CA1151789A - Photopolymerization type resin composition and solder resist containing the same - Google Patents
Photopolymerization type resin composition and solder resist containing the sameInfo
- Publication number
- CA1151789A CA1151789A CA000347923A CA347923A CA1151789A CA 1151789 A CA1151789 A CA 1151789A CA 000347923 A CA000347923 A CA 000347923A CA 347923 A CA347923 A CA 347923A CA 1151789 A CA1151789 A CA 1151789A
- Authority
- CA
- Canada
- Prior art keywords
- type epoxy
- acrylates
- solder
- resin composition
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 title description 2
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000005977 Ethylene Substances 0.000 claims abstract description 8
- 229920003987 resole Polymers 0.000 claims abstract description 8
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 6
- 229920001225 polyester resin Polymers 0.000 claims description 11
- 239000004645 polyester resin Substances 0.000 claims description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 6
- -1 methacryloyl groups Chemical group 0.000 claims description 6
- 238000004040 coloring Methods 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 101100491149 Caenorhabditis elegans lem-3 gene Proteins 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- SOGFHWHHBILCSX-UHFFFAOYSA-J prop-2-enoate silicon(4+) Chemical class [Si+4].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C SOGFHWHHBILCSX-UHFFFAOYSA-J 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32754/1979 | 1979-03-20 | ||
| JP3275479A JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1151789A true CA1151789A (en) | 1983-08-09 |
Family
ID=12367623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000347923A Expired CA1151789A (en) | 1979-03-20 | 1980-03-19 | Photopolymerization type resin composition and solder resist containing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS55127097A (enrdf_load_stackoverflow) |
| CA (1) | CA1151789A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771085A (en) * | 1986-10-07 | 1988-09-13 | E. I. Du Pont De Nemours And Company | Curable dielectric compositions |
| US6399277B1 (en) | 1996-06-28 | 2002-06-04 | Vantico Inc. | Photopolymerizable thermosetting resin composition |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825371A (ja) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | 紫外線硬化型印刷回路用インキ組成物 |
| JPS59213779A (ja) * | 1983-04-22 | 1984-12-03 | Meidensha Electric Mfg Co Ltd | 紫外線硬化型ソルダ−レジストインキ |
| JPS603624A (ja) * | 1983-06-22 | 1985-01-10 | Takao Ono | 感光性組成物 |
| JPS6049071A (ja) * | 1983-08-30 | 1985-03-18 | Toshiba Chem Corp | マ−キングインキ |
| JPS61252546A (ja) * | 1985-05-01 | 1986-11-10 | Ueno Kagaku Kogyo Kk | 感光性レジストインク，それを用いたｐｓ板の製造方法およびそのｐｓ板の蝕刻方法 |
| JPH0689284B2 (ja) * | 1985-06-29 | 1994-11-09 | 株式会社アサヒ化学研究所 | ソルダ−レジストインキ用硬化性樹脂組成物 |
| US4650743A (en) * | 1985-07-31 | 1987-03-17 | E. I. Du Pont De Nemours And Company | Optical coating composition |
| JPS62157029A (ja) * | 1985-12-28 | 1987-07-13 | Unitika Ltd | 感光性樹脂組成物 |
| JP2571800B2 (ja) * | 1987-11-27 | 1997-01-16 | イビデン株式会社 | 無電解めっき用感光性接着剤およびプリント配線板 |
| JP2700245B2 (ja) * | 1988-02-20 | 1998-01-19 | ソマール株式会社 | 硬化性接着剤組成物 |
| JPH0748109B2 (ja) * | 1988-04-01 | 1995-05-24 | イビデン株式会社 | 感光性樹脂組成物 |
| US5196296A (en) * | 1989-10-06 | 1993-03-23 | Nippon Steel Corporation | Epoxy acrylate resins and photosensitive resin compositions therefrom |
| JP2772227B2 (ja) * | 1993-11-15 | 1998-07-02 | イビデン株式会社 | プリント配線板 |
| JP4523679B2 (ja) * | 1998-06-22 | 2010-08-11 | 太陽インキ製造株式会社 | ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物 |
| JP5245099B2 (ja) * | 2008-04-25 | 2013-07-24 | 独立行政法人 国立印刷局 | 真偽判別用樹脂組成物、真偽判別用インキ組成物及びその真偽判別用印刷物 |
| JP6359605B2 (ja) * | 2016-11-15 | 2018-07-18 | 株式会社京写 | プリント配線板 |
| JP7137237B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップユニット |
| JP7137235B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップ、および、ヒーターチップユニット |
| JP7137236B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップユニット |
| JP7370075B2 (ja) * | 2020-11-05 | 2023-10-27 | 株式会社アポロ技研 | ヒーターチップユニット |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146159B2 (enrdf_load_stackoverflow) * | 1972-02-25 | 1976-12-07 | ||
| JPS5421546B2 (enrdf_load_stackoverflow) * | 1973-06-07 | 1979-07-31 | ||
| JPS5516393B2 (enrdf_load_stackoverflow) * | 1973-11-28 | 1980-05-01 | ||
| US4003877A (en) * | 1974-05-24 | 1977-01-18 | Dynachem Corporation | Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions |
| JPS5128677A (en) * | 1974-09-04 | 1976-03-11 | Alps Electric Co Ltd | Suitsuchi no tanshiban no seizohoho |
| JPS5183760A (ja) * | 1975-01-20 | 1976-07-22 | Mitsubishi Electric Corp | Toranjisutazofukuki |
| JPS51131706A (en) * | 1975-05-08 | 1976-11-16 | Taiyou Inki Seizou Kk | Solder resist ink |
-
1979
- 1979-03-20 JP JP3275479A patent/JPS55127097A/ja active Granted
-
1980
- 1980-03-19 CA CA000347923A patent/CA1151789A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771085A (en) * | 1986-10-07 | 1988-09-13 | E. I. Du Pont De Nemours And Company | Curable dielectric compositions |
| US6399277B1 (en) | 1996-06-28 | 2002-06-04 | Vantico Inc. | Photopolymerizable thermosetting resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55127097A (en) | 1980-10-01 |
| JPS6148800B2 (enrdf_load_stackoverflow) | 1986-10-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |