Even if the break does not occur, residual internal stress in the metal layer may reduce the reliability of the product. &Amp; For example, before plating on copper When this is first formed into a three-dimensional shape, peeling of the plating may occur. On the other hand, if the conductive circuit is provided with the above-mentioned shape in advance, the circuit breakage during the formation of the recessed portion can be highly suppressed, and the reliability is improved. Excellent circuit board for luminaries with recesses. Especially when the size of the light-emitting element or the luminaire is larger and the field with larger recesses is set 2226-6928-PF 24 200534513, or when bending deformation is required where the curvature is small. To make the conductive circuit have the above-mentioned shape, it has an excellent effect in ensuring the stability of the formation of the recessed portion. The circuit pattern is borrowed. Adhesion of the copper foil is then etched typically called a method of forming a circuit pattern easily formed sake. In addition, in the case of forming the expansion and contraction margin by conduction, etc., it is not necessary to increase the number of steps. y

As the shape of the above-mentioned conductive circuit, "the deformation allowance for the expansion and contraction of the liquid crystal polymer film when it deforms as it is stretched" has been taken into consideration, for example, the shape of f zigzag is made in plan view. In the case where the conductive circuit has such a shape, when the liquid crystal and the molecular film are deformed as it is stretched, ^ %% because the zigzag interval is extended to extend the length of the appearance, and the water also suppresses the breakage of the conductive circuit. . Larger, if such a shape is designed in advance, it will be affected by the liquid crystal polymer, and the shape of the P-shaped part will be extended and deformed (specifically, the main part is the wall surface of the recess).

An ^ ^ ^ ‘This prevents the concave #forming circuit pattern from breaking. The above-mentioned "made into a zigzag shape", the shape or wave shape, the wrong tooth shape (all these shapes: the twisted shape of the stomach. The same below). More specifically, u = any shape such as S-shape and V-shape in a plane is continuous, and nine 'v-shape; u-shape, /, and opening shape, U-shape, S-shape, v paste + any shape Those who intersect with their reversed shapes and V-shaped continuums and continuous openings on these shapes; and so on. In addition, two types of daggers are used in various shapes (U-shaped, S-shaped, V-shaped, etc.), and in the case of continuous shapes, they are not fixed. In addition, u-shaped or =: 曲: degree can be combined, and the verbal section can also have

222 6-6928-PF 25 200534513 Right-angled angle ’can also be curved. In addition, the above-mentioned "made into a zigzag shape" also includes: two directions which are approximately orthogonal to the direction of the above-mentioned electrode predetermined portion toward other circuits in the substrate, from one end to the other end without reaching the other end The above-mentioned slits have a shape (hereinafter, referred to as "slit shape") which is provided in such a manner that the ends of the slits are interactive.

In the case of the above-mentioned slit shape, the number of slits in the conductive circuit, the distance between the slits, and the length of each slit, when the recess is formed, as long as the conditions for preventing the breakage of the conductive circuit are fully exerted There is no particular limitation. For example, there is no reason to limit the interval to equal intervals. Depending on the shape of the recessed portion to be formed, an interval, position, length, angle, etc. that can sufficiently reduce the stress of the X carried by the conductive circuit during the forming may be appropriately selected. . The specific shape or size of the zigzag shape (the twisted shape, the wave shape, the zigzag shape, or the slit) as seen from the plane can be based on the value of the current flowing through the conductive circuit and the thickness of the metal layer. For example, Calculate the width of the conductive circuit [the length of the slit in the case of a slit shape (residue as the ^ degree of the conductive circuit)] or the number of twists (the shape of the slit) In the case of the number of slits), according to the calculated value, when the conductive circuit can maintain the strength of the forming process, and the shape of the slit is determined by the production confirmation of the actual machine, usually, the slit tool . ^, The length of the coin-worker's seam is less than 50% when the width of the conductive circuit is 5 and it is less than 50%, and when it is wide and more than 90%, it can also be a seam-shaped conductive circuit. Figure 2 of the figure shows that

2226-6928-PF 26 200534513 An example of a plate (flat plate). Figure 3 shows the substrate after the substrate in Figure 2 is formed with a recess. In addition, Fig. 4 is a cross-sectional view taken along line I-! Of Fig. 2 and Fig. 5 is a cross-sectional view taken along line 11-11 of Fig. 3. In FIGS. 2 and 3, the 7-series slits are shown. In FIG. 3, 8 is the bottom surface of the recessed portion, and 9 is the wall surface of the recessed portion. In addition, in FIGS. 2 to 5, the same symbols as those in FIG. 1 are not repeated (the same applies to the following figures). In the flat substrate (Fig. 2), the slits 7 provided in the conductive circuits 3, 3 are widened when the recesses are formed (Fig. 3). • Therefore, the length of the appearance of the conductive circuits 3, 3 will be extended (also, since Figure 3 is a plan view, the length of the conductive circuit is not shown in an extended manner, but the gap between the slits is widened, and the figure Extending in depth). Therefore, compared with a liquid crystal polymer film, breakage of a conductive circuit made of a metal having poor extensibility is highly suppressed. The effect of preventing the breakage of the conductive circuit caused by such a small degree of zigzag can also be exerted even in other shapes (such as a u-shape) as exemplified in the paragraph "Making zigzag shapes". Fig. 6 shows an example of a substrate (flat plate) having conductive circuits 3 and 3 having a continuous shape of S shape among other shapes having such shapes. In addition, "a zigzag shape in a plan view" is preferably a shape that is substantially radially symmetrical. Here, “radial symmetry” means: from the center point in the three-dimensional forming to the same pattern at an equal distance, with a fixed center angle, for example, the center angle: 180. , 120. Or 90. It is repeatedly formed into a shape. Figure 16 shows the radial symmetrical circuit pattern with a center angle of 180. In the form, the center angle of the 17th figure is 90. The type, the 18th 222 6-692 8-PF 27 200534513% The center angle of the figure is 120. Examples of types. If the radial symmetrical shape of this type is made, the force of the deformed part when the recess is formed will have a more even force on the circuit pattern and the royal force of the mouth. As a result, the force to be received is not concentrated on only a part of the circuit pattern, but the possibility of breakage can be reduced.帛 ^ 6 Figure shows a specific example of this type. In addition, the radial symmetrical circuit patterns in the case where four electrode portions are provided in the i recesses and in the case where three electrodes are provided are shown in Figs. 17 and 18, respectively. Here, "substantially" means the extent to which the force applied to the circuit pattern can be dispersed during the formation of the recessed portion. The shape of the projection may be symmetrical. For example, in the case where there are "solid slits" at one end, even if it is not Strict radial symmetrical shapes are also possible. Circuit patterns are formed on at least one side of the liquid crystal polymer film, but may be formed on both sides as needed. When circuit patterns are formed on both sides, each circuit is used independently, or by using Before forming the through-holes, the so-called conventional method of plating or burying a conductive material in the through-holes first can be used by connecting the two circuits together. <Formation of the recesses> Second, a flat plate with a circuit pattern on the surface of the liquid crystal polymer film The substrate precursor is shaped like a light-emitting element mounting portion (electrode planned portion), and a recess having a bottom portion that should have a part of the conductive circuit and a wall surface that should have a part of the conductive circuit. The method of forming the recess is not particularly limited, For example, 旎 Using a conventional molding method (press forming method, etc.) using a mold, or a vacuum forming method, a pressure forming method, a vacuum pressing method, etc. Air forming method, etc. Among them, the vacuum forming method, the air forming method, and the vacuum pressure forming method can be formed on the circuit diagram 2226-6928-PF 28 200534513 with bifurcations, so that it can prevent the text from being damaged. It is more advantageous. On the other hand, the forming method may have a method of forming the position more accurately according to the actual circuit pattern or its purpose of use.

▲ The number of recesses of the mother-substrate is not particularly limited, but it is preferable to form a plurality of recesses. It is preferable to form a plurality of L and other than to cut the circuit board at a specified position 'because it can be manufactured continuously.

The shape and size of the recess are not particularly limited, and the shape and size can be made as required. For example, generally, the opening of the recessed portion is made into a circle with a diameter of 0.5mm to 30mm, and the diameter of the bottom surface of the recessed portion is made into a circle with a diameter of 0.45 to 27mm, and the opening is made larger than the bottom surface. Wide, and the shape and size of the recessed part (the vertical depth from the opening to the bottom surface) &0; [_ ~ 20 ·. However, the shape of the portion or bottom surface portion is not limited to a circle 'and can be appropriately selected.

The pattern forming surface does not have the usual advantages such as a circuit diagram, a stamping method, and the like when forming a cavity. In the present invention, the conditions suitable for forming the recesses having such a shape and size are appropriately used. For example, when the liquid crystal polymer film is composed of a type I liquid crystal polyester (polyester), it can be used. The condition is that the film temperature is set at 300 ~ 35 (TC, under 3 ~ 5MP &amp; for 3 to 10 minutes, forming, cooling after 200 ° C or less, and taking out; by vacuum forming method, the condition is that the film temperature is set at 300 ~ 350 ° C, reduced pressure to 0.10i2MPa or less; vacuum pressure forming method, provided that the film temperature is set to 300 ~ 350 ° C, and the pressure side is set to ~ 1 5 0 · 29 ~ 0 · 59 MPa, pressure reduction side is set to less than 0.12 MPa for minute forming, cooled after 200 ° C and taken out. 2226-6928-PF 29 200534513 Take the melon inches, in order to prevent the metal y zhengzhen / Wen / Nikou sheep ^ 1C, the Akane cup is in a non-reactive gas environment, taking a lamp brother or molding in an environment including reducing gas. It is formed in a hole in the air, etc. to form an oxide film on the surface of the metal layer. 'For example, Yang You Shou Jing Yu Mao defeated 4 rules After sufficiently washing with nitric acid aqueous solution, the oxide film can be easily removed. Using the above temperature bars to form nets, weather conditions, or daylight conditions, etc., when the recessed portion is formed, it is deformed by extension (particularly the recessed portion). Part of the wall and its vicinity), because in the extended square warehouse, right _

The molecular chain of the liquid crystal europium molecule in the Shen direction will be realigned, so the elastic modulus will be increased, and the shape retention of the recessed portion will be improved, that is, low :: ί ::, (the sealing resin before Γ) is used for injection molding. Physical properties in shape retention will improve. Therefore, in order to ensure the same shape retention of the concave portion as that of a circuit substrate having improved elasticity due to the realignment of the molecular chain of the liquid crystal polymer film, a thinner liquid crystal polymer film can be applied and a higher-level circuit can be achieved. Light weight, low cost, and thinner substrates. For example, a type 1 thermotropic liquid crystal polymer film with a thickness of ι〇〇 ″, and the MD direction of the 5 and TD directions are adjusted to about 16 ppm / C, Its tensile elastic modulus is 63%, and when it is extended twice in one direction, the tensile elastic modulus in the extending direction is about U times. "Phenomena, the molecular alignment can be easily controlled by using extension. The liquid crystal polymer film is remarkable. In the substrate of the present invention, the boundary between a part of the soil surface of the recess 4 and the vicinity thereof, especially the curved portion of the opening of the recess, and the wall surface of the bottom of the recess when forming the recess. 'As deformation occurs due to elongation, such an increase in elasticity is significant. Therefore, the exposed portion of the liquid crystal polymer film 2226-6928-PF 30 200534513 is rich in flexibility, especially In a part of the wall surface of the recessed portion and its vicinity, the hardness of the recessed portion is improved due to the increase in the elastic modulus, and the shape retention of the recessed portion is improved. In addition to the type of the electrode portion (that is, only one pair of electrode portions), there may also be a plurality of light-emitting element mounting portions in the manner shown in FIG. I. The substrate of φ shown in FIG. I has a delivery With sprockets 6, the so-called substrate can be used for continuous operations such as formation of recesses, mounting of light-emitting elements, sealing with sealing resin, etc. When a TAB substrate is considered and a continuous operation is considered, etc. The circuit board is preferably a long one (such as a tape). For example, it is recommended that the length be 0.5 m or more, and more preferably 5 () 11] or more. In the case of such a long circuit board, the handleability is good. From a viewpoint, it is better to roll into a roll shape. However, 'of course, it can also be manufactured in batch type. In addition, the substrate shown in Fig. 1 is equipped with a light-emitting element, sealed with a sealing resin, and then cut. The predetermined line (the dotted line in the first figure) is cut to obtain a plurality of light emitting elements (LEDs) having a solid light emitting element. The upper and lower sprocket wheels 6 and 6 in the predetermined line ㈣㈣1 can also be used. As the carrying multiple The tape-shaped light-emitting body of the piece. In the circuit board in FIG. I, the 'circuit is continuous across the entire length of the substrate shown in the figure, but = in a long-sized circuit board, it is not necessary to be the king that crosses the long side. A long and continuous circuit. For example, this is enough to get a plurality of specific lengths.

2226-6928-PF 31 200534513 "The way 'mother specific length (such as 1 m, etc.) is repeatedly formed into a circuit pattern of a specific shape, and the repeated units of the pattern are made into a broken line pattern, or a different pattern is set for each specific length Circuit, and make it broken between different patterns. Figure 19 shows an example of the latter with a socket (socket) pattern. Figure 20 is an enlarged view of j patterns in Figures 丨 9. In addition, as shown in Figure What is shown in FIG. 23 is that in addition to manufacturing a circuit that can also be applied to a pattern of a display device (dot matrix), it can also be cut at a specified position and used. A tape-shaped light-emitting body obtained from the substrate of FIG. 1 The central system is connected in parallel. At both ends of the luminous body (the left and right ends in Figure 1), it can be mounted on each of them only by connecting with an external circuit including a power supply and a resistor. All the light-emitting elements of the light-emitting body are confirmed to have good light-emitting efficiency. Therefore, the external circuit is connected to make the light-emitting element of the light-emitting element at the manufacturing stage double-checked. It can also be used as a manufacturing method of the planar light-emitting body.

In the conventional planar light-emitting body, a plurality of light-emitting bodies having one light-emitting 7G device were arranged side by side on a panel-shaped substrate, and wiring and soldering were required for each light-emitting body. The manufacturing thereof was extremely complicated. However, the tape-shaped light-emitting body obtained on the substrate of FIG. 2 is only a plurality of parallel side-by-sides. It is sufficient that the ends of each tape-shaped light-emitting body are not connected to an external circuit including a power supply portion. The light-emitting elements need to be connected one by one, wiring, and soldering, so the surface light-emitting body can be easily manufactured by covering the surface with a translucent plate or the like, and the surface light-emitting body can be made thinner and smaller. ^ A biochemical lightness. Of course, it is also possible to form a linear light emitter or a multi-point light emitter. In addition, it is easy to freely design the circuit in series, parallel, or a combination of these.

2226-6928-PF 200534513 Furthermore, in the substrate of the present invention, since a circuit pattern having a high degree of freedom can be formed simultaneously with the formation of a recessed portion, a substrate that is a planar light-emitting body can also be used. FIG. 7 is an example of a precursor of a circuit board for a planar light-emitting body. The substrate of FIG. 7 can directly mount a plurality of light-emitting elements (24 in FIG. 7), so it emits light more than the previous planar light. Can simplify its manufacturing steps. In addition, in the substrate of Figure 7,

Since the optical element mounting section has individual circuits, each light emitting element can also be connected to an individual external circuit. Since each light-emitting element can adjust the light emission and light-out, it can be used not only as a simple planar light-emitting body but also as a display device (dot matrix). On the other hand, the use of the present clay plate makes continuous manufacturing of the display device thus easy, and not only can the display device be thinned, miniaturized, lightened, and resource-saving ', but also a flexible display can be obtained. Device.

In other words, the “previous display device (dot matrix), for example, is a combination of a plurality of unit blocks with 1 or even a plurality of light-emitting elements individually.” The whole is held in a box, and the wiring from each block is added. The type of connection. The unit ㈣ is formed by placing a plate-shaped circuit substrate ^ equipped with a light-emitting element into a thermoplastic resin with a depth of about 10 and forming an E, and sealing it with an epoxy resin-specific transparent resin for environmental insulation. In addition, the light-emitting element 'in the forming recess' is covered with an umbrella-shaped formed body in order to improve the concealment of the circuit board and the light extraction efficiency'. In addition, at the bottom of the unit block, extraction holes for light emitted by the light emitting elements are provided. At the bottom of the unit block, when the transparent resin is molded, a film with a drossiness is attached to prevent the leakage from the hole, so as to penetrate 2226-6928-PF 33. 200534513 The adhesive film was peeled off after the resin was sealed. In such a conventional display device, a large amount of transparent resin is required in the above-mentioned unit block, which results in an increase in weight and poor heat dissipation. Furthermore,

In addition to the transparent resin formed in this way, together with forming boxes and other auxiliary materials (eg, umbrella-shaped formed bodies or boxes holding unit blocks, etc.), more materials must be used. When a circuit board is mounted in a molding case and sealed with a transparent resin, the transparent resin flows in under the condition that a three-dimensional structure with a complicated shape exists, such as a light-emitting element or the umbrella-shaped molded body. Air bubbles tend to remain in the resin, which has the problem of poor workability. In addition, after sealing with a transparent resin, the above-mentioned adhesive film also needs to be peeled off. Furthermore, the peeled adhesive film becomes waste, etc., which are disadvantages. In contrast, in the substrate of the present invention, since a display device having a plurality of light-emitting elements is made, the required resin can be a body and a light-emitting element. Because of the sharpness and seal of the P knife, the amount of use can be drastically reduced to less than a few tenths of the previous, and it is not necessary to use the molding E separately, and @ can achieve significant weight reduction or reduction of raw material costs. In addition, it is not necessary to use the above-mentioned adhesive film, and the workability is good. Furthermore, even at the time of disposal, environmental issues are taken into account because the number (especially the amount of resin) can be reduced significantly. Now, as a display of LEDs, large objects are put into practical use for outdoor use and are installed in the building. Here, it is constituted by integrating a plurality of guns with high brightness. On the other hand, for indoor use, as a large-scale thin-walled display, a liquid crystal display or a plasma display has been put into practical use, and it has been used in order to increase the size because of technical difficulties. The increase, and the combined corrosion is a high cost proportional to the size and multiplied.

222 6-6928-PF 34 200534513 As shown in Fig. 7 or Fig. 23, in the substrate of the present invention, light-emitting elements can be used for tape-shaped or planar light-emitting elements, which can emit light one by one. Therefore, it is possible to easily provide an extremely light-weight and thin-walled large-scale display by being configured by mounting a plurality of light emitting elements such as red, green, and monitors at a high density. This display is more suitable for the field of low-brightness objects, such as indoor use, than the display composed of cannonball-type LEDs. In addition, "Fig. 21" is an example of an application circuit having a radial symmetrical circuit pattern shown in Fig. 16-an example "display device (dot matrix) #a circuit substrate precursor for a light body. Fig. 22 is an external view showing a dot matrix I manufactured from the precursor. The wiring part and the socket part that can be seen at the lower part are flexible. In actual use, they are used as shown in Fig. 24. In addition, FIG. 23 is an example of a circuit board precursor for the 21st illuminating light-emitting body as a unit, which is published in the form of a glue and is continuously manufactured in a ▼ shape, as described later, after the light-emitting element is mounted on the substrate. The method of the light-emitting element was sealed in a jitter

^ ^ Sealed, but from the viewpoint of improving the adhesion with the sealing resin, "β 山 ^ ^ U JL, a thin liquid crystal local molecule of the substrate before the formation of the recess ^ or after the formation of the recess ^ ψ 3 film It is better to apply surface treatment to the exit part. As such surface treatment, for example, external irradiation treatment of plasma, plasma treatment, sand treatment, alkali treatment, etc. I ,, and injection can be applied. In addition, The combination of the above processes is used to obtain a molecular circuit board by thermocompression bonding the roughened metal, and even if it is only liquid and sunny, good adhesion can be obtained. 扪 夜 日 日 呵 刀 刀 表

2226-6928-PF 35 200534513 <The structure of the light-emitting body> The light-emitting system of the present invention has a circuit board for the light-emitting body of the present invention after the recess is formed. There is no particular limitation on other structures. Various structures of the luminous body. FIG. 8 is a cross-sectional view showing an example of the light-emitting body of the present invention. The light-emitting body is electrically connected to one of the electrode portions 2 and 2 of the circuit substrate 1: the light-emitting element 10 is mounted in a manner, and the other is Electrode section = 10 ′ is electrically connected by the connection U. Thereafter, the light-emitting element is obtained by sealing the resin and sealing the resin by hardening the resin. For example, mainly a GaA1As-based light-emitting element is provided, and various types of light-emitting elements are provided. There is no particular limitation: a light-emitting element of a type that can secure a necessary light-emitting color can be used. The mounting of the advancement member H 'can be performed by, for example, connection with a mold using a conventional silver paste or the like. There is also no special system for wiring 11, and it is possible to use the material (usually gold) that is commonly used in the field of light emitters. ▲ The sealing resin 12 is not particularly limited as long as it has a degree of transparency in which the light b emitted from the light-emitting element 10 passes well, and conventionally known materials (epoxy resin, etc.) can be used. In the case of the luminous body obtained from the substrate shown in Fig. 1 of the script, it is tape-shaped, so it can be rolled into a roll and shipped. In addition, in the light-emitting body of the present invention, it is also preferable to have a heat dissipation device on the side opposite to the circuit pattern forming surface of the substrate. Figure 9 shows

2226-6928-PF 36 200534513 /, Examples of light-emitting body with exothermic device. The luminous body 3 in Fig. 9 has a heat radiating plate 14 as a heat sink. It is better to have a light-emitting body to eliminate heat generated during light emission, and to dissipate the heat by using a large-sized lead frame. However, the size of the light-emitting body is worrying, and the heat removal efficiency gradually decreases. problem. The luminous body of the present invention is different from the conventional tree-shaped substrate formed by injection molding. The thickness of the liquid crystal polymer film used for the substrate is reduced, and good heat-resistant deformability can be ensured. Thermal deformation prevention effect), and more reliable insulation than the coating film formed with the coating. Therefore, on the surface of the liquid crystal polymer film (opposite to the circuit pattern forming surface), a heat dissipation device such as a heat dissipation plate composed of a material with good thermal conductivity is provided, which is different from the heat dissipation of the previous lead frame. Heat is removed from a wide area of the substrate, and efficient heat removal can be achieved without worrying about leakage. As the heat radiation plate, for example, a metal plate such as an aluminum plate or a magnesium plate, or a resin plate or a glass plate containing an inorganic material having good thermal conductivity in the evening. The δ of the heat sink is set again. It is necessary to set a recessed part in the heat sink in advance according to the shape of the board. It is only necessary to embed the board here. However, it is better to use the board after dissolving it with the heat sink or using an adhesive. In addition, as shown in Fig. 9, it is better to use a heat radiating plate 14 having a refrigerant passage hole 15 as a heat dissipating device. In this case, it is possible to form more efficient heat removal. As the refrigerant, water or other conventional refrigerants can be applied. The above description is the result of a review of the luminous body. However, the present invention can also be applied to liquid-tight semiconductors other than the luminous body 2226-6928-PF 37 200534513. Examples Hereinafter, the present invention will be described in detail based on examples. However, the present invention is not limited to the following embodiments, and can be modified and implemented without departing from the meanings described before and afterwards, and all are included in the technical scope of the present invention. It should be noted that "%" used in this embodiment means a quality standard unless otherwise specified. The linear expansion coefficient of the film described below uses the TMA method to set the width of the test piece for the MD direction and the TD direction of the film: 4.5 mm, the distance between the chucks: 15 mm, and the weight: 1 g. The temperature was raised to 2000. (After (^ 1 speed · 5 C / min) cooling at 5 ° C / min, the temperature will be calculated from the dimensional change of the test piece measured between 160 ° C and 25 ° C. The value obtained by averaging the values. Experiment 1 "Production of a circuit board for a light-emitting body and a light-emitting body" Example 1 _ In a type I thermotropic liquid crystal polyester film (heat-resistant thermoplastic resin film, "BIAC BA" manufactured by Japan Goatex, transmissive temperature of liquid crystal: 335.0, thickness: m, linear expansion coefficient: MD direction, TD direction are both 16ppm / ° C)

Temperature: 340 C, pressure: 3.9 MPa, time: 5 minutes under copper (Cu) alloy box ("NK120" manufactured by Nippon Mining Material Co., Ltd., containing 0.2% chromium (Cr)-0 · 1% 鍅(Zr) — 0.2% zinc high-conductivity lead frame steel alloy single-side roughened product, thickness ·· 18 // in, coefficient of linear expansion: 17 · 4PPm 2226-6928-PF 38 200534513) ° The sprocket shown in FIG. 10 is set to obtain a resin film having a metal layer. Secondly, the circuit pattern of the structure shown in FIG. 10 and FIG. In Figures 10 and 11, the numerical values with a sign indicate the length and the unit is _. In Fig. 10, 16 is the guide hole of 5_must, and the diameter of sprocket 6 is 1 · 3_. Guiding hole system The hole used in the forming of the stalk, and the sprocket system is used for the delivery of the tape during continuous use. • On the surface of the metal layer, a dry film photoresist with a thickness of 50 # m in the form of a salt-based aqueous solution ("HF45〇" manufactured by Lihwa Kasei Co., Ltd.) is used. ) (Roller surface temperature · 105 ° C), laminated at a speed of 0.5 m / min, a linear pressure of 0.2 to 4 MPa, and left to stand for 15 minutes. Thereafter, a designated mask was superposed on the photoresist-coated surface, and a vacuum tight exposure machine was used, and ultraviolet rays were irradiated under the conditions of 100 mJ / cm2. It was further left at room temperature for 15 minutes, and then a 1% aqueous solution of a2C03 was used, at a temperature of 30. . 1. Spray dry film photoresist under the conditions of spraying time and 60 seconds to form a photoresist pattern. The metal layer of the resin film after the photoresist pattern is formed, an aqueous solution of ferrous chloride (so that 500 g of ferrous chloride is dissolved in a 3% aqueous solution of HC1:

1L aqueous solution). Then, a dry film resist was peeled off with a 3% aqueous solution of NaOH at a temperature of 50 ° C and a spray pressure of 0.1 MPa to obtain a plate-shaped luminous body circuit substrate precursor. L The above-mentioned luminous body circuit substrate precursor is formed with a recess 2226-6928-PF 39 200534513 by a mold forming method. The shape of the recessed part is a circle with a diameter of 1 · 7mni, the opening is a circle with a diameter of 2.3mm ', and the vertical depth from the recessed part to the bottom surface is 0.85mm. FIG. 12 is a cross-sectional view showing a portion where the recess is formed (a cross-sectional view of the substrate after the recess is formed in FIG. 11). In Figure 12, the unit of the numerical value (curvature radius) marked with "r" is mm. The molding conditions were set to a heating temperature: 32 (rc, pressure: 0.5 Mpa, time: 5 minutes, and molding in a nitrogen stream. The circuit board for the luminous body after the recess was formed, a low-pressure mercury lamp was used, and the temperature was 32 mW. The surface treatment is performed by irradiating ultraviolet rays for 30 seconds under a condition of 270 cm / cm2. The light-emitting element is mounted on the bottom surface of the recessed portion of the circuit board for the light-emitting body after the surface treatment. Product number: E1C4〇— 〇B〇〇〇〇2 ″, using this silver paste and die bonding (die bond) on one of the electrode parts (electrode scheduled part). In addition, the light-emitting element and the other electrode part is used Gold wire was used for wiring. Then, a two-liquid epoxy-based transparent sealant ("HL2000A, HL2000B2" manufactured by Inaba Industry Co., Ltd.) was filled in the recessed portion of the circuit board on which the light-emitting element was mounted to cover the light-emitting element. The sealing material is hardened once at 12 5 C and 1.5 hours, and then hardened twice under the conditions of 5 0 and 6 hours, and then the environment is insulated to obtain a long tape. The light-emitting body is cut from the above-mentioned tape-shaped light-emitting body, and 5 pieces of tape-shaped light-emitting bodies having 10 light-emitting elements are produced, and 5 rows are attached in parallel to the end of each glue-shaped light-emitting body on the phenol resin substrate. For external circuits that have a power source incorporated into a resistor, etc., use lead-free solder ("M7〇5" manufactured by Senju Metals Co., Ltd.), 2226-6928-PF 40 200534513, which is connected by soldering at 260 ° C. Second, A translucent acrylic plate was arranged on the surface to obtain a planar luminous body. The formation and efficiency of the planar luminous body were good. Power was applied to the obtained planar luminous body, and it was confirmed that bright luminous light can be transmitted through a window. Example 2 As a liquid crystal polymer film, a Π-type thermally-interchangeable liquid crystal polyester film (liquid crystal transfer temperature: 2 80 ° C, thickness: 1 0 0 // m, linear expansion coefficient: md, spring direction, TD direction are both I6ppm / ° C). The manufacturing method of the above-mentioned type 11 thermally-interchangeable liquid crystal polyester film is as follows. The type II thermally-interchangeable liquid-crystalline polyester is melted in a uniaxial extruder (screw diameter: 50_). ("VECTORA A950" made by Polyplastics), from T-die at the tip of the machine (squeegee length: 300mm, squeegee clearance ··· 2.5mm, weight temperature: 30 ° C), extruded into a thin sheet under the condition of a slope ratio ·· 5, and obtained after cooling Thickness: 500 // m liquid crystal polyester film. On both sides of the liquid crystal polyester film, a thin film of porous polytetrafluoroethylene (PTM) was thinly modified (thickness average pore diameter: 0.5 // m, porosity: 80%), using a lamination device with a pair of hot rollers, and performing thermal compression bonding at a temperature of 32 (rc, drum peripheral speed: 2 m / min), and then passed through a pair of cooling rollers (temperature: 1 0 0 ° C) and cooled down to make a laminate. This laminated body was extended with a two-axis stretcher. Elongation conditions: The temperature is 300 t, the magnification is MD direction: 1.6 times, the TD direction: 3.2 times, and the elongation speed is 20% / second. Thereafter, the porous PTFE film on both sides was peeled off to obtain an 11-type thermally-interchangeable liquid crystal polyester film having a thickness of 100 A m. 2226-6928-PF 41 200534513 ——The single side of the liquid crystal polymer film obtained in this way will be the same as the metal foil used in Example 1 only, with temperature: 275 ° C, pressure: 3.9MPa, time : Paste under the condition of 5 minutes, and set the sprocket on the resin film with metal layer as shown in Fig. 10. The tree-shaped film having this metal layer was etched in the same manner as in Example 1 to obtain a flat-plate-shaped circuit board precursor for a light-emitting body. In addition, regarding the above-mentioned flat-shaped light-emitting body circuit substrate precursor, the flat-shaped light-emitting body circuit board and the light-emitting body circuit having the concave parts were produced in the same manner as in Example i except that the forming temperature during the formation of the concave parts was set to 2651. Substrate, and long tape-shaped light emitter. From this tape-shaped light-emitting body to the production of a planar light-emitting body in the same manner as in Example 1, the soldering temperature could not be endured, which caused defects. Therefore, a normal solder (rSn63 "manufactured by Senju Metal Co., Ltd.) containing lead was used at a temperature of 22 ° C. (: Except for welding, a planar light-emitting body was produced in the same manner as in Example 1, and the formability and formation efficiency were the same as in Example 1. In addition, after the planar light-emitting body was energized, it was confirmed that light emission was compatible with Example 1 is the same. Comparative Example 1 Instead of a liquid crystal polymer film attached with a copper alloy foil, a heat-cured polyimide (produced by Nippon Steel Chemical Co., Ltd.) is used instead of a liquid crystal polymer film attached with a copper foil. Thickness: Except for 50 // m, copper foil thickness: 12; / in), a flat-shaped circuit board precursor for a light-emitting body was produced in the same manner as in Example 1. Recess formation was attempted in the same manner as in Example 1, but the same was impossible. 2226- 6928-PF 42 200534513 Comparative Example 2 A flat circuit board using the umbrella made in Comparative Example 1 smiles at you

The drive body, except that it does not form a recess, every month, J Bu tried the same as in Example 1 to make a tape-shaped light-emitting body of the county size for the seal to occur in the ramie private language, such as before the heat hardening sealant. Outflow of the agent, sealing is impossible. Comparative Example 3 A flat-shaped circuit board precursor for a light-emitting body was produced in the same manner as in Example i except that a polyimide film (manufactured by Mitsubishi Resin Co., Ltd., thickness · 1 GG // m) was used instead of the liquid crystal polymer film. The formation of the recessed portion was attempted in the same manner as in the implementation of Wi, but a large warpage occurred and processing was impossible. The film has a linear expansion coefficient of 56 ppmrc in the plane direction, which is considered to be because the difference from the linear expansion coefficient of the copper alloy foil is too large. Comparative Example 4 A flat-shaped circuit board precursor for a light-emitting body was produced in the same manner as in Comparative Example 3, except that a 1-mm-thick aluminum plate was bonded to the opposite side of the circuit pattern forming surface of the polyetherimide film used in Comparative Example 3. . The formation of the recessed portion was attempted in the same manner as in Example 1. However, the shape of the recessed portion was not as sharp as that of the injection-molded article of January 1) due to the existence of the aluminum plate, and the moldability was poor. Subsequent evaluations were therefore stopped. Run 2 <Production of Luminous Body with Heat Dissipating Device> Example 3 2226-6928-PF 43 200534513 The planar light-emitting body obtained in Example 1 was allowed to emit light at 25 ° C for 10 minutes. The temperature of the surface (luminous surface) of the rear luminous body was 28.5 ° C. Example 4 On the opposite side of the circuit pattern forming surface of the planar light-emitting body obtained in Example 1, a heat sink (aluminum mold forming plate) having a refrigerant passage hole as shown in Fig. 9 was mounted using an adhesive. Thereafter, the cooling water of 20 ° C was continued. The surface light-emitting body was caused to emit light at 25 ° C through the refrigerant passage hole. The temperature of the surface of the light-emitting body (light-emitting surface) after 2 minutes was measured to be 25.5 ° C. As described above, in the light-emitting body of the present invention, since the heat-dissipating device is provided, heat generated during light emission can be well removed. Experiment 3 "Production of a light-emitting circuit board and a light-emitting body provided with a conductive circuit having a specific shape" Example 5

And examples! Similarly, make the last name engraved pattern shown in Fig. 13, and the planned recessed part is the pattern shown in Fig. 14 (hereinafter referred to as "with a slit"): or the planned recessed part is the pattern shown in Fig. 15 (hereinafter (Called "slit") 4 flat-shaped circuit substrates' are formed by a mold forming method, and the disconnection of the conductive circuit is confirmed. The 14th and ^^ lines (circles) indicate that the recesses form a predetermined portion (hereinafter referred to as &amp; "concave :: alignment"), the inner circle is the boundary between the bottom surface of the recess and the wall surface, and the second: the wall surface of the circular recess and The outer boundary of the recess. In addition 彳 之 2226-6928-PF 44

Good, the incidence rate is expressed as a percentage. "When Shiguoxian 1 is disconnected, it is not shown in Tables i and.

200534513 One of the dotted lines in the figure 'the predetermined part is formed by the recessed part. The numerical value of the position of the surface of the slit in the 14th figure (0.447mjn,... 85mm, 100 °, and 1.0mm) is from the above-dotted dotted line. The distance up to the intersection of the center point at which the center point of the recess formation predetermined portion is centered and the midpoint of the upper and lower ends of each slit opening portion side of the line segment passing through the end portion of the lead circuit. ...... The circuit board with slits is supplemented to explain the pattern. There are 4 slits per fixed circuit, and the beginning of the slits is staggered. The width of 2 is the width of the metal layer of the conductive circuit of the U5mm 'slot formation area, A °, 1 position. In addition, 'the slits are oriented in such a way that the slits stand on the recesses, and then the most curved part of the substrate is matched with the recesses to form a pre-curved line' to further widen the width of the slit openings. The shape of the recess is the same as that of the embodiment. In addition, the forming pressure, time: 5 minutes, take-out temperature: fiber, until the final concave shape, shape, 塥 rv, 7 punch &amp; one person, complete the depression from a a 1 1 punch卩 卩 # ^ a stage seeding, hereinafter referred to as "1 stage of the heart and 5 times, to form the recess with 5 steps of slave punching, slowly forming the recess, press!) It is called "5 stage punch / i" to visually confirm the disconnection of the conductive circuit. The number of tests is 20-people, and the conductive circuit is caused by the formation of the recessed part. 2226-6928-PF 45 200534513 can be used even if there is no slit in the circuit The substrate is multi-stage stamping (5 stage stamping in this experiment). As long as the number of steps is increased, a recess can be formed. In contrast, a circuit board with a slit in a conductive circuit can be formed with a higher number of steps. (In this experiment, i-stage punching is performed.) "The recessed portion is formed with broken wires, and the formability of the recessed portion is better. Experiment 4 &lt; Confirmation of the effect of improving the reflectance> Example 6 An 18 # m thick electrolytic copper foil (Furukawa Circuit Foil) Manufacturing, GTS 18 ") single-sided The temperature treatment, the pressure treatment, and the time: 5 minutes, bonding to a rigid "thick" liquid crystal polymer film (manufactured by Japan Goatex, "biac_BC") to obtain a resin with a metal layer film. Here, the resin film having a metal layer is etched under the same conditions as in Example i to obtain the circuit pattern shown in i. The recessed portion is formed to have a flat plate-shaped luminous body circuit board precursor as shown in FIG. 16. body.

On the surface of the known circuit substrate precursor for a light-emitting body, a silver layer is formed on the copper box by plating. Here, in a place including the (electrode planned portion), a three-dimensional mold is used to form a truncated cone-shaped concave portion with a diameter of M. The bottom surface is straight: · 1.7mm, depth ··· 85. The area of the circuit part (golden trowel) occupied by the wall part. Similarly, the area of the circuit blade occupied by the portion that becomes the wall surface of the recessed portion (14th and 15th @) of the circuit pattern formed in the fifth embodiment is also calculated. For the circuit substrate precursor, the surface of the &amp; recessed wall surface 2226-6928-PF 46 '200534513 Figures 14, 15, and 16 The area of the circuit portion occupied by the portion which becomes the recessed wall surface is A, B, At c, the relative proportions are as follows: · A · B · · c: D = 13. 4 · 18 · 9 · · 54.1: 1〇〇 That is, the circuit pattern shown in Figure 16 is better than it should be The proportion of the wall surface of the recessed portion on which the light emitting element is mounted has increased significantly. = Outside ”Using the above-mentioned circuit board precursor for the luminous body, the light reflectance of the liquid crystal high-resolution 4 film surface and the plated silver surface was measured by its own spectrophotometer (say s = manufactured" U-35GG "). The results are shown in Table 2 as the increase rate of the reflectivity of the liquid crystal to the silver-plated surface of the molecular film surface. Table 2 __— Wavelength ___ Increasing rate (%) 'All area (400 ~ sonnnn) 116 Red (630nm) 107' ___: Green (580nm) __ ^ 114. 6 ^ Blue (430nm) According to the result, it can be known that power ore For the liquid crystal polymer film surface, the reflectance of the silver surface is U3 times that of the blue wavelength light and $ [M times that of the total visible light. That is, 'the circuit pattern shown in FIG. 16 is a recessed portion where the light emitting element is mounted. The proportion of the circuit portion occupied by the wall surface increases, which can be expected to make up for: the effect of reducing the wavelength side light anti-reflective effect, good light emission = 5 &lt; the effect of a circuit pattern with a radial symmetrical expansion and contraction margin He did meet &gt; Example 7 Replacement of electrolytic copper foil and use of pressed handles &amp; copper extension (manufactured by Nisshin Material Co., Ltd.)

222 6-6928-PF 47 200534513 Other than "" τ ") ', the circuit pattern shown in Fig. 16 was formed on the liquid crystal polymer film under the same conditions as in Example 6 above to obtain a circuit board precursor for ceremony. In addition, a circuit board precursor for a light-emitting body having the pattern shown in FIG. 14 is also formed. For the precursor of the circuit board for the luminous body, the concave part shown in the actual example 6 is taken by the camera, and only her photo of the electrode part of the concave part at the bottom of the concave part is shown in Figure U. Circuit pattern, exemplifying ... The distance (gap) between the two electrode portions of W. In addition to the circuit pattern, measure the distance between the two electrode sections (the 16th and wu in the figure), and connect the two conductive circuits between the electrode sections. Arrow section). The results are shown in Table 3. Here, the "electrode two places" means the distance between the wall surface of the recess and the bottom shoulder near the bottom surface side of the boundary of the bottom surface, and the distance between the two electrodes. Soil 1mm M-Omm 〇.10mm Figure 14-• ------- Figure 16-From this result, even if the electrode spacing caused by the formation is completely 81 ”, in the recessed circuit pattern, That is, when viewed in plan, it is a radiation pair: but the circuit pattern of the amount shown in Figure 16 has not been observed with recesses = zigzags with expansion and contraction. This is considered to be the electrode that is called when the recesses are formed. The circuit part of the wall part of the spaced part (the force of the metal 呷-is caused by the part being applied to the recess). Evenly dispersed without 222 6-6928-pp 48 200534513 That is' according to the radial shape The circuit diagram of cake avoidance, ranching, and expansion and contraction. The deviation from the H case when the light-emitting element is mounted across the board can be more effectively prevented. In addition, the circuit port system has a precursor, and the reflection is caused by The arrangement of the circuit portion (metal portion) of the thunder μ / a π of the concave portion of the light emitted by the light-emitting element will not be disordered. That is, a uniform pattern formed at the concave portion from the center T ^ point will be formed. This circuit pattern also has a good uniformity in reflected light Examination 6 <Confirmation of Adhesiveness> # Example 8 The hot-dust metal box with a roughened surface was connected to the liquid crystal polymer film, and when the name of the adhesive was engraved, the adhesion of the epoxy resin and film of the sealing resin was reviewed. The materials used are as follows: Liquid crystal polymer film 1: Japan's "BIAC-BA" liquid manufactured by Japan Shun (transliteration) company, polymer film 2: Japan "Biac_bc" manufactured by Japan G〇Am (transliteration) company Copper box: single-sided The roughening process "18 &quot; m thick electrolytic copper box (" GTS-18 "manufactured by Furukawa Electric Foil Co., Ltd.) has the same conditions as in Example 1. However, the roughened side of the copper box is attached to the liquid crystal polymer film. The surface of the copper box on the side of the roughening treatment: the thickness is Rz: 8 &quot; m. The measurement of the adhesive force is performed in accordance with the JIS K6850 viscosity = force measurement method. That is, the obtained luminous body circuit board precursor It is affixed to an aluminum plate with a width of 15m and a thickness of 2 · by a two-liquid epoxy resin transparent sealant ("HL2000A, HL2000B2" manufactured by Inaba Industry Co., Ltd.) Leave the position about 50mm from the surface and fix it symmetrically with the fixture of the tensile tester. , 65 seconds ± 2G second adhesive portion destruction

2226-6928-PF 49 200534513 ^ speed only stayed as a test machine, and 丨 丨 丨 &amp; 士 e 士 士 士 力 疋 力 力 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 力 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 Power at the time of destruction. During the measurement, five samples were tested separately, and the π test was used to produce ten mean values. Among them, fit 15X15mm. In addition, 屮 蚨 / t ^ is a comparative example. In order to determine the adhesion of copper foil (circuit surface sealant), the test was also performed without pushing γ μ 丨 占 and etch treatment. The results show于 表 4。 Table 4. Table 4

From this result, the adhesion force between the surface of the liquid crystal polymer film engraved with the surface roughened copper box and the adhesive was confirmed to be two times better than the adhesion between the surface of the untreated film and the adhesive θ. ★ 可 刀 at Field branch. Specifically, the above-mentioned film 1 is about 2.5 times, and the film 2 is about 35 times, which is higher than the adhesion between the copper drop (circuit surface) and the sealant. In addition, it is known that the liquid crystal polymer itself is superior to polyimide, which has a proven track record as a material for flexible circuit substrates. Also, the force Γ hunts the adhesion force between the circuit board and the epoxy resin by using the above-mentioned etching-processed liquid crystal polymer film, which can make the moisture resistance better, and it is expected that it will be ready to serve. Products with higher reliability ° Experiment 7 "Confirmation of effect of circuit with expansion and contraction allowance" Example 9 Conductive circuit of circuit pattern to light-emitting body circuit substrate precursor, test at 2226-6928-PF 50 200534513 circuit p &quot; The difference in the occurrence rate of disconnection when the expansion allowance is considered when the recess is formed, and when the expansion allowance is long. The materials used are as follows: q Liquid crystal polymer film: "mac_m copper cymbal made by G0ATEX (Japan): single-sided roughened 18" thick electrolytic copper box (Nihon "" BHY-13B-T "circuit The patterns are shown in the first to fourth figures, and the etching conditions are the same as in the above-mentioned Example 8. Each pattern is Example Hy. Each of the obtained luminous body circuit substrate precursors is based on the above-mentioned examples. The number of times is limited to $ 1. After the recess is formed, observe the food continuity test with a microscope to confirm whether there is a disconnection. Even in the case of continuity, if the circuit has a break in the microscope, it is also judged as a disconnection. In addition: The radius of curvature m of the boundary (refer to Figure 12), and also the concave portion with a more moderate radius of curvature such as :: 35, Lai and 0. 5 are shown in Table 5. The results of the incidence of broken lines in 20 cases of each test are shown in Table 5. 5 Disconnection rate H)

For example, if the radius of curvature is large to form a mild recessed portion, "all-step punching will not cause disconnection. When the curvature is reduced by half, Example 9-2 causes a disconnection. That is, in the case where the curvature I is reduced to 4 times, it is better to use multiple stamping. However, when the radius of curvature is small and every 3 W, there is a circuit pattern related to 2226-6928-PF 51 200534513 which does not cause disconnection of the present invention. [Schematic description] Figure 1 shows A plan view of an example of a circuit board precursor (flat plate) for a light-emitting body of the present invention. The second figure is a plan view showing an example of a circuit board precursor (bottle V-shaped plate) for the light-emitting body of the present invention that does not impart a shape to the circuit. Fig. 3 is a plan view of a circuit board for a light-emitting body showing a recess formed on a substrate of Fig. 9 and Fig. 2; Figure 4 is a sectional view taken along line I-I of Figure 2. Fig. 5 is a sectional view taken along the line II-II of Fig. 3. Fig. 6 is a plan view showing another example of a circuit board precursor (plate I) of a light-emitting body of the present invention which is given a specific shape to a conductive circuit. Fig. 7 is a plan view showing an example of a circuit substrate precursor for a light-emitting body of the present invention for a planar light-emitting body. Fig. 8 is a sectional view showing an example of the light-emitting body of the present invention. Fig. 9 is a sectional view showing a light-emitting body of the present invention including a heat-radiating device. Fig. 10 is a plan view showing the #engraved substrate formed in the embodiment. FIG. 11 is an enlarged view of a recessed portion forming a predetermined portion in FIG. 10. Fig. 12 is a cross-sectional view showing a recessed portion of the substrate produced in the embodiment, and Fig. 11 is a cross-sectional view taken along the line II-II. ★ The picture is a plan view of the case 2226-6928-PF 52 200534513, which is carved on the shoulder of the substrate precursor made in Bayan 3. FIG. 14 is an enlarged view of a predetermined portion formed in a recessed portion of a substrate precursor (with a slit in a conductive circuit) prepared in Ex. 3. FIG. FIG. 15 is an enlarged view of a predetermined portion formed in the recessed portion of the substrate precursor (there is no slit in the conductive circuit) prepared in Ex. 3. FIG. FIG. 16 is a substrate precursor manufactured in Example 6. (a) is a zigzag shape in a plan view and has a substantially radial symmetrical expansion and contraction margin in Pojo # 180 ## $ +

* 卩 forms an enlarged view of the pre- 疋 part. The oblique line portion should be the electrode portion of the light emitting element (the Q electrode scheduled portion) (the Q electrode scheduled portion). (B) A cross-sectional view in the direction A-A 'of Fig. 16 (a) of the case where the precursor of the substrate is formed with a recess. (C) is a good obituary of the recess ^ η. | &Lt; However, for the sake of convenience, the circuit pattern is omitted, and the actual post in the month s _ 口 Wei Beichen is the part that is not deformed when the recess is formed. The dotted line shows the undeformed part. Figure 17 has a meandering shape in plan view and at the center angle: 90. It has a substantially radial expansion and contraction margin, and can be equipped with a plurality of (2 or 3) light-emitting element recesses to form an enlarged view of a predetermined portion. Fig. 18 has a meandering shape in a plan view and a center angle of "20". It has a substantially symmetrical expansion and contraction margin, and can be mounted on two light-emitting elements. Fig. 19 is an example of a circuit diagram showing the use of the "8-character Xitian". Fig. 20 is an enlarged view of Fig. 19. Fig. 21 is a diagram showing the use of the 16th planar luminous body for the dot matrix. Fig. 22 is a diagram showing the use of the recessed part of Fig. 21 to form a predetermined portion, and a circuit board precursor for a luminaire. The luminous body shown in the figure is a planar luminous body made of a circuit board precursor 2226-6928-PF 53 200534513. Fig. 23 is a diagram showing an example of a circuit board precursor for a light-emitting body according to the present invention. In this way, in addition to being able to manufacture the substrate precursor in a long size, it can also be suitably cut and used at any position in the block (b 1 ock) unit. Fig. 24 is a view showing the state when the planar light-emitting body of Fig. 22 is actually used from the back. [Description of main component symbols] ® 1 Circuit board precursor for light emitter 2 Electrode intended part 3 Conductive circuit 4 Other circuits in the substrate 5 Liquid crystal polymer film 6 Sprocket 7 Slit (s 1 it) 8 Recessed bottom surface _ 9 Recessed wall surface 10 Light-emitting element 11 Wirebond 12 Sealing resin 13 Luminous body 14 Radiator 1 5 Refrigerant passage hole 16 Guide hole 2226-6928-PF 54

Claims (1)

200534513 10. Scope of patent application: 1. A method for manufacturing a circuit board for a luminous body, which is characterized in that it includes: · a predetermined electrode portion having at least one pair of light-emitting elements is formed on the surface of a liquid crystal polymer film; A step of conducting a metal circuit pattern connected to other circuits in the substrate (hereinafter, 2 is referred to as a "circuit pattern forming step"); and forming the electrode predetermined portion at a portion including the electrode predetermined portion, and A step of having a bottom portion of the conductive circuit and a recessed portion that should have a cut-out surface of the conductive circuit (hereinafter, referred to as "recessed portion forming step"). 2. The method for manufacturing a circuit board for a light-emitting body according to item 丨 of the application, wherein a plurality of the recesses are formed. 3. The method of manufacturing a circuit board for a light-emitting body according to item 1 of the patent application scope, wherein the predetermined electrode portion is formed in such a manner that a plurality of pairs of the predetermined electrode portions can be stored in each of the concave portions. 4. The method for manufacturing a circuit board for a light-emitting body according to item 1 of the patent application, wherein as the liquid crystal polymer film, a linear expansion coefficient in a direction parallel to the film plane is adjusted to 25 ppm / or less. 5. The method for manufacturing a circuit board for a luminous body, such as the scope of the patent application, which uses the above-mentioned liquid crystal south molecule of the thermotropic liquid crystal polyester. In the method for manufacturing a circuit board for a light-emitting body, in a circuit pattern forming step, a metal foil roughened at least on a surface of the liquid crystal fluorene molecular film side is pasted and etched 2226-6928-PF 55 200534513 for engraving In addition, a metal circuit pattern is formed. 7. The manufacturing method of the luminous body circuit board as described in the patent application scope Nos. ^ 2, 3, Φ A, c 5 times and 6 times, wherein in the circuit pattern forming step, a Γ shape is formed = taking into account the formation of the recess in the next step Distorted metal circuit pattern made of stretched concrete. 8. The method for manufacturing a circuit board for a luminous body according to item 7 of the patent application ', wherein a metal circuit pattern having an expansion and contraction allowance for deformation when a recess is formed is formed into a zigzag shape in a plan view. 9. The method for manufacturing a circuit board for a light-emitting body according to item 8 of the scope of the patent application, wherein the zigzag shape in plan view is made substantially symmetrical. 10. The method for manufacturing a circuit board for a light-emitting body according to item 丨 of the patent application, wherein in the recess forming step, the liquid crystal polymer molecular chain is re-aligned at a part or all of the wall surface of the recess and its vicinity. 11 · If the method of manufacturing a circuit board for a luminous body according to item 丨 of the patent application, wherein in the circuit pattern forming step, the proportion of the area occupied by the metal circuit pattern which should be the part of the wall surface of the recess in the next step is before molding In the state of 20% to 90%. 12 · —A kind of circuit substrate precursor for a luminous body, characterized in that: a metal circuit pattern is formed on a surface of a liquid crystal polymer film; and at least one pair of electrode predetermined portions for a light emitting element should be stored in the circuit pattern. The predetermined portion is connected to other circuits in the substrate through the conductive circuit, respectively; and the portion including the electrode predetermined portion is used to form the electrode predetermined portion 2226-6928-PF 56 200534513, and the bottom portion having the conductive circuit should be There is a recess on the wall surface of the conductive circuit. 13. The circuit board precursor for a light-emitting body according to item 12 of the patent application, which is used for forming a plurality of the above-mentioned recesses. 14. The circuit board precursor for a light-emitting body according to item 12 of the patent application, which has a plurality of pairs of the electrode predetermined portions. 15. For example, the circuit substrate precursor for a luminous body according to item 12 of the patent application, wherein the liquid crystal polymer film is adjusted to have a linear expansion coefficient in a direction parallel to the plane of the film to 25 ppm / ° C or less. 16. The circuit substrate precursor for a light-emitting body according to item 12 of the patent application, wherein the liquid crystal polymer is a thermally-interchangeable liquid crystal polyester. 17. The surface of at least the above-mentioned liquid crystal of the metal foil constituting the above-mentioned circuit pattern of the circuit substrate precursor for a luminous body No. 8 of the scope of application for a patent is roughened at least on the sub-film side. 18. The circuit board precursor for a light-emitting body according to item 12 of the patent application, wherein the conductive circuit has a planar shape having a stretching allowance when the liquid crystal polymer climbing film is extended and deformed. 19. The circuit substrate precursor for a light-emitting body according to item 18 of the scope of patent application, wherein the conductive circuit has a zigzag shape in a plan view. _ ○ If the circuit board precursor for a light-emitting body described in item 19 of the patent claims that the above meandering shape is substantially radial symmetrical. 21 • The area ratio of the metal circuit pattern in the part of the circuit board precursor for the luminous body, such as the item 2 of the patent application, which should be the wall surface of the above recessed portion, is 20 to 20 in the state before molding. 90%. 2226-6928-PF 57 200534513 22-A circuit board for a light-emitting body, characterized in that a recessed portion on which a light-emitting element is mounted, and a bottom surface and a wall surface. In the portion of the rigid substrate of the circuit substrate for a luminous body of any one of the scope of application for patents of the patent application, including the above-mentioned electrode predetermined portion, the conductive circuit should be formed in the recessed portion. The circuit board for a luminous body according to the item, wherein the recess is in the above. The wall surface of ρ-part or all of it, and its vicinity, realignment of liquid crystal polymer molecular chains to improve the elastic modulus. 24. The circuit board for a light-emitting body, such as the item 22 of the scope of application for a patent, wherein the circuit board for a long-length light-emitting body is rolled into a roll shape. 25. A light-emitting body characterized by having a circuit board for a light-emitting body in accordance with claim 22 of the scope of patent application. 26. The light-emitting body according to item 25 of the scope of patent application, wherein a heat-radiating device is provided on the side opposite to the circuit pattern forming surface of the circuit board for the light-emitting body. 2226-6928-PF 58