DE3611811C2 - - Google Patents

Info

Publication number
DE3611811C2
DE3611811C2 DE3611811A DE3611811A DE3611811C2 DE 3611811 C2 DE3611811 C2 DE 3611811C2 DE 3611811 A DE3611811 A DE 3611811A DE 3611811 A DE3611811 A DE 3611811A DE 3611811 C2 DE3611811 C2 DE 3611811C2
Authority
DE
Germany
Prior art keywords
cooling
semiconductor
recesses
conductor
cooling element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3611811A
Other languages
German (de)
English (en)
Other versions
DE3611811A1 (de
Inventor
Hiroshi Itahana
Yoshinori Katsuta Jp Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3611811A1 publication Critical patent/DE3611811A1/de
Application granted granted Critical
Publication of DE3611811C2 publication Critical patent/DE3611811C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W40/00—
    • H10W40/73—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19863611811 1985-04-10 1986-04-08 Vorrichtung zur dampfkuehlung eines halbleiters Granted DE3611811A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60074283A JPS61234059A (ja) 1985-04-10 1985-04-10 半導体素子の沸謄冷却装置

Publications (2)

Publication Number Publication Date
DE3611811A1 DE3611811A1 (de) 1986-10-16
DE3611811C2 true DE3611811C2 (enExample) 1990-06-13

Family

ID=13542635

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863611811 Granted DE3611811A1 (de) 1985-04-10 1986-04-08 Vorrichtung zur dampfkuehlung eines halbleiters

Country Status (7)

Country Link
US (1) US4694323A (enExample)
JP (1) JPS61234059A (enExample)
KR (1) KR860008604A (enExample)
CN (1) CN1003026B (enExample)
AU (1) AU561322B2 (enExample)
BR (1) BR8601580A (enExample)
DE (1) DE3611811A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19905980C2 (de) * 1999-02-12 2001-02-08 Fraunhofer Ges Forschung Kühlvorrichtung und Kühlverfahren

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
JPH0724293B2 (ja) * 1987-09-30 1995-03-15 株式会社日立製作所 沸騰冷却装置
US4864385A (en) * 1987-12-29 1989-09-05 Hitachi, Ltd. Power semiconductors connected antiparallel via heatsinks
JP2741255B2 (ja) * 1989-08-18 1998-04-15 株式会社日立製作所 沸騰冷却用伝熱体
AU618203B2 (en) * 1989-09-29 1991-12-12 Mitsubishi Denki Kabushiki Kaisha Boiling type cooler device for power semiconductor switching elements
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
US5448108A (en) * 1993-11-02 1995-09-05 Hughes Aircraft Company Cooling of semiconductor power modules by flushing with dielectric liquid
US6357517B1 (en) 1994-07-04 2002-03-19 Denso Corporation Cooling apparatus boiling and condensing refrigerant
JP3487382B2 (ja) * 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
DE19709934B4 (de) * 1996-03-14 2008-04-17 Denso Corp., Kariya Kühlgerät zum Sieden und Kondensieren eines Kältemittels
DE10211568B4 (de) * 2002-03-15 2004-01-29 Siemens Ag Kälteanlage für zu kühlende Teile einer Einrichtung
US6604571B1 (en) * 2002-04-11 2003-08-12 General Dynamics Land Systems, Inc. Evaporative cooling of electrical components
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US20070023169A1 (en) * 2005-07-29 2007-02-01 Innovative Fluidics, Inc. Synthetic jet ejector for augmentation of pumped liquid loop cooling and enhancement of pool and flow boiling
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
JP2009135142A (ja) * 2007-11-28 2009-06-18 Toyota Industries Corp 沸騰冷却装置
JP5401419B2 (ja) * 2010-08-31 2014-01-29 株式会社日立製作所 鉄道車両用電力変換装置
US8797739B2 (en) * 2011-06-23 2014-08-05 Delphi Technologies, Inc. Self circulating heat exchanger
CN102975843B (zh) * 2012-11-13 2016-01-13 浙江海洋学院 大型船舶主机尾气余热利用装置
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink
EP3186574B1 (en) * 2014-08-28 2019-08-21 Aavid Thermalloy, LLC Thermosiphon with integrated components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE250511C (enExample) *
SE337263B (enExample) * 1969-03-24 1971-08-02 Asea Ab
JPS5046079A (enExample) * 1973-08-28 1975-04-24
US4028723A (en) * 1975-02-24 1977-06-07 Mitsubishi Denki Kabushiki Kaisha Cooling device for heat generation member
JPS5267978A (en) * 1975-12-03 1977-06-06 Mitsubishi Electric Corp Boiling-cooling type semiconductor unit
JPS53138677A (en) * 1977-05-10 1978-12-04 Mitsubishi Electric Corp Vapor cooling type semiconductor device
JPS5541734A (en) * 1978-09-20 1980-03-24 Hitachi Ltd Boiling water cooling-type semiconductor stack
JPS5568662A (en) * 1978-11-17 1980-05-23 Hitachi Ltd Semiconductor cooler
JPS55129462U (enExample) * 1979-03-08 1980-09-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19905980C2 (de) * 1999-02-12 2001-02-08 Fraunhofer Ges Forschung Kühlvorrichtung und Kühlverfahren

Also Published As

Publication number Publication date
KR860008604A (ko) 1986-11-17
DE3611811A1 (de) 1986-10-16
BR8601580A (pt) 1986-12-09
AU561322B2 (en) 1987-05-07
JPH0363825B2 (enExample) 1991-10-02
CN1003026B (zh) 1989-01-04
JPS61234059A (ja) 1986-10-18
CN86102472A (zh) 1986-10-15
AU5568686A (en) 1986-10-16
US4694323A (en) 1987-09-15

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee