CN100440504C - 电源布线和接地布线的由交错凸起冶金法形成的条的方法 - Google Patents

电源布线和接地布线的由交错凸起冶金法形成的条的方法 Download PDF

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CN100440504C
CN100440504C CNB028076249A CN02807624A CN100440504C CN 100440504 C CN100440504 C CN 100440504C CN B028076249 A CNB028076249 A CN B028076249A CN 02807624 A CN02807624 A CN 02807624A CN 100440504 C CN100440504 C CN 100440504C
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M·T·博尔
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

一种装置，其包括具有表面的管芯，所述管芯包括：导电凸起的阵列；以及多个处于导电凸起阵列内的导电条。

Description

电源布线和接地布线的由交错凸起冶金法形成的条的方法
技术领域
本发明涉及微芯片封装的领域，尤其涉及在微芯片和封装衬底之间进行电源连接和接地连接的布线。
背景技术
采用高功率电平的集成电路要求电源线和接地线密集地布置，以便传输所需的电流并实现预期的性能。随着电路的功率要求的提高，需要更多普通的互连层(例如P860上的M5和M6)以用于对电源线和接地线进行布线，这些互连层对布线信号来说是较少用到的。对电源线和接地线进行布线的需求必须通过增设更多的互连层来解决。图1A是具有C4凸起图案的管芯表面的图示，其包括信号、电源和接地的输入/输出(I/O)。在管芯和管芯封装之间提供更小节距的凸起的要求增大了在管芯表面上的布线及其复杂性。图1B是具有ABM凸起的管芯表面的图示，ABM凸起与芯片上的接地线(Vss)和电源线(Vdd)相连。在这种设计中，凸起之间的最小间距约为75微米，凸起直径约为75微米，且最小节距为150微米，这样就可有效地布置信号线。
发明内容
一种装置，其包括具有表面的管芯，所述管芯包括：导电凸起的阵列；以及多个处于导电凸起阵列内的导电条。
具体地，本发提出一种形成电源条和/或接地条的方法，包括：在管芯的顶金属层上沉积介质层，管芯具有形成在其上的一个或多个电源线及一个或多个接地线；在所述介质层上沉积钝化层；在所述介质层和钝化层中形成一个或多个钝化开口，使得至少一个所述电源线和/或接地线中的一部分被外露；用导电材料在所述钝化开口上加上衬里；和在所述钝化层的顶面上沉积多个与所述带衬里的钝化开口相接触的导电条。
还包括：在衬底上设置焊接区阵列；和将所述管芯与所述衬底相连，使得所述焊接区阵列与所述管芯上的多个导电条相配合。
所述多个导电条中的至少一个与电源相连。
所述多个导电条中的至少一个与接地相连。
所述多个导电条形成环绕管芯的周边。
附图说明
图1A是具有C4凸起图案的管芯表面的图示，其包括信号、电源和接地的I/O。
图1B是具有ABM凸起的管芯表面的图示，ABM凸起与芯片上的接地线(Vss)和电源线(Vdd)相连。
图2A是带有采用交错凸起冶金法(alternate bump metallurgy)制成的电源条和接地条的管芯的图示。
图2B是带有电源条和接地条以及边缘环的管芯的图示。
图3是位于接地线和电源线上的ABM条的图示，其处于金属层内并与带有衬里的钝化开口互连。
图4A是与M7铜层相连的ABM条的图示。
图4B是沿与图4A所示成90度的方向看去的与M7铜层相连的ABM条的图示。
图5A-5H是用于在管芯上生产ABM条的方法的图示。
图6A和6B显示了管芯-衬底组件600。
图5A是包括有位于金属层内的电源线和接地线的管芯的图示。
图5B是具有设于金属层上的介质层的管芯的图示。
图5C是具有设于介质层上的钝化层的管芯的图示。
图5D是具有蚀刻穿过介质层和钝化层的钝化开口的管芯的图示。
图5E是具有带有衬里的钝化开口的管芯的图示。
图5F是具有形成图案的光致抗蚀层的管芯的图示。
图5G是具有由铜填充的图案的管芯的图示。
图5H是带有电源条、接地条和具有由交错凸起冶金法制成的凸起的管芯的图示。
具体实施方式
公开了一种用于提供中心处于管芯表面上的I/O信号凸起的阵列中的电源条和接地条的结构和方法。在一个实施例中，I/O信号凸起以及电源条和接地条可以为铜凸起的形式。此结构和方法可提供在微芯片(管芯)和衬底之间连接电源和接地的有效方式。此结构和方法可采用与焊接不同的凸起冶金法(即交错凸起冶金法或ABM)。结果，电源和接地结构可位于带有I/O信号凸起(信号凸起)的管芯上，并处于周围的有序阵列中。另外，电源和接地结构可由与信号凸起相同的金属层中制成。此结构和方法可允许在互连金属层中设置更多的电源线和接地线，这是因为可以采用更紧密的间隔。
在一个实施例中，在装配时，管芯上的信号凸起可与衬底如管芯封装上的各个焊接区配合。管芯封装可具有许多焊接区，以便与管芯上的电源条和接地条以及信号凸起相接触。或者，焊接区可覆盖足够大的面积以与一个或多个电源条和/或接地条的整个表面相接触。电源条和接地条以及相配合的焊接区可具有从方形到多条线段的任何形状。
在下述介绍中将阐述大量的具体细节，例如特定的材料、设备和工艺，以便提供对本发明的完全的理解。另外，并未详细地阐述众所周知的计算机装配技术和器械，以便使本发明更清晰。
图2A和2B是带有采用交错凸起冶金法(ABM)制成的电源条和接地条的管芯202的图示。在图2A所示的实施例中，信号凸起206设置在阵列式图案中，在此图案中设有电源条和接地条204。在图2B所示的另一实施例中，在信号凸起的外周即晶片边缘处设有一组额外的条。边缘条的目的是在将管芯连接到衬底如塑料封装上时提供改善的密封。在一个实施例中，电源条和接地条204可形成为矩形的形状，并通过介质涂层和钝化涂层与顶层金属间隔开。电源条和接地条可随后涂覆一层低温焊料的薄层，以提高它们与配合衬底上的配合焊接区或条的电接触。
图3是具有电源ABM条304和304’以及接地ABM条303的管芯302的一部分区域的图示，电源ABM条304和304’以及接地ABM条303置于接地线312和312’以及电源线314和314’上并处于管芯302的金属层中，而且与带衬里的钝化开口310和310’(处于钝化层和介质层中)电连接。ABM条304，304’和303约为75微米宽，并在管芯302上间隔开约75微米。带衬里的钝化开口310和310’可由各侧边长度约为5微米的大致方形的区域形成。在ABM条304，304’和303与金属表面之间形成有足够数量的带衬里的钝化开口310和310’，以便使ABM条304，304’和303与各自的电源线314和314’以及接地线312和312’互连。
图3还显示了在采用ABM条304和304’来将电源和接地与管芯302之外的电路相连时所得到的比采用凸起(上述图1B)时所得到的更窄的节距308。ABM条304和304’对电源布线来说更佳，这是因为它们可在管芯302上均匀地分配功率。对于ABM凸起来说(上述图1B)，最后金属层中的下方电源线只可能布置在凸起之下，凸起节距因工艺局限性而限制在约150微米。因此电源线和接地线只能每75微米间隔开。回到图3，由于设有ABM条304和304’，钝化开口310可沿条304和304’设置在任何位置，因此电源线和接地线(Vdd/Vss)312，312’，314和314’几乎可根据需要来布置，例如每30微米就进行一次布线。具有更紧密间隔的更多电源线和接地线312，312’，314和314’通过减少电阻降并具有较低的电感而提高了功率传输。结果是性能得到提高。
图4A和4B显示了具有与M7层406相连的互连构件(带衬里的钝化开口)404的ABM接地条402的侧视图。在一个实施例中，互连构件穿过Si3N4介质层408和聚酰亚胺钝化层410。图4A和4B显示了与从M7层406中制出的铜接地线410相连的ABM接地条402，同时相邻的ABM接地条412通过Si3N4介质层408和聚酰亚胺钝化层410与接地线410间隔开。
图5A-5H显示了用于在管芯上生产ABM条的方法。图5A显示了管芯500上的最终金属互连层501如M7(沉积在形成图案的介质层中)，其可包括电源线502和502’以及接地线504和504’的组合。如图5B所示，在包括有蚀刻的M7层501的管芯500的表面上沉积介质材料层506，介质材料例如为氮化硅(Si3N4)或碳化硅(SiC)。图5C显示了钝化层508的沉积。在一个实施例中，钝化层可以是例如聚酰亚胺或二氧化硅的材料，并通过溅射、旋压、CVD或滚压来均厚沉积以覆盖介质涂层506。在涂覆了钝化层之后，采用光致抗蚀剂(未示出)来在表面上形成图案。图5D显示了处于钝化层508和介质层506中的钝化开口510和510’、金属电源线502和502’的暴露区域，以及处于M7501内的接地线504和504’。首先用光致抗蚀剂(未示出)来形成图案，然后蚀刻穿过钝化层506和介质层504以在M7501处暴露出线502，502’，504和504’，从而形成开口510和510’。图5E是衬有导电金属或金属合金的带衬里的钝化开口512和512’的图示。在一个实施例中，钝化开口512和512’具有由钛溅射随后和铜溅射而加衬的双层(未示出)。图5F显示了涂覆在钝化涂层506上的形成了图案的光致抗蚀剂514。图5G显示了用铜516填充光致抗蚀剂图案514中的开口的电镀工艺的结果。图5H显示了管芯500的剖视图，其中已通过溶剂剥去了光致抗蚀剂，多个ABM条518和518’以及铜信号凸起520保留下来并与M7501内的线502，502’，504和504’相连。
图6A和6B显示了管芯-衬底组件600。通过例如上述图5A-5H所示实施例的装配工艺可将管芯602与衬底604相连。衬底604可以是任何用于将管芯602与外部电路如封装或印制电路板相连的配合件，其中衬底604可包括焊料609和609’的接触接地区域606和606’以及电源区域608，它们可与管芯602上的接地条区域610和610’以及电源条区域612相配合。焊料609和609’可以是低温焊料，例如铅锡焊料或银锡焊料，它们涂覆在下方铜(未示出)的表面上。在衬底604上具有与管芯602上的铜电源条610和610’以及接地条612相配合的等效配合的焊接区609和609’的一个优点是，在管芯在计算机中执行操作时，管芯602中的热传导速率增大。
然后通过将管芯-衬底组件放在回流炉中来进行加热循环，其可加热焊料直到如液体一样地流动为止。在回流操作之后，将铜凸起与焊接区电连接且机械连接，将管芯的电源/接地条与衬底上的相配合的电源/接地条或区域电连接且机械连接。
在生产过程中，使之后将与管芯相配的衬底如塑料封装或印制电路板通过焊接装置，在其中对衬底的一侧进行焊接操作，以在各衬底上焊接数百个端子。众所周知，为实现此目的可采用波峰焊机器。这些机器包括传送带，其将电路板在熔融焊料池上运送，熔融焊料池被搅拌以在板的底面上形成波峰。在波峰焊之前需要进行涂覆阻焊掩膜的操作，以防止封装衬底的一些部分与热的熔融焊料相接触。通过众所周知的技术，例如溅射、喷射或丝网印刷如通过钢制筛网的丝网印刷来涂覆阻焊掩膜作为一个或多个涂层。当采用筛网来涂覆阻焊掩膜时，筛网中的图案可在阻焊掩膜中提供开口，这些开口将随后在焊接操作中填充。在阻焊掩膜固化后，进行波峰焊以填充掩模中的开口区域。固化的阻焊掩膜保留在所形成的衬底上，为待保护的电路线提供良好的介质覆盖。

Claims (5)

1.一种形成电源条和/或接地条的方法，包括：
在管芯的顶金属层上沉积介质层，管芯具有形成在其上的一个或多个电源线及一个或多个接地线；
在所述介质层上沉积钝化层；
在所述介质层和钝化层中形成一个或多个钝化开口，使得至少一个所述电源线和/或接地线中的一部分被外露；
用导电材料在所述钝化开口上加上衬里；和
在所述钝化层的顶面上沉积多个与所述带衬里的钝化开口相接触的导电条。
2.根据权利要求1所述的方法，其特征在于，还包括：
在衬底上设置焊接区阵列；和
将所述管芯与所述衬底相连，使得所述焊接区阵列与所述管芯上的多个导电条相配合。
3.根据权利要求2所述的方法，其特征在于，所述多个导电条中的至少一个与电源相连。
4.根据权利要求2所述的方法，其特征在于，所述多个导电条中的至少一个与地相连。
5.根据权利要求2所述的方法，其特征在于，所述多个导电条形成环绕管芯的周边。
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