BR112021020686A2 - Dispositivo eletrônico incluindo antena e estrutura de dissipação de calor - Google Patents

Dispositivo eletrônico incluindo antena e estrutura de dissipação de calor

Info

Publication number
BR112021020686A2
BR112021020686A2 BR112021020686A BR112021020686A BR112021020686A2 BR 112021020686 A2 BR112021020686 A2 BR 112021020686A2 BR 112021020686 A BR112021020686 A BR 112021020686A BR 112021020686 A BR112021020686 A BR 112021020686A BR 112021020686 A2 BR112021020686 A2 BR 112021020686A2
Authority
BR
Brazil
Prior art keywords
disposed
electronic device
antenna
pcb
heat dissipation
Prior art date
Application number
BR112021020686A
Other languages
English (en)
Inventor
Changwon Jang
Jongpill Lee
Seunghan Seo
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of BR112021020686A2 publication Critical patent/BR112021020686A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Thermal Sciences (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Telephone Function (AREA)
  • Transceivers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Support Of Aerials (AREA)

Abstract

dispositivo eletrônico incluindo antena e estrutura de dissipação de calor. dispositivo eletrônico inclui um alojamento incluindo uma porção condutora, um módulo de antena disposto em um espaço interno do alojamento e incluindo placa de circuito impresso (pcb) disposta no espaço interno, incluindo uma primeira superfície e uma segunda superfície faceando uma direção oposta à primeira superfície, pelo menos um elemento de antena disposto na primeira superfície da pcb ou próximo da primeira superfície na pcb, um circuito de comunicação sem fios disposto na segunda superfície e configurado para transmitir e/ou receber um sinal de rádio através de pelo menos um elemento de antena, um membro de proteção disposto na segunda superfície da pcb para cercar pelo menos parcialmente o circuito de comunicação sem fios, e uma camada de blindagem condutora disposta na camada protetora, e um membro condutor conectado com a porção condutora do alojamento e faceando a camada de blindagem condutora do módulo de antena pelo menos em parte.
BR112021020686A 2019-04-15 2020-04-13 Dispositivo eletrônico incluindo antena e estrutura de dissipação de calor BR112021020686A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190043503A KR20200121037A (ko) 2019-04-15 2019-04-15 안테나 및 방열 구조물을 포함하는 전자 장치
PCT/KR2020/004958 WO2020213900A1 (en) 2019-04-15 2020-04-13 Electronic device including antenna and heat dissipation structure

Publications (1)

Publication Number Publication Date
BR112021020686A2 true BR112021020686A2 (pt) 2021-12-14

Family

ID=72428232

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021020686A BR112021020686A2 (pt) 2019-04-15 2020-04-13 Dispositivo eletrônico incluindo antena e estrutura de dissipação de calor

Country Status (9)

Country Link
US (5) US11160161B2 (pt)
EP (2) EP4123825A1 (pt)
KR (1) KR20200121037A (pt)
CN (2) CN115458898A (pt)
AU (1) AU2020203508B2 (pt)
BR (1) BR112021020686A2 (pt)
ES (1) ES2927623T3 (pt)
WO (1) WO2020213900A1 (pt)
ZA (1) ZA202107822B (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102537318B1 (ko) * 2018-10-19 2023-05-26 삼성전자 주식회사 회로 기판 어셈블리 및 그것을 포함하는 전자 장치
KR20200121037A (ko) 2019-04-15 2020-10-23 삼성전자주식회사 안테나 및 방열 구조물을 포함하는 전자 장치
TWI713258B (zh) * 2019-05-14 2020-12-11 啓碁科技股份有限公司 訊號傳輸裝置
US11916277B2 (en) * 2020-06-25 2024-02-27 Getac Holdings Corporation Electronic device and antenna assembly
KR20220076083A (ko) * 2020-11-30 2022-06-08 삼성전자주식회사 노이즈 유도 구조를 포함하는 전자 장치
US11978950B2 (en) 2020-11-30 2024-05-07 Samsung Electronics Co., Ltd. Electronic device including noise inducing structure
KR20220126523A (ko) * 2021-03-09 2022-09-16 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
US20220327878A1 (en) * 2021-04-13 2022-10-13 Samsung Electronics Co., Ltd. Electronic device with keyless sensor
TWI787877B (zh) * 2021-06-22 2022-12-21 啟碁科技股份有限公司 散熱結構
WO2023018198A1 (ko) * 2021-08-10 2023-02-16 삼성전자 주식회사 안테나를 포함하는 전자 장치
KR20230047642A (ko) * 2021-10-01 2023-04-10 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115141A (en) 1980-02-14 1981-09-10 Matsushita Electric Works Ltd Automatic voltage changing type charger
JP2007116217A (ja) * 2005-10-18 2007-05-10 Hitachi Ltd ミリ波レーダ装置およびそれを用いたミリ波レーダシステム
JP5950549B2 (ja) 2011-03-30 2016-07-13 デクセリアルズ株式会社 アンテナ装置、通信装置
CN102427159A (zh) * 2011-08-12 2012-04-25 华为终端有限公司 无线终端及其天线架
JP6330149B2 (ja) * 2013-06-04 2018-05-30 パナソニックＩｐマネジメント株式会社 無線モジュール及び無線装置
KR102126564B1 (ko) * 2013-11-01 2020-06-24 삼성전자주식회사 안테나를 포함하는 디스플레이 모듈
US9620464B2 (en) * 2014-08-13 2017-04-11 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
EP3185361B1 (en) * 2014-10-20 2019-11-27 Murata Manufacturing Co., Ltd. Wireless communication module
JP6445355B2 (ja) * 2015-03-09 2018-12-26 デクセリアルズ株式会社 アンテナ装置、及び電子機器
JP6552919B2 (ja) * 2015-08-27 2019-07-31 Ｄｙｎａｂｏｏｋ株式会社 電子機器
US9966653B2 (en) * 2015-08-28 2018-05-08 Apple Inc. Antennas for electronic device with heat spreader
CN107105596A (zh) * 2016-02-23 2017-08-29 中兴通讯股份有限公司 散热组件
KR102483238B1 (ko) * 2016-08-01 2022-12-30 삼성전자 주식회사 방열 장치 및 이를 구비하는 전자 장치
KR20170010868A (ko) * 2017-01-18 2017-02-01 주식회사 아모센스 무선전력 수신모듈
KR101952870B1 (ko) 2017-01-23 2019-02-28 삼성전기주식회사 안테나 통합형 rf 모듈
US10396432B2 (en) 2017-01-23 2019-08-27 Samsung Electro-Mechanics Co., Ltd. Antenna-integrated radio frequency module
KR102598060B1 (ko) 2019-02-15 2023-11-09 삼성전자주식회사 이중 편파 안테나 및 그것을 포함하는 전자 장치
KR20200121037A (ko) 2019-04-15 2020-10-23 삼성전자주식회사 안테나 및 방열 구조물을 포함하는 전자 장치

Also Published As

Publication number Publication date
US20240064889A1 (en) 2024-02-22
ZA202107822B (en) 2024-02-28
AU2020203508A1 (en) 2020-10-29
CN112088525A (zh) 2020-12-15
AU2020203508B2 (en) 2021-04-01
US20200329550A1 (en) 2020-10-15
KR20200121037A (ko) 2020-10-23
EP3744077B1 (en) 2022-09-07
US20200329549A1 (en) 2020-10-15
EP3744077A4 (en) 2021-05-05
US11516903B2 (en) 2022-11-29
ES2927623T3 (es) 2022-11-08
US20230049711A1 (en) 2023-02-16
US11832381B2 (en) 2023-11-28
US10939539B2 (en) 2021-03-02
EP4123825A1 (en) 2023-01-25
US20210392735A1 (en) 2021-12-16
CN112088525B (zh) 2022-10-04
EP3744077A1 (en) 2020-12-02
CN115458898A (zh) 2022-12-09
WO2020213900A1 (en) 2020-10-22
US11160161B2 (en) 2021-10-26

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