CN100409404C - 晶化方法,晶化设备,处理衬底,薄膜晶体管及显示器设备 - Google Patents
晶化方法,晶化设备,处理衬底,薄膜晶体管及显示器设备 Download PDFInfo
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- CN100409404C CN100409404C CNB2004100640080A CN200410064008A CN100409404C CN 100409404 C CN100409404 C CN 100409404C CN B2004100640080 A CNB2004100640080 A CN B2004100640080A CN 200410064008 A CN200410064008 A CN 200410064008A CN 100409404 C CN100409404 C CN 100409404C
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
- Y10T117/1008—Apparatus with means for measuring, testing, or sensing with responsive control means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP189093/2003 | 2003-06-30 | ||
JP2003189093 | 2003-06-30 | ||
JP2003193779A JP2005032831A (ja) | 2003-07-08 | 2003-07-08 | 結晶化方法、結晶化装置、薄膜トランジスタ及び表示装置 |
JP193779/2003 | 2003-07-08 | ||
JP2003308935 | 2003-09-01 | ||
JP308935/2003 | 2003-09-01 | ||
JP402197/2003 | 2003-12-01 | ||
JP2003402197 | 2003-12-01 | ||
JP093200/2004 | 2004-03-26 | ||
JP2004093200A JP4524413B2 (ja) | 2003-06-30 | 2004-03-26 | 結晶化方法 |
Publications (2)
Publication Number | Publication Date |
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CN1585094A CN1585094A (zh) | 2005-02-23 |
CN100409404C true CN100409404C (zh) | 2008-08-06 |
Family
ID=33545607
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CNB2004100640080A Expired - Fee Related CN100409404C (zh) | 2003-06-30 | 2004-06-30 | 晶化方法,晶化设备,处理衬底,薄膜晶体管及显示器设备 |
Country Status (4)
Country | Link |
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US (3) | US7410848B2 (zh) |
KR (1) | KR101040463B1 (zh) |
CN (1) | CN100409404C (zh) |
TW (1) | TW200503061A (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4347546B2 (ja) * | 2002-06-28 | 2009-10-21 | 株式会社 液晶先端技術開発センター | 結晶化装置、結晶化方法および光学系 |
JP4347545B2 (ja) * | 2002-06-28 | 2009-10-21 | 株式会社 液晶先端技術開発センター | 結晶化装置および結晶化方法 |
TWI301295B (en) * | 2002-07-24 | 2008-09-21 | Adv Lcd Tech Dev Ct Co Ltd | Crystallization apparatus, crystallization method, thim film transistor and display apparatus |
TW200422749A (en) | 2003-04-22 | 2004-11-01 | Adv Lcd Tech Dev Ct Co Ltd | Crystallization apparatus, crystallization method, phase modulation element, device and display apparatus |
JP2005294801A (ja) * | 2004-03-11 | 2005-10-20 | Advanced Lcd Technologies Development Center Co Ltd | レーザー結晶化装置及びレーザー結晶化方法 |
JP4834853B2 (ja) * | 2004-06-10 | 2011-12-14 | シャープ株式会社 | 薄膜トランジスタ回路、薄膜トランジスタ回路の設計方法、薄膜トランジスタ回路の設計プログラム、設計プログラム記録媒体、及び表示装置 |
KR20060048937A (ko) * | 2004-08-03 | 2006-05-18 | 가부시키가이샤 에키쇼센탄 기쥬쓰 가이하쓰센타 | 레이저 결정화 장치 |
SE527733C2 (sv) * | 2004-10-08 | 2006-05-23 | Midsummer Ab | Anordning och metod för att tillverka solceller |
US7528028B2 (en) * | 2005-06-17 | 2009-05-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Super anneal for process induced strain modulation |
US20070010073A1 (en) * | 2005-07-06 | 2007-01-11 | Chien-Hao Chen | Method of forming a MOS device having a strained channel region |
JP2007165716A (ja) * | 2005-12-15 | 2007-06-28 | Advanced Lcd Technologies Development Center Co Ltd | レーザー結晶化装置及び結晶化方法 |
US7560321B2 (en) * | 2006-03-17 | 2009-07-14 | Advanced Lcd Technologies Development Center Co., Ltd. | Crystallization method, thin film transistor manufacturing method, thin film transistor, display, and semiconductor device |
US7687334B2 (en) * | 2006-03-23 | 2010-03-30 | Board Of Trustees Of The University Of Arkansas | Fabrication of large grain polycrystalline silicon film by nano aluminum-induced crystallization of amorphous silicon |
KR100713895B1 (ko) * | 2006-04-06 | 2007-05-04 | 비오이 하이디스 테크놀로지 주식회사 | 다결정막의 형성방법 |
US7977752B2 (en) * | 2006-06-26 | 2011-07-12 | Advanced Lcd Technologies Development Center Co., Ltd. | Thin-film semiconductor device, lateral bipolar thin-film transistor, hybrid thin-film transistor, MOS thin-film transistor, and method of fabricating thin-film transistor |
US8654045B2 (en) * | 2006-07-31 | 2014-02-18 | Sony Corporation | Display and method for manufacturing display |
US7569462B2 (en) * | 2006-12-13 | 2009-08-04 | Applied Materials, Inc. | Directional crystallization of silicon sheets using rapid thermal processing |
US20080142475A1 (en) * | 2006-12-15 | 2008-06-19 | Knowles Electronics, Llc | Method of creating solid object from a material and apparatus thereof |
CN100524579C (zh) * | 2007-02-09 | 2009-08-05 | 南京大学 | 半导体纳米硅场电子发射材料及其制备方法 |
JP2008270726A (ja) * | 2007-03-23 | 2008-11-06 | Advanced Lcd Technologies Development Center Co Ltd | 結晶化装置、結晶化方法、デバイス、および光変調素子 |
US7795119B2 (en) * | 2007-07-17 | 2010-09-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Flash anneal for a PAI, NiSi process |
WO2009035421A1 (en) * | 2007-09-14 | 2009-03-19 | Laserresearch (S) Pte Ltd | Single laser system for manufacture of thin film solar cell |
US20090078940A1 (en) * | 2007-09-26 | 2009-03-26 | Sharp Laboratories Of America, Inc. | Location-controlled crystal seeding |
US8476552B2 (en) * | 2008-03-31 | 2013-07-02 | Electro Scientific Industries, Inc. | Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes |
JP2009272509A (ja) * | 2008-05-09 | 2009-11-19 | Advanced Lcd Technologies Development Center Co Ltd | 光照射装置、結晶化装置、結晶化方法、およびデバイス |
KR100982311B1 (ko) * | 2008-05-26 | 2010-09-15 | 삼성모바일디스플레이주식회사 | 박막트랜지스터, 그의 제조방법 및 이를 포함하는유기전계발광표시장치 |
TWI464880B (zh) * | 2008-09-04 | 2014-12-11 | Au Optronics Corp | 薄膜電晶體陣列基板及其製作方法 |
KR101259982B1 (ko) * | 2009-09-25 | 2013-06-03 | (주)티엔스 | 엑시머 레이저를 이용한 마이크로머시닝 시스템 및 그 제어 방법 |
KR101094285B1 (ko) * | 2009-12-04 | 2011-12-19 | 삼성모바일디스플레이주식회사 | 박막트랜지스터 및 이를 포함하는 표시장치 |
GB2489682B (en) * | 2011-03-30 | 2015-11-04 | Pragmatic Printing Ltd | Electronic device and its method of manufacture |
KR101991405B1 (ko) * | 2012-09-19 | 2019-06-20 | 삼성전자주식회사 | 빔 형상기, 이를 구비하는 레이저 어닐링 시스템 및 이 시스템을 이용하여 반사형 포토 마스크를 제작하는 방법 |
CN104775161B (zh) * | 2015-03-04 | 2017-10-13 | 信利(惠州)智能显示有限公司 | 激光晶化光路系统、低温多晶硅薄膜及其制备方法 |
KR102470044B1 (ko) * | 2016-05-13 | 2022-11-24 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 및 이의 제조 방법 |
CN107293511B (zh) * | 2017-07-05 | 2019-11-12 | 京东方科技集团股份有限公司 | 一种膜层退火设备及退火方法 |
JP7190875B2 (ja) * | 2018-11-16 | 2022-12-16 | 東京エレクトロン株式会社 | ポリシリコン膜の形成方法及び成膜装置 |
WO2021026530A1 (en) * | 2019-08-08 | 2021-02-11 | The Regents Of The University Of California | Crystallization of two-dimensional structures comprising multiple thin films |
KR20210025165A (ko) * | 2019-08-26 | 2021-03-09 | 삼성디스플레이 주식회사 | 레이저 광원 및 레이저 결정화 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1012891A (ja) * | 1996-06-20 | 1998-01-16 | Sony Corp | 薄膜半導体装置の製造方法 |
US20020047580A1 (en) * | 1999-04-19 | 2002-04-25 | Masafumi Kunii | Process of crystallizing semiconductor thin film and laser irradiation system |
US6393042B1 (en) * | 1999-03-08 | 2002-05-21 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer and laser irradiation apparatus |
CN1407601A (zh) * | 2001-08-30 | 2003-04-02 | 株式会社半导体能源研究所 | 制造半导体器件的方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5424230A (en) * | 1992-02-19 | 1995-06-13 | Casio Computer Co., Ltd. | Method of manufacturing a polysilicon thin film transistor |
JPH11283933A (ja) | 1998-01-29 | 1999-10-15 | Toshiba Corp | レ―ザ照射装置,非単結晶半導体膜の製造方法及び液晶表示装置の製造方法 |
JP2000082669A (ja) | 1998-09-07 | 2000-03-21 | Japan Science & Technology Corp | 太陽電池用多結晶半導体膜の製造方法 |
JP4784955B2 (ja) * | 2001-07-18 | 2011-10-05 | 株式会社 液晶先端技術開発センター | 薄膜半導体装置の製造方法 |
JP2003178979A (ja) | 2001-08-30 | 2003-06-27 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2003109911A (ja) * | 2001-10-01 | 2003-04-11 | Sharp Corp | 薄膜処理装置、薄膜処理方法および薄膜デバイス |
JP2004119919A (ja) | 2002-09-30 | 2004-04-15 | Hitachi Ltd | 半導体薄膜および半導体薄膜の製造方法 |
-
2004
- 2004-06-23 TW TW093118162A patent/TW200503061A/zh unknown
- 2004-06-29 US US10/878,331 patent/US7410848B2/en not_active Expired - Fee Related
- 2004-06-30 KR KR1020040050203A patent/KR101040463B1/ko not_active IP Right Cessation
- 2004-06-30 CN CNB2004100640080A patent/CN100409404C/zh not_active Expired - Fee Related
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2006
- 2006-04-21 US US11/408,022 patent/US20060186412A1/en not_active Abandoned
-
2008
- 2008-07-02 US US12/166,997 patent/US8114217B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1012891A (ja) * | 1996-06-20 | 1998-01-16 | Sony Corp | 薄膜半導体装置の製造方法 |
US6393042B1 (en) * | 1999-03-08 | 2002-05-21 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer and laser irradiation apparatus |
US20020047580A1 (en) * | 1999-04-19 | 2002-04-25 | Masafumi Kunii | Process of crystallizing semiconductor thin film and laser irradiation system |
CN1407601A (zh) * | 2001-08-30 | 2003-04-02 | 株式会社半导体能源研究所 | 制造半导体器件的方法 |
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US20060186412A1 (en) | 2006-08-24 |
KR101040463B1 (ko) | 2011-06-09 |
US20040266080A1 (en) | 2004-12-30 |
US7410848B2 (en) | 2008-08-12 |
US8114217B2 (en) | 2012-02-14 |
KR20050002644A (ko) | 2005-01-07 |
CN1585094A (zh) | 2005-02-23 |
TW200503061A (en) | 2005-01-16 |
US20080289573A1 (en) | 2008-11-27 |
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