CN1003026B - 半导体汽化冷却装置 - Google Patents

半导体汽化冷却装置 Download PDF

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Publication number
CN1003026B
CN1003026B CN86102472A CN86102472A CN1003026B CN 1003026 B CN1003026 B CN 1003026B CN 86102472 A CN86102472 A CN 86102472A CN 86102472 A CN86102472 A CN 86102472A CN 1003026 B CN1003026 B CN 1003026B
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CN
China
Prior art keywords
cooling
semiconductor
semiconductor stack
mentioned
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN86102472A
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English (en)
Chinese (zh)
Other versions
CN86102472A (zh
Inventor
板鼻搏
簿井义典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN86102472A publication Critical patent/CN86102472A/zh
Publication of CN1003026B publication Critical patent/CN1003026B/zh
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN86102472A 1985-04-10 1986-04-09 半导体汽化冷却装置 Expired CN1003026B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60074283A JPS61234059A (ja) 1985-04-10 1985-04-10 半導体素子の沸謄冷却装置
JP74283/85 1985-04-10

Publications (2)

Publication Number Publication Date
CN86102472A CN86102472A (zh) 1986-10-15
CN1003026B true CN1003026B (zh) 1989-01-04

Family

ID=13542635

Family Applications (1)

Application Number Title Priority Date Filing Date
CN86102472A Expired CN1003026B (zh) 1985-04-10 1986-04-09 半导体汽化冷却装置

Country Status (7)

Country Link
US (1) US4694323A (enExample)
JP (1) JPS61234059A (enExample)
KR (1) KR860008604A (enExample)
CN (1) CN1003026B (enExample)
AU (1) AU561322B2 (enExample)
BR (1) BR8601580A (enExample)
DE (1) DE3611811A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
JPH0724293B2 (ja) * 1987-09-30 1995-03-15 株式会社日立製作所 沸騰冷却装置
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks
JP2741255B2 (ja) * 1989-08-18 1998-04-15 株式会社日立製作所 沸騰冷却用伝熱体
AU618203B2 (en) * 1989-09-29 1991-12-12 Mitsubishi Denki Kabushiki Kaisha Boiling type cooler device for power semiconductor switching elements
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
US5448108A (en) * 1993-11-02 1995-09-05 Hughes Aircraft Company Cooling of semiconductor power modules by flushing with dielectric liquid
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
DE19709934B4 (de) 1996-03-14 2008-04-17 Denso Corp., Kariya Kühlgerät zum Sieden und Kondensieren eines Kältemittels
DE19905980C2 (de) * 1999-02-12 2001-02-08 Fraunhofer Ges Forschung Kühlvorrichtung und Kühlverfahren
DE10211568B4 (de) * 2002-03-15 2004-01-29 Siemens Ag Kälteanlage für zu kühlende Teile einer Einrichtung
US6604571B1 (en) * 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US20070023169A1 (en) * 2005-07-29 2007-02-01 Innovative Fluidics, Inc. Synthetic jet ejector for augmentation of pumped liquid loop cooling and enhancement of pool and flow boiling
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
JP2009135142A (ja) * 2007-11-28 2009-06-18 Toyota Industries Corp 沸騰冷却装置
JP5401419B2 (ja) * 2010-08-31 2014-01-29 株式会社日立製作所 鉄道車両用電力変換装置
US8797739B2 (en) * 2011-06-23 2014-08-05 Delphi Technologies, Inc. Self circulating heat exchanger
CN102975843B (zh) * 2012-11-13 2016-01-13 浙江海洋学院 大型船舶主机尾气余热利用装置
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink
CN105556232B (zh) * 2014-08-28 2018-06-26 阿威德热合金有限公司 具有一体式部件的热虹吸装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE250511C (enExample) *
SE337263B (enExample) * 1969-03-24 1971-08-02 Asea Ab
JPS5046079A (enExample) * 1973-08-28 1975-04-24
US4028723A (en) * 1975-02-24 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Cooling device for heat generation member
JPS5267978A (en) * 1975-12-03 1977-06-06 Mitsubishi Electric Corp Boiling-cooling type semiconductor unit
JPS53138677A (en) * 1977-05-10 1978-12-04 Mitsubishi Electric Corp Vapor cooling type semiconductor device
JPS5541734A (en) * 1978-09-20 1980-03-24 Hitachi Ltd Boiling water cooling-type semiconductor stack
JPS5568662A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Semiconductor cooler
JPS55129462U (enExample) * 1979-03-08 1980-09-12

Also Published As

Publication number Publication date
AU561322B2 (en) 1987-05-07
CN86102472A (zh) 1986-10-15
US4694323A (en) 1987-09-15
BR8601580A (pt) 1986-12-09
DE3611811A1 (de) 1986-10-16
KR860008604A (ko) 1986-11-17
JPH0363825B2 (enExample) 1991-10-02
AU5568686A (en) 1986-10-16
JPS61234059A (ja) 1986-10-18
DE3611811C2 (enExample) 1990-06-13

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