CA2343386A1 - Procede d'application de pistes conductrices metalliques servant d'electrode sur une plaque a canaux pour ecrans plats a grande surface - Google Patents
Procede d'application de pistes conductrices metalliques servant d'electrode sur une plaque a canaux pour ecrans plats a grande surface Download PDFInfo
- Publication number
- CA2343386A1 CA2343386A1 CA002343386A CA2343386A CA2343386A1 CA 2343386 A1 CA2343386 A1 CA 2343386A1 CA 002343386 A CA002343386 A CA 002343386A CA 2343386 A CA2343386 A CA 2343386A CA 2343386 A1 CA2343386 A1 CA 2343386A1
- Authority
- CA
- Canada
- Prior art keywords
- process according
- layer
- paths
- deposited
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 72
- 239000004020 conductor Substances 0.000 title claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 title claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 46
- 238000000151 deposition Methods 0.000 claims abstract description 36
- 238000005530 etching Methods 0.000 claims abstract description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 67
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 43
- 239000010410 layer Substances 0.000 claims description 41
- 229910052763 palladium Inorganic materials 0.000 claims description 33
- 230000008021 deposition Effects 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 238000005260 corrosion Methods 0.000 claims description 18
- 230000007797 corrosion Effects 0.000 claims description 18
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 239000007858 starting material Substances 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 10
- 230000003190 augmentative effect Effects 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 8
- 230000006911 nucleation Effects 0.000 claims description 8
- 238000010899 nucleation Methods 0.000 claims description 8
- 150000002739 metals Chemical group 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000007791 liquid phase Substances 0.000 claims description 6
- 238000000206 photolithography Methods 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 5
- 238000005422 blasting Methods 0.000 claims description 5
- 239000007772 electrode material Substances 0.000 claims description 5
- 239000010970 precious metal Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005234 chemical deposition Methods 0.000 claims description 2
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- -1 for example Substances 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 238000007639 printing Methods 0.000 abstract description 6
- 238000004544 sputter deposition Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 36
- 239000000243 solution Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000012153 distilled water Substances 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 238000001465 metallisation Methods 0.000 description 9
- 230000002829 reductive effect Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- HCWFRUHIOMLJCH-UHFFFAOYSA-L dichlorotin;hydrochloride Chemical compound Cl.Cl[Sn]Cl HCWFRUHIOMLJCH-UHFFFAOYSA-L 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 101150114843 Mgll gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- YCLAMANSVUJYPT-UHFFFAOYSA-L aluminum chloride hydroxide hydrate Chemical compound O.[OH-].[Al+3].[Cl-] YCLAMANSVUJYPT-UHFFFAOYSA-L 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000002920 hazardous waste Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
- H01J11/26—Address electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
- H01J2217/49207—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19841900A DE19841900A1 (de) | 1998-09-11 | 1998-09-11 | Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme |
| DE19841900.7 | 1998-09-11 | ||
| PCT/EP1999/005615 WO2000016366A2 (fr) | 1998-09-11 | 1999-08-03 | Procede d'application de pistes conductrices metalliques servant d'electrode sur une plaque a canaux pour ecrans plats a grande surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2343386A1 true CA2343386A1 (fr) | 2000-03-23 |
Family
ID=7880821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002343386A Abandoned CA2343386A1 (fr) | 1998-09-11 | 1999-08-03 | Procede d'application de pistes conductrices metalliques servant d'electrode sur une plaque a canaux pour ecrans plats a grande surface |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP1112586A2 (fr) |
| JP (1) | JP2002525797A (fr) |
| KR (1) | KR20010090726A (fr) |
| CN (1) | CN1319245A (fr) |
| CA (1) | CA2343386A1 (fr) |
| DE (1) | DE19841900A1 (fr) |
| HK (1) | HK1040322A1 (fr) |
| TW (1) | TW442817B (fr) |
| WO (1) | WO2000016366A2 (fr) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10011455B4 (de) * | 2000-03-10 | 2005-12-08 | Schott Ag | Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme |
| DE10026976C2 (de) * | 2000-05-31 | 2002-08-01 | Schott Glas | Kanalplatte aus Glas für Flachbildschirme und Verfahren zu ihrer Herstellung |
| DE10026974A1 (de) * | 2000-05-31 | 2002-01-03 | Schott Glas | Kanalplatte aus Glas für Flachbildschirme und Verfahren zu ihrer Herstellung |
| JP3960064B2 (ja) * | 2002-02-05 | 2007-08-15 | 松下電器産業株式会社 | プラズマディスプレイパネルの製造方法 |
| CN101489356B (zh) * | 2008-01-16 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | 电路板及其制作方法 |
| CN102522293B (zh) * | 2011-12-31 | 2015-06-17 | 四川虹欧显示器件有限公司 | 等离子显示屏中寻址电极及其制备方法 |
| CN102496547A (zh) * | 2011-12-31 | 2012-06-13 | 四川虹欧显示器件有限公司 | 等离子显示屏中寻址电极及其制备方法 |
| CN102522292B (zh) * | 2011-12-31 | 2015-07-15 | 四川虹欧显示器件有限公司 | 等离子显示屏中显示电极及其制备方法 |
| CN103384452A (zh) * | 2012-05-02 | 2013-11-06 | 力达通讯股份有限公司 | 线路图案的制造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53112056A (en) * | 1977-03-11 | 1978-09-30 | Fujitsu Ltd | Gas discharging panel of self shift type |
| DE3132452A1 (de) * | 1981-08-17 | 1983-02-24 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen einer nach dem galvanischen aufbau von metallischen strukturen planaren strukturebene |
| NL8105922A (nl) * | 1981-12-31 | 1983-07-18 | Philips Nv | Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen. |
| JPS60221928A (ja) * | 1984-04-19 | 1985-11-06 | Sony Corp | 放電表示装置の製造方法 |
| US4686114A (en) * | 1986-01-17 | 1987-08-11 | Halliwell Michael J | Selective electroless plating |
| JP2962776B2 (ja) * | 1989-08-31 | 1999-10-12 | 大日本印刷株式会社 | 導電性パターン形成用組成物及び導電性パターン形成方法 |
| US5137618A (en) * | 1991-06-07 | 1992-08-11 | Foster Miller, Inc. | Methods for manufacture of multilayer circuit boards |
| DE4125863A1 (de) * | 1991-08-03 | 1993-02-04 | Lpkf Cad Cam Systeme Gmbh | Verfahren zum aufbringen von strukturierten metallschichten auf glassubstraten |
| DE4330961C1 (de) * | 1993-09-09 | 1994-07-28 | Krone Ag | Verfahren zur Herstellung von strukturierten Metallisierungen auf Oberflächen |
| BE1007610A3 (nl) * | 1993-10-11 | 1995-08-22 | Philips Electronics Nv | Werkwijze voor het stroomloos aanbrengen van een metaalpatroon op een elektrisch isolerend substraat. |
| DE59503175D1 (de) * | 1994-04-25 | 1998-09-17 | Siemens Nv | Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen |
| DE4438799A1 (de) * | 1994-10-18 | 1996-04-25 | Atotech Deutschland Gmbh | Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen |
| JPH08222128A (ja) * | 1995-02-14 | 1996-08-30 | Fujitsu Ltd | 表示パネルの電極形成方法 |
| US5804920A (en) * | 1996-01-19 | 1998-09-08 | Philips Electronics North America Corporation | Plasma addressed liquid crystal display with etched glass spacers |
| DE69738794D1 (de) * | 1996-02-08 | 2008-08-14 | Canon Kk | Verfahren zur Herstellung einer elektronenemittierende Vorrichtung, einer Elektronenquelle und eines Bilderzeugungsgerätes und Verfahren zur Überprüfung der Herstellung |
-
1998
- 1998-09-11 DE DE19841900A patent/DE19841900A1/de not_active Withdrawn
-
1999
- 1999-08-03 WO PCT/EP1999/005615 patent/WO2000016366A2/fr not_active Application Discontinuation
- 1999-08-03 EP EP99939446A patent/EP1112586A2/fr not_active Withdrawn
- 1999-08-03 KR KR1020017003105A patent/KR20010090726A/ko not_active Application Discontinuation
- 1999-08-03 CN CN99810719A patent/CN1319245A/zh active Pending
- 1999-08-03 JP JP2000570808A patent/JP2002525797A/ja active Pending
- 1999-08-03 CA CA002343386A patent/CA2343386A1/fr not_active Abandoned
- 1999-09-10 TW TW088115651A patent/TW442817B/zh active
-
2002
- 2002-03-15 HK HK02102029.9A patent/HK1040322A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000016366A2 (fr) | 2000-03-23 |
| TW442817B (en) | 2001-06-23 |
| KR20010090726A (ko) | 2001-10-19 |
| CN1319245A (zh) | 2001-10-24 |
| HK1040322A1 (zh) | 2002-05-31 |
| WO2000016366A3 (fr) | 2000-07-13 |
| JP2002525797A (ja) | 2002-08-13 |
| DE19841900A1 (de) | 2000-03-30 |
| EP1112586A2 (fr) | 2001-07-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |