DE60216433D1 - Lothöckermetallurgieschienen für versorgungs- und massenleitungsführung - Google Patents

Lothöckermetallurgieschienen für versorgungs- und massenleitungsführung

Info

Publication number
DE60216433D1
DE60216433D1 DE60216433T DE60216433T DE60216433D1 DE 60216433 D1 DE60216433 D1 DE 60216433D1 DE 60216433 T DE60216433 T DE 60216433T DE 60216433 T DE60216433 T DE 60216433T DE 60216433 D1 DE60216433 D1 DE 60216433D1
Authority
DE
Germany
Prior art keywords
lothöckmetallurgi
rails
supply
guidance
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60216433T
Other languages
English (en)
Other versions
DE60216433T2 (de
Inventor
T Bohr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE60216433D1 publication Critical patent/DE60216433D1/de
Application granted granted Critical
Publication of DE60216433T2 publication Critical patent/DE60216433T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/1405—Shape
    • H01L2224/14051—Bump connectors having different shapes
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/141—Disposition
    • H01L2224/1412—Layout
    • H01L2224/1413—Square or rectangular array
    • H01L2224/14133—Square or rectangular array with a staggered arrangement, e.g. depopulated array
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/013—Alloys
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Escalators And Moving Walkways (AREA)
  • Replacing, Conveying, And Pick-Finding For Filamentary Materials (AREA)
  • Forklifts And Lifting Vehicles (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE60216433T 2001-03-30 2002-03-22 Lothöckermetallurgieschienen für versorgungs- und massenleitungsführung Expired - Lifetime DE60216433T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/823,427 US6653563B2 (en) 2001-03-30 2001-03-30 Alternate bump metallurgy bars for power and ground routing
US823427 2001-03-30
PCT/US2002/008905 WO2002080273A2 (en) 2001-03-30 2002-03-22 Alternate bump metallurgy bars for power and ground routing

Publications (2)

Publication Number Publication Date
DE60216433D1 true DE60216433D1 (de) 2007-01-11
DE60216433T2 DE60216433T2 (de) 2007-09-20

Family

ID=25238741

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60216433T Expired - Lifetime DE60216433T2 (de) 2001-03-30 2002-03-22 Lothöckermetallurgieschienen für versorgungs- und massenleitungsführung

Country Status (8)

Country Link
US (1) US6653563B2 (de)
EP (1) EP1374306B1 (de)
CN (1) CN100440504C (de)
AT (1) ATE347176T1 (de)
AU (1) AU2002252469A1 (de)
DE (1) DE60216433T2 (de)
TW (1) TW557553B (de)
WO (1) WO2002080273A2 (de)

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CN1579019A (zh) 2005-02-09
WO2002080273A2 (en) 2002-10-10
EP1374306B1 (de) 2006-11-29
US20020141171A1 (en) 2002-10-03
TW557553B (en) 2003-10-11
DE60216433T2 (de) 2007-09-20
EP1374306A2 (de) 2004-01-02
US6653563B2 (en) 2003-11-25
ATE347176T1 (de) 2006-12-15
WO2002080273A3 (en) 2003-07-03
AU2002252469A1 (en) 2002-10-15

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