BR0316301A - Método para prover suporte para um componente eletrônico em um dispositivo eletrônico, e, dispositivo eletrônico - Google Patents

Método para prover suporte para um componente eletrônico em um dispositivo eletrônico, e, dispositivo eletrônico

Info

Publication number
BR0316301A
BR0316301A BR0316301-6A BR0316301A BR0316301A BR 0316301 A BR0316301 A BR 0316301A BR 0316301 A BR0316301 A BR 0316301A BR 0316301 A BR0316301 A BR 0316301A
Authority
BR
Brazil
Prior art keywords
electronic device
pcb
electronic
electronic component
providing support
Prior art date
Application number
BR0316301-6A
Other languages
English (en)
Inventor
Per Holmberg
Original Assignee
Sony Ericsson Mobile Comm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP02388071A external-priority patent/EP1422985B1/en
Application filed by Sony Ericsson Mobile Comm Ab filed Critical Sony Ericsson Mobile Comm Ab
Publication of BR0316301A publication Critical patent/BR0316301A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

"MéTODO PARA PROVER SUPORTE PARA UM COMPONENTE ELETRôNICO EM UM DISPOSITIVO ELETRôNICO,E, DISPOSITIVO ELETRôNICO". Um método para prover suporte para um componente eletrônico (17) em um dispositivo eletrônico compreendendo uma PCB (placa de circuito impresso) (14) e um elemento estrutural (15) cobrindo pelo menos uma parte da PCB (14). O método compreende as etapas de montar o componente eletrônico (17) na PCB (14), aplicar um material elasticamente compressível e absorvedor de choques (18) ao elemento estrutural (15) em uma área (22) deste que é adaptada para cobrir o componente (17) e montar a PCB (14) e o elemento estrutural (15) de tal maneira que o material elasticamente compressível e absorvedor de choques (18) exerça uma pressão sobre o componente eletrônico (17), na direção da PCB (14). Um dispositivo eletrônico compreendendo um material elasticamente compressível e absorvedor de choques entre o elemento estrutural e a PCB é também descrito.
BR0316301-6A 2002-11-19 2003-10-14 Método para prover suporte para um componente eletrônico em um dispositivo eletrônico, e, dispositivo eletrônico BR0316301A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP02388071A EP1422985B1 (en) 2002-11-19 2002-11-19 A method of supporting electronic components and an electronic device with elestic support for an electronic component
US42837502P 2002-11-22 2002-11-22
PCT/EP2003/011458 WO2004047510A2 (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component

Publications (1)

Publication Number Publication Date
BR0316301A true BR0316301A (pt) 2005-09-27

Family

ID=32327865

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0316301-6A BR0316301A (pt) 2002-11-19 2003-10-14 Método para prover suporte para um componente eletrônico em um dispositivo eletrônico, e, dispositivo eletrônico

Country Status (7)

Country Link
JP (1) JP5404667B2 (pt)
KR (1) KR20050085013A (pt)
AU (1) AU2003294695A1 (pt)
BR (1) BR0316301A (pt)
MX (1) MXPA05005356A (pt)
RU (1) RU2328841C2 (pt)
WO (1) WO2004047510A2 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102413323B1 (ko) * 2015-02-06 2022-06-27 엘지전자 주식회사 이동 단말기
WO2016144039A1 (en) 2015-03-06 2016-09-15 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
SE540653C2 (sv) 2016-03-29 2018-10-09 Atlas Copco Airpower Nv Arrangemang anordnat att innesluta ett kretskort innefattande elektroniska komponenter och ett verktyg innefattande arrangemanget
US10477737B2 (en) 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
KR102551657B1 (ko) 2016-12-12 2023-07-06 삼성전자주식회사 전자파 차폐구조 및 그 제조방법
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
KR102373931B1 (ko) 2017-09-08 2022-03-14 삼성전자주식회사 전자파 차폐구조
CN114900950A (zh) * 2022-05-25 2022-08-12 广东江粉高科技产业园有限公司 一种抗弯折裂纹柔性线路板以及设计方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE340959T1 (de) * 1988-05-06 1990-08-16 Digital Equipment Corp., Maynard, Mass. Schaltungschipspackung zum schuetzen gegen elektromagnetische interferenzen, elektrostatische entladungen und thermische und mechanische spannungen.
US5390083A (en) * 1993-09-30 1995-02-14 Honeywell Inc. Apparatus and method for stiffening circuit card assemblies
DE4428320A1 (de) * 1994-08-10 1996-02-15 Duerrwaechter E Dr Doduco Kunststoffgehäuse mit einer schwingungsdämpfenden Lagerung eines bondbaren Elements
FR2798553B1 (fr) * 1999-09-14 2001-10-12 Sagem Dispositif de protection de composants electroniques
JP2001177345A (ja) * 1999-12-15 2001-06-29 Murata Mfg Co Ltd 圧電発振器
JP2001326492A (ja) * 2000-05-17 2001-11-22 Casio Comput Co Ltd 熱および電磁ノイズ兼用対策部品、および電子機器

Also Published As

Publication number Publication date
WO2004047510A2 (en) 2004-06-03
JP2011124598A (ja) 2011-06-23
RU2328841C2 (ru) 2008-07-10
AU2003294695A8 (en) 2004-06-15
AU2003294695A1 (en) 2004-06-15
JP5404667B2 (ja) 2014-02-05
WO2004047510A3 (en) 2007-12-21
KR20050085013A (ko) 2005-08-29
MXPA05005356A (es) 2005-08-26
RU2005119195A (ru) 2006-01-20

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Legal Events

Date Code Title Description
B07A Technical examination (opinion): publication of technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFIRO O PEDIDO DE ACORDO COM ART. 8O COMBINADO COM ART. 13 DA LPI

B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL.