CA2582332A1 - Method for making electronic devices having a dielectric layer surface treatment - Google Patents
Method for making electronic devices having a dielectric layer surface treatment Download PDFInfo
- Publication number
- CA2582332A1 CA2582332A1 CA002582332A CA2582332A CA2582332A1 CA 2582332 A1 CA2582332 A1 CA 2582332A1 CA 002582332 A CA002582332 A CA 002582332A CA 2582332 A CA2582332 A CA 2582332A CA 2582332 A1 CA2582332 A1 CA 2582332A1
- Authority
- CA
- Canada
- Prior art keywords
- polymeric layer
- layer
- plasma
- monomers
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/10—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00 comprising field-effect transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
- H10P14/687—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene
Landscapes
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/954,413 | 2004-09-30 | ||
| US10/954,413 US7399668B2 (en) | 2004-09-30 | 2004-09-30 | Method for making electronic devices having a dielectric layer surface treatment |
| PCT/US2005/030412 WO2006039019A1 (en) | 2004-09-30 | 2005-08-26 | Method for making electronic devices having a dielectric layer surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2582332A1 true CA2582332A1 (en) | 2006-04-13 |
Family
ID=35427645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002582332A Abandoned CA2582332A1 (en) | 2004-09-30 | 2005-08-26 | Method for making electronic devices having a dielectric layer surface treatment |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7399668B2 (https=) |
| EP (1) | EP1800358A1 (https=) |
| JP (1) | JP2008515222A (https=) |
| KR (1) | KR20070072897A (https=) |
| CN (1) | CN100593249C (https=) |
| CA (1) | CA2582332A1 (https=) |
| WO (1) | WO2006039019A1 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0207350D0 (en) * | 2002-03-28 | 2002-05-08 | Univ Sheffield | Surface |
| US20060214154A1 (en) * | 2005-03-24 | 2006-09-28 | Eastman Kodak Company | Polymeric gate dielectrics for organic thin film transistors and methods of making the same |
| GB0507753D0 (en) * | 2005-04-18 | 2005-05-25 | Univ Durham | A method for producing a nitrogen functionalised surface |
| US8138075B1 (en) | 2006-02-06 | 2012-03-20 | Eberlein Dietmar C | Systems and methods for the manufacture of flat panel devices |
| WO2008016836A2 (en) * | 2006-07-29 | 2008-02-07 | Lotus Applied Technology, Llc | Radical-enhanced atomic layer deposition system and method |
| US20080271625A1 (en) * | 2007-01-22 | 2008-11-06 | Nano Terra Inc. | High-Throughput Apparatus for Patterning Flexible Substrates and Method of Using the Same |
| US20100037820A1 (en) * | 2008-08-13 | 2010-02-18 | Synos Technology, Inc. | Vapor Deposition Reactor |
| US20100037824A1 (en) * | 2008-08-13 | 2010-02-18 | Synos Technology, Inc. | Plasma Reactor Having Injector |
| US8770142B2 (en) | 2008-09-17 | 2014-07-08 | Veeco Ald Inc. | Electrode for generating plasma and plasma generator |
| US8851012B2 (en) * | 2008-09-17 | 2014-10-07 | Veeco Ald Inc. | Vapor deposition reactor using plasma and method for forming thin film using the same |
| JP2012511106A (ja) * | 2008-12-05 | 2012-05-17 | ロータス アプライド テクノロジー エルエルシー | 改善されたバリア層の性質を有する薄膜の高速成膜 |
| US8871628B2 (en) * | 2009-01-21 | 2014-10-28 | Veeco Ald Inc. | Electrode structure, device comprising the same and method for forming electrode structure |
| KR101172147B1 (ko) | 2009-02-23 | 2012-08-07 | 시너스 테크놀리지, 인코포레이티드 | 플라즈마에 의한 라디칼을 이용한 박막 형성 방법 |
| JP2010244868A (ja) * | 2009-04-07 | 2010-10-28 | Sony Corp | 有機電界発光素子および表示装置 |
| US8758512B2 (en) * | 2009-06-08 | 2014-06-24 | Veeco Ald Inc. | Vapor deposition reactor and method for forming thin film |
| KR200448504Y1 (ko) * | 2009-07-14 | 2010-04-21 | 주식회사 협진아이엔씨 | 휴대폰용 접속단자 |
| TWI394305B (zh) * | 2009-10-08 | 2013-04-21 | Nat Univ Tsing Hua | 有機薄膜電晶體之製備方法以及有機薄膜電晶體之閘極介電層表面處理方法 |
| US8637123B2 (en) * | 2009-12-29 | 2014-01-28 | Lotus Applied Technology, Llc | Oxygen radical generation for radical-enhanced thin film deposition |
| US8771791B2 (en) | 2010-10-18 | 2014-07-08 | Veeco Ald Inc. | Deposition of layer using depositing apparatus with reciprocating susceptor |
| US8877300B2 (en) | 2011-02-16 | 2014-11-04 | Veeco Ald Inc. | Atomic layer deposition using radicals of gas mixture |
| US9163310B2 (en) * | 2011-02-18 | 2015-10-20 | Veeco Ald Inc. | Enhanced deposition of layer on substrate using radicals |
| KR102046130B1 (ko) * | 2012-03-06 | 2019-11-18 | 셈블란트 리미티드 | 코팅된 전기 어셈블리 |
| BE1023998B1 (nl) | 2015-06-09 | 2017-10-26 | P2I Ltd | Coatings |
| GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
| TWI805162B (zh) * | 2017-04-18 | 2023-06-11 | 日商東京威力科創股份有限公司 | 被處理體之處理裝置 |
| CN111372692A (zh) * | 2018-05-04 | 2020-07-03 | 美商菲沃泰科技公司 | 电子设备的纳米涂层保护方法 |
| GB201814231D0 (en) * | 2018-08-31 | 2018-10-17 | Univ Surrey | Apparatus for forming a poly(p-xylylene) film on a component |
| GB2579871B (en) * | 2019-02-22 | 2021-07-14 | P2I Ltd | Coatings |
| US11938512B2 (en) * | 2019-11-04 | 2024-03-26 | Hzo, Inc. | In situ polymerization of para-xylene for production of parylene F-like coating |
| CN118389997B (zh) * | 2024-06-26 | 2024-10-29 | 深圳市汉嵙新材料技术有限公司 | 二维聚合物薄膜材料及其制备方法 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3743399A (en) * | 1971-07-21 | 1973-07-03 | Ncr | Microform reader cover plate opening mechanism |
| US3843399A (en) | 1972-04-19 | 1974-10-22 | Rca Corp | Metallized video disc having an insulating layer thereon |
| JPS6058467B2 (ja) * | 1977-10-22 | 1985-12-20 | 株式会社リコー | 電子写真用感光体 |
| JPS55101853A (en) | 1979-01-30 | 1980-08-04 | Agency Of Ind Science & Technol | Method of fabricating comparison electrode with fet |
| JPS6066865A (ja) | 1983-09-24 | 1985-04-17 | Toppan Printing Co Ltd | 薄膜トランジスタの製造方法 |
| JPS62288560A (ja) | 1986-06-07 | 1987-12-15 | Masao Saito | バイオセンサ− |
| US5210045A (en) | 1987-10-06 | 1993-05-11 | General Electric Company | Dual dielectric field effect transistors for protected gate structures for improved yield and performance in thin film transistor matrix addressed liquid crystal displays |
| DD277466A1 (de) | 1988-11-30 | 1990-04-04 | Karl Marx Stadt Tech Hochschul | Verfahren zur immobilisierung biologisch aktiver materialien |
| DE4339721C1 (de) | 1993-11-22 | 1995-02-02 | Lueder Ernst | Verfahren zur Herstellung einer Matrix aus Dünnschichttransistoren |
| US5888591A (en) | 1996-05-06 | 1999-03-30 | Massachusetts Institute Of Technology | Chemical vapor deposition of fluorocarbon polymer thin films |
| JP3191745B2 (ja) * | 1997-04-23 | 2001-07-23 | 日本電気株式会社 | 薄膜トランジスタ素子及びその製造方法 |
| JP3411559B2 (ja) | 1997-07-28 | 2003-06-03 | マサチューセッツ・インスティチュート・オブ・テクノロジー | シリコーン膜の熱分解化学蒸着法 |
| US6045864A (en) | 1997-12-01 | 2000-04-04 | 3M Innovative Properties Company | Vapor coating method |
| US6265243B1 (en) | 1999-03-29 | 2001-07-24 | Lucent Technologies Inc. | Process for fabricating organic circuits |
| US20040185678A1 (en) * | 1999-04-15 | 2004-09-23 | Lee Wei William | Integrated circuit dielectric and method |
| AU779530B2 (en) | 2000-05-10 | 2005-01-27 | Nkt Research A/S | A method of coating the surface of an inorganic substrate with an organic material and the product obtained |
| US6423630B1 (en) | 2000-10-31 | 2002-07-23 | Lsi Logic Corporation | Process for forming low K dielectric material between metal lines |
| US7095460B2 (en) | 2001-02-26 | 2006-08-22 | Samsung Electronics Co., Ltd. | Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same |
| CN1300824C (zh) | 2001-08-24 | 2007-02-14 | Gracel株式会社 | 具有有机聚合物栅极绝缘层的有机半导体晶体管的制造方法 |
| US6433359B1 (en) * | 2001-09-06 | 2002-08-13 | 3M Innovative Properties Company | Surface modifying layers for organic thin film transistors |
| US20030097010A1 (en) | 2001-09-27 | 2003-05-22 | Vogel Dennis E. | Process for preparing pentacene derivatives |
| US6864396B2 (en) | 2001-09-27 | 2005-03-08 | 3M Innovative Properties Company | Substituted pentacene semiconductors |
| JP3856202B2 (ja) * | 2001-10-05 | 2006-12-13 | 日本電気株式会社 | 有機薄膜トランジスタ |
| US6998068B2 (en) * | 2003-08-15 | 2006-02-14 | 3M Innovative Properties Company | Acene-thiophene semiconductors |
| US6887578B2 (en) | 2001-10-30 | 2005-05-03 | Massachusetts Institute Of Technology | Fluorocarbon-organosilicon copolymers and coatings prepared by hot-filament chemical vapor deposition |
| US6617609B2 (en) | 2001-11-05 | 2003-09-09 | 3M Innovative Properties Company | Organic thin film transistor with siloxane polymer interface |
| US6946676B2 (en) * | 2001-11-05 | 2005-09-20 | 3M Innovative Properties Company | Organic thin film transistor with polymeric interface |
| US20030151118A1 (en) | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US6821348B2 (en) | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
| US6897164B2 (en) | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| JP2003282240A (ja) * | 2002-03-25 | 2003-10-03 | Pioneer Electronic Corp | 有機エレクトロルミネッセンス表示パネル及び製造方法 |
| JP2003282241A (ja) * | 2002-03-25 | 2003-10-03 | Pioneer Electronic Corp | 有機エレクトロルミネッセンス表示パネル及び製造方法 |
| US20040131881A1 (en) * | 2002-12-31 | 2004-07-08 | Eastman Kodak Company | Complex fluorene-containing compounds for use in OLED devices |
| JP2004235298A (ja) | 2003-01-29 | 2004-08-19 | Pioneer Electronic Corp | 有機半導体素子及びその製造方法 |
| US7098525B2 (en) * | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
| US7109519B2 (en) | 2003-07-15 | 2006-09-19 | 3M Innovative Properties Company | Bis(2-acenyl)acetylene semiconductors |
-
2004
- 2004-09-30 US US10/954,413 patent/US7399668B2/en not_active Expired - Fee Related
-
2005
- 2005-08-26 EP EP05790788A patent/EP1800358A1/en not_active Withdrawn
- 2005-08-26 JP JP2007534599A patent/JP2008515222A/ja not_active Withdrawn
- 2005-08-26 KR KR1020077009606A patent/KR20070072897A/ko not_active Withdrawn
- 2005-08-26 CA CA002582332A patent/CA2582332A1/en not_active Abandoned
- 2005-08-26 CN CN200580039067A patent/CN100593249C/zh not_active Expired - Fee Related
- 2005-08-26 WO PCT/US2005/030412 patent/WO2006039019A1/en not_active Ceased
-
2008
- 2008-02-19 US US12/033,143 patent/US20080145701A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN100593249C (zh) | 2010-03-03 |
| US20060068519A1 (en) | 2006-03-30 |
| CN101057346A (zh) | 2007-10-17 |
| JP2008515222A (ja) | 2008-05-08 |
| US7399668B2 (en) | 2008-07-15 |
| WO2006039019A1 (en) | 2006-04-13 |
| EP1800358A1 (en) | 2007-06-27 |
| KR20070072897A (ko) | 2007-07-06 |
| US20080145701A1 (en) | 2008-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued | ||
| FZDE | Discontinued |
Effective date: 20090826 |