CA1151789A - Photopolymerization type resin composition and solder resist containing the same - Google Patents
Photopolymerization type resin composition and solder resist containing the sameInfo
- Publication number
- CA1151789A CA1151789A CA000347923A CA347923A CA1151789A CA 1151789 A CA1151789 A CA 1151789A CA 000347923 A CA000347923 A CA 000347923A CA 347923 A CA347923 A CA 347923A CA 1151789 A CA1151789 A CA 1151789A
- Authority
- CA
- Canada
- Prior art keywords
- type epoxy
- acrylates
- solder
- resin composition
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275479A JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
| JP32754/1979 | 1979-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1151789A true CA1151789A (en) | 1983-08-09 |
Family
ID=12367623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000347923A Expired CA1151789A (en) | 1979-03-20 | 1980-03-19 | Photopolymerization type resin composition and solder resist containing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS55127097A (enrdf_load_stackoverflow) |
| CA (1) | CA1151789A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771085A (en) * | 1986-10-07 | 1988-09-13 | E. I. Du Pont De Nemours And Company | Curable dielectric compositions |
| US6399277B1 (en) | 1996-06-28 | 2002-06-04 | Vantico Inc. | Photopolymerizable thermosetting resin composition |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825371A (ja) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | 紫外線硬化型印刷回路用インキ組成物 |
| JPS59213779A (ja) * | 1983-04-22 | 1984-12-03 | Meidensha Electric Mfg Co Ltd | 紫外線硬化型ソルダ−レジストインキ |
| JPS603624A (ja) * | 1983-06-22 | 1985-01-10 | Takao Ono | 感光性組成物 |
| JPS6049071A (ja) * | 1983-08-30 | 1985-03-18 | Toshiba Chem Corp | マ−キングインキ |
| JPS61252546A (ja) * | 1985-05-01 | 1986-11-10 | Ueno Kagaku Kogyo Kk | 感光性レジストインク,それを用いたps板の製造方法およびそのps板の蝕刻方法 |
| JPH0689284B2 (ja) * | 1985-06-29 | 1994-11-09 | 株式会社アサヒ化学研究所 | ソルダ−レジストインキ用硬化性樹脂組成物 |
| US4650743A (en) * | 1985-07-31 | 1987-03-17 | E. I. Du Pont De Nemours And Company | Optical coating composition |
| JPS62157029A (ja) * | 1985-12-28 | 1987-07-13 | Unitika Ltd | 感光性樹脂組成物 |
| JP2571800B2 (ja) * | 1987-11-27 | 1997-01-16 | イビデン株式会社 | 無電解めっき用感光性接着剤およびプリント配線板 |
| JP2700245B2 (ja) * | 1988-02-20 | 1998-01-19 | ソマール株式会社 | 硬化性接着剤組成物 |
| JPH0748109B2 (ja) * | 1988-04-01 | 1995-05-24 | イビデン株式会社 | 感光性樹脂組成物 |
| US5196296A (en) * | 1989-10-06 | 1993-03-23 | Nippon Steel Corporation | Epoxy acrylate resins and photosensitive resin compositions therefrom |
| JP2772227B2 (ja) * | 1993-11-15 | 1998-07-02 | イビデン株式会社 | プリント配線板 |
| JP4523679B2 (ja) * | 1998-06-22 | 2010-08-11 | 太陽インキ製造株式会社 | ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物 |
| JP5245099B2 (ja) * | 2008-04-25 | 2013-07-24 | 独立行政法人 国立印刷局 | 真偽判別用樹脂組成物、真偽判別用インキ組成物及びその真偽判別用印刷物 |
| JP6359605B2 (ja) * | 2016-11-15 | 2018-07-18 | 株式会社京写 | プリント配線板 |
| JP7137236B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップユニット |
| JP7137235B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップ、および、ヒーターチップユニット |
| JP7137237B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップユニット |
| JP7370075B2 (ja) * | 2020-11-05 | 2023-10-27 | 株式会社アポロ技研 | ヒーターチップユニット |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146159B2 (enrdf_load_stackoverflow) * | 1972-02-25 | 1976-12-07 | ||
| JPS5421546B2 (enrdf_load_stackoverflow) * | 1973-06-07 | 1979-07-31 | ||
| JPS5516393B2 (enrdf_load_stackoverflow) * | 1973-11-28 | 1980-05-01 | ||
| US4003877A (en) * | 1974-05-24 | 1977-01-18 | Dynachem Corporation | Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions |
| JPS5128677A (en) * | 1974-09-04 | 1976-03-11 | Alps Electric Co Ltd | Suitsuchi no tanshiban no seizohoho |
| JPS5183760A (ja) * | 1975-01-20 | 1976-07-22 | Mitsubishi Electric Corp | Toranjisutazofukuki |
| JPS51131706A (en) * | 1975-05-08 | 1976-11-16 | Taiyou Inki Seizou Kk | Solder resist ink |
-
1979
- 1979-03-20 JP JP3275479A patent/JPS55127097A/ja active Granted
-
1980
- 1980-03-19 CA CA000347923A patent/CA1151789A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771085A (en) * | 1986-10-07 | 1988-09-13 | E. I. Du Pont De Nemours And Company | Curable dielectric compositions |
| US6399277B1 (en) | 1996-06-28 | 2002-06-04 | Vantico Inc. | Photopolymerizable thermosetting resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55127097A (en) | 1980-10-01 |
| JPS6148800B2 (enrdf_load_stackoverflow) | 1986-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1151789A (en) | Photopolymerization type resin composition and solder resist containing the same | |
| JP4290510B2 (ja) | インクジェット用光硬化性・熱硬化性組成物とそれを用いたプリント配線板 | |
| KR910001746B1 (ko) | 솔더 레지스트 조성물 | |
| KR20130050361A (ko) | 잉크젯용 경화성 조성물 및 전자 부품의 제조 방법 | |
| US6618933B2 (en) | Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof | |
| WO1996011239A1 (fr) | Encre resist de photosoudure, carte a circuit imprime et procede de fabrication | |
| JPWO2006109890A1 (ja) | 感光性樹脂組成物、プリント配線板、および半導体パッケージ基板 | |
| US7910631B2 (en) | Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition | |
| EP0429250A2 (en) | Tacky photopolymerizable adhesive compositions | |
| EP0246467A2 (en) | Photosensitive resin composition and use thereof | |
| CA2007180C (en) | Method of forming electrically conducting layer | |
| JP4273894B2 (ja) | 樹脂組成物 | |
| JP3686699B2 (ja) | アルカリ現像型の光硬化性・熱硬化性樹脂組成物 | |
| JP2820553B2 (ja) | ソルダーレジストインキ組成物及びその硬化物 | |
| CN108535959B (zh) | 感光胶黏剂及其制备方法和应用 | |
| US4425209A (en) | Photosetting resin compositions | |
| JPH0414151B2 (enrdf_load_stackoverflow) | ||
| JP2003113221A (ja) | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 | |
| KR19980083440A (ko) | Uv반응성 고분자바인더를 함유하는 액상 광중합성 솔더마스크 조성물 | |
| JPH02199179A (ja) | 塗料の硬化方法 | |
| JP2004168921A (ja) | 熱硬化性樹脂組成物 | |
| JPS63238174A (ja) | レジストインク組成物及び印刷配線板における硬化塗膜の形成方法 | |
| JPH02206615A (ja) | 熱硬化性液状組成物 | |
| JPH09316173A (ja) | 樹脂組成物及びその硬化物 | |
| JPH06228253A (ja) | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |