BRPI0815312A2 - Dispositivo emissor de luz utilizando material luminescente não estequiométrico - Google Patents
Dispositivo emissor de luz utilizando material luminescente não estequiométricoInfo
- Publication number
- BRPI0815312A2 BRPI0815312A2 BRPI0815312-4A2A BRPI0815312A BRPI0815312A2 BR PI0815312 A2 BRPI0815312 A2 BR PI0815312A2 BR PI0815312 A BRPI0815312 A BR PI0815312A BR PI0815312 A2 BRPI0815312 A2 BR PI0815312A2
- Authority
- BR
- Brazil
- Prior art keywords
- light emitting
- luminescent material
- light
- stoichiometric
- emitting diode
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 5
- 239000013078 crystal Substances 0.000 abstract 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract 3
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0086483 | 2007-08-28 | ||
| KR20070086483 | 2007-08-28 | ||
| KR10-2008-0075181 | 2008-07-31 | ||
| KR1020080075181A KR101055769B1 (ko) | 2007-08-28 | 2008-07-31 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
| PCT/KR2008/004734 WO2009028818A2 (en) | 2007-08-28 | 2008-08-14 | Light emitting device employing non-stoichiometric tetragonal alkaline earth silicate phosphors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0815312A2 true BRPI0815312A2 (pt) | 2015-02-10 |
| BRPI0815312B1 BRPI0815312B1 (pt) | 2019-04-30 |
Family
ID=40692817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0815312-4A BRPI0815312B1 (pt) | 2007-08-28 | 2008-08-14 | Dispositivo emissor de luz utilizando material luminescente não- estequiométrico |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US8134165B2 (pt) |
| JP (1) | JP5599483B2 (pt) |
| KR (1) | KR101055769B1 (pt) |
| CN (2) | CN102623611B (pt) |
| AT (1) | ATE541024T1 (pt) |
| BR (1) | BRPI0815312B1 (pt) |
| MY (1) | MY155543A (pt) |
| RU (1) | RU2470411C2 (pt) |
| TW (1) | TWI434430B (pt) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
| KR100658700B1 (ko) * | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Ｒｇｂ 발광소자와 형광체를 조합한 발광장치 |
| KR100665299B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
| US8318044B2 (en) * | 2004-06-10 | 2012-11-27 | Seoul Semiconductor Co., Ltd. | Light emitting device |
| KR100665298B1 (ko) * | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광장치 |
| KR101258397B1 (ko) * | 2005-11-11 | 2013-04-30 | 서울반도체 주식회사 | 구리 알칼리토 실리케이트 혼성 결정 형광체 |
| KR101055772B1 (ko) * | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
| KR100875443B1 (ko) * | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
| KR101258227B1 (ko) | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
| CN101784636B (zh) * | 2007-08-22 | 2013-06-12 | 首尔半导体株式会社 | 非化学计量四方铜碱土硅酸盐磷光体及其制备方法 |
| KR101055769B1 (ko) * | 2007-08-28 | 2011-08-11 | 서울반도체 주식회사 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
| US8426871B2 (en) * | 2009-06-19 | 2013-04-23 | Honeywell International Inc. | Phosphor converting IR LEDs |
| KR101055762B1 (ko) * | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
| DE102009030205A1 (de) * | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
| US8796706B2 (en) | 2009-07-03 | 2014-08-05 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
| WO2012023737A2 (en) * | 2010-08-14 | 2012-02-23 | Seoul Semiconductor Co., Ltd. | Light emitting device having surface-modified silicate luminophores |
| DE102010034322A1 (de) | 2010-08-14 | 2012-02-16 | Litec-Lp Gmbh | Oberflächenmodifizierter Silikatleuchtstoffe |
| US9234129B2 (en) | 2010-08-14 | 2016-01-12 | Seoul Semiconductor Co., Ltd. | Surface-modified quantum dot luminophores |
| US9614129B2 (en) | 2010-08-14 | 2017-04-04 | Seoul Semiconductor Co., Ltd. | Light emitting device having surface-modified luminophores |
| US9196785B2 (en) | 2010-08-14 | 2015-11-24 | Seoul Semiconductor Co., Ltd. | Light emitting device having surface-modified quantum dot luminophores |
| CN102544303A (zh) * | 2010-12-21 | 2012-07-04 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
| DE202011106052U1 (de) | 2011-09-23 | 2011-11-09 | Osram Ag | Lichtquelle mit Leuchtstoff und zugehörige Beleuchtungseinheit. |
| CN103325920A (zh) * | 2013-05-31 | 2013-09-25 | 江苏索尔光电科技有限公司 | 一种led发光二极管体的封装形式 |
| US9935247B2 (en) | 2014-07-23 | 2018-04-03 | Crystal Is, Inc. | Photon extraction from ultraviolet light-emitting devices |
| JP6589048B2 (ja) * | 2016-03-14 | 2019-10-09 | 三井金属鉱業株式会社 | 蛍光体 |
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- 2008-08-14 CN CN201210023185.9A patent/CN102623611B/zh active Active
- 2008-08-14 RU RU2010111739/04A patent/RU2470411C2/ru active
- 2008-08-14 CN CN2008801050918A patent/CN101796657B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI434430B (zh) | 2014-04-11 |
| ATE541024T1 (de) | 2012-01-15 |
| CN102623611B (zh) | 2014-10-29 |
| CN101796657B (zh) | 2012-03-28 |
| MY155543A (en) | 2015-10-30 |
| US20100207132A1 (en) | 2010-08-19 |
| RU2470411C2 (ru) | 2012-12-20 |
| JP2013175739A (ja) | 2013-09-05 |
| US8431954B2 (en) | 2013-04-30 |
| CN102623611A (zh) | 2012-08-01 |
| US8134165B2 (en) | 2012-03-13 |
| US20120132939A1 (en) | 2012-05-31 |
| CN101796657A (zh) | 2010-08-04 |
| KR20090023092A (ko) | 2009-03-04 |
| BRPI0815312B1 (pt) | 2019-04-30 |
| KR101055769B1 (ko) | 2011-08-11 |
| JP5599483B2 (ja) | 2014-10-01 |
| TW200915626A (en) | 2009-04-01 |
| RU2010111739A (ru) | 2011-10-10 |
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