CA1155239A - Diode and rom or eeprom device using same - Google Patents
Diode and rom or eeprom device using sameInfo
- Publication number
- CA1155239A CA1155239A CA000366713A CA366713A CA1155239A CA 1155239 A CA1155239 A CA 1155239A CA 000366713 A CA000366713 A CA 000366713A CA 366713 A CA366713 A CA 366713A CA 1155239 A CA1155239 A CA 1155239A
- Authority
- CA
- Canada
- Prior art keywords
- region
- diode according
- diode
- atomic percent
- doped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims abstract description 68
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 230000004888 barrier function Effects 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 13
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 12
- 239000011737 fluorine Substances 0.000 claims abstract description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 8
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 5
- 239000002019 doping agent Substances 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229940060037 fluorine Drugs 0.000 claims 2
- 235000019000 fluorine Nutrition 0.000 claims 2
- 229920000053 polysorbate 80 Polymers 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 62
- 229910045601 alloy Inorganic materials 0.000 abstract description 13
- 239000000956 alloy Substances 0.000 abstract description 13
- 239000011159 matrix material Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- 239000000758 substrate Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 14
- 239000010408 film Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 12
- 239000013078 crystal Substances 0.000 description 11
- 229910052732 germanium Inorganic materials 0.000 description 11
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 11
- 101001034843 Mus musculus Interferon-induced transmembrane protein 1 Proteins 0.000 description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 9
- 238000012856 packing Methods 0.000 description 9
- 230000000737 periodic effect Effects 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910000077 silane Inorganic materials 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- 239000002178 crystalline material Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical group [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 235000016768 molybdenum Nutrition 0.000 description 4
- 229910021339 platinum silicide Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052714 tellurium Inorganic materials 0.000 description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 4
- 229910001080 W alloy Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229960001866 silicon dioxide Drugs 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 240000001973 Ficus microcarpa Species 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910017817 a-Ge Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- QUZPNFFHZPRKJD-UHFFFAOYSA-N germane Chemical compound [GeH4] QUZPNFFHZPRKJD-UHFFFAOYSA-N 0.000 description 1
- 229910052986 germanium hydride Inorganic materials 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/167—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table further characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/685—Hi-Lo semiconductor devices, e.g. memory devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8615—Hi-lo semiconductor devices, e.g. memory devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/35—Material including carbon, e.g. graphite, grapheme
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10301179A | 1979-12-13 | 1979-12-13 | |
| US06/103,011 | 1979-12-13 | ||
| US20827480A | 1980-11-19 | 1980-11-19 | |
| US208,274 | 1980-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1155239A true CA1155239A (en) | 1983-10-11 |
Family
ID=26799984
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000366713A Expired CA1155239A (en) | 1979-12-13 | 1980-12-12 | Diode and rom or eeprom device using same |
| CA000430398A Expired CA1161970A (en) | 1979-12-13 | 1983-06-14 | Diode and rom device using same |
| CA000430399A Expired CA1162327A (en) | 1979-12-13 | 1983-06-14 | Diode and eeprom device using same |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000430398A Expired CA1161970A (en) | 1979-12-13 | 1983-06-14 | Diode and rom device using same |
| CA000430399A Expired CA1162327A (en) | 1979-12-13 | 1983-06-14 | Diode and eeprom device using same |
Country Status (15)
| Country | Link |
|---|---|
| JP (3) | JPS56115571A (xx) |
| KR (2) | KR850001045B1 (xx) |
| AU (1) | AU543740B2 (xx) |
| BE (1) | BE886631A (xx) |
| CA (3) | CA1155239A (xx) |
| DE (1) | DE3046701A1 (xx) |
| FR (1) | FR2475295A1 (xx) |
| GB (1) | GB2066566B (xx) |
| IL (1) | IL61671A (xx) |
| IT (1) | IT1194001B (xx) |
| MX (1) | MX150800A (xx) |
| NL (1) | NL8006771A (xx) |
| SE (1) | SE8008739L (xx) |
| SG (1) | SG72784G (xx) |
| ZA (3) | ZA807761B (xx) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3277665D1 (en) * | 1981-08-07 | 1987-12-17 | British Petroleum Co Plc | Non-volatile electrically programmable memory device |
| JPS5867066A (ja) * | 1981-10-16 | 1983-04-21 | Semiconductor Energy Lab Co Ltd | 絶緑ゲート型電界効果半導体装置の作製方法 |
| JPS59501988A (ja) * | 1982-11-11 | 1984-11-29 | ハイドリル カンパニ− | 安全弁装置及び方法 |
| US4545111A (en) * | 1983-01-18 | 1985-10-08 | Energy Conversion Devices, Inc. | Method for making, parallel preprogramming or field programming of electronic matrix arrays |
| US4677742A (en) * | 1983-01-18 | 1987-07-07 | Energy Conversion Devices, Inc. | Electronic matrix arrays and method for making the same |
| AU562641B2 (en) * | 1983-01-18 | 1987-06-18 | Energy Conversion Devices Inc. | Electronic matrix array |
| US4569121A (en) * | 1983-03-07 | 1986-02-11 | Signetics Corporation | Method of fabricating a programmable read-only memory cell incorporating an antifuse utilizing deposition of amorphous semiconductor layer |
| US4569120A (en) * | 1983-03-07 | 1986-02-11 | Signetics Corporation | Method of fabricating a programmable read-only memory cell incorporating an antifuse utilizing ion implantation |
| JPS60153552U (ja) * | 1984-03-24 | 1985-10-12 | 沖電気工業株式会社 | Ｐｎ接合半導体装置 |
| US4667217A (en) * | 1985-04-19 | 1987-05-19 | Ncr Corporation | Two bit vertically/horizontally integrated memory cell |
| US4914055A (en) * | 1989-08-24 | 1990-04-03 | Advanced Micro Devices, Inc. | Semiconductor antifuse structure and method |
| GB9113795D0 (en) * | 1991-06-26 | 1991-08-14 | Philips Electronic Associated | Thin-film rom devices and their manufacture |
| GB9117680D0 (en) * | 1991-08-16 | 1991-10-02 | Philips Electronic Associated | Electronic matrix array devices |
| JP3501416B2 (ja) * | 1994-04-28 | 2004-03-02 | 忠弘 大見 | 半導体装置 |
| JP2500484B2 (ja) * | 1994-07-11 | 1996-05-29 | ソニー株式会社 | 薄膜トランジスタの製法 |
| US6646912B2 (en) * | 2001-06-05 | 2003-11-11 | Hewlett-Packard Development Company, Lp. | Non-volatile memory |
| US6599796B2 (en) * | 2001-06-29 | 2003-07-29 | Hewlett-Packard Development Company, L.P. | Apparatus and fabrication process to reduce crosstalk in pirm memory array |
| JP3948292B2 (ja) | 2002-02-01 | 2007-07-25 | 株式会社日立製作所 | 半導体記憶装置及びその製造方法 |
| AU2003264480A1 (en) * | 2002-09-19 | 2004-04-08 | Sharp Kabushiki Kaisha | Variable resistance functional body and its manufacturing method |
| JP4541651B2 (ja) * | 2003-03-13 | 2010-09-08 | シャープ株式会社 | 抵抗変化機能体、メモリおよびその製造方法並びに半導体装置および電子機器 |
| JP4634014B2 (ja) * | 2003-05-22 | 2011-02-16 | 株式会社日立製作所 | 半導体記憶装置 |
| KR100504700B1 (ko) * | 2003-06-04 | 2005-08-03 | 삼성전자주식회사 | 고집적 상변환 램 |
| JP4767653B2 (ja) * | 2004-10-22 | 2011-09-07 | 株式会社半導体エネルギー研究所 | 半導体装置及び無線チップ |
| CN101044624A (zh) | 2004-10-22 | 2007-09-26 | 株式会社半导体能源研究所 | 半导体器件 |
| JP2008118108A (ja) * | 2006-08-25 | 2008-05-22 | Qimonda Ag | 情報記憶素子およびその製造方法 |
| JP2007019559A (ja) * | 2006-10-23 | 2007-01-25 | Hitachi Ltd | 半導体記憶装置及びその製造方法 |
| US7915603B2 (en) * | 2006-10-27 | 2011-03-29 | Qimonda Ag | Modifiable gate stack memory element |
| CN101689603B (zh) * | 2007-06-20 | 2015-08-12 | 台湾积体电路制造股份有限公司 | 电子元件及其制造方法 |
| US9716225B2 (en) | 2014-09-03 | 2017-07-25 | Micron Technology, Inc. | Memory cells including dielectric materials, memory devices including the memory cells, and methods of forming same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51122382A (en) * | 1975-04-18 | 1976-10-26 | Fujitsu Ltd | Semiconductor device |
| US4064521A (en) * | 1975-07-28 | 1977-12-20 | Rca Corporation | Semiconductor device having a body of amorphous silicon |
| JPS5819138B2 (ja) * | 1977-01-11 | 1983-04-16 | 日本電信電話株式会社 | 半導体装置 |
| JPS53144274A (en) * | 1977-05-23 | 1978-12-15 | Hitachi Ltd | Semiconductor device and its manufacture |
| JPS5457879A (en) * | 1977-10-15 | 1979-05-10 | Cho Lsi Gijutsu Kenkyu Kumiai | Semiconductor |
| US4177475A (en) * | 1977-10-31 | 1979-12-04 | Burroughs Corporation | High temperature amorphous memory device for an electrically alterable read-only memory |
| DE2909197A1 (de) * | 1978-03-20 | 1979-10-04 | Texas Instruments Inc | Verfahren zur herstellung eines festspeichers und festspeichermatrix |
-
1980
- 1980-12-09 IL IL61671A patent/IL61671A/xx unknown
- 1980-12-10 MX MX185133A patent/MX150800A/es unknown
- 1980-12-10 GB GB8039611A patent/GB2066566B/en not_active Expired
- 1980-12-11 ZA ZA00807761A patent/ZA807761B/xx unknown
- 1980-12-11 DE DE19803046701 patent/DE3046701A1/de not_active Withdrawn
- 1980-12-11 ZA ZA00807762A patent/ZA807762B/xx unknown
- 1980-12-11 JP JP17520080A patent/JPS56115571A/ja active Pending
- 1980-12-11 ZA ZA00807763A patent/ZA807763B/xx unknown
- 1980-12-11 JP JP17519980A patent/JPS56100464A/ja active Pending
- 1980-12-12 CA CA000366713A patent/CA1155239A/en not_active Expired
- 1980-12-12 FR FR8026401A patent/FR2475295A1/fr active Pending
- 1980-12-12 KR KR8004727A patent/KR850001045B1/ko active
- 1980-12-12 SE SE8008739A patent/SE8008739L/xx not_active Application Discontinuation
- 1980-12-12 KR KR1019800004729A patent/KR830004681A/ko unknown
- 1980-12-12 BE BE0/203148A patent/BE886631A/fr not_active IP Right Cessation
- 1980-12-12 AU AU65315/80A patent/AU543740B2/en not_active Withdrawn - After Issue
- 1980-12-12 JP JP17568280A patent/JPS56103474A/ja active Pending
- 1980-12-12 IT IT26643/80A patent/IT1194001B/it active
- 1980-12-12 NL NL8006771A patent/NL8006771A/nl not_active Application Discontinuation
-
1983
- 1983-06-14 CA CA000430398A patent/CA1161970A/en not_active Expired
- 1983-06-14 CA CA000430399A patent/CA1162327A/en not_active Expired
-
1984
- 1984-10-17 SG SG727/84A patent/SG72784G/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA1162327A (en) | 1984-02-14 |
| ZA807761B (en) | 1981-12-30 |
| AU6531580A (en) | 1981-06-18 |
| SE8008739L (sv) | 1981-06-14 |
| GB2066566A (en) | 1981-07-08 |
| MX150800A (es) | 1984-07-19 |
| SG72784G (en) | 1985-03-29 |
| IT1194001B (it) | 1988-08-31 |
| IT8026643A0 (it) | 1980-12-12 |
| CA1161970A (en) | 1984-02-07 |
| JPS56103474A (en) | 1981-08-18 |
| ZA807762B (en) | 1981-12-30 |
| KR830004681A (ko) | 1983-07-16 |
| AU543740B2 (en) | 1985-05-02 |
| KR830004679A (ko) | 1983-07-16 |
| GB2066566B (en) | 1984-07-04 |
| NL8006771A (nl) | 1981-07-16 |
| ZA807763B (en) | 1981-12-30 |
| JPS56100464A (en) | 1981-08-12 |
| IL61671A0 (en) | 1981-01-30 |
| JPS56115571A (en) | 1981-09-10 |
| DE3046701A1 (de) | 1981-10-15 |
| KR850001045B1 (en) | 1985-07-19 |
| IL61671A (en) | 1984-04-30 |
| FR2475295A1 (fr) | 1981-08-07 |
| BE886631A (fr) | 1981-04-01 |
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