BRPI0411684A - processo de fabricação de peças para componentes eletrÈnicos passivos, peças, placa, processos de fabricação de um componente eletrÈnico passivo e de um circuito impresso - Google Patents

processo de fabricação de peças para componentes eletrÈnicos passivos, peças, placa, processos de fabricação de um componente eletrÈnico passivo e de um circuito impresso

Info

Publication number
BRPI0411684A
BRPI0411684A BRPI0411684A BRPI0411684A BR PI0411684 A BRPI0411684 A BR PI0411684A BR PI0411684 A BRPI0411684 A BR PI0411684A BR PI0411684 A BRPI0411684 A BR PI0411684A
Authority
BR
Brazil
Prior art keywords
passive electronic
parts
printed circuit
electronic component
board
Prior art date
Application number
Other languages
English (en)
Inventor
Martin Gijs
Jean-Pierre Reyal
Farid Amalou
Original Assignee
Imphy Alloys
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imphy Alloys filed Critical Imphy Alloys
Publication of BRPI0411684A publication Critical patent/BRPI0411684A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
    • H01F10/131—Amorphous metallic alloys, e.g. glassy metals containing iron or nickel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/265—Magnetic multilayers non exchange-coupled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/13—Amorphous metallic alloys, e.g. glassy metals
    • H01F10/138—Amorphous metallic alloys, e.g. glassy metals containing nanocrystallites, e.g. obtained by annealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0233—Manufacturing of magnetic circuits made from sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0591—Cutting by direct application of fluent pressure to work

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Laminated Bodies (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

"PROCESSO DE FABRICAçãO DE PEçAS PARA COMPONENTES ELETRÈNICOS PASSIVOS, PEçAS, PLACA, PROCESSOS DE FABRICAçãO DE UM COMPONENTE ELETRÈNICO PASSIVO E DE UM CIRCUITO IMPRESSO". Processo de fabricação de peças para componentes eletrónicos passivos segundo qual: - fabrica-se uma tira estratificada (1) constituída por pelo menos um empilhamento de uma tira metálica fina e de uma camada de um material adesivo, e recorta-se na tira estratificada (1) pelo menos uma peça (6), e o recorte é efetuado por um processo que comporta pelo menos uma etapa de gravura por jateamento de areia. Peças obtidas.
BRPI0411684 2003-06-23 2004-06-22 processo de fabricação de peças para componentes eletrÈnicos passivos, peças, placa, processos de fabricação de um componente eletrÈnico passivo e de um circuito impresso BRPI0411684A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0307563A FR2856552B1 (fr) 2003-06-23 2003-06-23 Procede de fabrication de pieces pour composants electroniques passifs et pieces obtenues
PCT/FR2004/001556 WO2005002308A2 (fr) 2003-06-23 2004-06-22 Pieces pour composants electroniques passifs et procede de fabrication

Publications (1)

Publication Number Publication Date
BRPI0411684A true BRPI0411684A (pt) 2006-08-29

Family

ID=33484654

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0411684 BRPI0411684A (pt) 2003-06-23 2004-06-22 processo de fabricação de peças para componentes eletrÈnicos passivos, peças, placa, processos de fabricação de um componente eletrÈnico passivo e de um circuito impresso

Country Status (9)

Country Link
US (2) US7640641B2 (pt)
EP (1) EP1637017A2 (pt)
JP (2) JP4381414B2 (pt)
KR (1) KR101104385B1 (pt)
CN (1) CN1830232B (pt)
BR (1) BRPI0411684A (pt)
CA (2) CA2774224A1 (pt)
FR (1) FR2856552B1 (pt)
WO (1) WO2005002308A2 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100987185B1 (ko) 2007-12-26 2010-10-11 한국과학기술원 유전체 코어를 갖는 수동소자 제조방법
SG154342A1 (en) 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
FR2928006B1 (fr) * 2008-02-26 2011-03-04 Univ Claude Bernard Lyon Procede de fabrication d'un capteur de champ magnetique et capteur de champ magnetique obtenu
KR101133327B1 (ko) * 2010-04-09 2012-04-05 삼성전기주식회사 적층 세라믹 커패시터의 제조방법
US20160301241A1 (en) * 2015-04-09 2016-10-13 Samsung Electro-Mechanics Co., Ltd. Wireless power receiver and power supply apparatus using the same
KR102450606B1 (ko) * 2015-09-25 2022-10-05 주식회사 위츠 무선 전력 수신 장치 및 그를 이용한 전원 공급 장치
GB2550593A (en) * 2016-05-24 2017-11-29 Vacuumschmelze Gmbh & Co Kg Soft magnetic laminated core, method of producing a laminated core for a stator and/or rotor of an electric machine
JP6296407B1 (ja) * 2017-02-02 2018-03-20 株式会社伸光製作所 多列型プリント基板とその製造方法
JP6261104B1 (ja) * 2017-03-30 2018-01-17 株式会社伸光製作所 プリント基板の製造方法
JP7619756B2 (ja) * 2018-11-09 2025-01-22 マグネコンプ コーポレーション ラップアラウンド電極を有する圧電マイクロアクチュエータの製造方法
EP3736839A1 (en) * 2019-05-06 2020-11-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising embedded magnet stack
EP4700809A3 (en) * 2019-12-20 2026-04-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded magnetic inlay and integrated coil structure
JP7441490B2 (ja) * 2020-01-27 2024-03-01 相模ピーシーアイ株式会社 プリント基板の加工方法
WO2022054725A1 (ja) * 2020-09-09 2022-03-17 アルプスアルパイン株式会社 磁性コアおよび磁気部品

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Also Published As

Publication number Publication date
CA2774224A1 (fr) 2005-01-06
KR20060017651A (ko) 2006-02-24
WO2005002308A3 (fr) 2005-03-17
CN1830232B (zh) 2012-05-30
JP4381414B2 (ja) 2009-12-09
JP4917632B2 (ja) 2012-04-18
JP2007520872A (ja) 2007-07-26
WO2005002308A2 (fr) 2005-01-06
CA2529899C (fr) 2013-01-15
US8362361B2 (en) 2013-01-29
US7640641B2 (en) 2010-01-05
FR2856552B1 (fr) 2005-10-21
KR101104385B1 (ko) 2012-01-16
FR2856552A1 (fr) 2004-12-24
EP1637017A2 (fr) 2006-03-22
US20090314521A1 (en) 2009-12-24
CN1830232A (zh) 2006-09-06
US20070119284A1 (en) 2007-05-31
CA2529899A1 (fr) 2005-01-06
JP2009224800A (ja) 2009-10-01

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