CH608653A5 - - Google Patents

Info

Publication number
CH608653A5
CH608653A5 CH1371375A CH1371375A CH608653A5 CH 608653 A5 CH608653 A5 CH 608653A5 CH 1371375 A CH1371375 A CH 1371375A CH 1371375 A CH1371375 A CH 1371375A CH 608653 A5 CH608653 A5 CH 608653A5
Authority
CH
Switzerland
Application number
CH1371375A
Inventor
Takeshi Matsushita
Hisao Hayashi
Teruaki Aoki
Hidenobu Mochizuki
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CH608653A5 publication Critical patent/CH608653A5/xx

Links

Classifications

    • H10W74/147
    • H10P14/662
    • H10P14/683
    • H10P14/6903
    • H10W74/131
    • H10W74/137
    • H10P14/6306
    • H10P14/6309
    • H10P14/6322
    • H10P14/6334
    • H10P14/6342
    • H10P14/6682
    • H10P14/69215
    • H10P14/6922
    • H10P14/6929
    • H10P14/69391
    • H10P14/69433
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/905Plural dram cells share common contact or common trench
CH1371375A 1974-10-26 1975-10-23 CH608653A5 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49123765A JPS6022497B2 (ja) 1974-10-26 1974-10-26 半導体装置

Publications (1)

Publication Number Publication Date
CH608653A5 true CH608653A5 (cg-RX-API-DMAC10.html) 1979-01-15

Family

ID=14868714

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1371375A CH608653A5 (cg-RX-API-DMAC10.html) 1974-10-26 1975-10-23

Country Status (15)

Country Link
US (1) US4063275A (cg-RX-API-DMAC10.html)
JP (1) JPS6022497B2 (cg-RX-API-DMAC10.html)
AT (1) AT370561B (cg-RX-API-DMAC10.html)
AU (1) AU504667B2 (cg-RX-API-DMAC10.html)
BR (1) BR7506996A (cg-RX-API-DMAC10.html)
CA (1) CA1046650A (cg-RX-API-DMAC10.html)
CH (1) CH608653A5 (cg-RX-API-DMAC10.html)
DE (1) DE2547304A1 (cg-RX-API-DMAC10.html)
DK (1) DK142758B (cg-RX-API-DMAC10.html)
ES (1) ES442102A1 (cg-RX-API-DMAC10.html)
FR (1) FR2290040A1 (cg-RX-API-DMAC10.html)
GB (1) GB1515179A (cg-RX-API-DMAC10.html)
IT (1) IT1044592B (cg-RX-API-DMAC10.html)
NL (1) NL183260C (cg-RX-API-DMAC10.html)
SE (1) SE411606B (cg-RX-API-DMAC10.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2632647A1 (de) * 1976-07-20 1978-01-26 Siemens Ag Halbleiterbauelement mit passivierender schutzschicht
IN147578B (cg-RX-API-DMAC10.html) * 1977-02-24 1980-04-19 Rca Corp
DE2730367A1 (de) * 1977-07-05 1979-01-18 Siemens Ag Verfahren zum passivieren von halbleiterelementen
US4174252A (en) * 1978-07-26 1979-11-13 Rca Corporation Method of defining contact openings in insulating layers on semiconductor devices without the formation of undesirable pinholes
CA1136773A (en) * 1978-08-14 1982-11-30 Norikazu Ohuchi Semiconductor device
FR2459551A1 (fr) * 1979-06-19 1981-01-09 Thomson Csf Procede et structure de passivation a autoalignement sur l'emplacement d'un masque
GB2071411B (en) * 1980-03-07 1983-12-21 Philips Electronic Associated Passivating p-n junction devices
US4344985A (en) * 1981-03-27 1982-08-17 Rca Corporation Method of passivating a semiconductor device with a multi-layer passivant system by thermally growing a layer of oxide on an oxygen doped polycrystalline silicon layer
US4420765A (en) * 1981-05-29 1983-12-13 Rca Corporation Multi-layer passivant system
AT384121B (de) * 1983-03-28 1987-10-12 Shell Austria Verfahren zum gettern von halbleiterbauelementen
JPS6042859A (ja) * 1983-08-19 1985-03-07 Toshiba Corp 高耐圧半導体装置の製造方法
JPS61222172A (ja) * 1985-03-15 1986-10-02 Sharp Corp Mosfetのゲ−ト絶縁膜形成方法
JPS6276673A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 高耐圧半導体装置
DE3542166A1 (de) * 1985-11-29 1987-06-04 Telefunken Electronic Gmbh Halbleiterbauelement
EP0388612B1 (en) * 1989-03-24 1994-11-30 International Business Machines Corporation Semiconductor device with self-aligned contact to buried subcollector
JPH04343479A (ja) * 1991-05-21 1992-11-30 Nec Yamagata Ltd 可変容量ダイオード
DE69427501T2 (de) * 1993-04-05 2002-05-23 Denso Corp., Kariya Halbleiteranordnung mit Dünnfilm-Widerstand
US6242792B1 (en) 1996-07-02 2001-06-05 Denso Corporation Semiconductor device having oblique portion as reflection
CN1293374C (zh) * 2002-04-17 2007-01-03 北京师范大学 能直接测量波长的新结构光电探测器及其探测方法
CN111816574B (zh) * 2020-05-29 2022-03-04 济宁东方芯电子科技有限公司 一种uv膜模板及利用uv膜模板实现洁净玻璃钝化的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2789258A (en) * 1955-06-29 1957-04-16 Raytheon Mfg Co Intrinsic coatings for semiconductor junctions
DE1184178B (de) * 1960-02-20 1964-12-23 Standard Elektrik Lorenz Ag Verfahren zum Stabilisieren der Oberflaeche von Halbleiterkoerpern mit pn-UEbergaengen durch Vakuumbedampfen
CH428947A (fr) * 1966-01-31 1967-01-31 Centre Electron Horloger Procédé de fabrication d'un circuit intégré
GB1211354A (en) * 1966-12-01 1970-11-04 Gen Electric Improvements relating to passivated semiconductor devices
DE1614455C3 (de) * 1967-03-16 1979-07-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen einer teils aus Siliciumoxid, teils aus Siliciumnitrid bestehenden Schutzschicht an der Oberfläche eines Halbleiterkörpers
US3419746A (en) * 1967-05-25 1968-12-31 Bell Telephone Labor Inc Light sensitive storage device including diode array
US3440477A (en) * 1967-10-18 1969-04-22 Bell Telephone Labor Inc Multiple readout electron beam device
NL162250C (nl) * 1967-11-21 1980-04-15 Philips Nv Halfgeleiderinrichting met een halfgeleiderlichaam, waarvan aan een hoofdoppervlak het halfgeleideroppervlak plaatselijk met een oxydelaag is bedekt, en werkwijze voor het vervaardigen van planaire halfgeleider- inrichtingen.
US3558348A (en) * 1968-04-18 1971-01-26 Bell Telephone Labor Inc Dielectric films for semiconductor devices
US3615913A (en) * 1968-11-08 1971-10-26 Westinghouse Electric Corp Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating
JPS497870B1 (cg-RX-API-DMAC10.html) * 1969-06-06 1974-02-22
US3878549A (en) * 1970-10-27 1975-04-15 Shumpei Yamazaki Semiconductor memories
DE2220807A1 (de) * 1971-04-30 1972-11-16 Texas Instruments Inc Verfahren und Vorrichtung zum Abscheiden von polykristallinen Duennfilmen aus Silicium und Siliciumdioxid auf Halbleitersubstraten
NL7204741A (cg-RX-API-DMAC10.html) * 1972-04-08 1973-10-10
JPS532552B2 (cg-RX-API-DMAC10.html) * 1974-03-30 1978-01-28

Also Published As

Publication number Publication date
NL7512559A (nl) 1976-04-28
AU504667B2 (en) 1979-10-25
JPS5149686A (cg-RX-API-DMAC10.html) 1976-04-30
US4063275A (en) 1977-12-13
GB1515179A (en) 1978-06-21
FR2290040B1 (cg-RX-API-DMAC10.html) 1979-08-17
SE411606B (sv) 1980-01-14
DE2547304C2 (cg-RX-API-DMAC10.html) 1988-08-11
CA1046650A (en) 1979-01-16
AU8599175A (en) 1977-04-28
JPS6022497B2 (ja) 1985-06-03
DE2547304A1 (de) 1976-04-29
DK480275A (cg-RX-API-DMAC10.html) 1976-04-27
ATA818475A (de) 1982-08-15
DK142758B (da) 1981-01-12
NL183260B (nl) 1988-04-05
SE7511927L (sv) 1976-04-27
FR2290040A1 (fr) 1976-05-28
DK142758C (cg-RX-API-DMAC10.html) 1981-08-10
BR7506996A (pt) 1976-08-17
AT370561B (de) 1983-04-11
IT1044592B (it) 1980-03-31
NL183260C (nl) 1988-09-01
ES442102A1 (es) 1977-03-16

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Legal Events

Date Code Title Description
PL Patent ceased