MX9404627A - Un dispositivo para blindaje y enfriamiento de componentes electronicos. - Google Patents

Un dispositivo para blindaje y enfriamiento de componentes electronicos.

Info

Publication number
MX9404627A
MX9404627A MX9404627A MX9404627A MX9404627A MX 9404627 A MX9404627 A MX 9404627A MX 9404627 A MX9404627 A MX 9404627A MX 9404627 A MX9404627 A MX 9404627A MX 9404627 A MX9404627 A MX 9404627A
Authority
MX
Mexico
Prior art keywords
frame
cooling
cooling plate
armoring
electronic components
Prior art date
Application number
MX9404627A
Other languages
English (en)
Inventor
Sven Yngve Pettersson
Georg Adelbert Schneider
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of MX9404627A publication Critical patent/MX9404627A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La presente invención se relaciona con un dispositivo para blindaje y/oenfriamiento de un componente electrónico montado sobre un circuitoimpreso ó algún elemento semejante. De conformidad con la invención, eldispositivo comprende un bastidor metálico (2) que está montado en elcircuito impreso para rodear al componente electrónico (1), y una placametálica de enfriamiento (3) que se ajusta en el bastidor (2). El bastidortiene provisto a lo largo del mismo un borde que se encuentra distante altablero de circuito con medios resilientes de contacto (5) los cualescrean contacto eléctrico entre la placa (3) y el bastidor (2) y presionala placa de enfriamiento (3) contra el componente (1) para lograr unabuena transmisión térmica entre el componente y la placa de enfriamiento.
MX9404627A 1993-06-29 1994-06-17 Un dispositivo para blindaje y enfriamiento de componentes electronicos. MX9404627A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9302243A SE9302243L (sv) 1993-06-29 1993-06-29 Anordning för skärmning och kylning av elektronikkomponent

Publications (1)

Publication Number Publication Date
MX9404627A true MX9404627A (es) 1995-01-31

Family

ID=20390455

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9404627A MX9404627A (es) 1993-06-29 1994-06-17 Un dispositivo para blindaje y enfriamiento de componentes electronicos.

Country Status (6)

Country Link
EP (1) EP0632686B1 (es)
AU (1) AU677325B2 (es)
DE (1) DE69400397T2 (es)
ES (1) ES2093508T3 (es)
MX (1) MX9404627A (es)
SE (1) SE9302243L (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9404266U1 (de) * 1994-03-14 1994-05-19 Siemens Nixdorf Informationssysteme AG, 33106 Paderborn Kühl- und Abschirmvorrichtung für eine integrierte Schaltung
US5586005A (en) * 1995-03-16 1996-12-17 International Business Machines Corporation Removable heat sink assembly for a chip package
JPH0942883A (ja) * 1995-07-26 1997-02-14 Mitsubishi Alum Co Ltd 放熱フィンおよびその製造方法
JPH11354700A (ja) * 1998-06-09 1999-12-24 Minebea Co Ltd ヒートシンク
DE10013863A1 (de) * 2000-03-21 2001-10-04 Fujitsu Siemens Computers Gmbh Luftleithaube
DE10026353A1 (de) * 2000-05-27 2001-11-29 Mannesmann Vdo Ag Abgeschirmte, elektronische Schaltung
AU2002220163A1 (en) * 2000-11-15 2002-05-27 Laird Technologies, Inc. Electromagnetic shielding and cooling device for printed circuit board
TW591363B (en) * 2001-10-10 2004-06-11 Aavid Thermalloy Llc Heat collector with mounting plate
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7623360B2 (en) 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7463496B2 (en) 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
DE102006061215A1 (de) * 2006-08-12 2008-02-21 Diehl Ako Stiftung & Co. Kg Leistungselektronik mit Kühlkörper
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
EP2774465A4 (en) * 2011-10-31 2015-09-09 Thomson Licensing SHIELDING STRUCTURE FOR AN ELECTRONIC DEVICE
US11490548B2 (en) 2020-09-10 2022-11-01 Tecvox, Llc Stackable frame and shield

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758924A (en) * 1986-05-29 1988-07-19 Honeywell Bull Inc. Electronic equipment housing
DE3717009A1 (de) * 1987-05-21 1988-12-15 Philips Patentverwaltung Funkgeraet fuer eine mobilfunkanlage
EP0380740A2 (de) * 1989-02-03 1990-08-08 VDO Adolf Schindling AG Elektronischer Schaltkreis
EP0465692B1 (de) * 1990-07-09 1994-06-08 Siemens Aktiengesellschaft Schaltungsträger
US5237486A (en) * 1992-06-05 1993-08-17 Apple Computer, Inc. Structural frame for portable computer

Also Published As

Publication number Publication date
DE69400397D1 (de) 1996-09-26
EP0632686A1 (en) 1995-01-04
SE9302243D0 (sv) 1993-06-29
EP0632686B1 (en) 1996-08-21
ES2093508T3 (es) 1996-12-16
DE69400397T2 (de) 1997-03-20
AU677325B2 (en) 1997-04-17
SE9302243L (sv) 1994-12-30
AU6598294A (en) 1995-01-12

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Legal Events

Date Code Title Description
FG Grant or registration
MM Annulment or lapse due to non-payment of fees