CA1201821A - Method of connecting a semiconductor to elements of a support, especially of a portable card - Google Patents

Method of connecting a semiconductor to elements of a support, especially of a portable card

Info

Publication number
CA1201821A
CA1201821A CA000428006A CA428006A CA1201821A CA 1201821 A CA1201821 A CA 1201821A CA 000428006 A CA000428006 A CA 000428006A CA 428006 A CA428006 A CA 428006A CA 1201821 A CA1201821 A CA 1201821A
Authority
CA
Canada
Prior art keywords
wafer
conducting
metallizations
holes
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000428006A
Other languages
English (en)
French (fr)
Inventor
Paul Parmentier
Philippe Jourdain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1201821A publication Critical patent/CA1201821A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H10W70/093—
    • H10W72/073—
    • H10W72/9413—
    • H10W90/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
CA000428006A 1982-05-14 1983-05-12 Method of connecting a semiconductor to elements of a support, especially of a portable card Expired CA1201821A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8208430 1982-05-14
FR8208430A FR2527036A1 (fr) 1982-05-14 1982-05-14 Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative

Publications (1)

Publication Number Publication Date
CA1201821A true CA1201821A (en) 1986-03-11

Family

ID=9274042

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000428006A Expired CA1201821A (en) 1982-05-14 1983-05-12 Method of connecting a semiconductor to elements of a support, especially of a portable card

Country Status (6)

Country Link
US (1) US4731645A (enExample)
EP (1) EP0094716B1 (enExample)
JP (1) JPS58209133A (enExample)
CA (1) CA1201821A (enExample)
DE (1) DE3369233D1 (enExample)
FR (1) FR2527036A1 (enExample)

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CH661808A5 (fr) * 1985-01-21 1987-08-14 Lupa Finances Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique.
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
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JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
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JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Ｉｃカ−ド
US4839713A (en) * 1987-02-20 1989-06-13 Mitsubishi Denki Kabushiki Kaisha Package structure for semiconductor device
JP2579937B2 (ja) * 1987-04-15 1997-02-12 株式会社東芝 電子回路装置およびその製造方法
FR2635916B1 (fr) * 1988-08-23 1990-10-12 Bull Sa Support de circuit integre de haute densite et son procede de fabrication
US6938825B1 (en) 1989-04-24 2005-09-06 Ultracard, Inc. Data system
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JP2816028B2 (ja) * 1991-02-18 1998-10-27 株式会社東芝 半導体装置の製造方法
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FR2721732B1 (fr) * 1994-06-22 1996-08-30 Solaic Sa Carte à mémoire sans contact dont le circuit électronique comporte un module.
DE19539181C2 (de) * 1995-10-20 1998-05-14 Ods Gmbh & Co Kg Chipkartenmodul sowie entsprechendes Herstellungsverfahren
US6013948A (en) 1995-11-27 2000-01-11 Micron Technology, Inc. Stackable chip scale semiconductor package with mating contacts on opposed surfaces
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
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US5811879A (en) * 1996-06-26 1998-09-22 Micron Technology, Inc. Stacked leads-over-chip multi-chip module
JP2777114B2 (ja) * 1996-09-02 1998-07-16 株式会社日立製作所 テープキャリア
US6250192B1 (en) * 1996-11-12 2001-06-26 Micron Technology, Inc. Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
DE19735171A1 (de) * 1997-08-13 1999-01-07 Siemens Ag Halbleitermodul
US5899705A (en) 1997-11-20 1999-05-04 Akram; Salman Stacked leads-over chip multi-chip module
DE19809073A1 (de) * 1998-03-04 1999-09-16 Orga Kartensysteme Gmbh Chipmodul und Verfahren zur Herstellung einer Chipkarte
US6208019B1 (en) * 1998-03-13 2001-03-27 Kabushiki Kaisha Toshiba Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
US6414391B1 (en) 1998-06-30 2002-07-02 Micron Technology, Inc. Module assembly for stacked BGA packages with a common bus bar in the assembly
DE19830540A1 (de) * 1998-07-08 2000-01-13 Siemens Ag Elektronischer Schaltungsträger
US6871787B1 (en) 1998-07-10 2005-03-29 Ultracard, Inc. Data storage card having a glass substrate and data surface region and method for using same
JP2000099678A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd Ｉｃカード及びその製造方法
DE19845665C2 (de) * 1998-10-05 2000-08-17 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelements für einen IC-Baustein zum Einbau in Chipkarten
US6815251B1 (en) 1999-02-01 2004-11-09 Micron Technology, Inc. High density modularity for IC's
DE19940480C2 (de) 1999-08-26 2001-06-13 Orga Kartensysteme Gmbh Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte
US7487908B1 (en) 1999-10-23 2009-02-10 Ultracard, Inc. Article having an embedded accessible storage member, apparatus and method for using same
US8397998B1 (en) 1999-10-23 2013-03-19 Ultracard, Inc. Data storage device, apparatus and method for using same
US7036739B1 (en) 1999-10-23 2006-05-02 Ultracard, Inc. Data storage device apparatus and method for using same
DE19955538B4 (de) * 1999-11-18 2014-06-05 Morpho Cards Gmbh Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht
DE10014379A1 (de) 2000-03-23 2001-10-11 Infineon Technologies Ag Verfahren und Vorrichtung zum Verbinden mindestens eines Chips mit einer Umverdrahtungsanordnung
DE10042312A1 (de) * 2000-08-29 2002-03-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
US6969006B1 (en) 2000-09-15 2005-11-29 Ultracard, Inc. Rotable portable card having a data storage device, apparatus and method for using same
US6707149B2 (en) * 2000-09-29 2004-03-16 Tessera, Inc. Low cost and compliant microelectronic packages for high i/o and fine pitch
FR2816107B1 (fr) * 2000-10-30 2003-11-28 Gemplus Card Int Module de circuit integre sur film et son procede de fabrication
FR2818802B1 (fr) * 2000-12-21 2003-11-28 Gemplus Card Int Connexion par isolant decoupe et cordon imprime en plan
FR2822338B1 (fr) * 2001-03-14 2003-06-27 Sagem Procede pour connecter electriquement des plots de contact d'un composant microelectronique directement a des pistes de circuits imprimes, et plaque a circuits imprimes ainsi constituee
JP3678212B2 (ja) * 2002-05-20 2005-08-03 ウシオ電機株式会社 超高圧水銀ランプ
US6755700B2 (en) * 2002-11-12 2004-06-29 Modevation Enterprises Inc. Reset speed control for watercraft
US20040102753A1 (en) * 2002-11-26 2004-05-27 Kimberly-Clark Worldwide, Inc. Male incontinence absorbent article and method of producing same
FI20031341A7 (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI117814B (fi) * 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI119714B (fi) 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
FI122128B (fi) * 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
DE112006001506T5 (de) * 2005-06-16 2008-04-30 Imbera Electronics Oy Platinenstruktur und Verfahren zu ihrer Herstellung
US10206288B2 (en) * 2015-08-13 2019-02-12 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate
US10165677B2 (en) 2015-12-10 2018-12-25 Palo Alto Research Center Incorporated Bare die integration with printed components on flexible substrate without laser cut
US10847384B2 (en) 2017-05-31 2020-11-24 Palo Alto Research Center Incorporated Method and fixture for chip attachment to physical objects

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DE2202348A1 (de) * 1972-01-19 1973-07-26 Siemens Ag Kreuzschienenverteiler
JPS5180770A (enExample) * 1975-01-13 1976-07-14 Suwa Seikosha Kk
GB1565207A (en) * 1975-09-05 1980-04-16 Sinclair Radionics Printed circuits
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
FR2382101A1 (fr) * 1977-02-28 1978-09-22 Labo Electronique Physique Dispositif a semi-conducteur, comportant des pattes metalliques isolees
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
JPS5649178U (enExample) * 1979-09-21 1981-05-01
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
FR2490059A1 (fr) * 1980-09-09 1982-03-12 Serras Paulet Edouard Circuit imprime et son procede de fabrication
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten

Also Published As

Publication number Publication date
EP0094716A1 (fr) 1983-11-23
EP0094716B1 (fr) 1987-01-14
US4731645A (en) 1988-03-15
FR2527036B1 (enExample) 1985-02-01
DE3369233D1 (en) 1987-02-19
FR2527036A1 (fr) 1983-11-18
JPS58209133A (ja) 1983-12-06

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Legal Events

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