FR2818802B1 - Connexion par isolant decoupe et cordon imprime en plan - Google Patents
Connexion par isolant decoupe et cordon imprime en planInfo
- Publication number
- FR2818802B1 FR2818802B1 FR0017132A FR0017132A FR2818802B1 FR 2818802 B1 FR2818802 B1 FR 2818802B1 FR 0017132 A FR0017132 A FR 0017132A FR 0017132 A FR0017132 A FR 0017132A FR 2818802 B1 FR2818802 B1 FR 2818802B1
- Authority
- FR
- France
- Prior art keywords
- plan
- cut
- connection
- out insulator
- cord
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/24011—Deposited, e.g. MCM-D type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2405—Shape
- H01L2224/24051—Conformal with the semiconductor or solid-state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/76—Apparatus for connecting with build-up interconnects
- H01L2224/7665—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0017132A FR2818802B1 (fr) | 2000-12-21 | 2000-12-21 | Connexion par isolant decoupe et cordon imprime en plan |
AU2002226499A AU2002226499A1 (en) | 2000-12-21 | 2001-12-21 | Connection by cut-out insulation and plane-printed weld |
PCT/FR2001/004181 WO2002050905A1 (fr) | 2000-12-21 | 2001-12-21 | Connexion par isolant decoupe et cordon imprime en plan |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0017132A FR2818802B1 (fr) | 2000-12-21 | 2000-12-21 | Connexion par isolant decoupe et cordon imprime en plan |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2818802A1 FR2818802A1 (fr) | 2002-06-28 |
FR2818802B1 true FR2818802B1 (fr) | 2003-11-28 |
Family
ID=8858282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0017132A Expired - Fee Related FR2818802B1 (fr) | 2000-12-21 | 2000-12-21 | Connexion par isolant decoupe et cordon imprime en plan |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002226499A1 (fr) |
FR (1) | FR2818802B1 (fr) |
WO (1) | WO2002050905A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2848023B1 (fr) * | 2002-11-28 | 2005-02-18 | Gemplus Card Int | Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement |
KR101218529B1 (ko) | 2006-06-30 | 2013-01-21 | 톰슨 라이센싱 | 매체와 사용하기 위한 무선 주파수 트랜스폰더 |
CN109854631A (zh) * | 2019-03-15 | 2019-06-07 | 北方工业大学 | 一种挠性波纹管联轴器及制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2527036A1 (fr) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative |
DE9109295U1 (fr) * | 1991-04-11 | 1991-10-10 | Export-Contor Aussenhandelsgesellschaft Mbh, 8500 Nuernberg, De | |
FR2684471B1 (fr) * | 1991-12-02 | 1994-03-04 | Solaic | Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue. |
FR2735284B1 (fr) * | 1995-06-12 | 1997-08-29 | Solaic Sa | Puce pour carte electronique revetue d'une couche de matiere isolante et carte electronique comportant une telle puce |
DE19539181C2 (de) * | 1995-10-20 | 1998-05-14 | Ods Gmbh & Co Kg | Chipkartenmodul sowie entsprechendes Herstellungsverfahren |
DE19600388C2 (de) * | 1996-01-08 | 2000-03-09 | Orga Kartensysteme Gmbh | Chipkarte |
FR2748335A1 (fr) * | 1996-05-06 | 1997-11-07 | Solaic Sa | Carte a memoire et procede de fabrication d'une telle carte |
-
2000
- 2000-12-21 FR FR0017132A patent/FR2818802B1/fr not_active Expired - Fee Related
-
2001
- 2001-12-21 AU AU2002226499A patent/AU2002226499A1/en not_active Abandoned
- 2001-12-21 WO PCT/FR2001/004181 patent/WO2002050905A1/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
FR2818802A1 (fr) | 2002-06-28 |
WO2002050905A1 (fr) | 2002-06-27 |
AU2002226499A1 (en) | 2002-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO20032587D0 (no) | ABCA-1 eleverende forbindelser | |
DE69938733D1 (de) | Trainingsgerät | |
DE69934783D1 (de) | Trainingsgerät | |
GB2359240B (en) | Deflection device for birds and for pigeons in particular | |
DE60119418D1 (de) | Gesichtsbildaufnehmendes Erkennungsgerät und Passprüfungsgerät | |
DE1215119T1 (de) | Sechsachsige Ausricht- und Installationsvorrichtung | |
ATE397917T1 (de) | Pseudoephedrin und fexofenadine enthaltende osmotische vorrichtung | |
DE60139763D1 (de) | Lanzen und -tieren | |
DE60134785D1 (de) | Ionenleiter | |
DE59907478D1 (de) | Trainingsgerät | |
GB0002169D0 (en) | Combustion simulating device | |
FI20002591A0 (fi) | Tuloilmalaite | |
DE60115700D1 (de) | Gaspedalvorrichtung | |
DE60142600D1 (de) | Entwicklungsverfahren und -vorrichtung | |
NO20023802L (no) | Terminalinnretning og koblingsinnretning | |
DE60044426D1 (de) | Weiterleitungsvorrichtung und -Verfahren | |
DE60103580D1 (de) | Stromversorgungsgerät | |
FI20000813A (fi) | Tuloilmalaite | |
FR2818802B1 (fr) | Connexion par isolant decoupe et cordon imprime en plan | |
DE50111832D1 (de) | Fremdstarteinrichtung | |
DE19924209B4 (de) | Steckvorrichtung | |
ATA6512000A (de) | Trainingsgerät | |
DE50004333D1 (de) | Steckvorrichtung | |
DE60123690D1 (de) | Verbindungssteckervorrichtung | |
FR2815473B1 (fr) | Diac planar symetrique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090831 |