JPH0738154A - Mid chip type light emitting element - Google Patents

Abstract

PURPOSE:To provide a MID chip type light emitting element which can be lessened in thermal stress when heat is applied and enhanced in reliability and wherein resin can be easily controlled in amount of filling in a manufacturing process, and color mixture can be set high in uniformity when LED chips are mounted. CONSTITUTION:Grooves 3 and 3' shallower than the base of a recess 2 are provided to the two opposed sides of the outer wall which surrounds the recess 2 of an insulating block body 1, and a wire is bonded to the upside of the groove 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a MID chip type light emitting device used for a display board or the like.

[0002]

2. Description of the Related Art A conventional technique will be described with reference to FIG. FIG. 5 is a sectional view of a conventional MID chip type light emitting device.

As shown in FIG. 5, an insulating block body 31 having a concave portion 30 is provided with a plated portion 32 to be a three-dimensional wiring, and an LED chip 33 is placed on the plated portion 32 on the bottom surface of the concave portion 30. Wire 3 from LED chip 33
4, the plated portion 3 of another wiring on the bottom surface of the same recess 30
2 is connected by wire bonding. Reference numeral 35 is a translucent sealing resin for protection.

[0004]

By the way, in the conventional structure as described above, the recess 30 in which the LED chip 33 is mounted is mounted.
Since the connection portion 36 for wire bonding is provided on the same surface as the bottom surface of, the area of the bottom surface requires a certain amount of space or more. In particular, in the case of a multicolor chip that requires a plurality of LED chips, it is necessary to widen the bottom surface area, and in this case, there is a problem that the mixed colors are not uniform.

Further, since the resin amount of the sealing resin 35 is inevitably increased as the area is widened, as a result, when thermal stress is applied, the difference in thermal expansion coefficient from the insulating block body is obtained. There is also a problem in that the stress applied to the element due to such factors also increases.

Further, in the conventional manufacturing method, a plurality of recesses for mounting the individual chips are provided in advance on the resin substrate, and the protective resin is injected into the recesses. As a result, it is necessary to inject the resin into each single concave portion, and moreover, the injection amount must be accurate, which is troublesome.

Therefore, an object of the present invention is to reduce the amount of sealing resin that is injected into the concave portion of the light-emitting chip to reduce the stress when heat stress is applied, and more particularly to an element equipped with a plurality of LED chips. In the case of, high-reliability MI that can mix colors uniformly and simplify the resin injection method.
It is to provide a D-chip type light emitting device.

[0008]

In order to achieve the above object, the present invention provides a three-dimensional wiring on an insulating block body having a recess and mounts an LED chip on the bottom surface of the recess, and the LED chip and the In a MID chip type light emitting device, which is connected to a three-dimensional wiring by bonding with a wire, a groove portion shallower than a bottom surface of the concave portion is formed on two opposite sides of an outer wall surrounding the concave portion of the insulating block, and the groove portion. The wire is bonded and connected to the upper surface of the.

[0009]

In the past, both the LED chip and the bonding wire were mounted and connected on the bottom surface of the same recess, but in the MID chip light-emitting device of the present invention, the recess is limited to a small area for mounting only the LED chip. Since the connection destination of the bonding wire is the upper surface of the groove, which is shallower than the bottom surface of the recess, the resin amount of the translucent resin for sealing the recess and the groove is the same for the LED chip and the bonding wire as in the conventional case. The number can be reduced as compared with mounting and connecting on the bottom surface of the recess.

Therefore, the stress caused by the thermal stress can be reduced and the reliability can be improved.

Further, when a large number of chips are mounted, the distance between the chips can be made small, so that the mixed color light emission can be made uniform.

Further, the groove portion has a structure obtained by dividing the groove between the concave portions during the manufacturing process. Therefore, when the translucent resin is injected into the recess, the resin can be easily moved to the adjacent recess by the squeegee, so that the amount of resin can be easily adjusted and the efficiency of the mass production process can be improved.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. FIG. 1 is a perspective view of a MID chip type light emitting device according to this embodiment.

The feature of this embodiment is that the size of the recess for mounting the LED chip is limited to such a size that only the LED chip body can be mounted. Accordingly, the connection tip of the bonding wire that connects to the LED chip is
It is connected to a shallow groove provided above the recess.

That is, as shown in FIG. 1, the insulating block body 1 of the present embodiment has a recess 2 and shallow groove portions 3, 3'formed on two opposite sides of an outer wall surrounding the recess 2. Have The insulating block body 1 is provided with a plated portion 4 which becomes a three-dimensional wiring. Then, the LED chip 6 is mounted on the bottom surface of the recess 2 by the conductive paste 5,
The bonding wire 7 connected to the chip 6 is connected to the groove 3. Here, the plated portion of the groove portion 3 and the plated portion of the bottom surface of the concave portion 2 are separated by the step portion.

On the other hand, the plating of the groove portion 3'and the plating of the bottom surface of the concave portion 2 are continuously formed. Further, the concave portion 2 and the groove portions 3 and 3 ′ are resin-sealed with a translucent resin 8. In the figure, 9 is a resist for preventing the translucent resin 8 from wrapping around on the back surface through a through hole 10 described later, and is provided so as to cover the upper portion of the through hole 10.

As described above, in the present embodiment, the bottom surface of the recess 2 is limited to a small area for mounting the LED chip 6, and the bonding wire is connected to the groove 3 located above the recess 2. Therefore, the resin amount of the translucent resin 8 for sealing the recess 2 and the grooves 3 and 3 ′ with resin is smaller than that in the conventional case where the LED chip and the bonding wire are both mounted and connected on the bottom of the same recess. Can be reduced.

Therefore, the stress caused by the thermal stress can be reduced and the reliability can be improved.

2 and 3 show another embodiment of the present invention, which is an embodiment of a multicolor chip of two colors and three colors, respectively. The same functional parts as those in the embodiment of FIG. 1 are designated by the same symbols. In FIG. 2, the LED chips 11 and 12
In the recess 13, and in FIG. 3, the LED chips 14, 1
5, 16 are mounted in the recess 17. The recess 17 of FIG.
And the step between the groove portions 3 and 3'is substantially vertical.

Also in the above-described embodiment, as in the case of FIG. 1, the amount of the light-transmitting resin can be made smaller than before, so that the stress can be reduced when thermal stress is applied. Moreover, in the case of such a multicolor chip, conventionally, there was a problem that the way of mixing the colors becomes uneven because the bottom area of the recess is large, but in the case of the present embodiment, the recess has an LED. Since only the chips are mounted, there is an advantage that the distance between the chips can be reduced and color mixing can be made uniform.

A method of manufacturing the above MID chip type light emitting display device will be described below.

FIG. 4 is a diagram for explaining a method of injecting a transparent resin into the recess. As shown in FIG. 4, the multi-cavity MID substrate 18 is provided with a groove 19 that is continuously formed between the plurality of recesses 2 and 2 that are individually divided later. Reference numeral 20 denotes a resin outflow preventing jig that prevents the translucent resin from flowing out of the MID substrate 18 and reaching the back surface of the substrate. The MID substrate 18 is plated with any of the three-dimensional wiring patterns shown in FIGS. 1 to 3 by the MID method or the like.

Here, in order to perform side surface plating of the insulator block 1 of the MID chip type light emitting device shown in FIGS. 1 to 3, through holes (corresponding to the through holes 10 after the substrate is divided) are formed at four corners around the recess 2. ) Is formed (not shown).
By plating the inside of this through hole, side surface plating after division is obtained.

Next, when each recess 2 of the MID substrate 18 is sealed with resin, through holes are formed in the resist 9 described above in the description of FIGS.
Seal with. Next, the LED chip 6 is attached to the conductive paste 5
Is mounted on the one-dimensional polar wiring pattern of the MID substrate 18, and the LED chip 6 is connected to the other polar three-dimensional wiring pattern by the bonding wire 7. Next, the translucent resin 8 is injected into the recess 2 and the amount of resin is adjusted by the squeegee 21.

At this time, the resin easily moves to the adjacent concave portion 2 through the groove portion 19, so that the resin adjustment can be easily performed. In addition, as the material of the MID substrate, an insulator capable of forming a metal layer such as ceramic, liquid crystal polymer, or PPS is used. After that, each recess 2 is divided to obtain a single MID chip type light emitting element.

As described above, according to the present embodiment, in the MID chip type light emitting device, the recess 2 is limited to a small area for mounting the LED chip 6, and the connection destination of the bonding wire is located above the recess 2. Since the groove portion 3 is formed, the resin amount of the translucent resin 8 for resin-sealing the recess portion 2 and the groove portions 3 and 3'is smaller than in the conventional case, and the stress when heat stress is applied can be reduced. The reliability can be improved.

Further, these groove portions 3 and 3 ′ are grooves 17 that connect the recessed portions 2 and 2 during the manufacturing process, and the resin can be easily adjusted by the squeegee method through the groove 19, so that the mass production process is performed. Can be made more efficient.

[0028]

As described above, according to the MID chip type light emitting device of the present invention, the sealing resin for the LED chip can be reduced as compared with the conventional case, so that the stress when the thermal stress is applied can be reduced and the reliability can be improved. You can improve the property.

Further, when a plurality of LED chips are mounted, the LED chips are mounted concentratedly on the bottom surface of the recess except for the bonding wires, so that mixed color light emission can be made uniform.

Further, since the squeegee method can be adopted in the resin injection work in the manufacturing process, the efficiency of the mass production process can be achieved.

[Brief description of drawings]

FIG. 1 is a perspective view of a MID chip type light emitting device according to an embodiment of the present invention.

FIG. 2 is a perspective view of an MID chip type light emitting device according to another embodiment of the present invention.

FIG. 3 is a perspective view of an MID chip type light emitting device according to another embodiment of the present invention.

FIG. 4 is a diagram for explaining a resin injection method in the manufacturing method of the MID chip type light emitting device of the present invention.

FIG. 5 is a sectional view of a conventional MID chip type light emitting device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating block body 2 Recessed portion 3, 3'groove portion 6 LED chip 7 Bonding wire

Claims (1)

[Claims] 1. An MID chip type light emission in which an insulating block body having a recess is provided with three-dimensional wiring, an LED chip is mounted on the bottom surface of the recess, and the LED chip and the three-dimensional wiring are bonded and connected by a wire. In the element, a groove portion shallower than a bottom surface of the concave portion is formed on two opposite sides of an outer wall surrounding the concave portion of the insulating block body, and the wire is bonded and connected to an upper surface of the groove portion. MID chip type light emitting device.