BRPI0922795A2 - alta taxa de deposição de filmes finos com propriedades de camada de barreira melhorada - Google Patents

alta taxa de deposição de filmes finos com propriedades de camada de barreira melhorada

Info

Publication number
BRPI0922795A2
BRPI0922795A2 BRPI0922795A BRPI0922795A BRPI0922795A2 BR PI0922795 A2 BRPI0922795 A2 BR PI0922795A2 BR PI0922795 A BRPI0922795 A BR PI0922795A BR PI0922795 A BRPI0922795 A BR PI0922795A BR PI0922795 A2 BRPI0922795 A2 BR PI0922795A2
Authority
BR
Brazil
Prior art keywords
barrier layer
thin films
deposition rate
high deposition
layer properties
Prior art date
Application number
BRPI0922795A
Other languages
English (en)
Inventor
R Dickey Eric
Barrow William
Original Assignee
Lotus Applied Tech Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lotus Applied Tech Llc filed Critical Lotus Applied Tech Llc
Publication of BRPI0922795A2 publication Critical patent/BRPI0922795A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/405—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
    • C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
    • C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Wrappers (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
BRPI0922795A 2008-12-05 2009-12-07 alta taxa de deposição de filmes finos com propriedades de camada de barreira melhorada BRPI0922795A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12038108P 2008-12-05 2008-12-05
US16128709P 2009-03-18 2009-03-18
PCT/US2009/067024 WO2010065966A2 (en) 2008-12-05 2009-12-07 High rate deposition of thin films with improved barrier layer properties

Publications (1)

Publication Number Publication Date
BRPI0922795A2 true BRPI0922795A2 (pt) 2018-05-29

Family

ID=42231418

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0922795A BRPI0922795A2 (pt) 2008-12-05 2009-12-07 alta taxa de deposição de filmes finos com propriedades de camada de barreira melhorada

Country Status (7)

Country Link
US (1) US20100143710A1 (pt)
EP (1) EP2364380A4 (pt)
JP (1) JP2012511106A (pt)
KR (1) KR20110100618A (pt)
CN (1) CN102239278A (pt)
BR (1) BRPI0922795A2 (pt)
WO (1) WO2010065966A2 (pt)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602007014190D1 (de) 2006-03-26 2011-06-09 Lotus Applied Technology Llc Atomlagenabscheidungssystem und verfahren zur beschichtung von flexiblen substraten
EP2488678B1 (en) 2009-10-14 2019-01-16 Lotus Applied Technology, LLC Inhibiting excess precursor transport between separate precursor zones in an atomic layer deposition system
US8637123B2 (en) * 2009-12-29 2014-01-28 Lotus Applied Technology, Llc Oxygen radical generation for radical-enhanced thin film deposition
CN103119198B (zh) * 2010-07-23 2015-08-19 莲花应用技术有限责任公司 接触用于辊到辊薄膜沉积的柔性网片基材单侧的基材传送机构
JP5864089B2 (ja) 2010-08-25 2016-02-17 日亜化学工業株式会社 発光装置の製造方法
WO2012032343A1 (en) 2010-09-07 2012-03-15 Sun Chemical B.V. A carbon dioxide barrier coating
JP5682372B2 (ja) * 2011-02-07 2015-03-11 ソニー株式会社 電池用セパレータ、電池用セパレータの製造方法、電池、電池パックおよび電子機器
CN103459665B (zh) * 2011-03-29 2017-02-22 凸版印刷株式会社 卷绕成膜装置
JP6204911B2 (ja) * 2011-07-11 2017-09-27 ロータス アプライド テクノロジー エルエルシーＬｏｔｕｓ Ａｐｐｌｉｅｄ Ｔｅｃｈｎｏｌｏｇｙ， Ｌｌｃ 混合金属酸化物バリアフィルム及び混合金属酸化物バリアフィルムを形成する原子層成膜方法
JP5803488B2 (ja) * 2011-09-22 2015-11-04 凸版印刷株式会社 原子層堆積法によるフレキシブル基板への成膜方法及び成膜装置
CN102514280B (zh) * 2011-12-12 2015-02-04 武汉理工大学 一种太阳能选择性吸收涂层的制备方法
KR20140144243A (ko) * 2012-03-23 2014-12-18 피코순 오와이 원자층 증착 방법 및 장치
JP6119745B2 (ja) 2012-05-31 2017-04-26 凸版印刷株式会社 巻き取り成膜装置
KR101372309B1 (ko) * 2012-08-07 2014-03-13 (주)씨엔원 롤투롤 방식의 원자층 증착 장비 및 원자층 증착 방법
TWI592310B (zh) * 2012-10-18 2017-07-21 凸版印刷股份有限公司 積層體、阻氣薄膜及其製造方法
US9631275B2 (en) * 2012-11-30 2017-04-25 Lg Chem, Ltd. Device for forming a layer
WO2014105734A1 (en) * 2012-12-31 2014-07-03 Saint-Gobain Performance Plastics Corporation Thin film silicon nitride barrier layers on flexible substrate
CN104134756A (zh) * 2013-04-30 2014-11-05 成均馆大学校产学协力团 多层封装薄膜
EP3213341A4 (en) * 2014-10-17 2018-08-29 Lotus Applied Technology, LLC High-speed deposition of mixed oxide barrier films
EP3234216A2 (en) * 2014-12-19 2017-10-25 Fujifilm Manufacturing Europe BV Transparent sheet materials
JP5795427B1 (ja) * 2014-12-26 2015-10-14 竹本容器株式会社 被膜付き樹脂容器の製造方法及び樹脂容器被覆装置
CH710826A1 (de) * 2015-03-06 2016-09-15 Fofitec Ag Vorrichtungen und Verfahren zur Abscheidung dünner Schichten auf einer laufenden Folienbahn sowie Folienbahn oder Zuschnitte daraus.
KR101704723B1 (ko) * 2015-04-06 2017-02-09 연세대학교 산학협력단 탄소 박막 소자 및 이의 제조 방법
CN107815665A (zh) * 2016-09-14 2018-03-20 中国科学院上海硅酸盐研究所 一种二氧化钛薄膜及其制备方法和应用
CN106947957A (zh) * 2017-03-01 2017-07-14 秦皇岛博硕光电设备股份有限公司 食品/药品容器的加工方法、食品/药品容器用材料及食品/药品容器
WO2018237212A1 (en) 2017-06-22 2018-12-27 The Procter & Gamble Company FILMS COMPRISING A WATER-SOLUBLE LAYER AND AN ORGANIC COATING DEPOSITED IN STEAM PHASE
CN110719968A (zh) * 2017-06-22 2020-01-21 宝洁公司 包括水溶性层和气相沉积无机涂层的膜
KR20200143713A (ko) * 2018-04-12 2020-12-24 신에쓰 가가꾸 고교 가부시끼가이샤 광촉매 전사 필름 및 그의 제조 방법
EP3771751A1 (en) * 2019-08-02 2021-02-03 AR Metallizing N.V. Multi-metal layer wvtr barrier products on water vapour and oxygen permeable bio-based substrates
CN115685301B (zh) * 2023-01-04 2023-04-07 中创智科(绵阳)科技有限公司 一种防爆型氚浓度测量仪
CN117301589A (zh) * 2023-11-02 2023-12-29 江苏思尔德科技有限公司 一种柔性显示用高阻隔膜制备方法

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE393967B (sv) * 1974-11-29 1977-05-31 Sateko Oy Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket
US4389973A (en) * 1980-03-18 1983-06-28 Oy Lohja Ab Apparatus for performing growth of compound thin films
US5256205A (en) * 1990-05-09 1993-10-26 Jet Process Corporation Microwave plasma assisted supersonic gas jet deposition of thin film materials
DE4228853C2 (de) * 1991-09-18 1993-10-21 Schott Glaswerke Optischer Wellenleiter mit einem planaren oder nur geringfügig gewölbten Substrat und Verfahren zu dessen Herstellung sowie Verwendung eines solchen
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5817550A (en) * 1996-03-05 1998-10-06 Regents Of The University Of California Method for formation of thin film transistors on plastic substrates
US6342277B1 (en) * 1996-08-16 2002-01-29 Licensee For Microelectronics: Asm America, Inc. Sequential chemical vapor deposition
US5693956A (en) * 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
US6090442A (en) * 1997-04-14 2000-07-18 University Technology Corporation Method of growing films on substrates at room temperatures using catalyzed binary reaction sequence chemistry
US6165554A (en) * 1997-11-12 2000-12-26 Jet Process Corporation Method for hydrogen atom assisted jet vapor deposition for parylene N and other polymeric thin films
US6200893B1 (en) * 1999-03-11 2001-03-13 Genus, Inc Radical-assisted sequential CVD
US6812157B1 (en) * 1999-06-24 2004-11-02 Prasad Narhar Gadgil Apparatus for atomic layer chemical vapor deposition
US20040224504A1 (en) * 2000-06-23 2004-11-11 Gadgil Prasad N. Apparatus and method for plasma enhanced monolayer processing
US6664186B1 (en) * 2000-09-29 2003-12-16 International Business Machines Corporation Method of film deposition, and fabrication of structures
US7476420B2 (en) * 2000-10-23 2009-01-13 Asm International N.V. Process for producing metal oxide films at low temperatures
US6689220B1 (en) * 2000-11-22 2004-02-10 Simplus Systems Corporation Plasma enhanced pulsed layer deposition
KR100421219B1 (ko) * 2001-06-14 2004-03-02 삼성전자주식회사 β-디케톤 리간드를 갖는 유기 금속 착물을 이용한 원자층증착방법
US9376750B2 (en) * 2001-07-18 2016-06-28 Regents Of The University Of Colorado, A Body Corporate Method of depositing an inorganic film on an organic polymer
US6820570B2 (en) * 2001-08-15 2004-11-23 Nobel Biocare Services Ag Atomic layer deposition reactor
EP1291932A3 (en) * 2001-09-05 2006-10-18 Konica Corporation Organic thin-film semiconductor element and manufacturing method for the same
US6932871B2 (en) * 2002-04-16 2005-08-23 Applied Materials, Inc. Multi-station deposition apparatus and method
TWI278532B (en) * 2002-06-23 2007-04-11 Asml Us Inc Method for energy-assisted atomic layer deposition and removal
US6827789B2 (en) * 2002-07-01 2004-12-07 Semigear, Inc. Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry
US6797337B2 (en) * 2002-08-19 2004-09-28 Micron Technology, Inc. Method for delivering precursors
EP1597408B1 (en) * 2003-02-27 2012-12-05 Symmorphix, Inc. Method for forming dielectric barrier layers
US7294360B2 (en) * 2003-03-31 2007-11-13 Planar Systems, Inc. Conformal coatings for micro-optical elements, and method for making the same
US6888172B2 (en) * 2003-04-11 2005-05-03 Eastman Kodak Company Apparatus and method for encapsulating an OLED formed on a flexible substrate
CN1791989A (zh) * 2003-05-16 2006-06-21 纳幕尔杜邦公司 通过原子层沉积形成的塑料基材阻挡层膜
US20040261703A1 (en) * 2003-06-27 2004-12-30 Jeffrey D. Chinn Apparatus and method for controlled application of reactive vapors to produce thin films and coatings
US7323231B2 (en) * 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7074719B2 (en) * 2003-11-28 2006-07-11 International Business Machines Corporation ALD deposition of ruthenium
WO2005074330A1 (en) * 2004-01-28 2005-08-11 Agency For Science, Technology And Research Multicolor organic light emitting devices
US20050221021A1 (en) * 2004-03-31 2005-10-06 Tokyo Electron Limited Method and system for performing atomic layer deposition
US7482037B2 (en) * 2004-08-20 2009-01-27 Micron Technology, Inc. Methods for forming niobium and/or vanadium containing layers using atomic layer deposition
US7399668B2 (en) * 2004-09-30 2008-07-15 3M Innovative Properties Company Method for making electronic devices having a dielectric layer surface treatment
JP5464775B2 (ja) * 2004-11-19 2014-04-09 エイエスエム インターナショナル エヌ．ヴェー． 低温での金属酸化物膜の製造方法
JP4865214B2 (ja) * 2004-12-20 2012-02-01 東京エレクトロン株式会社 成膜方法および記憶媒体
US20090194233A1 (en) * 2005-06-23 2009-08-06 Tokyo Electron Limited Component for semicondutor processing apparatus and manufacturing method thereof
JP2007098679A (ja) * 2005-09-30 2007-04-19 Dainippon Printing Co Ltd ガスバリアフィルムおよびその製造方法
DE602007014190D1 (de) * 2006-03-26 2011-06-09 Lotus Applied Technology Llc Atomlagenabscheidungssystem und verfahren zur beschichtung von flexiblen substraten
US20070281105A1 (en) * 2006-06-02 2007-12-06 Nima Mokhlesi Atomic Layer Deposition of Oxides Using Krypton as an Ion Generating Feeding Gas
US20070281089A1 (en) * 2006-06-05 2007-12-06 General Electric Company Systems and methods for roll-to-roll atomic layer deposition on continuously fed objects
EP2024998A1 (en) * 2006-06-05 2009-02-18 Dow Corning Corporation Electronic package and method of preparing same
US7663312B2 (en) * 2006-07-24 2010-02-16 Munisamy Anandan Flexible OLED light source
US8187679B2 (en) * 2006-07-29 2012-05-29 Lotus Applied Technology, Llc Radical-enhanced atomic layer deposition system and method
US20080119098A1 (en) * 2006-11-21 2008-05-22 Igor Palley Atomic layer deposition on fibrous materials
US7781031B2 (en) * 2006-12-06 2010-08-24 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
WO2009070574A2 (en) * 2007-11-27 2009-06-04 North Carolina State University Methods for modification of polymers, fibers and textile media
US8945675B2 (en) * 2008-05-29 2015-02-03 Asm International N.V. Methods for forming conductive titanium oxide thin films

Also Published As

Publication number Publication date
WO2010065966A2 (en) 2010-06-10
JP2012511106A (ja) 2012-05-17
WO2010065966A3 (en) 2010-10-14
EP2364380A4 (en) 2012-07-04
EP2364380A2 (en) 2011-09-14
CN102239278A (zh) 2011-11-09
US20100143710A1 (en) 2010-06-10
KR20110100618A (ko) 2011-09-14

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