CN100459191C

CN100459191C - Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body

Info

Publication number: CN100459191C
Application number: CNB200580008026XA
Authority: CN
Inventors: 芦贺原治之
Original assignee: Japan Gore Tex Inc
Current assignee: Japan Gore Tex Inc
Priority date: 2004-03-17
Filing date: 2005-03-08
Publication date: 2009-02-04
Anticipated expiration: 2025-03-08
Also published as: TW200534513A; CN1930696A; WO2005088736A1; JPWO2005088736A1; KR20070026393A; KR101062935B1; JP4163228B2

Abstract

A circuit board precursor for light emitting body capable of forming a recess having a bottom face including a part for mounting a light emitting element while reducing the weight and thickness, a circuit board for light emitting body in which a recess is formed, a method for producing the same, and a light emitting body having a board in which a recess is formed. The method for produce a circuit board for light emitting body is characterized by comprising a step for forming, on the surface of a liquid crystal polymer film, a metal circuit pattern having at least a pair of the scheduled electrode parts of the light emitting element each connected with other circuits in the board through a conductive circuit, and a step for forming, at a part including the scheduled electrode parts, a recess having a bottom part where the scheduled electrode parts and the conductive circuit should exist, and a wall face where the conductive circuit should exist.

Description

Luminous element with the manufacture method of circuit substrate, luminous element with precursor of circuit board and luminous element with circuit substrate and luminous element

Technical field

The present invention relates to be used for element mounted and form the manufacture method of the circuit substrate of luminous element, precursor, this circuit substrate and the luminous element of this circuit substrate.And, in this specification, so-called " luminous element circuit substrate " is meant the circuit substrate that is used for forming by element mounted luminous element, and so-called " luminous element precursor of circuit board " is meant by dimensional topography and becomes the recess of element mounted to become the material of luminophor circuit substrate.So-called " light-emitting component " is meant luminescent substances (semiconductor substance) such as GaAlAs itself, and so-called " luminous element " is meant this light-emitting element chip is welded on the electrode part of circuit substrate, the material (light-emitting diode or LED) that gets with the transparent resin sealing.In addition, so-called chip LED is meant and is used as the LED that chip part is made.

Background technology

As the method for making of the so-called chip LED that has carried light-emitting component, be method as follows in the past.(i) on each position of continuous lead frame, utilize methods such as stamping-out or etching to offer the hole, utilize injection molding method (insertion forming process) to form the shell of stable on heating thermoplastic resin system at this place.(ii) use chips welding paste etc. that light-emitting component is installed at this housing department, by utilizing the lead-in wire bonding method that light-emitting component is connected with other electrode with after external circuit is connected, use transparent sealing resin that this light-emitting element part and environment are insulated.(iii) cut off and form product according to each independent chip LED.In addition,, prepared to carry out the plastic banded shell that embossing is recessed into shape in addition, inserted chip LED one by one, enclosed with band in order to make the property handled good.In addition, the convenience during for use in tinuous production thereafter also has the situation of it being made product with the form of reeling.

But in the described method for making, the connecting airtight property of lead frame and thermoplastic resin enclosure is not good, the problem that has sealing resin to spill from their interface.In addition, owing to insert shaping, so manufacturing process's complexity, productivity is not good yet.In addition, under as described above with the situation of inserting the formal productization in the banded shell,, therefore the problem that produces cost of idleness and discarded object is arranged because this shell goes out of use.

Described problem for the manufacturing that solves chip LED has proposed various technical schemes.For example, open in the flat 1-283883 communique the spy, announcing has following chip LED, that is, the electrode part of space pattern that has been provided with plating in this concave surface portion of the reflective coating with concave surface has been carried light-emitting component on this electrode part.In this communique,, compare, can reduce manufacturing cost, and can solve the problems such as sealing resin leakage between lead frame and the reflective coating with the chip LED that utilizes insertion forming process in the past according to this technology.

In addition, open in the flat 6-350206 communique the spy, following circuit substrate for solid configuration has been proposed, promptly, comprising that the once-forming body is shaped and the surface of the once-forming body at the interface of integrated secondary forming body with being inserted into, the circuit pattern that formation is made by electric conducting material, in the part that does not have the secondary forming body, the part of this circuit pattern is exposed.This spy opens in the flat 6-350206 communique, open the technology of flat 1-283883 communique for described spy and point out following problem, promptly, owing to be roughly to implement plating on comprehensively in the face side of circuit substrate, so tendency that has cost and plating area to raise pro rata, finishing in the product after element mounted in addition, because the electrode pattern of the part that is covered by sealing resin does not expose, therefore when handling or light-emitting component can bring damage etc. when installing and might produce the broken string etc. of electrode pattern.In addition; open the technology that flat 6-350206 communique is announced according to the spy; owing to utilize the major part that the secondary forming body can the protective circuit pattern; therefore can avoid the problems such as broken string of electrode pattern; in addition, the high problem of cost that is caused by the increase of plating area also can solve by resin used in the secondary forming body is made as specific constituting.

On the other hand, the circuit substrate (for example the spy opens flat 11-54863 communique, the spy opens flat 11-204904 communique and the spy opens flat 11-298050 communique) used as the LED of matrix with metal-cored (metallic plate) has also been proposed.These circuit substrates are after being located at insulating barrier (stable on heating thermoplastic resin) surface on metal-cored and having formed printed circuit, utilize the embedding mould of formpiston and former and have formed the substrate of depression (described recess).In these communiques, the breakage of the printed circuit when preventing that this is recessed to form has been announced shaping angle etc. has been carried out the technology of handling.

In addition, the technology of the breakage of the circuit when being used to prevent to be shaped has the spy to open the technology of being put down in writing in the flat 3-204979 communique.According to this technology, by the stress between the solar cell device that will utilize inner lead to connect between the solar cell device, be absorbed in when make the solar module distortion.

In addition, the spy opens in the flat 5-283849 communique, in the manufacture method of solid forming circuit board, announces the technology of the cut-out be useful on the conducting channel when preventing to carry out concavo-convex figuration etc.Specifically, at transfer printing circuit on the thermoplastic resin and after forming the once-forming circuit board, after with the variant part heating, perhaps before the once-forming circuit board body cooling of injection moulding, with concavo-convex figuration.

In addition, open in the flat 11-307904 communique, record the distribution thin slice incorporate method when the die forming of the three-dimensional body that is formed from a resin that to be pre-formed Wiring pattern the spy.

But, open the technology of flat 6-350206 communique according to described spy, to insert forming process integrated with once-forming body and secondary forming body owing to need to utilize, and therefore the productivity for the problem of the technology of opening flat 1-283883 communique as the spy improves still unresolved.

In addition, open the technology and the special common problem of technology of opening flat 6-350206 communique of flat 1-283883 communique, the following fact is arranged as the spy, that is, and after the stage that circuit pattern is set on the substrate that light-emitting component is installed is shaping at substrate.Consequently, must form circuit pattern with the form fit ground of complexity after being shaped, this operation is difficulty very.In addition, though the plating method of in these communiques, being announced (electroless plating covers method), utilize the circuit pattern forming method of transfer printing in addition, still be not easy, particularly in fine circuit, be difficult to form pattern with high precision yet on the substrate after the shaping, form circuit pattern.

On the other hand, the spy opens in the technology of flat 11-54863 communique etc., has carried out the method that recess forms behind the circuit pattern owing to adopted being pre-formed, and therefore just can realize the pattern formation that ratio of precision is higher.But the circuit substrate of being announced in these documents is the metal substrate that is provided with insulating barrier in fact, and following problem is arranged.Because used metal-cored thickness reaches 0.6～1.2mm in the technology of these communiques, so the thickness of chip LED or weight will increase.In addition, even will in small-sized chip LED purposes, form recess, since metal-cored very thick, the therefore impossible recess that forms small-sized and sharp-pointed shape.

In addition, the spy opens in the flat 5-283849 communique technology, in transfer printing in advance in polybutylene terephthalate (PBT) thermoplastic resins such as (PBT) behind the circuit, form.But, this technology can't be applied in the liquid crystal polymer film.In this technology, by with variant part heating, or before the resin cooling, form the cut-out of the circuit when preventing concavo-convex shaping the etc.But, not only need to be used for the cost of heating arrangements, and in liquid crystal polymer film, when being shaped with the degree that can realize distortion when keeping whole shape, sequential is difficulty very.In fact, in this communique, being used as circuit board material illustrative is PBT only, without any the record of liquid crystal polymer film.

In the technology of Te Kaiping 3-204979 communique, though by will connecting broken string when preventing to be out of shape etc. with inner lead between the element, yet owing to wherein need operation that element is connected one by one, so this method is not suitable for a large amount of synthetic.If still wish a large amount of synthesizing, then circuit should be printed on the surface plate.

And the spy opens in the technology of flat 11-307904 communique, though after having formed Wiring pattern on the liquid crystal polymer film, form, do not recognize the problems such as broken string that when being out of shape, produce fully with the scope that comprises this Wiring pattern.If see the accompanying drawing in this communique, then Wiring pattern exists only in the position of not following distortion as can be known.

In addition, use in recent years in the luminous element of LED, the requirement (the backlight liquid crystal display lamp of portable phone etc.) of miniaturization is arranged.But, open in the circuit substrate of flat 11-54863 communique etc. spy as metal substrate (metal core substrate), because of the weight of chip LED or thickness increases and the aspect of the formability (to the formability of sharp-pointed shape) of recess, can't adapt to the requirement of miniaturization fully.In addition, can't form the band-type product of the flexibility of having made spool and so in order to improve the property handled etc., and compare totally unfavorable as the situation of substrate with film resin.

In addition, consider that the circuit substrate that preferably will possess the long size at a plurality of positions that should element mounted is made continuously from the viewpoint of the high efficiency of the production of circuit substrate.This be because, go for the long substrate of circuit pattern, under the situation of making the short substrate of circuit pattern, also can use in addition making the back severing continuously.Making under the situation of luminous element to grow size, can by again on the design attitude on the circuit substrate continuously element mounted improve productivity.But, the circuit substrate of this duration size is required to be wound into web-like and handles, yet special open the circuit substrate of being announced in the flat 11-54863 communique etc. owing to have core metal sheet near the thickness of 1mm, therefore not good aspect flexible, can not be wound into web-like with the curvature of common degree.In Te Kaiping 5-283849 number the technology, the thickness that circuit board is acquired a certain degree of having to forms in the method for jog in the time of this external injection moulding, is difficult to make continuously.

Summary of the invention

The present invention finishes in view of described situation, its purpose is, the recess that can realize having the bottom surface at the position that comprises element mounted forms, and provide the luminous element that can also realize lightweight, thin-walled property with precursor of circuit board and the luminous element that formed recess with circuit substrate and manufacture method thereof and luminous element with the substrate that has formed recess.

The luminous element of the present invention that can reach described purpose is to comprise with the feature of the manufacture method of circuit substrate:

On the liquid crystal polymer film surface, form the operation (below be called " circuit pattern formation operation ") of following metallic circuit pattern, that is, have the electrode reservations of 1 pair of light-emitting component at least, these electrode reservations are connected via other the circuit in conducting channel and the substrate separately;

At the position that comprises these electrode reservations, form the operation (below be called " recess formation operation ") of following recess, that is, have the bottom that should have these electrode reservations and this conducting channel, the wall that should have this conducting channel.Here, in " being connected " with other the circuit in the substrate, comprise with substrate in the part ways of connecting that can be connected with external circuit.

In addition, luminous element of the present invention with the feature of precursor of circuit board is, is the material that is formed with metal circuit pattern on the liquid crystal polymer film surface,

In this circuit pattern, exist should element mounted at least 1 pair of electrode reservations, these electrode reservations are connected via other the circuit in conducting channel and the substrate separately,

And be at the position that comprises these electrode reservations, form the recess of the wall that has the bottom that should have these electrode reservations and this conducting channel, should have this conducting channel and the substrate that uses.The definition that " connects with other the circuit in the substrate " is identical with described content.

Luminous element of the present invention with the feature of circuit substrate is, be at the position of described luminous element with comprising of precursor of circuit board of described electrode reservations, be formed with should element mounted recess, and described conducting channel is present in the bottom surface of this recess and the substrate on the wall.

The feature of luminous element of the present invention is to have described luminous element circuit substrate.

And said among the present invention " film " also comprises the notion of so-called thin slice.

Description of drawings

Fig. 1 is the vertical view of expression luminous element of the present invention with an example of precursor of circuit board (tabular).

Fig. 2 is that expression has been given the vertical view of the luminous element of the present invention of given shape with an example of precursor of circuit board (tabular) to conducting channel.

Fig. 3 is illustrated in to have carried out luminous element that recess the forms vertical view with circuit substrate in the substrate of Fig. 2.

Fig. 4 is the I-I line profile of Fig. 2.

Fig. 5 is the II-II line profile of Fig. 3.

Fig. 6 is an expression luminous element of the present invention of conducting channel having been given given shape with other the vertical view of example of precursor of circuit board (tabular).

Fig. 7 is the vertical view that luminous element of the present invention used in the planar luminous element of expression is used an example of precursor of circuit board.

Fig. 8 is the profile of an example of expression luminous element of the present invention.

Fig. 9 is the profile of an example that expression has possessed the luminous element of the present invention of cooling mechanism.

Figure 10 is the vertical view of the etched pattern of the substrate of made among the expression embodiment.

Figure 11 is the enlarged drawing that the recess of Figure 10 forms reservations.

Figure 12 is the profile of the recess shapes of the substrate of made among the expression embodiment, is the profile of the II-II line of Figure 11.

Figure 13 is the vertical view of the etched pattern of the substrate precursor of made in the expression experiment 3.

Figure 14 is the enlarged drawing that the recess of the substrate precursor (slit is arranged in conducting channel) of made in the experiment 3 forms reservations.

Figure 15 is the enlarged drawing that the recess of the substrate precursor (not having slit in conducting channel) of made in the experiment 3 forms reservations.

Figure 16 is the substrate precursor of made among the embodiment 6, (a) is to overlook for the shape of complications and with central angle: 180 ° of recesses with the elongation that is essentially radial symmetry form the enlarged drawings of reservations.Oblique line portion be should element mounted electrode part (electrode reservations).(b) be the profile of the A-A ' direction of the Figure 16 (a) when on this substrate precursor, having formed recess.(c) be the birds-eye view of this recess.But, for convenience, having omitted the circuit pattern of side at the moment, solid line portion is illustrated in the part of being out of shape when recess is shaped, and dotted line part is represented indeformable part.

Figure 17 has to overlook for the shape of complications and with central angle: 90 ° of circuit with elongation of radial in fact symmetry, the recess that can carry a plurality of (2 or 3) light-emitting component forms the enlarged drawing of reservations.

Figure 18 has to overlook for the shape of complications and with central angle: 120 ° of circuit with elongation of radial in fact symmetry, the recess that can carry a plurality of (2 or 3) light-emitting component forms the enlarged drawing of reservations.

Figure 19 is the figure of an example of the expression circuit diagram that is used for showing " 8 " word.

Figure 20 is the enlarged drawing of Figure 19.

Figure 21 has utilized the recess of Figure 16 to form the parts of reservations, is that expression can be used for luminous element that the planar luminous element of dot matrix the uses figure with precursor of circuit board.

Figure 22 is that the figure of the luminous element of Figure 21 with the planar luminous element of precursor of circuit board making used in expression.

Figure 23 is the figure of expression luminous element of the present invention with an example of precursor of circuit board.Like this, with after growing size and having made the substrate precursor, can be on the position arbitrarily of block unit suitably cutting use.

Figure 24 is the figure of the state when seeing the planar luminous element that in fact uses Figure 22 from the back side.

Wherein, 1: luminous element precursor of circuit board, 2: the electrode reservations, 3: conducting channel, 4: the circuit of other in the substrate, 5: liquid crystal polymer film, 6: sprocket, 7: slit, 8: the recess bottom surface, 9: recess wall, 10: light-emitting component, 11: the lead-in wire bonding, 12: sealing resin, 3: luminous element, 14: heating panel, 15: cold-producing medium passes the hole, and 16: guide hole

Embodiment

According to luminous element according to the present invention manufacture method, can realize the formation of fine and the circuit pattern that precision is high, the formation of recess and luminous element lightweight, thin-walled property with circuit substrate with position that should element mounted with circuit substrate.In addition, luminous element is very useful with the manufacturing intermediate of circuit substrate as manufacture method of the present invention and luminous element with precursor of circuit board.In addition, luminous element of the present invention with circuit substrate owing to can make banded substrate, therefore can realize the continuous manufacturing of luminous element, can improve the productivity of luminous element, can also carry out the luminescent inspection of each luminous element in addition simply, the manufacturing of planar in addition luminous element or display unit also becomes easy.

In addition, luminous element of the present invention as mentioned above, can easily take mode as planar luminous element or display unit, and has the circuit substrate of the present invention that the liquid crystal polymer film by thin thickness constitutes, therefore by the opposing face side that forms face at circuit pattern cooling mechanism is set, just can will discharges effectively by the heat that luminous element produces via this thin polymer film.

Among the present invention, when the luminous element that obtains to have formed the recess with the bottom surface that comprises position (following be called sometimes " light-emitting component equipped section ") that should element mounted is used circuit substrate, use is made of liquid crystal polymer film, and be pre-formed the flat luminous element precursor of circuit board of metal circuit pattern, carry out recess thereon and form, have maximum feature in this.

Open flat 1-283883 communique for described spy, as mentioned above, on having the substrate of recess, form in the method for circuit pattern, be difficult to form fine circuit pattern with high accuracy.Therefore, among the present invention, by on flat substrate, being pre-formed circuit pattern, it is shaped, and can realizes that circuit pattern fine and that precision is high forms.

In addition, by constituting substrate with liquid crystal polymer film, then can not use and form the different reinforcement of the metal level of usefulness with circuit pattern (spy opens such metal-cored of the circuit substrate announced in the flat 11-54863 communique etc. with metallic plate, particularly thickness is 0.6～metallic plate about number mm), and realize shaping (recess formation) after circuit pattern forms.As mentioned above, in the Te Kaiping 11-54863 communique etc. such use in the metal-cored circuit substrate of heavy wall, aspect the increase of weight and formability difference, the material that can not form long size in the increase because of thickness is disadvantageous aspect being wound into that web-like handles in addition.On the other hand, open in the resin substrate in the past of the circuit in the flat 1-283883 communique the spy, the thickness of resin part is big, is unfavorable for the shaping after circuit pattern forms.In addition, in semiconductor applications, as film substrate [for example TAB (Tape AutomatedBonding) substrate], known polyimide substrate, yet it is owing to be that hardenite by the thermosetting polyimides constitutes, therefore can not realize that in fact the recess of substrate of the present invention forms such deformation processing that is accompanied by extension, i.e. plastic deformation.

In addition, constituting with the thermoplastic resin membrane under the situation of substrate, the heat of the soldering during because of element mounted etc. also has the problem of base plate deformation, and among the present invention, by selecting the liquid crystal polymer of excellent heat resistance, just can eliminate this kind problem.

In addition, polyether-ether-ketone resin (PEEK resin) waits in other the thermal endurance thermoplastic resin, and the linear expansivity of resin monomer is big, with the situation of metal-clad under be easy to generate warpage.In order to prevent this situation, the filling of filler or polymer alloyization etc. have been attempted.But, in these improved resin, the unfavorable aspect of fine formability difference is arranged also.On the other hand, not only linear expansivity is low for liquid crystal polymer used among the present invention, and fine formability is also good.

Below, will each formation and the luminous element of the present invention of substrate of the present invention be described in detail.

＜liquid crystal polymer film 〉

The liquid crystal polymer that constitutes liquid crystal polymer film is stable on heating thermoplastic resin, and the TLCP that shows liquid crystal liquid crystal property under molten condition is for example arranged.Preferred TLCP among the present invention, more particularly, preferred thermotropic liquor polyester or thermotropic liquor polyester acid amides.

So-called thermotropic liquor polyester (being designated hereinafter simply as " liquid crystal polyester ") is meant, for example the aromatic polyester that is synthesized based on monomer such as aromatic dicarboxylic acid and aromatic diol or aromatic hydroxy-carboxylic is the material that shows liquid crystal liquid crystal property when fusion.

As its representational material, can enumerate by P-hydroxybenzoic acid (PHB), terephthalic acid (TPA), 4, the I type [following formula (1)] that 4 '-xenol is synthetic and by PHB and 2, the synthetic II type [following formula (2)] of 6-hydroxynaphthoic acid, the III type [following formula (3)] that synthesizes by PHB and terephthalic acid (TPA), ethylene glycol.

As liquid crystal polyester, though any one of I type～III type can, yet consider from the aspect of thermal endurance, dimensional stability, preferred Wholly aromatic polyester (I type and II type), consider and to realize unleaded soldering (for example under 260 ℃, implementing), and the aspect that the recess formability is also good, the liquid crystal polyester of preferred especially I type.

In addition, as liquid crystal polymer of the present invention, so long as show the material of liquid crystal liquid crystal property (particularly thermotropic liquid crystal), then for example also can be based on the unit shown in the formula of described (1)～(3) (for example in whole formations unit of liquid crystal polymer, account for 50 moles more than the %), also have the polymer of copoly type of other unit.As other unit, for example can enumerate unit, unit, have the unit of amido link etc. with imide bond with ehter bond.

In order to obtain liquid crystal polymer film, as long as adopt and the corresponding known the whole bag of tricks of resin that constitutes it.In addition, in the inventive method,, for example can use the commercially available products such as " BIAC (registered trade marks) " of JAPNA GORE TEX Co., Ltd. system as the film that has used particularly preferred described illustrative liquid crystal polyester.

In addition, the liquid crystal polyester acid amides is equivalent to have as other unit the described liquid crystal polyester of amido link, for example can enumerate the material of the structure with following formula (4).For example, in the formula (4), the mol ratio of known s unit, t unit and u unit is 70/15/15 material.

In addition, in liquid crystal polymer film, also can use the polymer alloy that contains described liquid crystal polymer.Under this situation, as mixing with liquid crystal polymer or chemically combined alloy polymer, can enumerate fusing point is more than 220 ℃, preferred 280～360 ℃ polymer, for example polyether-ether-ketone, polyether sulfone, polyimides, Polyetherimide, polyamide, polyamidoimide, poly-aryl esters etc., however be not limited to them certainly.Liquid crystal polymer and described alloy are not particularly limited with the mixed proportion of polymer, yet for example represent preferred 10: 90～90: 10 with mass ratio, more preferably 30: 70～70: 30.The polymer alloy that contains liquid crystal polymer can keep the excellent characteristic of liquid crystal polymer.

In the described liquid crystal polymer film, the coefficient of linear expansion of the direction parallel with thin film planar preferably is adjusted to below 25ppm/ ℃.More preferably below 21ppm/ ℃.In addition, the preferred 8ppm/ of the lower limit of the described coefficient of linear expansion of liquid crystal polymer film ℃.The coefficient of linear expansion of liquid crystal polymer film is to utilize Instrumental Analysis (TMA) method, the test film width is made as 4.5mm, distance is made as 15mm between chuck, load is made as 1g, after being warmed up to 200 ℃ (programming rate: 5 ℃/minute) from room temperature, during with 5 ℃ of/minute coolings of cooling rate, the value of trying to achieve according to the change in size of test film from 160 ℃ to 25 ℃ of period detectings, for example MD direction of film (direct of travel during thin film fabrication) and TD direction (with the direction of MD direction quadrature) if any one of coefficient of linear expansion satisfy described scope.

In the circuit substrate of the present invention, form recess being provided with on the flat substrate of circuit pattern.With thermoplastic film, when applying metallic circuit thereon carries out three-dimensional together, if made up the big material of the difference of coefficient of linear expansion, then the part of the metallic circuit on film just is easy to generate warpage or problems such as distortion, concave surface.In addition, under this situation, though determine according to the thickness of film and metal or modulus of elasticity etc., also might cause in stage and to curl or warpage film and metal-clad.

For example, at the liquid crystal polymer film that satisfies described coefficient of linear expansion except replacement, use coefficient of linear expansion as beyond 56ppm/ ℃ the Polyetherimide film, have in the circuit substrate of the formation identical with the present invention, the inventor confirms, when carrying out recess under the temperature about 340 ℃ when forming, the metallic circuit part on the Polyetherimide film then produces the warpage, distortion, concave surface of described part etc.

The coefficient of linear expansion of desirable metal is generally (being 16.2ppm/ ℃ for copper for example) about 3～30ppm/ ℃ the used metal level in the formation of circuit pattern.Like this, if have the liquid crystal polymer film of the following coefficient of linear expansion of described higher limit, then because little, therefore in recess forms with the difference of the coefficient of linear expansion of metal level, at the exposed division of liquid crystal polymer film, the generation of aforesaid problem is suppressed efficiently.But the used preferred coefficient of linear expansion of metal is as far as possible near the material of liquid crystal polymer film among the present invention.

In liquid crystal polymer film, when coefficient of linear expansion is adjusted as described above, as long as the polymer molecular chain in this film is orientated randomly along the thin film planar direction.Specifically, can adopt following method, that is, temporarily utilize extrusion by melting to make the film of high one-way orientation, with it along TD direction uniaxial extension, or along the method for MD direction and the two-way extension of TD direction.The method for making of so having been adjusted the liquid crystal polymer film of coefficient of linear expansion at length is published in the spy and is opened in the flat 10-294335 communique.

And therefore liquid crystal polymer film of the present invention preferably possesses and can improve the reflection of light rate owing to also undertake effect as the shell of luminous element, with the light that sends effectively to the formation of outside output.Specifically, recommend liquid crystal polymer film is made as the color of reflection of light rates raisings such as white or silver color.When giving this kind color to liquid crystal polymer film, for example can adopt in liquid crystal polymer mixing after coloring pigment (titanium dioxide powder etc.) etc., carry out the method for filming.

Though the thickness of liquid crystal polymer film needs only basis the desired size of luminous element is suitably selected, yet more than for example preferred 10 μ m, more preferably more than the 50 μ m, below the preferred 3mm, more preferably below the 1mm.When thickness is crossed when thin, then in circuit substrate, be easy to generate in forming and break or fold at recess, practicality reduces.On the other hand, when thickness is blocked up, cooling mechanism (describing in detail in the back) then is set after having formed luminous element, thermal discharge efficiency in the time of will going out from the hot type that light-emitting component sends via liquid crystal polymer film reduces, in addition because saturated by adding the effect (raising of mechanical strength etc.) that thick film gets, therefore can use unnecessary material on the contrary, unfavorable aspect cost or lightweight.For example, for the such small-sized luminous element purposes of the chip LED that was widely used in the past, even the thin liquid crystal polymer film (for example following degree of 200 μ m) in the middle of the described thickness also can adapt to.On the other hand, be under the situation among the bigger LED more than the diameter 5mm being applied to the light-emitting component equipped section, even in described scope, also recommend to use slightly thick liquid crystal polymer film.

＜circuit pattern 〉

The circuit pattern of precursor of circuit board of the present invention or circuit substrate forms in the reservations at the recess that becomes the light-emitting component equipped section, has 1 pair of electrode reservations at least, has other the circuit that is connected with these electrode reservations.Here " circuit of other in the substrate " comprise the part that can be connected with external circuit in the substrate.In described other circuit, the position of the electronic unit beyond the element mounted can be set also.Among the present invention, owing to after having formed circuit pattern on the plane liquid crystal polymer film, carry out three-dimensionally formed, therefore with in the look-ahead technique of carrying out three-dimensionally formed back formation circuit pattern compare, can more easily carry out the formation of complicated and fine circuit pattern.

Circuit pattern is a metallic, for example on the liquid crystal polymer film surface metal level is set, and forms by this metal level being implemented etching etc.Formation method as metal level, except method, can also adopt on the liquid crystal polymer film surface and utilize vacuum vapour deposition or sputtering method, ion implantation, plating method, CVD method to wait the method that forms liquid crystal polymer film and metallic plate (comprising metal forming, metallic film etc.) applying.

As the method with liquid crystal polymer film and metallic plate applying, preferred hot melt connection.As the hot melt connection, can adopt the thermoplasticity of utilizing liquid crystal polymer, with this film stack aspect thermoplastic, the stacked method of cooling off behind the metallic plate on this face, or it is liquid crystal polymer film and metallic plate is overlapping, it is passed between warmed-up 1 pair roller and make it thermal welding, the method for cooling off thereafter etc.

In addition, if use, then can further improve the connecting airtight property of liquid crystal polymer film and circuit pattern with the material behind the surface coarsening that contacts a side at least with described liquid crystal polymer film of metallic plates such as metal forming.That is, if with the surface by alligatoring metal forming etc. utilize after being crimped on the liquid crystal polymer film etching etc. to form circuit, then the surface of the part that has been removed such as metal forming also can be by alligatoring.Consequently, with the connecting airtight property raising of sealing resin, it is bad to reduce product.Be not particularly limited though be used to form the degree of the alligatoring on the metallic plate of circuit or liquid crystal polymer film surface, be expressed as about 1～15 μ m yet for example can be made as with Rz.This is because if Rz more than 1 μ m, then can expect to produce effect, if particularly be more than the 8 μ m, then as described later shown in the embodiment 8, confirmation can be brought into play the bonding force above copper foil surface.

Metal as constituting metal level is not particularly limited, the alloy [stainless steel (SUS), lead frame with copper class alloy, 42 alloys (42%Ni-Fe alloy) etc.] etc. that can enumerate copper, aluminium, tin, silver, gold, platinum, zinc, iron and contain these metals.Metal level both can be a monolayer constructions will, also can be stacked the stromatolithic structure of the different metal more than 2 kinds.Stacked method also is not particularly limited, for example can adopt following method etc., promptly, after liquid crystal polymer film and metallic plate are fitted, utilize at this metal sheet surface settings such as vacuum vapour deposition or sputtering method, ion implantation, coating method, CVD method by with the metal level that the metal variety classes constitutes that constitutes of metallic plate.Though constitute the metal of metal level as long as suitably select, yet for example consider, preferably the approaching metal of coefficient of linear expansion of the selection wire coefficient of expansion and liquid crystal polymer film from the viewpoint that improves formability according to purpose.

Be used to form more than for example preferred 1 μ m of metal layer thickness of electronic circuit of the present invention, more preferably more than the 5 μ m, below the preferred 500 μ m, more preferably below the 50 μ m.When metal layer thickness is crossed when thin, then not good as the reliability of circuit, carry out recess on this external substrate when forming, have because of being subjected to the situation that slight tension force breaks.On the other hand, when metal layer thickness is blocked up, then utilize the formation of the circuit pattern that etching etc. the carries out difficulty that to become, also have the impaired tendency of formability when on substrate, forming recess in addition.

The part of this metal level is removed, form circuit pattern.As its method, preferred known etching method.As etching method, for example can enumerate following method, promptly, the mode of utilizing known photoetching process to expose according to the part of removing that makes metal level in the layer on surface of metal setting has formed the photoresist film of pattern, use can the dissolution of metals layer liquid (for example if the alloy-layer of copper class, then be ferric chloride in aqueous solution etc.), after this exposed division dissolving of metal level removed, this photoresist film is removed.Photoresist resin, the lysate of metal level, the formation condition of removing liquid, photoresist film of photoresist film or the dissolution conditions of metal level etc. used in the etching are not particularly limited, and the circuit pattern that can maybe will form according to the raw material of metal level is suitably selected.

Circuit pattern is made as following structure,, at least 1 pair of electrode reservations is set in the light-emitting component equipped section that is, and these electrode reservations are connected via other the circuit (comprise be used for external circuit connection terminals etc.) in conducting channel and the substrate respectively.Have in formation under the situation of circuit of this splicing ear, the mechanical strength for this splicing ear portion of improving substrate of the present invention as required, also can attach stiffener to strengthen in the part at the circuit back side.As the material of this stiffener, can use liquid crystal polymer or polyimides etc.Represented the example of luminous element of the present invention among Fig. 1 with precursor of circuit board.1 is the luminous element precursor of circuit board, and 2 is the electrode reservations, and 3 is conducting channel, and 4 is other the circuit in the substrate, and 5 is liquid crystal polymer film.The luminous element of Fig. 1 is the mode with a plurality of 1 pair of electrode reservations 2,2 (being the light-emitting component equipped section) with precursor of circuit board 1.Electrode reservations 2,2 are connected via other the circuit 4,4 in conducting channel 3,3 and the substrate respectively.And, though electrode reservations 2 are not necessarily clear with the boundary of conducting channel 3, yet can will should be called the electrode reservations in the place of the end of conducting channel 3 element mounted.

Among Fig. 1, the excision preset lines of dotted line when luminous element used separately when forming final products in element mounted etc., is that benchmark is cut at essential position with this dotted line part.In addition, 6 sprockets (describing in detail in the back) for substrate conveying usefulness.

In addition, the luminous element of Fig. 1 with precursor of circuit board in each recess, have 1 pair should element mounted the electrode reservations, in continuous circuit substrate, have the formation reservations of a plurality of recesses.Under the situation that forms a plurality of light-emitting components lift-launchs position like this, just can make the luminous element circuit substrate and the luminous element of long size continuously by form recess at each position, its severing can be used (with reference to Figure 19 and Figure 23).

For example the light-emitting component that is carried in recess is under 1 the situation, the electrode reservations are 1 pair and get final product, yet for example the light-emitting component more than 2 is being equipped under 1 situation in the recess (for example in order to send whole three primary colors of light, in 1 recess, carry red, blue, the situation of green 3 light-emitting components etc.), in recess, the electrode reservations of the number that just needs corresponding with the number of the light-emitting component that is carried are (for example under the situation of carrying 2 light-emitting components, be 2 pairs of electrode reservations, under the situation of carrying 3 light-emitting components, be 3 pairs of electrode reservations etc.).

And, for example in 1 pair of electrode reservations, in a side electrode reservations, dispose light-emitting component, the electrical connections such as lead-in wire bonding of the opposing party's electrode reservations and light-emitting component.Like this, in 1 recess, carry under the situation of a plurality of light-emitting components, though being used for directly disposing the electrode reservations of light-emitting component need be corresponding with the number of the light-emitting component that carries, however sometimes also can be shared in a plurality of light-emitting components by the electrode reservations that are connected with light-emitting component with lead-in wire bonding etc.Like this, under this situation, in 1 recess, by the electrode reservations of using lead-in wire bonding etc. to be connected with light-emitting component also can be less than this recess the number of the light-emitting component that should carry.That is, " 1 pair " electrode reservations are meant the group of the electrode reservations that can carry 1 light-emitting component, not necessarily will stipulate the number of electrode reservations.For example, in 1 recess, carry under the situation of 2 light-emitting components, 4 electrode reservations also can be set, and for a plurality of situations, owing to can have 1 electrode reservations by 2 light-emitting components, therefore 3 electrode reservations are set as long as form predetermined position at each recess.Similarly, in 1 recess, carry under the situation of 3 light-emitting components, 4 electrode reservations are set as long as form predetermined position at each recess.

For circuit pattern, the remaining area that is preferably designed as metal level is big as far as possible.Because the remaining area of metal level is big more, then the stiffening effect of substrate is just high more, therefore will become the high substrate of intensity.In addition, as described later, because light-emitting component radiates heat when luminous, therefore preferably it is discharged, the remaining area of metal level is big more, and then this metal level (circuit) will be high more to the effect of dispersing of heat.In addition, from improving intensity, realize that the viewpoint that stable continuous is produced considers, also residual in the used sprocket portion when being preferably in continuous production have a metal level.Because it is the processing of the part beyond such circuit can utilize etching method and circuit pattern side by side to form, therefore very favourable.

In addition, when luminous element is few with the exposed portions serve of liquid crystal polymer in the recess of circuit substrate, when promptly the remaining area of metal level is big, then can obtain the light reflectivity height and the good luminous element of brightness.On the other hand, be accompanied by the formation of recess when circuit part and when shared ratio is big in the part of being out of shape, the possibility that circuit breaks uprised.So in the precursor of circuit board before forming recess, preferably the mode that reaches 20～90% (more preferably more than 45%, below 65%) according to the shared area ratio of the metallic circuit pattern of the part that makes the wall that should become recess forms circuit pattern.This is because if in this scope, then can suppress the generation of defective products when the high reflectance that utilizes the metallic circuit face partly replenishes the brightness of luminous element.

In addition, be used for conducting channel that other the circuit in electrode reservations and the substrate is connected, preferably have an elongation of having considered the distortion when liquid crystal polymer film is accompanied by the distortion of extension with plane.Metal used in the formation of circuit pattern is under the recess formation condition, owing to compare the non-constant of extensibility with liquid crystal polymer film, therefore in being located at the circuit part (being described conducting channel) at position of distortion that recess is required to be accompanied by extension in forming, being easy to generate and breaking.Even do not producing under the situation of breaking, also might be in metal level residual internal stress, reliability of products reduces.In addition, for example during with its three-dimensional, then also peeling off of coating might be taken place when implemented plating on Copper Foil after.Different with it, for described conducting channel, if give described shape, breaking of the circuit in the time of then can suppressing recess formation efficiently can obtain to have the luminous element circuit substrate of the more good recess of reliability.Particularly maximize, be provided with under the situation of bigger recess, or requiring under the littler diastrophic situation of curvature at light-emitting component or luminous element, make conducting channel have described shape guarantee that recess forms stable aspect very effective.

The way that has this elongation with " plane " is because plane circuit pattern can utilize the so common circuit pattern formation method of the tight continuous etching of Copper Foil is easily formed.In addition, do not need as with the situation of these elongations of formation such as lead-in wire, increasing operation yet.

As the shape of " elongation of the distortion when having considered that liquid crystal polymer film is accompanied by the distortion of extension " in the described conducting channel, for example can enumerate and overlook tortuous shape.Have in conducting channel under the situation of this kind shape, when liquid crystal polymer film is accompanied by the distortion of extension,, therefore just can suppress breaking of conducting channel efficiently because by drawing back tortuous interval, apparent length promptly prolongs.Like this, when recess forms thin polymer film be subjected to being accompanied by extension distortion the position (specifically, mainly be the recess wall), if design, then can prevent the breaking of circuit pattern when recess forms more efficiently according to the mode of the conducting channel that forms this kind shape.

As described " tortuous shape ", for example comprise that (these shapes all are the shapes of overlooking for so-called undulations or bellows-shaped, zigzag fashion etc.Below identical).More particularly, can enumerate the U font; The S font; The V font; Any one continuous shape such as U font, S font, V font; Any one shapes such as U font, S font, V font and its counter-rotating shape be continuous shape alternatively; The continuous shape etc. that comprises these the shape more than 2.And under the situation of continuous shape, the size or the tortuous degree of each shape (U font, S font, V font etc.) might not.In addition, under situations such as U font or S font, zigzag part both can have the right angle equal angles, also can be with curved.

In addition, in described " tortuous shape ", also comprise following shape (being designated hereinafter simply as " shape of slit "), promptly, with from other the direction of circuit of described electrode reservations in described substrate roughly on the direction of quadrature, since an end towards the other end and and the slit more than 2 of this other end of no show be provided with according to the staggered mode in the end that makes this slit.

For the situation of described shape of slit, as long as the bar number, slit separation of being located at the slit in the conducting channel can be when recess form from the length of, each slit, performance prevents the effect of breaking of conducting channel fully, just is not particularly limited.For example not necessarily be restricted to uniformly-spaced, can be according to the recess shapes that will be shaped, suitably select to alleviate fully the interval, position, length, angle of the suffered stress of in this shaping conducting channel etc.

For shape (the described undulations of overlooking to complications, bellows-shaped, zigzag fashion etc. or slit) concrete shape or size, based on current value that flows through conducting channel and metal layer thickness, for example according to the mode that when switching on, conducting channel can not blown, the width that calculates conducting channel is [for the situation of shape of slit, length (as the residual length of conducting channel) for slit], the number (situation for slit is the number of slit) that rises and falls, can be based on this calculated value, in addition according to conducting channel can being kept to stand the mode of intensity of processing of being shaped, confirm and determine through the production that utilizes real machine.For the situation of shape of slit, as a rule, the length of slit is 50% following degree when the width of conducting channel is narrow, when this width is wide, also can surpass 90%.

Among Fig. 2, represented to have possessed an example of the substrate (tabular) of conducting channel, among Fig. 3, represented in the substrate of Fig. 2, to have formed the substrate behind the recess with described shape of slit.In addition, Fig. 4 is the I-I line profile of Fig. 2, and Fig. 5 is the II-II line profile of Fig. 3.Among Fig. 2 and Fig. 3,7 is slit, and among Fig. 3,8 is the recess bottom surface, and 9 is the recess wall.In addition, among Fig. 2～Fig. 5,, will avoid repeat specification (following all identical) for each figure for the symbol identical with Fig. 1.

In flat substrate (Fig. 2), be located at described slit 7 in the conducting

channel

3,3 when having formed recess, it is broadening (Fig. 3) at interval.Like this, the prolongation of the length of the outward appearance of conducting channel 3,3 (and, because Fig. 3 is a vertical view, do not show that therefore the length of conducting channel prolongs, yet the interval broadening of slit extends to the inboard direction of figure).Like this, compare, even the conducting channel that is made of the metal of extensibility difference also can suppress it efficiently and break with liquid crystal polymer film.Prevent effect by the degree of such complications the breaking of conducting channel of bringing that diminish,, in illustrated in the above other the shape (U font etc.), also can similarly be brought into play for " tortuous shapes ".Among Fig. 6, represented to have possessed the example of substrate (tabular) of conducting

channel

3,3 of the continuous shape of the S font in the middle of the shape with such other.

In addition, the shape of the preferred radial in fact symmetry of " overlooking shape " into complications.Here so-called " radial symmetry " is meant, the center during from three-dimensional is lighted and is in equidistant pattern by with certain central angle, for example central angle: 180 °, 120 ° or 90 ° of repeated shapes.Figure 16 is that the central angle in the middle of the circuit pattern of the radial symmetry of this kind is 180 °, and Figure 17 is 90 ° for central angle, and Figure 18 is 120 ° example for central angle.If form the shape of the radial symmetry of this kind, then the power in the part of distortion will be applied on the circuit pattern as a whole equably in recess forms.Consequently, the concentrated area only is not applied to situation on the part of circuit pattern effectively, can reduce the possibility of breaking.The a kind of of concrete example of this kind mode is shown among Figure 16.In addition, the information slip that 4 electrode part will be set in 1 recess is shown among Figure 17, and the radial symmetric circuit pattern table that the situation of 3 electrodes is set is shown among Figure 18.And, here so-called " in fact " is meant, if the radial symmetric shape of the degree that can disperse in the power that recess applies to circuit pattern in forming, when then for example at one end existing, also can not strict radial symmetric shape more than 1 slit etc.

Though circuit pattern is to form on the single face at least of liquid crystal polymer film, yet also can on two-sided, form as required.On two-sided, formed under the situation of circuit pattern, can use each circuit independently, perhaps after having formed through hole, utilized the known method that embeds the through hole plated film or embed electric conducting material and so on, two circuit have been linked use.

The formation of＜recess 〉

Be provided with in the flat substrate precursor of circuit pattern on the liquid crystal polymer film surface, form recess, its have the part that should have light-emitting component equipped section (electrode reservations) and conducting channel the bottom, should have the wall of the part of conducting channel.The formation method of recess is not particularly limited, and for example can adopt the common forming process (punching formation etc.) of having used mould, vacuum forming method, extruding formation method, extrusion under vacuum method etc.Wherein, vacuum forming method or extruding formation method, extrusion under vacuum method be owing to can make mould and pattern formation face carry out recess to form with connecting airtight, therefore can prevent the damage of the circuit pattern in the recess formation etc., is favourable in this.On the other hand, if common forming process such as punching formation then has shaping position advantage more accurately.Among the present invention,, adopt more suitable method to get final product as long as according to the circuit pattern of reality or its application target etc.

The number of the recess of each substrate is not particularly limited, yet is preferably formed as a plurality of.This be because, formed a plurality of after, on the desired position, the circuit substrate severing is got final product, thereby can realize continuous manufacturing.

Shape, the size of recess also are not particularly limited, as long as be made as and required corresponding shape, size.For example generally be made as following shape, size, promptly, the peristome of recess is made as the circle of diameter 0.5mm～30mm, the diameter of recess bottom surface is made as the circle of 0.45mm～27mm, and make peristome wideer, in addition recess depths (vertical depth from the peristome to the bottom surface) is made as 0.1mm～20mm than the bottom surface.But the shape of peristome or bottom surface sections is not limited to circle, can suitably select.

Condition as the recess that forms such shape, size, for example under the situation that liquid crystal polymer film is made of I type liquid crystal polyester, can adopt following condition, promptly, in common die forming, film temperature is made as 300～350 ℃, carries out being shaped in 3～10 minutes, be cooled to the taking-up of back below 200 ℃ with 1～5MPa; In the vacuum forming method, film temperature is made as 300～350 ℃, reduce pressure below the 0.1012MPa; In the extrusion under vacuum method, film temperature is made as 300～350 ℃, pressure side is made as 0.29～0.59MPa, depressurised side is made as below the 0.1012MPa, carry out being shaped in 0.1～15 minute, be cooled to below 200 ℃ and take out.

And, in the shaping of recess,, be preferably under the inert gas atmosphere, contain in the atmosphere of reducibility gas and be shaped in order to prevent the oxidation of metal level.In air, form etc. and formed at layer on surface of metal under the situation of oxide film thereon, for example impregnated in the aqueous solution of nitric acid etc. of 4 equivalent degree,, just can easily this oxide film thereon be removed thereafter by washing fully.

When utilizing described temperature conditions, pressure condition etc. to form recess, in the position of the distortion that has been subjected to being accompanied by extension (particularly the part of the wall of recess and near), because the strand of liquid crystal polymer is orientated once more along bearing of trend, therefore modulus of elasticity improves, the shape retention of recess, i.e. cast as low viscosity resin (presclerotic sealing resin) improves with the rerum natura in the shape maintenance of shell.Like this, when the equal recess shapes retentivity of the circuit substrate of guaranteeing to improve with the modulus of elasticity that obtains of orientation once more that utilizes the liquid crystal polymer strand, can use thinner liquid crystal polymer film, lightweight, cost degradation, the thin-walled property of can realization degree higher circuit substrate.

For example, be in the I type thermotropic liquor polyester film of 100 μ m at thickness, the coefficient of linear expansion of MD direction and TD direction is adjusted in the material about 16ppm/ ℃, and its tensile modulus of elasticity is 6300N/mm ²About, and when with it when a direction is extended 2 times once more, then the tensile modulus of elasticity of bearing of trend just becomes about 1.5 times.This kind phenomenon is fairly obvious in the liquid crystal polymer film that the orientation that can utilize extension easily to carry out molecule is controlled.

In the substrate of the present invention, carrying out recess when forming, the local of recess wall and near, particularly at the meanders of recess peristome, the intersection of recess bottom surface one wall, owing to produce the distortion that is accompanied by extension, so this kind modulus of elasticity raising phenomenon is fairly obvious.Like this, though at the exposed division of liquid crystal polymer film, be imbued with flexibility as a whole, yet particularly the local of recess wall and near, because of the increase hardening of described modulus of elasticity, so the shape retention of recess improves.

The structure of＜substrate 〉

In the substrate of the present invention,, as shown in Figure 1, also preferably there is the mode of a plurality of light-emitting components equipped section except only being beyond the mode of 1 light-emitting component equipped section (that is, electrode part only is 1 pair).And the substrate shown in Fig. 1 has the sprocket 6 of carrying usefulness, as so-called TAB substrate, can realize that recess forms, the lift-launch of light-emitting component, utilize the working continuously of sealing etc. of sealing resin.

When the situation that consider to adopt the TAB substrate to implement to work continuously etc., circuit substrate of the present invention is the substrate of long size (for example banded) preferably.For example its length is recommended as more than the 0.5m, more preferably more than the 50m.Under the situation of the circuit substrate of so long size, consider from the viewpoint that the property handled is good, preferably be wound into web-like.But, can certainly make with batch.

In addition, in the substrate shown in Fig. 1, except in element mounted, after the sealing resin sealing, according to excision preset lines (dotted line part among Fig. 1) excision, to obtain a plurality of luminous elements (LED) with 1 light-emitting component beyond using, also can only cut off among Fig. 1 sprocket 6,6 up and down, as the luminous element utilization of the band shape of having carried a plurality of light-emitting components with the excision preset lines.And though in the circuit substrate of Fig. 1, it is continuous endlong that circuit spreads all over illustrated substrate, yet for example in the circuit substrate of long size, also can not form the continuous endlong circuit that spreads all over long side direction.For example, in order to obtain the circuit of a plurality of length-specifics, can on each length-specific (for example 1m etc.), repeat to form the circuit pattern of given shape, make the recurring unit of pattern separated pattern, or the circuit of different patterns is set on each length-specific, different patterns is separated.Be illustrated in an example of the pattern that has added socket among the latter among Figure 19.Figure 20 is the enlarged drawing of 1 pattern of Figure 19.In addition, as shown in figure 23, behind the repetitive of having made the circuit that can also be applied to the pattern in the display unit (dot matrix), can on the desired position, cut off and use.

Form parallel circuits in the luminous element of the band shape that obtains by the substrate of Fig. 1, by at the luminous element both ends (being left and right end portions among Fig. 1), be connected with comprising packed into the external circuit of resistance etc. of power supply ground, just can confirm luminous effectively the whole light-emitting component that is equipped on the luminous element.Like this, by connecting external circuit, the luminous affirmation inspection of the light-emitting component of fabrication stage just becomes more easy.In addition, can also utilize as the manufacturing means of planar luminous element.

In the planar luminous element in the past, on the substrate of panel shape, be arranged with a plurality of luminous elements with 1 light-emitting component, need carry out distribution soldering etc. to each luminous element, its manufacturing is very miscellaneous.But, if the luminous element of the band shape that obtains by the substrate of Fig. 1, as long as then owing to be arranged in parallel many, the end of each banded luminous element is connected with the external circuit that comprises power supply gets final product, do not need distribution soldering to each light-emitting component, therefore can by with the surface with translucent coverings such as plate, just can make planar luminous element simply, can also realize the slimming miniaturization lightweight of planar luminous element.Certainly, also can form wire luminous element or multiple spot shape luminous element.In addition, circuit can be series, parallel and their combination etc., can freely design at an easy rate.

In addition, in the substrate of the present invention, owing to can realize simultaneously that the high circuit pattern of the degree of freedom forms, recess forms two aspects, therefore can also be as the substrate utilization of planar luminous element.Fig. 7 is the example of planar luminous element with the precursor of circuit substrate.In the substrate of Fig. 7,, therefore compare, can make its manufacturing process very simple with planar luminous element in the past owing to can directly carry a plurality of light-emitting components (among Fig. 7 being 24).In addition, in the substrate of Fig. 7, owing in each light-emitting component equipped section, all have independently circuit, therefore each light-emitting component can also be connected with external circuit independently.Like this, owing to can realize lighting the adjusting of extinguishing, therefore not only can be used as simple planar luminous element, but also can realize utilizing as display unit (dot matrix) to each light-emitting component.In addition, the substrate of the application of the invention, the continuous manufacturing of such display unit also becomes more easy, can realize that not only resource is saved in the slimming miniaturization lightweight of display unit, and can obtain flexible display unit.

That is, display unit in the past (dot matrix) for example will possess 1 a plurality of units block combination to a plurality of light-emitting components independently, and integral body is kept with shell, will link from the distribution of each block.This unit block is following member, that is, be in the shaping shell of the thermoplastic resin about 10mm with the tabular circuit substrate that the has carried light-emitting component degree of depth of packing into, with transparent resins such as epoxy resin cast sealing, insulate with environment.And, on the light-emitting component in the shaping shell,, be coated with the formed body of umbrella in order to improve the delivery efficiency with light of covering to circuit substrate.In addition, the end of the shaping shell of unit block, be provided with the delivery outlet of the light that produces from light-emitting component.Like this, in the bottom of the shaping shell of unit block, when the cast transparent resin, in order to prevent from the leakage from this hole, be pasted with to have the film of cementability, after the sealing that utilizes transparent resin, this adhering film promptly is stripped from.

In this kind display unit in the past, in described unit block, owing to need a large amount of transparent resins, so weight is big, thermal transpiration is also poor.Except such transparent resin, also need to use shaping shell, other a lot of material of auxiliary material (keeping the formed body of umbrella or the shell of unit block etc.) in addition.In addition, when circuit substrate being fixed on the shaping shell and sealing with transparent resin, owing to be under the situation of the D structure thing existence of the shape of complexity such as formed body of light-emitting component or described umbrella, to flow into transparent resin, therefore easy residual bubble in this transparent resin has the problem of operability difference.In addition, after the sealing that utilizes transparent resin, also need operation that described adhesive film is peeled off, the adhering film of having peeled off in addition becomes discarded object, also is disadvantageous in this.

Different with it, in the substrate of the present invention, because when formation has possessed the display unit of a plurality of light-emitting components, the resin that needs in addition can only carry out the sealing of light-emitting element part, therefore its use amount can be reduced sharply in the past tens of/below one, do not need to use in addition the shaping shell, thereby can realize the reduction of significantly lightweight or cost of material.In addition, also do not need to use described adhering film, thereby operability is also good.In addition, when discarded,, also be the countermeasure of improving environment therefore owing to can cut down its amount (particularly amount of resin) significantly.

Now, as the display that has used LED, large-scale display is used as outside the room of wall of being located at building etc. purposes practicability.Here, be that bullet cut LED that brightness is high is integrated in large quantities and constitute.On the other hand, for purposes within doors, as the giant display of thin type, though LCD or plasma scope are practical, yet in order to realize further maximization, difficulty increases technically, and the cost that therefore can cause multiplying each other pro rata with size raises.

In the substrate of the present invention, as shown in Fig. 7 or Figure 23, in banded or planar luminous element, can also adopt the luminous formation of extinguishing that can realize each light-emitting component.Like this, by carrying a plurality of points (dot) that three kinds of light-emitting components of red, green, blue constitute that dispose to high-density, just can easily provide the very giant display of light weight, thin type.This display is compared with the display that is made of bullet cut LED, is applicable to the field of the display that uses low-light level, for example purposes within doors.

In addition, Figure 21 is the example of application circuit of device with radial symmetric circuit pattern of Figure 16, is the example of display unit (dot matrix) luminous element with precursor of circuit board.Figure 22 is the figure of expression by the outward appearance of the dot matrix product of this precursor manufacturing.The wiring part that can see in the bottom and socket portion are flexible, when the use of reality, as illustrated in fig. 24 around using to the back side.In addition, Figure 23 is that expression uses precursor of circuit board as the unit luminous element shown in Figure 21, the example of the pattern when making continuously with band shape.

And, as described later, though after having carried light-emitting component on the substrate, this light-emitting component is sealed with sealing resin with covering, yet consider that from improving the liquid crystal polymer film exposed division of the substrate after preferably recess being formed preceding or recess and forms is implemented surface treatment with the viewpoint of the connecting airtight property of sealing resin.As this kind surface treatment, for example can enumerate ultraviolet irradiation processing, plasma irradiating processing, bead, alkali treatment etc.Also these treatment combinations can be used more than 2 kinds.In addition, the crimping of alligatoring metal fever in the liquid crystal polymer circuit substrate that gets, is only utilized and removed the liquid crystal polymer surface behind the metal, just can obtain good bonding force.

The formation of＜luminous element 〉

Luminous element of the present invention is to have the luminous element of the of the present invention luminous element of recess after forming with circuit substrate, is not particularly limited for other formation, can adopt various formations used in the known in the past luminous element.

An example of expression luminous element of the present invention among Fig. 8.With luminous element with any one party of 1 pair of

electrode part

2,2 of the circuit substrate 1 ground connection element mounted 10 that is electrically connected, in addition, utilize lead-in wire bonding 11 that the opposing party's electrode part 2 is electrically connected with light-emitting component 10.With sealing resin 12 recess covered, seal, just can obtain luminous element 13 by making this hardening of resin thereafter.

For example can provide with the GaAlAs class for light-emitting component 10 is the element of a plurality of kinds of representative, yet is not particularly limited in the luminous element of the present invention, can adopt the light-emitting component of the kind that can guarantee essential glow color.The lift-launch of light-emitting component 10 is for example as long as use the chips welding used known silver-colored paste etc.

Also be not particularly limited for lead-in wire bonding 11, can use normally used raw-material material in the luminous element field (being generally gold).

For sealing resin 12, so long as have the material of the transparency of the degree that the light by light-emitting component 10 radiation can see through well, just be not particularly limited, can utilize known in the past material (epoxy resin etc.).

And the situation of the luminous element that obtains for the substrate by Fig. 1 owing to be banded, therefore also can be wound into web-like and sale etc.

In addition, in the luminous element of the present invention, the setting that the opposing face side that forms face at the circuit pattern of substrate has cooling mechanism also is preferred mode.Expression has the example of the luminous element of cooling mechanism among Fig. 9.The luminous element 13 of Fig. 9 has heating panel 14 as cooling mechanism.

In the luminous element, the countermeasure of wishing to have the hot type that produces when luminous to go out, however be that lead frame is maximized in the past, pass it and heat extraction.But, when the size of luminous element becomes big, just have the problem that thermal discharge efficiency reduces.

In the luminous element of the present invention, different with the resin substrate that utilizes injection moulding in the past, can be in the attenuate substrate in the thickness of used liquid crystal polymer film, guarantee good resistance to heat distorsion (effect of the thermal deformation of the substrate when preventing soldering etc.), and compare with utilizing filming of coating formation, can keep the high insulating properties of reliability.Like this, by on liquid crystal polymer film surface (circuit pattern forms the opposing face of face), be provided with the cooling mechanisms such as heating panel that constitute by the good raw material of heat conductivity, just can be different with the heat extraction that utilizes lead frame in the past, realization can not worried producing electric leakage ground and is realized effective heat extraction from the large-area heat extraction of substrate.

As heating panel, can enumerate metallic plates such as aluminium sheet, magnesium plate, the resin plate that contains the good inorganic material of a large amount of heat conduction, glass plate etc.Being provided with of heating panel can be with the form fit of substrate ground recess to be set in heating panel, substrate is embedded wherein get final product, yet more preferably substrate and heating panel are welded again, or use bonding agent etc. is bonding and use.

In addition,, as shown in Figure 9, more preferably use to have the heating panel 14 that cold-producing medium passes hole 15, under this situation, can realize more efficiently heat extraction as cooling mechanism.As cold-producing medium, can make water, other known cold-producing medium.

And though described explanation all is to have summed up the content that obtains the result at luminous element research, yet clearly the present invention also can be used as the semiconductor of luminous element aqueous closed type in addition with using.

Embodiment

Below, will be described in detail the present invention based on embodiment.But following embodiment is not a restriction example of the present invention, and the scheme of implementing change before not breaking away from the scope of purport described later all is contained in the technical scope of the present invention.And used " % " short of particularly pointing out in the present embodiment then all is quality criteria.

And, the coefficient of linear expansion of film described later is following value of trying to achieve, that is, utilize the TMA method, at the MD direction and the TD direction of film, the test film width is made as 4.5mm, distance between chuck is made as 15mm, load is made as 1g, after being warmed up to 200 ℃ (programming rate: 5 ℃/minute) from room temperature, during with the cooling of 5 ℃/minute cooling rates, the value after will be according to the value that the change in size of the test film from 160 ℃ to 25 ℃ of period detectings is tried to achieve average.

Test of the making of 1＜luminous element〉with circuit substrate and luminous element

Embodiment 1

I type thermotropic liquor polyester film (thermal endurance thermoplastic resin membrane, JAPAN GORE TEX corporate system " BIAC BA ", liquid crystal conversion temperature: 335 ℃, thickness: 100 μ m, coefficient of linear expansion: MD direction, the TD direction all is 16ppm/ ℃) single face on, with Cu Alloy Foil (day ore deposit materials corporate system " NK120 ", the high conduction lead frame Cu alloy single face asperities item for disposal that contains 0.2%Cr-0.1%Zr-0.2%Zn, thickness: 18 μ m, coefficient of linear expansion: 17.4ppm/ ℃) in temperature: 340 ℃, pressure: 3.9MPa, time: attach under 5 minutes the condition, sprocket as shown in figure 10 is set, has obtained having the resin film of metal level.

Then, use etching method, on described resin film, the circuit pattern of Figure 10 and structure shown in Figure 11 is set.Among Figure 10 and Figure 11, remove symbol numeric representation length in addition, unit is mm.Among Figure 10,16 is the guide hole of 5mm φ, and the diameter of sprocket 6 is 1.3mm.Guide hole is the hole that is used in the die forming, and sprocket is the setting that the band when being used for using is continuously carried.

At layer on surface of metal, with thickness is the alkaline aqueous solution developable dry type film photoresist (Hitachi changes into corporate system " HF450 ") of 50 μ m, use warmed-up roll laminating machine (roll surface temperature: 105 ℃), under speed: 0.5m/ minute, the condition of linear pressure: 0.2～0.4MPa, carry out lamination, at room temperature placed 15 minutes.The mask overlap of regulation in photoresist coated face on, used vacuum contact exposure machine, at 100mJ/cm thereafter, ²Condition under irradiation ultraviolet radiation.Then at room temperature placed 15 minutes, and used Na thereafter ₂CO ₃1% aqueous solution, in temperature: 30 ℃, atomisation pressure: 0.2MPa, time: under 60 seconds the condition,, formed the photoresist pattern with the dry type film photoresist developing.

Use ferric chloride in aqueous solution (in 3% aqueous solution 1L of HCl, having dissolved the solution of 500g iron chloride) to carry out etching the metal level of the resin film behind the formation photoresist pattern, thereafter, use 3% aqueous solution of NaOH, in temperature: with the dry type film photoresist lift off, obtained flat luminophor circuit substrate precursor under 50 ℃, the condition of atomisation pressure: 0.1MPa.

On described luminophor circuit substrate precursor, utilize the die forming method to carry out recess formation.Being shaped as of recess: the bottom surface is the circle of diameter 1.7mm, and peristome is the circle of diameter 2.3mm, and the vertical depth from the recess peristome to the bottom surface is 0.85mm.Among Figure 12, the expression recess forms the profile (having formed the II-II profile behind the recess in the substrate of Figure 11) of part.Among Figure 12, the unit that has added the numerical value (radius of curvature) of symbol and " R " is mm.Molding condition is made as: heating-up temperature: 320 ℃, and pressure: 0.5MPa, time: 5 minutes, in stream of nitrogen gas, be shaped.

For the luminous element circuit substrate behind the formation recess, by using Cooper-Hewitt lamp, at 32mW/cm ²Condition under the irradiation ultraviolet ray in 30 seconds, carried out surface treatment.On the recess bottom surface of the luminous element after the surface treatment, carried light-emitting component with circuit substrate.Light-emitting component uses Toyoda Gosei Co., Ltd.'s system " GaN class blue led chip goods number: E1C40-0B001-02 ", utilizes silver-colored paste chips welding on a side of electrode part (electrode reservations) it.In addition, light-emitting component and the opposing party's electrode part utilizes gold thread to carry out the lead-in wire bonding.Thereafter, with two component epoxy resin transparent sealant (Dao field industry corporate system " HL2000A, HL2000B2 ") be filled in the recess of the circuit substrate that has carried light-emitting component, light-emitting component is covered, the sealing material is carried out a underhardening under 125 ℃, 1.5 hours condition, under 150 ℃, 6 hours condition, carry out post-curing in addition and with environment insulation, obtained the banded luminous element of long size.

Then with described banded luminous element severing, make 5 banded luminous elements with 10 light-emitting components, 5 row are attached on the phenolic resins substrate abreast, by the end of each banded luminous element being used unleaded scolding tin (thousand live metal company system " M705 ") 260 ℃ of following solderings, the external circuit of the resistance of having packed into possessing power supply etc. is connected.Then, at the translucent acrylic panel of surface configuration, obtained planar luminous element.The formation of planar luminous element, to form efficient good.To the planar luminous element energising of gained, affirmation can be sent the light of the brightness of having passed sliding door.

Embodiment 2

As liquid crystal polymer film, and use II type thermotropic liquor polyester film (the liquid crystal conversion temperature: 280 ℃, thickness: 100 μ m, coefficient of linear expansion: MD direction, TD direction all are 16ppm/ ℃).

The manufacture method of described II type thermotropic liquor polyester film is as follows.With II type thermotropic liquor polyester (POLYPLASTICS corporate system " ベ Network トラ A950 ") at single shaft extruder (screw diameter: fusion 50mm), T shape mould (lip length: 300mm from this extruder head end, lip gap: 2.5mm, mould temperature: 300 ℃) in, in molding than being to extrude with laminar under 5 the condition, cooling, having obtained thickness is the liquid crystal polyester thin film of 500 μ m.Two sides at this liquid crystal polyester thin film, use has the laminating machine of a pair of hot-rolling, in temperature is that 320 ℃, roller linear velocity are under 2m/ minute the condition, thermo-compressed porous Teflon (PTFE) film (thickness: 40 μ m, average pore size: 0.5 μ m, void content: 80%), thereafter, pass a pair of chill roll (temperature: 100 ℃) and cool off, formed laminated body.Utilize two-way elongator to extend this laminated body.The extension condition is: temperature is 300 ℃, and multiplying power is the MD direction: 1.6 times, the TD direction: 3.2 times, extension speed is 20%/second.Thereafter, the porous ptfe film on two sides is peeled off, having obtained thickness is the II type thermotropic liquor polyester film of 100 μ m.

Single face at the liquid crystal polymer film that so obtains, temperature be 275 ℃, pressure be 3.9MPa, time are attach under 5 minutes the condition with embodiment 1 in the used identical metal forming of material, sprocket as shown in figure 10 is set, has obtained having the resin film of metal level.To this have metal level resin film, implement etching in the same manner with embodiment 1, obtained flat luminous element precursor of circuit board.

In addition, to described flat luminous element precursor of circuit board, forming temperature when recess is formed is made as 265 ℃, with embodiment 1 made in the same manner flat luminous element with circuit substrate, have the banded luminous element of the luminous element of recess with circuit substrate and long size.From this band shape luminous element, when attempting in the same manner making planar luminous element, can't tolerate the temperature of soldering with embodiment 1, produced bad.Therefore, except use contains plumbous common scolding tin (thousand live metal company system " Sn63 "), under 220 ℃ of temperature, carried out beyond the soldering, made planar luminous element in the same manner with embodiment 1 after, obtained with the formation of embodiment 1 equal extent, formed efficient.In addition, after planar luminous element energising, can confirm to realize luminous with embodiment 1 equal extent to this.

Comparative example 1

Attached the liquid crystal polymer film of Cu Alloy Foil except replacement, and used thermmohardening polyimide film (chemical company of the Nippon Steel system " エスパネ Star Network ス " that attaches Copper Foil, thickness 50 μ m, the thickness of Copper Foil: 12 μ m) in addition, made flat luminous element precursor of circuit board in the same manner with embodiment 1.Itself and embodiment 1 have been attempted recess formation in the same manner, yet can't realize.

Comparative example 2

Except using the flat luminous element precursor of circuit board of making in the comparative example 1, do not form beyond the recess, attempt the making of the banded luminous element of long size in the same manner with embodiment 1, yet the outflow of sealing agent has taken place before with the sealant thermmohardening, can't realize sealing.

Comparative example 3

Polyetherimide film (Mitsubishi's resin corporate system, thickness: 100 μ m) in addition, made flat luminous element precursor of circuit board have in the same manner been used except replacing liquid crystal polymer film with embodiment 1.Itself and embodiment 1 have been attempted recess formation in the same manner, yet produced very big warpage, can't process.This is considered to because the coefficient of linear expansion of the thin film planar direction of Polyetherimide film is 56ppm/ ℃, and is very big with the difference of the coefficient of linear expansion of Cu Alloy Foil.

Comparative example 4

Except the circuit pattern of the Polyetherimide film that uses forms the aluminium sheet that applying 1mm is thick on the opposing face of face, made flat luminous element precursor of circuit board in the same manner with comparative example 3 in comparative example 3.Itself and embodiment 1 have been attempted recess formation in the same manner, yet because of the existence of aluminium sheet, the shape of recess can not become the sharp-pointed shape as injection-molded article in the past, formability is bad.Therefore, ended evaluation thereafter.

Experiment 2＜have a making of the luminous element of cooling mechanism 〉

Embodiment 3

Make the planar luminous element that obtains among the embodiment 1 luminous under 25 ℃ environment, the temperature of emitter surface (light-emitting area) has reached 28.5 ℃ after 10 minutes.

Embodiment 4

The circuit pattern of the planar luminous element that obtains in embodiment 1 forms the opposing face side of face, uses bonding agent that as shown in Figure 9 the heating panel (aluminum casting forming plate) that cold-producing medium passes the hole that has has been installed.Thereafter, when the cooling water that makes 20 ℃ passes cold-producing medium and passes the hole, making planar luminous element luminous under 25 ℃ environment, measured the temperature of the emitter surface (light-emitting area) after 10 minutes, is 25.5 ℃.

Like this, in the luminous element of the present invention, because of possessing described cooling mechanism, just the heat that can produce when luminous is discharged well.

Experiment 3＜possessed of the making of the luminous element of conducting channel〉with circuit substrate and luminous element with given shape

Embodiment 5

With etched pattern shown in Figure 13, making recess in the same manner with embodiment 1, to form reservations be that pattern shown in Figure 14 (below be called " slit is arranged ") or recess form the flat circuit substrate that reservations are pattern shown in Figure 15 (below be called " no slit "), utilize the die forming method to carry out recess and form, confirmed the broken string situation of conducting channel.And the dotted line of Figure 14 and Figure 15 (circle) expression recess forms reservations (below be called " recess formation preset lines "), and inboard circle is the interface of recess bottom surface and wall, and the circle in the outside is the interface of the outside of recess wall and recess.In addition, the central point that recess forms reservations is passed in the line of the single-point of Figure 14 and Figure 15.The numerical value of the expression slit location of Figure 14 (0.47mm, 0.85mm, 1.0mm and 1.15mm) expression is the distance of concentric circles with the intersection point of the mid point of each slit opening portion side upper and lower side of the line segment that passes the conducting channel end at center from the central point that described single-point is scoring to recess formation reservations.

And, for the circuit substrate that slit is arranged,, then being made as 4 slits in each conducting channel if its pattern is remarked additionally, the beginning end of slit is staggered.Slit width is made as 0.05mm, and the width that slit is formed the remaining portion of metal level of regional conducting channel is made as 0.1mm.In addition, make slit towards with recess form preset lines towards coupling, make the slit part when recess forms, be positioned at the substrate part of bending the most, in addition, with the width of slit opening portion establish slightly wide (0.1mm).

It is identical with embodiment 1 that recess shapes is made as.In addition, be made as temperature at molding condition: 330 ℃, pressure: 1.3MPa, time: 5 minutes, take out temperature: 200 ℃, and will be made as 1 time up to the number of times of the punching press of the shape that obtains final recess the time (when fully forming recess with 1 time punching press, below be called " punching press of 1 stage "), and (be used for the punching press that recess forms with 5 stages when being made as 5 times, when carrying out recess formation lentamente, below be called " punching press of 5 stages ") two kinds of situations under, all arrived the broken string of conducting channel with Visual Confirmation.Test number (TN) is made as 20, and the situation that will produce broken string because of the formation of recess in conducting channel is made as bad, with its incidence with the performance of percentage mark.The results are shown in Table 1.

Table 1

From table 1, can see,,, increase process number, can realize that also recess forms if utilize multistage pressing (being the punching press of 5 stages in this experiment) even there is not the circuit substrate of slit.Different with it, for the circuit substrate that in conducting channel, is provided with slit, can not have the broken string ground of conducting channel to carry out recess with process number (being the punching press of 1 stage in this experiment) still less and form, the recess formability is more good.

The affirmation that experiment 4＜reflectivity improves effect 〉

Embodiment 6

Use is at the thick electrolytic copper foil of 18 μ m (Furukawa サ-キ Star ト Off オイ Le corporate system, " GTS-18 ") on carried out the processing of single face asperities material, in temperature: 310 ℃, pressure: 3MPa, time: under 5 minutes the condition, with thick liquid crystal polymer film (the JAPAN GORE TEX corporate system of 100 μ m, " BIAC-BC ") fit, obtained having the resin film of metal level.This is had the resin film of metal level, under the condition identical, implement etching, obtained forming the flat luminous element precursor of circuit board that reservations have the shape of Figure 16 at circuit pattern center dant shown in Figure 10 with embodiment 1.

On the luminous element of gained surface with precursor of circuit board, utilize and electroplate, on Copper Foil, formed the silver layer of 3 μ m.Here, at the position that comprises electrode part (electrode reservations), use the mould dimensional topography to become diameter: under the situation of the recess of the truncated cone of 2.3mm, bottom surface diameter: 1.7mm, the degree of depth: 0.85mm, to calculate the area of shared circuit part (metal part) in the part of the wall that becomes this recess.Similarly, in the circuit pattern (Figure 14 and Figure 15) that in described embodiment 5, forms, also calculated the area of circuit part shared in the part that becomes the recess wall.In precursor of circuit board, when the area of the part that will become wall is made as D, when the area of shared circuit part was made as A, B, C respectively in will the part that becomes the recess wall in Figure 14,15,16, relative scale separately was as follows.

A∶B∶C∶D＝13.4∶18.9∶54.1∶100

So find, the shared ratio in the wall of recess that should element mounted of the circuit pattern shown in Figure 16 increases considerably.

Use described luminous element precursor of circuit board in addition, utilize from spectrophotometer (Hitachi's system " U-3500 ") light reflectivity of polymerizable mesogenic object plane, electrosilvering face has been measured the accumulative total light quantity.The result as the increment rate of silvered face with respect to the reflectivity of liquid crystal polymer film face, is shown in the table 2.

[table 2]

Wavelength	Increment rate (%)
Wavelength	Increment rate (%)	Zone Full (400～800nm)	116
Red (630nm)	107	Zone Full (400～800nm)	116
Red (630nm)	107	Green (560nm)	114.6
Blue (430nm)	153.2	Green (560nm)	114.6

Shown in this result, the reflectivity of silvered face is 1.53 times with respect to the liquid crystal polymer film face for blue wavelength light, also reaches 1.16 times for total visible light.So, such by circuit pattern as shown in Figure 16, be increased in the ratio of circuit part shared in the wall of recess of element mounted, just can expect to remedy the effect of reduction of the short wavelength side reflection of light rate of pellicular front, can obtain good luminous element.

The affirmation of effect of the circuit pattern of the elongation of the radial symmetric form of experiment 5＜have 〉

Embodiment 7

Except replacing electrolytic copper foil, used rolled copper foil (Ri Xing material corporate system, " BHY-13B-T ") in addition, under the condition identical with described embodiment 6, on liquid crystal polymer film, form circuit pattern shown in Figure 16, obtained the luminous element precursor of circuit board.In addition, similarly, also made the luminous element precursor of circuit board of circuit pattern shown in Figure 14.

These luminous elements with precursor of circuit board on, in fact form the recess shown in the described embodiment 6, shooting is present in the microphotograph of electrode part of the bottom of recess, in the circuit pattern of Figure 14, has measured the distance (gap) between 2 electrode part of electrode inlet portion and electrode end portion.In addition, in the circuit pattern of Figure 16, the distance (the arrow portion of Figure 16) of the electrode inlet portion between 2 conducting channels that measured distance between 2 electrode part (the oblique line portion of Figure 16), are connected with electrode part.The results are shown in Table 3.And near the wall that so-called here " electrode inlet portion " is meant recess and the bottom surface side of the boundary of bottom surface, the distance between the what is called " electrode end portion " is meant 2 interelectrode distances.

[table 3]

According to this result, in the circuit pattern shown in Figure 14, form by recess in the electrode gap that obtains no problem basically, and in the circuit pattern shown in Figure 16, promptly have in the circuit pattern of overlooking to radial tortuous elongation symmetrically, do not observe the disorder that forms the electrode gap that causes by recess.This is considered to because applied force is disperseed equably by the circuit part's (metal part) on the wall reservations that are present in recess when recess forms, rather than only puts on the part.

So if utilize the circuit pattern of the expansion and contraction with radial symmetry, it is bad that the dislocation in the time of then can more effectively preventing by actual element mounted causes.In addition, do not have disorder in the configuration of circuit part's (metal part) of the luminous element with this circuit pattern in the recess of the light that reflection is sent by light-emitting component.That is, in recess, form the pattern that becomes radial homogeneous from central point.So this circuit pattern is the good pattern of catoptrical homogeneity.

The affirmation of experiment 6＜bonding force 〉

Embodiment 8

With surface coarsening the metal forming thermo-compressed on liquid crystal polymer film, carried out then under the etched situation, to studying as the epoxy resin of sealing resin and the bonding force of film.Used material is as follows.

Liquid crystal polymer film 1:JAPAN GORE TEX corporate system " BIAC-BA "

Liquid crystal polymer film 2:JAPAN GORE TEX corporate system " BIAC-BC "

Copper Foil: the single face roughening treatment the thick electrolytic copper foil of 18 μ m (Furukawa サ-キ Star ト Off オイ Le corporate system, " GTS-18 ")

Etching condition is identical with described embodiment 1.But, with the roughening treatment of Copper Foil a side direction liquid crystal polymer film attach.And, roughening treatment the roughness of copper foil surface of a side be Rz:8 μ m.The mensuration of bonding force is that the bonding force assay method according to JIS K6850 carries out.That is, the luminophor circuit substrate precursor with gained utilizes two component epoxy resin transparent sealant (Dao field industry corporate system " HL2000A, HL2000B2 ") be attached to wide: on the aluminium sheet of 15mm, thick: 2mm.This test sample is fixed in position apart from the about 50mm of binding face symmetrically with the clamping element of cupping machine, and the certain speed that breaks with adhesive portion in 65 seconds ± 20 seconds makes the testing machine action, has measured the power when breaking.Mensuration is that each test sample is tested 5 separately, has tried to achieve its mean value.Wherein, binding face is made as 15 * 15mm.In addition, as a comparative example,, carried out or not the same test of etch processes in order to measure the bonding force of Copper Foil (circuit face) and sealant.The results are shown in Table 4.

[table 4]

Test sample	Bonding force (N/mm ²)
Test sample	Bonding force (N/mm ²)	Untreated membrane 1 etch processes film 1	6.72 16.84
Untreated membrane 2 etch processes films 2	5.84 20.54	Untreated membrane 1 etch processes film 1	6.72 16.84
Untreated membrane 2 etch processes films 2	5.84 20.54	Copper Foil (circuit face)	14.42

Confirm according to this result, attached surface coarsening Copper Foil after carried out the liquid crystal polymer film surface of etch processes and the bonding force of sealant, compare with the bonding force of sealant significantly with untreated film surface and rise.Specifically, be about 2.5 times for described film 1, be about 3.5 times for film 2, it is higher than the bonding force of Copper Foil (circuit face) and sealant.In addition, well-known, the moisture-proof characteristic of liquid crystal polymer self with compare more good as the effectual polyimides of the material of most flexible circuit board.So by using the described liquid crystal polymer film that carries out etch processes, the bonding force of circuit substrate and epoxy resin is enhanced, thereby can expect because of the high product of reliability such as the moisture-proof characteristic is more good.

Experiment 7＜the have affirmation of effect of the circuit of elongation 〉

Embodiment 9

To in luminophor circuit substrate precursor,, have the situation of elongation of the distortion when having considered that recess forms and the different of broken string incidence of situation about not having and test in the conducting channel portion of circuit pattern.Used material is as follows.

Liquid crystal polymer film: JAPAN GORE TEX corporate system " BIAC-BA "

Copper Foil: the single face roughening treatment the thick rolled copper foil (of 18 μ m Ri Xing material corporate system, " BHY-13B-T ")

The circuit pattern that forms is made as the pattern shown in Figure 14～16, and etching condition is identical with described embodiment 8.Each pattern is made as embodiment 9-1～3 respectively.On each luminophor circuit substrate precursor of gained, under the condition of described embodiment 1, with the punching press time number limiting be formed recess 1 time after, utilize microscopic examination and continuity test to confirm having or not of broken string.Even under the situation of conducting, also be judged to be broken string for the sample that utilizes microscopic examination in circuit, to observe the crack.In addition, the radius of curvature that recess has a common boundary is made as 0.2mm (with reference to Figure 12), has also formed the recess under the so more mild radius of curvature of 0.35mm and 0.5mm in addition.For each sample, each has tested 20 examples, with the broken string incidence the result be shown in the table 5.

[table 5] broken string incidence (%)

Shown in this result, form mild recess if increase radius of curvature, then utilize the punching press in 1 stage can not cause broken string, and when dwindling radius of curvature, then in embodiment 9-2, promptly produced broken string.So, dwindling under the situation of curvature, preferably carry out the multistage punching press.But,, under the situation of the circuit pattern with elongation of the present invention, can not produce broken string even when radius of curvature hour yet.

Claims

1. the manufacture method of a luminous element usefulness circuit substrate is characterized in that, comprises that circuit forms operation and recess forms operation,

It is the operation that forms the metallic circuit on the liquid crystal polymer film surface that described circuit forms operation, this metallic circuit has the electrode reservations of 1 pair of light-emitting component at least, these electrode reservations are connected with other circuit in the substrate via conducting channel separately, and this metallic circuit also have the degree that can disperse in the power that recess applies to circuit in forming radial symmetry be the plane surplus that tortuous shape leaves with the distortion when considering formation recess in the subsequent processing;

It is the operation that forms recess at the position that comprises these electrode reservations that described recess forms operation, and this recess has the wall at bottom and this conducting channel place at these electrode reservations and this conducting channel place.

2. manufacture method according to claim 1 wherein, forms a plurality of described recesses.

3. manufacture method according to claim 1 wherein, can exist many to the described electrode reservations of described electrode reservations ground formation at each described recess.

4. manufacture method according to claim 1 wherein, as described liquid crystal polymer film, is used in the coefficient of linear expansion on the direction parallel with thin film planar and is adjusted to film below 25ppm/ ℃.

5. manufacture method according to claim 1 wherein, is used thermotropic liquor polyester as described liquid crystal polymer.

6. manufacture method according to claim 1, wherein, form in the operation at circuit, surface coarsening by conforming to the side that the major general contacts with described liquid crystal polymer film on described liquid crystal polymer film surface metal forming, then metal forming is carried out etching, form the metallic circuit.

7. manufacture method according to claim 1, wherein, in recess forms operation, the wall of recess part or all and near the liquid crystal polymer strand is orientated once more.

8. manufacture method according to claim 1, wherein, in circuit formed operation, under the state before forming described recess, the ratio that will become the area of the metallic circuit in the part of wall of recess in subsequent processing was made as 20～90%.

9. a luminous element precursor of circuit board is characterized in that, is formed with metal circuit on the liquid crystal polymer film surface,

In this metallic circuit, there are at least 1 pair of electrode reservations that is used for element mounted, these electrode reservations are connected via other the circuit in conducting channel and the substrate separately, this metallic circuit also have the degree that can disperse in the power that recess applies to circuit in forming radial symmetry be the plane surplus that tortuous shape leaves with the distortion when considering the formation recess, and

Described luminous element precursor of circuit board is at the position that comprises these electrode reservations, forms the recess of wall at bottom with these electrode reservations and this conducting channel place and this conducting channel place and the substrate precursor that uses.

10. luminous element precursor of circuit board according to claim 9 wherein, is the substrate precursor that uses in order to form a plurality of described recesses.

11. luminous element precursor of circuit board according to claim 9 wherein, has many to described electrode reservations.

12. luminous element precursor of circuit board according to claim 9, wherein, described liquid crystal polymer film is to be adjusted to film below 25ppm/ ℃ in the coefficient of linear expansion on the direction parallel with thin film planar.

13. luminous element precursor of circuit board according to claim 9, wherein, described liquid crystal polymer is a thermotropic liquor polyester.

14. luminous element precursor of circuit board according to claim 9, wherein, the surface of described at least liquid crystal polymer film side of metal forming that constitutes described metallic circuit is by alligatoring.

15. luminous element precursor of circuit board according to claim 9 wherein, will become the ratio of the area of the metallic circuit in the part of wall of described recess, be 20～90% under the state before forming described recess.

16. luminous element circuit substrate, it is characterized in that, any described luminous element is with the position of comprising of precursor of circuit board of described electrode reservations in claim 9～15, be formed with the recess that is used for element mounted, and described conducting channel is present on the bottom surface and wall of this recess.

17. luminous element circuit substrate according to claim 16, wherein, the wall of described recess part or all and near, utilize the orientation once more of liquid crystal polymer strand to improve modulus of elasticity.

18. luminous element circuit substrate according to claim 16, wherein, this circuit substrate be long size and be wound into the luminous element circuit substrate that web-like forms.

19. a luminous element is characterized in that, has the described luminous element circuit substrate of claim 16.

20. luminous element according to claim 19 wherein, at the opposition side of luminous element with the circuit formation face of circuit substrate, has cooling mechanism.