KR101522027B1 - 전자 장치 테스트 세트 및 그 내에 사용되는 컨택트 - Google Patents
전자 장치 테스트 세트 및 그 내에 사용되는 컨택트 Download PDFInfo
- Publication number
- KR101522027B1 KR101522027B1 KR1020070019224A KR20070019224A KR101522027B1 KR 101522027 B1 KR101522027 B1 KR 101522027B1 KR 1020070019224 A KR1020070019224 A KR 1020070019224A KR 20070019224 A KR20070019224 A KR 20070019224A KR 101522027 B1 KR101522027 B1 KR 101522027B1
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- KR
- South Korea
- Prior art keywords
- contact
- contacts
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- engaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77665406P | 2006-02-24 | 2006-02-24 | |
| US60/776,654 | 2006-02-24 | ||
| US11/677,870 | 2007-02-22 | ||
| US11/677,870 US7639026B2 (en) | 2006-02-24 | 2007-02-22 | Electronic device test set and contact used therein |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070088404A KR20070088404A (ko) | 2007-08-29 |
| KR101522027B1 true KR101522027B1 (ko) | 2015-05-20 |
Family
ID=38110606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070019224A Active KR101522027B1 (ko) | 2006-02-24 | 2007-02-26 | 전자 장치 테스트 세트 및 그 내에 사용되는 컨택트 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7639026B2 (enExample) |
| EP (2) | EP1826575B1 (enExample) |
| JP (1) | JP5219383B2 (enExample) |
| KR (1) | KR101522027B1 (enExample) |
| CA (1) | CA2579697A1 (enExample) |
| MY (1) | MY154288A (enExample) |
| SG (1) | SG135138A1 (enExample) |
| TW (1) | TWI429913B (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009043591A (ja) * | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Icソケット |
| US8278955B2 (en) | 2008-03-24 | 2012-10-02 | Interconnect Devices, Inc. | Test interconnect |
| US20090267629A1 (en) * | 2008-04-23 | 2009-10-29 | J. Foong Technologies Sdn. Bhd. | Contact for interconnect system in a test socket |
| US20090289647A1 (en) | 2008-05-01 | 2009-11-26 | Interconnect Devices, Inc. | Interconnect system |
| US8282428B2 (en) | 2008-06-12 | 2012-10-09 | Multitest Elektronische Systeme Gmbh | Contact base |
| JP5029969B2 (ja) * | 2008-11-12 | 2012-09-19 | 山一電機株式会社 | 電気接続装置 |
| TW201027849A (en) | 2009-01-13 | 2010-07-16 | Yi-Zhi Yang | Connector |
| US9329204B2 (en) | 2009-04-21 | 2016-05-03 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
| US8558554B2 (en) * | 2009-04-21 | 2013-10-15 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
| US8988090B2 (en) | 2009-04-21 | 2015-03-24 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
| US9069011B2 (en) * | 2009-09-11 | 2015-06-30 | Exelon Generation Company, Llc | Electrical terminal test point and methods of use |
| US9651568B2 (en) | 2009-11-23 | 2017-05-16 | Cyvek, Inc. | Methods and systems for epi-fluorescent monitoring and scanning for microfluidic assays |
| US10065403B2 (en) | 2009-11-23 | 2018-09-04 | Cyvek, Inc. | Microfluidic assay assemblies and methods of manufacture |
| WO2013134741A2 (en) | 2012-03-08 | 2013-09-12 | Cyvek, Inc. | Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results |
| US9855735B2 (en) | 2009-11-23 | 2018-01-02 | Cyvek, Inc. | Portable microfluidic assay devices and methods of manufacture and use |
| US9500645B2 (en) | 2009-11-23 | 2016-11-22 | Cyvek, Inc. | Micro-tube particles for microfluidic assays and methods of manufacture |
| US9229001B2 (en) | 2009-11-23 | 2016-01-05 | Cyvek, Inc. | Method and apparatus for performing assays |
| US9759718B2 (en) | 2009-11-23 | 2017-09-12 | Cyvek, Inc. | PDMS membrane-confined nucleic acid and antibody/antigen-functionalized microlength tube capture elements, and systems employing them, and methods of their use |
| US9700889B2 (en) | 2009-11-23 | 2017-07-11 | Cyvek, Inc. | Methods and systems for manufacture of microarray assay systems, conducting microfluidic assays, and monitoring and scanning to obtain microfluidic assay results |
| WO2011145916A1 (en) * | 2010-05-21 | 2011-11-24 | Jf Microtechnology Sdn. Bhd. | An electrical interconnect assembly and a test contact for an electrical interconnect assembly |
| USD668625S1 (en) * | 2010-07-22 | 2012-10-09 | Titan Semiconductor Tool, LLC | Integrated circuit socket connector |
| WO2012165936A1 (en) * | 2011-05-27 | 2012-12-06 | Jf Microtechnology Sdn. Bhd. | An electrical interconnect assembly |
| KR200455379Y1 (ko) * | 2011-06-13 | 2011-09-01 | 나경화 | 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 |
| US9274141B1 (en) * | 2013-01-22 | 2016-03-01 | Johnstech International Corporation | Low resistance low wear test pin for test contactor |
| US10794933B1 (en) | 2013-03-15 | 2020-10-06 | Johnstech International Corporation | Integrated circuit contact test apparatus with and method of construction |
| JP6234441B2 (ja) * | 2013-04-11 | 2017-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| TWI500222B (zh) * | 2013-07-12 | 2015-09-11 | Ccp Contact Probes Co Ltd | 連接器組合 |
| US10114039B1 (en) * | 2015-04-24 | 2018-10-30 | Johnstech International Corporation | Selectively geometric shaped contact pin for electronic component testing and method of fabrication |
| US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
| US10436819B1 (en) | 2015-07-07 | 2019-10-08 | Johnstech International Corporation | Constant pressure pin tip for testing integrated circuit chips |
| US9958499B1 (en) | 2015-07-07 | 2018-05-01 | Johnstech International Corporation | Constant stress pin tip for testing integrated circuit chips |
| US10228367B2 (en) | 2015-12-01 | 2019-03-12 | ProteinSimple | Segmented multi-use automated assay cartridge |
| JP2018091643A (ja) * | 2016-11-30 | 2018-06-14 | 矢崎総業株式会社 | 磁界検出センサ |
| US11002760B1 (en) | 2017-02-06 | 2021-05-11 | Johnstech International Corporation | High isolation housing for testing integrated circuits |
| MX2020007325A (es) | 2017-09-25 | 2021-01-29 | Johnstech Int Corp | Contactor de alto grado de aislamiento con clavija de prueba y carcasa para probar circuitos integrados. |
| USD942290S1 (en) * | 2019-07-12 | 2022-02-01 | Johnstech International Corporation | Tip for integrated circuit test pin |
| US11906576B1 (en) | 2021-05-04 | 2024-02-20 | Johnstech International Corporation | Contact assembly array and testing system having contact assembly array |
| US11867752B1 (en) | 2021-05-13 | 2024-01-09 | Johnstech International Corporation | Contact assembly and kelvin testing system having contact assembly |
| KR20240104127A (ko) | 2021-11-03 | 2024-07-04 | 존스테크 인터내셔널 코포레이션 | 수직 백스톱을 갖는 하우징 |
| USD1042345S1 (en) | 2022-04-05 | 2024-09-17 | Johnstech International Corporation | Test pin |
| USD1042346S1 (en) | 2022-04-05 | 2024-09-17 | Johnstech International Corporation | Contact pin for integrated circuit testing |
| USD1075695S1 (en) | 2022-04-05 | 2025-05-20 | Johnstech International Corporation | Contact pin for integrated circuit testing |
| JP2024064692A (ja) * | 2022-10-28 | 2024-05-14 | 株式会社日本マイクロニクス | コンタクトピンおよび電気的接続装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000057821A (ko) * | 1999-01-29 | 2000-09-25 | 가부시키가이샤 어드밴티스트 | 컨택트 구조물의 패키징 및 상호 접속부 |
| KR20000076017A (ko) * | 1997-03-06 | 2000-12-26 | 플라둥, 만프레드 | 케이블을 테이크 업 또는 스토잉하기 위한 장치 |
| US20040248448A1 (en) * | 2003-04-23 | 2004-12-09 | Gilk Mathew L. | Small contactor pin |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4321122A (en) * | 1980-03-31 | 1982-03-23 | Eastman Kodak Company | Apparatus for forming electrical contact with an analysis slide |
| US5207584A (en) * | 1991-01-09 | 1993-05-04 | Johnson David A | Electrical interconnect contact system |
| US5634801A (en) * | 1991-01-09 | 1997-06-03 | Johnstech International Corporation | Electrical interconnect contact system |
| US5781022A (en) * | 1991-06-04 | 1998-07-14 | Micron Technology, Inc. | Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die |
| US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
| JP3675989B2 (ja) * | 1995-11-17 | 2005-07-27 | 株式会社テセック | 電子部品用コネクタ |
| JP2000156268A (ja) * | 1998-11-18 | 2000-06-06 | Kasasaku Electronics:Kk | Icソケット及びicソケット用コンタクトピン |
| JP2000228262A (ja) * | 1999-02-08 | 2000-08-15 | Mitsubishi Electric Corp | テストソケットのピン及び溝形成方法 |
| JP2001004698A (ja) * | 1999-06-18 | 2001-01-12 | Mitsubishi Electric Corp | テスト用ソケット、及びその接触端子の製造方法、並びに電子機器あるいは半導体パッケージ |
| US6794890B1 (en) * | 1999-07-27 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested |
| JP2002093541A (ja) * | 2000-09-19 | 2002-03-29 | Miyazaki Oki Electric Co Ltd | Icソケット |
| KR100351676B1 (ko) | 2000-10-12 | 2002-09-05 | 주식회사 우영 | 콘택핀 및 이것을 구비한 집적회로 패키지 테스트용 소켓 |
| US6854981B2 (en) * | 2002-06-03 | 2005-02-15 | Johnstech International Corporation | Small pin connecters |
| SG129245A1 (en) * | 2003-04-29 | 2007-02-26 | Tan Yin Leong | Improved probe for integrated circuit test socket |
| US7445465B2 (en) * | 2005-07-08 | 2008-11-04 | Johnstech International Corporation | Test socket |
-
2007
- 2007-02-22 US US11/677,870 patent/US7639026B2/en active Active
- 2007-02-23 MY MYPI20070275A patent/MY154288A/en unknown
- 2007-02-23 EP EP07003763A patent/EP1826575B1/en active Active
- 2007-02-23 SG SG200701278-4A patent/SG135138A1/en unknown
- 2007-02-23 EP EP12154283A patent/EP2463666A3/en not_active Withdrawn
- 2007-02-26 CA CA002579697A patent/CA2579697A1/en not_active Abandoned
- 2007-02-26 JP JP2007045642A patent/JP5219383B2/ja active Active
- 2007-02-26 KR KR1020070019224A patent/KR101522027B1/ko active Active
- 2007-02-26 TW TW096106539A patent/TWI429913B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000076017A (ko) * | 1997-03-06 | 2000-12-26 | 플라둥, 만프레드 | 케이블을 테이크 업 또는 스토잉하기 위한 장치 |
| KR20000057821A (ko) * | 1999-01-29 | 2000-09-25 | 가부시키가이샤 어드밴티스트 | 컨택트 구조물의 패키징 및 상호 접속부 |
| US20040248448A1 (en) * | 2003-04-23 | 2004-12-09 | Gilk Mathew L. | Small contactor pin |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5219383B2 (ja) | 2013-06-26 |
| EP2463666A3 (en) | 2012-08-29 |
| KR20070088404A (ko) | 2007-08-29 |
| EP1826575A3 (en) | 2009-06-03 |
| EP1826575A2 (en) | 2007-08-29 |
| EP1826575B1 (en) | 2012-02-08 |
| JP2007248460A (ja) | 2007-09-27 |
| TW200741210A (en) | 2007-11-01 |
| MY154288A (en) | 2015-05-29 |
| EP2463666A2 (en) | 2012-06-13 |
| US7639026B2 (en) | 2009-12-29 |
| SG135138A1 (en) | 2007-09-28 |
| TWI429913B (zh) | 2014-03-11 |
| US20070236236A1 (en) | 2007-10-11 |
| CA2579697A1 (en) | 2007-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20070226 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20120223 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20070226 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20130723 Patent event code: PE09021S01D |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140526 Patent event code: PE09021S01D |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20150224 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20150514 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 20150514 End annual number: 3 Start annual number: 1 |
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| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
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| PR1001 | Payment of annual fee |
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