CN100344579C - 具有钙钛矿结构的陶瓷粉末及其制法、电子部件及电容器 - Google Patents

具有钙钛矿结构的陶瓷粉末及其制法、电子部件及电容器 Download PDF

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CN100344579C
CN100344579C CNB2004100086418A CN200410008641A CN100344579C CN 100344579 C CN100344579 C CN 100344579C CN B2004100086418 A CNB2004100086418 A CN B2004100086418A CN 200410008641 A CN200410008641 A CN 200410008641A CN 100344579 C CN100344579 C CN 100344579C
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ceramic powder
powder
ceramic
lattice
manufacture method
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CN1532167A (zh
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川村知荣
棚田淳
茶园广一
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Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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CNB2004100086418A 2003-03-24 2004-03-12 具有钙钛矿结构的陶瓷粉末及其制法、电子部件及电容器 Expired - Lifetime CN100344579C (zh)

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JP2003080407A JP4141298B2 (ja) 2003-03-24 2003-03-24 ペロブスカイト構造を有する誘電体セラミック粉末の製造方法と、セラミック電子部品の製造方法と、積層セラミックコンデンサの製造方法
JP080407/2003 2003-03-24

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CNA2006101538962A Pending CN1951867A (zh) 2003-03-24 2004-03-12 具有钙钛矿结构的陶瓷粉末

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JP2005272295A (ja) * 2004-02-26 2005-10-06 Dowa Mining Co Ltd 正方晶チタン酸バリウム粒子およびその製造方法並びにセラミックコンデンサ
CN101014538B (zh) * 2004-08-13 2012-07-04 堺化学工业株式会社 钙钛矿化合物粉末的制备方法
JP4766910B2 (ja) * 2005-04-26 2011-09-07 京セラ株式会社 チタン酸バリウム粉末の製法、チタン酸バリウム粉末、およびチタン酸バリウム焼結体
JP4827011B2 (ja) * 2006-03-10 2011-11-30 Ｔｄｋ株式会社 セラミック粉末及びこれを用いた誘電体ペースト、積層セラミック電子部品、その製造方法
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