CA1180469A - Plastic encapsulated semiconductor device and method for manufacturing the same - Google Patents

Plastic encapsulated semiconductor device and method for manufacturing the same

Info

Publication number
CA1180469A
CA1180469A CA000403080A CA403080A CA1180469A CA 1180469 A CA1180469 A CA 1180469A CA 000403080 A CA000403080 A CA 000403080A CA 403080 A CA403080 A CA 403080A CA 1180469 A CA1180469 A CA 1180469A
Authority
CA
Canada
Prior art keywords
plastic
encapsulating housing
strips
substrate support
plastic encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000403080A
Other languages
English (en)
French (fr)
Inventor
Masami Yokozawa
Isao Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of CA1180469A publication Critical patent/CA1180469A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W70/481—
    • H10W72/0198—
    • H10W74/111—
    • H10W74/121—
    • H10W74/00—
    • H10W74/10—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CA000403080A 1981-05-18 1982-05-17 Plastic encapsulated semiconductor device and method for manufacturing the same Expired CA1180469A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP56075444A JPS57188858A (en) 1981-05-18 1981-05-18 Plastic molded type semiconductor device
JP75444/1981 1981-05-18

Publications (1)

Publication Number Publication Date
CA1180469A true CA1180469A (en) 1985-01-02

Family

ID=13576421

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000403080A Expired CA1180469A (en) 1981-05-18 1982-05-17 Plastic encapsulated semiconductor device and method for manufacturing the same

Country Status (5)

Country Link
US (1) US4503452A (enExample)
EP (1) EP0066188B1 (enExample)
JP (1) JPS57188858A (enExample)
CA (1) CA1180469A (enExample)
DE (1) DE3267996D1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130449A (ja) * 1983-01-17 1984-07-27 Nec Corp 絶縁型半導体素子用リードフレーム
JPS59135753A (ja) * 1983-01-25 1984-08-04 Toshiba Corp 半導体装置とその製造方法
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
JPS60128645A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法
JPS60229352A (ja) * 1984-04-26 1985-11-14 Fuji Electric Co Ltd 樹脂封止形半導体装置および樹脂封止方法
DE3535605C1 (de) * 1985-10-05 1986-12-04 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung
EP0257681A3 (en) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
DE3777324D1 (de) * 1986-10-15 1992-04-16 Sanyo Electric Co Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann.
JP2602234B2 (ja) * 1987-07-10 1997-04-23 株式会社日立製作所 樹脂封止半導体装置
EP0401211B1 (de) * 1988-02-20 1993-05-19 Deutsche ITT Industries GmbH Halbleiterbauelement, herstellungsverfahren, vorrichtung und montageplatz
EP0336173A3 (en) * 1988-04-05 1990-04-25 Siemens Aktiengesellschaft Molded component package isolating interior substrate by recesses containing exposed breakoffs
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
US5977630A (en) * 1997-08-15 1999-11-02 International Rectifier Corp. Plural semiconductor die housed in common package with split heat sink
US6255722B1 (en) * 1998-06-11 2001-07-03 International Rectifier Corp. High current capacity semiconductor device housing
USD573116S1 (en) * 2006-10-19 2008-07-15 Vishay General Semiconductor Llc Bridge rectifier package with heat sink
JP2010073841A (ja) * 2008-09-18 2010-04-02 Sony Corp 光学パッケージ素子、表示装置、および電子機器
DE102013220880B4 (de) * 2013-10-15 2016-08-18 Infineon Technologies Ag Elektronisches Halbleitergehäuse mit einer elektrisch isolierenden, thermischen Schnittstellenstruktur auf einer Diskontinuität einer Verkapselungsstruktur sowie ein Herstellungsverfahren dafür und eine elektronische Anordung dies aufweisend
DE102015118245B4 (de) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Elektronische Komponente mit einem thermischen Schnittstellenmaterial, Herstellungsverfahren für eine elektronische Komponente, Wärmeabfuhrkörper mit einem thermischen Schnittstellenmaterial und thermisches Schnittstellenmaterial
JP1646470S (enExample) * 2019-05-14 2019-11-25

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3716764A (en) * 1963-12-16 1973-02-13 Texas Instruments Inc Process for encapsulating electronic components in plastic
NL6903229A (enExample) * 1969-03-01 1970-09-03
US3611250A (en) * 1969-09-10 1971-10-05 Amp Inc Integrated circuit module and assembly
US3793709A (en) * 1972-04-24 1974-02-26 Texas Instruments Inc Process for making a plastic-encapsulated semiconductor device
IT993429B (it) * 1973-09-26 1975-09-30 Sgs Ates Componenti Perfezionamento di una cassa per dispositivo a semiconduttori
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS54111766A (en) * 1978-02-22 1979-09-01 Hitachi Ltd Coupling construction of lead and heat sink in semiconductor device
JPS54159177A (en) * 1978-06-07 1979-12-15 Hitachi Ltd Resin sealed semiconductor device
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
JPS5563854A (en) * 1978-11-08 1980-05-14 Nec Kyushu Ltd Method of manufacturing semiconductor device
JPS5587468A (en) * 1978-12-25 1980-07-02 Nec Corp Lead frame
JPS5596663A (en) * 1979-01-16 1980-07-23 Nec Corp Method of fabricating semiconductor device
JPS55108755A (en) * 1979-02-14 1980-08-21 Nec Corp Resin seal type semiconductor device
JPS5619646A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Resin sealing type semiconductor device
JPS5662344A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Resin sealed semiconductor device

Also Published As

Publication number Publication date
DE3267996D1 (en) 1986-01-30
JPS57188858A (en) 1982-11-19
EP0066188B1 (en) 1985-12-18
JPS6227750B2 (enExample) 1987-06-16
EP0066188A1 (en) 1982-12-08
US4503452A (en) 1985-03-05

Similar Documents

Publication Publication Date Title
CA1180469A (en) Plastic encapsulated semiconductor device and method for manufacturing the same
CA1174821A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4589010A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
EP0817261B1 (en) Method for manufacturing plastic package for electronic device having a fully insulated dissipator
CA1168764A (en) Encapsulation for semiconductor integrated circuit chip
US4965227A (en) Process for manufacturing plastic pin grid arrays and the product produced thereby
US5144412A (en) Process for manufacturing plastic pin grid arrays and the product produced thereby
US5362679A (en) Plastic package with solder grid array
EP0257681A2 (en) Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
EP0069390B1 (en) Lead frame for plastic encapsulated semiconductor device
JPH0117259B2 (enExample)
KR20020018145A (ko) 반도체장치 및 그 제조방법
EP0845801B1 (en) Process for manufacturing a plastic package for electronic devices having an heat dissipator
US6281579B1 (en) Insert-molded leadframe to optimize interface between powertrain and driver board
GB2151845A (en) A semiconductor memory
EP0382714A1 (en) Process for manufacturing plastic pin grid arrays and the product produced thereby
US20030134452A1 (en) Method for manufacturing semiconductor device packages
CA1209721A (en) Plastic encapsulated semiconductor device and lead frame therefor
JPS6362239A (ja) プラスチックカプセル封じ半導体デバイスの製造方法
JPH0512857B2 (enExample)
JP3597012B2 (ja) 半導体装置
KR20010061847A (ko) 열방출형 반도체 패키지 및 이 패키지가 실장된 메모리 모듈
JP2000216295A (ja) 半導体装置およびその製造方法並びにそれに使用される放熱体
CA1213678A (en) Lead frame for plastic encapsulated semiconductor device
JPH10144821A (ja) 樹脂パッケージ型半導体装置およびその製造方法

Legal Events

Date Code Title Description
MKEC Expiry (correction)
MKEX Expiry