JPS63114095U - - Google Patents
Info
- Publication number
- JPS63114095U JPS63114095U JP1987005766U JP576687U JPS63114095U JP S63114095 U JPS63114095 U JP S63114095U JP 1987005766 U JP1987005766 U JP 1987005766U JP 576687 U JP576687 U JP 576687U JP S63114095 U JPS63114095 U JP S63114095U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- shield plate
- chip
- interposed
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987005766U JPS63114095U (enExample) | 1987-01-19 | 1987-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987005766U JPS63114095U (enExample) | 1987-01-19 | 1987-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114095U true JPS63114095U (enExample) | 1988-07-22 |
Family
ID=30787656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987005766U Pending JPS63114095U (enExample) | 1987-01-19 | 1987-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114095U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02297954A (ja) * | 1989-02-14 | 1990-12-10 | Mitsubishi Electric Corp | 集積回路のシールド構造 |
| US6985341B2 (en) | 2001-04-24 | 2006-01-10 | Vlt, Inc. | Components having actively controlled circuit elements |
| US7443229B1 (en) | 2001-04-24 | 2008-10-28 | Picor Corporation | Active filtering |
-
1987
- 1987-01-19 JP JP1987005766U patent/JPS63114095U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02297954A (ja) * | 1989-02-14 | 1990-12-10 | Mitsubishi Electric Corp | 集積回路のシールド構造 |
| US6985341B2 (en) | 2001-04-24 | 2006-01-10 | Vlt, Inc. | Components having actively controlled circuit elements |
| US7443229B1 (en) | 2001-04-24 | 2008-10-28 | Picor Corporation | Active filtering |