JPH0463282U - - Google Patents
Info
- Publication number
- JPH0463282U JPH0463282U JP1990104739U JP10473990U JPH0463282U JP H0463282 U JPH0463282 U JP H0463282U JP 1990104739 U JP1990104739 U JP 1990104739U JP 10473990 U JP10473990 U JP 10473990U JP H0463282 U JPH0463282 U JP H0463282U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- conductive pattern
- pad
- main body
- device main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104739U JPH0463282U (enExample) | 1990-10-04 | 1990-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990104739U JPH0463282U (enExample) | 1990-10-04 | 1990-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463282U true JPH0463282U (enExample) | 1992-05-29 |
Family
ID=31850139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990104739U Pending JPH0463282U (enExample) | 1990-10-04 | 1990-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463282U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58209133A (ja) * | 1982-05-14 | 1983-12-06 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 電気接続方法及びそれを利用する個人カ−ド |
| JPS633422A (ja) * | 1986-06-23 | 1988-01-08 | Ricoh Co Ltd | Ｉｃチツプの実装方法 |
-
1990
- 1990-10-04 JP JP1990104739U patent/JPH0463282U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58209133A (ja) * | 1982-05-14 | 1983-12-06 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 電気接続方法及びそれを利用する個人カ−ド |
| JPS633422A (ja) * | 1986-06-23 | 1988-01-08 | Ricoh Co Ltd | Ｉｃチツプの実装方法 |