CA2579697A1 - Electronic device test set and contact used therein - Google Patents

Electronic device test set and contact used therein Download PDF

Info

Publication number
CA2579697A1
CA2579697A1 CA002579697A CA2579697A CA2579697A1 CA 2579697 A1 CA2579697 A1 CA 2579697A1 CA 002579697 A CA002579697 A CA 002579697A CA 2579697 A CA2579697 A CA 2579697A CA 2579697 A1 CA2579697 A1 CA 2579697A1
Authority
CA
Canada
Prior art keywords
contact
lead
test set
dut
orientation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002579697A
Other languages
English (en)
French (fr)
Inventor
Dennis B. Shell
Mathew L. Gilk
Jose E. Lopez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnstech International Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2579697A1 publication Critical patent/CA2579697A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
CA002579697A 2006-02-24 2007-02-26 Electronic device test set and contact used therein Abandoned CA2579697A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US77665406P 2006-02-24 2006-02-24
US60/776,654 2006-02-24
US11/677,870 US7639026B2 (en) 2006-02-24 2007-02-22 Electronic device test set and contact used therein
US11/677,870 2007-02-22

Publications (1)

Publication Number Publication Date
CA2579697A1 true CA2579697A1 (en) 2007-08-24

Family

ID=38110606

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002579697A Abandoned CA2579697A1 (en) 2006-02-24 2007-02-26 Electronic device test set and contact used therein

Country Status (8)

Country Link
US (1) US7639026B2 (enExample)
EP (2) EP1826575B1 (enExample)
JP (1) JP5219383B2 (enExample)
KR (1) KR101522027B1 (enExample)
CA (1) CA2579697A1 (enExample)
MY (1) MY154288A (enExample)
SG (1) SG135138A1 (enExample)
TW (1) TWI429913B (enExample)

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JP2009043591A (ja) * 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Ｉｃソケット
US8278955B2 (en) 2008-03-24 2012-10-02 Interconnect Devices, Inc. Test interconnect
US20090267629A1 (en) * 2008-04-23 2009-10-29 J. Foong Technologies Sdn. Bhd. Contact for interconnect system in a test socket
US20090289647A1 (en) 2008-05-01 2009-11-26 Interconnect Devices, Inc. Interconnect system
MY155348A (en) 2008-06-12 2015-10-15 Multitest Elektronische Syst Contact base
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
TW201027849A (en) 2009-01-13 2010-07-16 Yi-Zhi Yang Connector
US9329204B2 (en) 2009-04-21 2016-05-03 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US8558554B2 (en) 2009-04-21 2013-10-15 Johnstech International Corporation Electrically conductive Kelvin contacts for microcircuit tester
US8988090B2 (en) 2009-04-21 2015-03-24 Johnstech International Corporation Electrically conductive kelvin contacts for microcircuit tester
US9069011B2 (en) * 2009-09-11 2015-06-30 Exelon Generation Company, Llc Electrical terminal test point and methods of use
US9855735B2 (en) 2009-11-23 2018-01-02 Cyvek, Inc. Portable microfluidic assay devices and methods of manufacture and use
US9759718B2 (en) 2009-11-23 2017-09-12 Cyvek, Inc. PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use
WO2013133899A1 (en) 2012-03-08 2013-09-12 Cyvek, Inc Microfluidic assay systems employing micro-particles and methods of manufacture
US9500645B2 (en) 2009-11-23 2016-11-22 Cyvek, Inc. Micro-tube particles for microfluidic assays and methods of manufacture
US10022696B2 (en) 2009-11-23 2018-07-17 Cyvek, Inc. Microfluidic assay systems employing micro-particles and methods of manufacture
US9700889B2 (en) 2009-11-23 2017-07-11 Cyvek, Inc. Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results
US10065403B2 (en) 2009-11-23 2018-09-04 Cyvek, Inc. Microfluidic assay assemblies and methods of manufacture
CN102713621B (zh) 2009-11-23 2016-10-19 西维克公司 用于施行化验的方法和设备
WO2011145916A1 (en) * 2010-05-21 2011-11-24 Jf Microtechnology Sdn. Bhd. An electrical interconnect assembly and a test contact for an electrical interconnect assembly
USD668625S1 (en) * 2010-07-22 2012-10-09 Titan Semiconductor Tool, LLC Integrated circuit socket connector
JP2014516158A (ja) 2011-05-27 2014-07-07 ジェイエフ マイクロテクノロジ・スンディリアン・ブルハド 電気相互接続アッセンブリー
KR200455379Y1 (ko) * 2011-06-13 2011-09-01 나경화 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓
US9274141B1 (en) * 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor
US10794933B1 (en) 2013-03-15 2020-10-06 Johnstech International Corporation Integrated circuit contact test apparatus with and method of construction
EP2985614A4 (en) * 2013-04-11 2016-12-21 Renesas Electronics Corp METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
TWI500222B (zh) * 2013-07-12 2015-09-11 Ccp Contact Probes Co Ltd 連接器組合
US10114039B1 (en) * 2015-04-24 2018-10-30 Johnstech International Corporation Selectively geometric shaped contact pin for electronic component testing and method of fabrication
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
US9958499B1 (en) 2015-07-07 2018-05-01 Johnstech International Corporation Constant stress pin tip for testing integrated circuit chips
US10436819B1 (en) 2015-07-07 2019-10-08 Johnstech International Corporation Constant pressure pin tip for testing integrated circuit chips
US10228367B2 (en) 2015-12-01 2019-03-12 ProteinSimple Segmented multi-use automated assay cartridge
JP2018091643A (ja) * 2016-11-30 2018-06-14 矢崎総業株式会社 磁界検出センサ
US11002760B1 (en) 2017-02-06 2021-05-11 Johnstech International Corporation High isolation housing for testing integrated circuits
CN111164434B (zh) 2017-09-25 2022-10-28 约翰国际有限公司 用于集成电路测试的具有测试引脚和壳体的高隔离接触器
USD942290S1 (en) * 2019-07-12 2022-02-01 Johnstech International Corporation Tip for integrated circuit test pin
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
KR20240104127A (ko) * 2021-11-03 2024-07-04 존스테크 인터내셔널 코포레이션 수직 백스톱을 갖는 하우징
USD1042345S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Test pin
USD1042346S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Contact pin for integrated circuit testing
USD1075695S1 (en) 2022-04-05 2025-05-20 Johnstech International Corporation Contact pin for integrated circuit testing
JP2024064692A (ja) * 2022-10-28 2024-05-14 株式会社日本マイクロニクス コンタクトピンおよび電気的接続装置

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US4321122A (en) * 1980-03-31 1982-03-23 Eastman Kodak Company Apparatus for forming electrical contact with an analysis slide
US5207584A (en) * 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
US5781022A (en) * 1991-06-04 1998-07-14 Micron Technology, Inc. Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
JP3675989B2 (ja) * 1995-11-17 2005-07-27 株式会社テセック 電子部品用コネクタ
DE29704035U1 (de) * 1997-03-06 1997-05-22 Manfred Fladung GmbH, 63776 Mömbris Vorrichtung zur Aufnahme bzw. zum Verstauen eines Kabels
JP2000156268A (ja) * 1998-11-18 2000-06-06 Kasasaku Electronics:Kk Ｉｃソケット及びｉｃソケット用コンタクトピン
US6255585B1 (en) * 1999-01-29 2001-07-03 Advantest Corp. Packaging and interconnection of contact structure
JP2000228262A (ja) * 1999-02-08 2000-08-15 Mitsubishi Electric Corp テストソケットのピン及び溝形成方法
JP2001004698A (ja) * 1999-06-18 2001-01-12 Mitsubishi Electric Corp テスト用ソケット、及びその接触端子の製造方法、並びに電子機器あるいは半導体パッケージ
US6794890B1 (en) * 1999-07-27 2004-09-21 Mitsubishi Denki Kabushiki Kaisha Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
JP2002093541A (ja) * 2000-09-19 2002-03-29 Miyazaki Oki Electric Co Ltd Ｉｃソケット
KR100351676B1 (ko) 2000-10-12 2002-09-05 주식회사 우영 콘택핀 및 이것을 구비한 집적회로 패키지 테스트용 소켓
US6854981B2 (en) * 2002-06-03 2005-02-15 Johnstech International Corporation Small pin connecters
US7059866B2 (en) * 2003-04-23 2006-06-13 Johnstech International Corporation integrated circuit contact to test apparatus
SG129245A1 (en) * 2003-04-29 2007-02-26 Tan Yin Leong Improved probe for integrated circuit test socket
US7445465B2 (en) * 2005-07-08 2008-11-04 Johnstech International Corporation Test socket

Also Published As

Publication number Publication date
SG135138A1 (en) 2007-09-28
EP1826575A3 (en) 2009-06-03
JP5219383B2 (ja) 2013-06-26
KR20070088404A (ko) 2007-08-29
MY154288A (en) 2015-05-29
US7639026B2 (en) 2009-12-29
TWI429913B (zh) 2014-03-11
KR101522027B1 (ko) 2015-05-20
EP1826575A2 (en) 2007-08-29
JP2007248460A (ja) 2007-09-27
TW200741210A (en) 2007-11-01
EP2463666A3 (en) 2012-08-29
US20070236236A1 (en) 2007-10-11
EP1826575B1 (en) 2012-02-08
EP2463666A2 (en) 2012-06-13

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued

Effective date: 20150226