CN100364039C - 真空处理装置和基板传送方法 - Google Patents
真空处理装置和基板传送方法 Download PDFInfo
- Publication number
- CN100364039C CN100364039C CNB2004100327433A CN200410032743A CN100364039C CN 100364039 C CN100364039 C CN 100364039C CN B2004100327433 A CNB2004100327433 A CN B2004100327433A CN 200410032743 A CN200410032743 A CN 200410032743A CN 100364039 C CN100364039 C CN 100364039C
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- CN
- China
- Prior art keywords
- vacuum pump
- action
- vacuum
- scheduled time
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 title claims description 47
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims description 32
- 238000009489 vacuum treatment Methods 0.000 claims description 28
- 238000009434 installation Methods 0.000 claims description 27
- 238000003306 harvesting Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 abstract description 7
- 238000004134 energy conservation Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003111686 | 2003-04-16 | ||
JP2003111686A JP4451076B2 (ja) | 2003-04-16 | 2003-04-16 | 真空処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1538502A CN1538502A (zh) | 2004-10-20 |
CN100364039C true CN100364039C (zh) | 2008-01-23 |
Family
ID=33472166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100327433A Expired - Fee Related CN100364039C (zh) | 2003-04-16 | 2004-04-16 | 真空处理装置和基板传送方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US6990747B2 (zh) |
JP (1) | JP4451076B2 (zh) |
CN (1) | CN100364039C (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4496980B2 (ja) | 2005-02-10 | 2010-07-07 | セイコーエプソン株式会社 | 半導体製造装置の制御方法及びその制御システム |
CN100444346C (zh) * | 2005-12-08 | 2008-12-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种半导体刻蚀设备中控制分子泵的方法 |
JP4232788B2 (ja) * | 2006-04-03 | 2009-03-04 | セイコーエプソン株式会社 | 半導体製造装置の制御方法及びその制御システム |
JP4435799B2 (ja) * | 2007-03-19 | 2010-03-24 | 東京エレクトロン株式会社 | 開閉バルブ及び該開閉バルブを備えた処理装置 |
US8539257B2 (en) * | 2008-10-08 | 2013-09-17 | Applied Materials, Inc. | Method and apparatus for detecting an idle mode of processing equipment |
JP2010093125A (ja) * | 2008-10-09 | 2010-04-22 | Toray Eng Co Ltd | 基板処理システムおよび基板処理方法 |
CN101908467B (zh) * | 2009-06-05 | 2012-07-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 在线式基板处理系统 |
US9740184B2 (en) * | 2009-11-16 | 2017-08-22 | Applied Materials, Inc. | Controls interface solution for energy savings |
WO2012042800A1 (ja) * | 2010-09-28 | 2012-04-05 | 株式会社アルバック | ロードロック装置、排気制御装置及びロードロック装置の動作方法 |
US10043666B2 (en) | 2016-02-26 | 2018-08-07 | Applied Materials, Inc. | Method for inter-chamber process |
WO2018122428A1 (es) | 2016-12-29 | 2018-07-05 | Fundación Cidetec | Recubrimientos con funcionalidad repelente y su uso |
JP7014055B2 (ja) * | 2018-06-15 | 2022-02-01 | 東京エレクトロン株式会社 | 真空処理装置、真空処理システム、及び真空処理方法 |
KR102617398B1 (ko) * | 2020-08-13 | 2023-12-26 | 세메스 주식회사 | 기판 반송 장치, 기판 처리 장치 및 기판 반송 방법 |
CN113915971A (zh) * | 2021-12-09 | 2022-01-11 | 中国华能集团清洁能源技术研究院有限公司 | 一种真空闪蒸系统及真空闪蒸方法 |
CN116435215A (zh) * | 2022-01-04 | 2023-07-14 | 江苏微导纳米科技股份有限公司 | 晶圆处理设备、晶圆处理系统及控制方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11204508A (ja) * | 1998-01-09 | 1999-07-30 | Toshiba Corp | 半導体装置の製造方法及び半導体製造装置 |
WO2002052638A1 (fr) * | 2000-12-26 | 2002-07-04 | Tokyo Electron Limited | Procede de regulation de pression, dispositif de transfert, et outil en grappe |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3711226B2 (ja) * | 2000-02-23 | 2005-11-02 | 大日本印刷株式会社 | 真空乾燥装置および真空乾燥方法 |
US7521089B2 (en) * | 2002-06-13 | 2009-04-21 | Tokyo Electron Limited | Method and apparatus for controlling the movement of CVD reaction byproduct gases to adjacent process chambers |
-
2003
- 2003-04-16 JP JP2003111686A patent/JP4451076B2/ja not_active Expired - Fee Related
-
2004
- 2004-04-12 US US10/821,971 patent/US6990747B2/en not_active Expired - Lifetime
- 2004-04-16 CN CNB2004100327433A patent/CN100364039C/zh not_active Expired - Fee Related
-
2005
- 2005-10-27 US US11/259,147 patent/US7201851B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11204508A (ja) * | 1998-01-09 | 1999-07-30 | Toshiba Corp | 半導体装置の製造方法及び半導体製造装置 |
US6274507B1 (en) * | 1998-01-09 | 2001-08-14 | Kabushiki Kaisha Toshiba | Plasma processing apparatus and method |
WO2002052638A1 (fr) * | 2000-12-26 | 2002-07-04 | Tokyo Electron Limited | Procede de regulation de pression, dispositif de transfert, et outil en grappe |
Also Published As
Publication number | Publication date |
---|---|
US20060032074A1 (en) | 2006-02-16 |
JP4451076B2 (ja) | 2010-04-14 |
CN1538502A (zh) | 2004-10-20 |
US20040255485A1 (en) | 2004-12-23 |
US7201851B2 (en) | 2007-04-10 |
JP2004319761A (ja) | 2004-11-11 |
US6990747B2 (en) | 2006-01-31 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180306 Address after: Tokyo, Japan, Japan Co-patentee after: Toshiba Storage Corporation Patentee after: Tokyo Electron Limited Address before: Tokyo, Japan, Japan Co-patentee before: Toshiba Corp Patentee before: Tokyo Electron Limited |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190507 Address after: Tokyo, Japan, Japan Patentee after: Tokyo Electron Limited Address before: Tokyo, Japan, Japan Co-patentee before: Toshiba Storage Corporation Patentee before: Tokyo Electron Limited |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080123 Termination date: 20210416 |