JPS55127097A - Photocurable resin composition and solder resist - Google Patents
Photocurable resin composition and solder resistInfo
- Publication number
- JPS55127097A JPS55127097A JP3275479A JP3275479A JPS55127097A JP S55127097 A JPS55127097 A JP S55127097A JP 3275479 A JP3275479 A JP 3275479A JP 3275479 A JP3275479 A JP 3275479A JP S55127097 A JPS55127097 A JP S55127097A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- solder resist
- photocurable resin
- photocurable
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275479A JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
| CA000347923A CA1151789A (en) | 1979-03-20 | 1980-03-19 | Photopolymerization type resin composition and solder resist containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3275479A JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55127097A true JPS55127097A (en) | 1980-10-01 |
| JPS6148800B2 JPS6148800B2 (enrdf_load_stackoverflow) | 1986-10-25 |
Family
ID=12367623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3275479A Granted JPS55127097A (en) | 1979-03-20 | 1979-03-20 | Photocurable resin composition and solder resist |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS55127097A (enrdf_load_stackoverflow) |
| CA (1) | CA1151789A (enrdf_load_stackoverflow) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825371A (ja) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | 紫外線硬化型印刷回路用インキ組成物 |
| JPS59213779A (ja) * | 1983-04-22 | 1984-12-03 | Meidensha Electric Mfg Co Ltd | 紫外線硬化型ソルダ−レジストインキ |
| JPS603624A (ja) * | 1983-06-22 | 1985-01-10 | Takao Ono | 感光性組成物 |
| JPS6049071A (ja) * | 1983-08-30 | 1985-03-18 | Toshiba Chem Corp | マ−キングインキ |
| JPS61252546A (ja) * | 1985-05-01 | 1986-11-10 | Ueno Kagaku Kogyo Kk | 感光性レジストインク,それを用いたps板の製造方法およびそのps板の蝕刻方法 |
| JPS624390A (ja) * | 1985-06-29 | 1987-01-10 | 株式会社アサヒ化学研究所 | ソルダ−レジストインキ用硬化性樹脂組成物 |
| JPS6289773A (ja) * | 1985-07-31 | 1987-04-24 | イ−・アイ・デユポン・ドウ・ヌム−ル・アンド・カンパニ− | 光学コ−テイング組成物 |
| JPS62157029A (ja) * | 1985-12-28 | 1987-07-13 | Unitika Ltd | 感光性樹脂組成物 |
| JPH01142547A (ja) * | 1987-11-27 | 1989-06-05 | Ibiden Co Ltd | 感光性樹脂組成物 |
| JPH01213324A (ja) * | 1988-02-20 | 1989-08-28 | Somar Corp | 硬化性接着剤組成物 |
| JPH01253730A (ja) * | 1988-04-01 | 1989-10-11 | Ibiden Co Ltd | 感光性樹脂組成物 |
| US5196296A (en) * | 1989-10-06 | 1993-03-23 | Nippon Steel Corporation | Epoxy acrylate resins and photosensitive resin compositions therefrom |
| JPH06317905A (ja) * | 1993-11-15 | 1994-11-15 | Ibiden Co Ltd | 感光性樹脂組成物及びプリント配線板 |
| JP2000007974A (ja) * | 1998-06-22 | 2000-01-11 | Taiyo Ink Mfg Ltd | ハロゲンフリーの着色顔料を用いたプリント配線板用緑色インキ組成物 |
| JP2009263525A (ja) * | 2008-04-25 | 2009-11-12 | National Printing Bureau | 樹脂組成物、インキ組成物及びその印刷物 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4771085A (en) * | 1986-10-07 | 1988-09-13 | E. I. Du Pont De Nemours And Company | Curable dielectric compositions |
| JP3254572B2 (ja) | 1996-06-28 | 2002-02-12 | バンティコ株式会社 | 光重合性熱硬化性樹脂組成物 |
| JP6359605B2 (ja) * | 2016-11-15 | 2018-07-18 | 株式会社京写 | プリント配線板 |
| JP7137236B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップユニット |
| JP7137235B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップ、および、ヒーターチップユニット |
| JP7137237B2 (ja) * | 2020-09-09 | 2022-09-14 | 株式会社アポロ技研 | ヒーターチップユニット |
| JP7370075B2 (ja) * | 2020-11-05 | 2023-10-27 | 株式会社アポロ技研 | ヒーターチップユニット |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4888197A (enrdf_load_stackoverflow) * | 1972-02-25 | 1973-11-19 | ||
| JPS5012567A (enrdf_load_stackoverflow) * | 1973-06-07 | 1975-02-08 | ||
| JPS5083760A (enrdf_load_stackoverflow) * | 1973-11-28 | 1975-07-07 | ||
| JPS5128677A (en) * | 1974-09-04 | 1976-03-11 | Alps Electric Co Ltd | Suitsuchi no tanshiban no seizohoho |
| JPS5183760A (ja) * | 1975-01-20 | 1976-07-22 | Mitsubishi Electric Corp | Toranjisutazofukuki |
| JPS51131706A (en) * | 1975-05-08 | 1976-11-16 | Taiyou Inki Seizou Kk | Solder resist ink |
| US4064287A (en) * | 1974-05-24 | 1977-12-20 | Dynachem Corporation | Process for treating selected areas of a surface with solder |
-
1979
- 1979-03-20 JP JP3275479A patent/JPS55127097A/ja active Granted
-
1980
- 1980-03-19 CA CA000347923A patent/CA1151789A/en not_active Expired
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4888197A (enrdf_load_stackoverflow) * | 1972-02-25 | 1973-11-19 | ||
| JPS5012567A (enrdf_load_stackoverflow) * | 1973-06-07 | 1975-02-08 | ||
| JPS5083760A (enrdf_load_stackoverflow) * | 1973-11-28 | 1975-07-07 | ||
| US4064287A (en) * | 1974-05-24 | 1977-12-20 | Dynachem Corporation | Process for treating selected areas of a surface with solder |
| JPS5128677A (en) * | 1974-09-04 | 1976-03-11 | Alps Electric Co Ltd | Suitsuchi no tanshiban no seizohoho |
| JPS5183760A (ja) * | 1975-01-20 | 1976-07-22 | Mitsubishi Electric Corp | Toranjisutazofukuki |
| JPS51131706A (en) * | 1975-05-08 | 1976-11-16 | Taiyou Inki Seizou Kk | Solder resist ink |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5825371A (ja) * | 1981-08-06 | 1983-02-15 | Toyobo Co Ltd | 紫外線硬化型印刷回路用インキ組成物 |
| JPS59213779A (ja) * | 1983-04-22 | 1984-12-03 | Meidensha Electric Mfg Co Ltd | 紫外線硬化型ソルダ−レジストインキ |
| JPS603624A (ja) * | 1983-06-22 | 1985-01-10 | Takao Ono | 感光性組成物 |
| JPS6049071A (ja) * | 1983-08-30 | 1985-03-18 | Toshiba Chem Corp | マ−キングインキ |
| JPS61252546A (ja) * | 1985-05-01 | 1986-11-10 | Ueno Kagaku Kogyo Kk | 感光性レジストインク,それを用いたps板の製造方法およびそのps板の蝕刻方法 |
| JPS624390A (ja) * | 1985-06-29 | 1987-01-10 | 株式会社アサヒ化学研究所 | ソルダ−レジストインキ用硬化性樹脂組成物 |
| JPS6289773A (ja) * | 1985-07-31 | 1987-04-24 | イ−・アイ・デユポン・ドウ・ヌム−ル・アンド・カンパニ− | 光学コ−テイング組成物 |
| JPS62157029A (ja) * | 1985-12-28 | 1987-07-13 | Unitika Ltd | 感光性樹脂組成物 |
| JPH01142547A (ja) * | 1987-11-27 | 1989-06-05 | Ibiden Co Ltd | 感光性樹脂組成物 |
| JPH01213324A (ja) * | 1988-02-20 | 1989-08-28 | Somar Corp | 硬化性接着剤組成物 |
| JPH01253730A (ja) * | 1988-04-01 | 1989-10-11 | Ibiden Co Ltd | 感光性樹脂組成物 |
| US5196296A (en) * | 1989-10-06 | 1993-03-23 | Nippon Steel Corporation | Epoxy acrylate resins and photosensitive resin compositions therefrom |
| JPH06317905A (ja) * | 1993-11-15 | 1994-11-15 | Ibiden Co Ltd | 感光性樹脂組成物及びプリント配線板 |
| JP2000007974A (ja) * | 1998-06-22 | 2000-01-11 | Taiyo Ink Mfg Ltd | ハロゲンフリーの着色顔料を用いたプリント配線板用緑色インキ組成物 |
| JP2009263525A (ja) * | 2008-04-25 | 2009-11-12 | National Printing Bureau | 樹脂組成物、インキ組成物及びその印刷物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1151789A (en) | 1983-08-09 |
| JPS6148800B2 (enrdf_load_stackoverflow) | 1986-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS55127097A (en) | Photocurable resin composition and solder resist | |
| DE3061513D1 (en) | Photopolymerizable mixtures and photocurable elements made therefrom | |
| DE3065851D1 (en) | Photopolymerizable composition and photopolymerizable copying material produced therewith | |
| JPS5365279A (en) | Ultraviolet absorbing composition and manufacture thereof | |
| JPS5531889A (en) | Hardenable resin composition | |
| JPS53110649A (en) | Thermosetting resin composition | |
| JPS55162294A (en) | Solder mask composition | |
| JPS5680041A (en) | Resist composition | |
| JPS55112221A (en) | Vinylester resin composition | |
| GB1550982A (en) | Photocurable resin compositions | |
| JPS5619752A (en) | Photosensitive resin composition laminate | |
| DE3479665D1 (en) | Photocurable resin composition | |
| JPS5495686A (en) | Photocurable composition and curing method | |
| DE3067898D1 (en) | Heat-resistant thermosetting resin composition | |
| JPS5494599A (en) | Thermosetting resin composition | |
| JPS5592754A (en) | Resin composition | |
| JPS55152718A (en) | Resin composition | |
| GB2015518A (en) | Photopolymerizable compounds and photocurable compositions | |
| JPS55120027A (en) | Film resist | |
| JPS5627139A (en) | Electronnbeam resist composition | |
| JPS53142455A (en) | Particulate inorganic material and molding resin composition using same | |
| JPS5326891A (en) | Kyleneeformaldehyde resin composition and its preparation | |
| JPS54163947A (en) | Resin composition | |
| JPS5681359A (en) | Furan resin and its manufacture | |
| GB2054618B (en) | Thermosetting resin composition |