ES2120743T3 - Una disposicion para blindar y/o refrigerar componentes electronicos montados sobre una placa de circuito impreso. - Google Patents

Una disposicion para blindar y/o refrigerar componentes electronicos montados sobre una placa de circuito impreso.

Info

Publication number
ES2120743T3
ES2120743T3 ES95916074T ES95916074T ES2120743T3 ES 2120743 T3 ES2120743 T3 ES 2120743T3 ES 95916074 T ES95916074 T ES 95916074T ES 95916074 T ES95916074 T ES 95916074T ES 2120743 T3 ES2120743 T3 ES 2120743T3
Authority
ES
Spain
Prior art keywords
component
circuit board
cooling
hood
armoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95916074T
Other languages
English (en)
Inventor
Bo Uno Egon Henningsson
Stig Artur Arvidsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of ES2120743T3 publication Critical patent/ES2120743T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/35—Box or housing mounted on substrate or PCB

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

LA PRESENTE INVENCION SE REFIERE A UN CONJUNTO PARA BLINDAJE Y/O ENFRIAMIENTO DE COMPONENTES ELECTRONICOS MONTADOS SOBRE UNA PLACA DE CIRCUITO. EL CONJUNTO INCLUYE UNA CAPOTA DE BLINDAJE GENERALMENTE PLANA QUE TIENE BORDES LATERALES QUE SE EXTIENDEN HACIA ABAJO Y ALREDEDOR DEL PERIMETRO DE LA CAPOTA, CUYA FINALIDAD ES RODEAR AL COMPONENTE, Y ELEMENTOS DE ENFRIAMIENTO, LOS CUALES TIENEN UN LADO INFERIOR GENERALMENTE PLANO Y ALETAS DE ENFRIAMIENTO DISPUESTAS SOBRE SU PARTE SUPERIOR. DE ACUERDO CON LA INVENCION, EL CONJUNTO TAMBIEN INCLUYE MEDIOS DE SUJECION (5) EN FORMA DE MEDIOS DE ENGANCHE (6) MONTADOS SOBRE LA SUPERFICIE DE LA PLACA DE CIRCUITO (2), Y MEDIOS DE SOPORTE (7) MONTADOS SOBRE LOS ELEMENTOS DE ENFRIAMIENTO (4) Y COACTUANDO CON LOS MEDIOS DE ENGANCHE, EN DONDE LOS MEDIOS DE SUJECION (7) SE PUEDEN ENGRANAR DE MODO ELASTICO O MEDIANTE RESORTE CON LOS MEDIOS DE ENGANCHE. LA CAPOTA DE BLINDAJE (3) ESTA ADAPTADA AL COMPONENTE (1) Y CUANDO EL COMPONENTE VA A SER BLINDADO, SE COLOCA SOBRE EL COMPONENTE. EL ELEMENTO DE ENFRIAMIENTO (4) ESTA TAMBIEN ADAPTADO AL COMPONENTE (1) Y CUANDO EL COMPONENTE VA A SER DESACTIVADO, SE COLOCA SOBRE EL COMPONENTE O CUANDO SEA APROPIADO SOBRE LA CAPOTA DE BLINDAJE (3) SOBRE EL COMPONENTE. LOS MEDIOS DE SUJECION (5) TIENEN COMO FINALIDAD PRESIONAR LOS ELEMENTOS DE ENFRIAMIENTO(4) ELASTICAMENTE CONTRA LA CAPOTA DE BLINDAJE (3) Y CONTRA EL COMPONENTE (1) RESPECTIVAMENTE.
ES95916074T 1994-04-11 1995-04-04 Una disposicion para blindar y/o refrigerar componentes electronicos montados sobre una placa de circuito impreso. Expired - Lifetime ES2120743T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9401203A SE9401203L (sv) 1994-04-11 1994-04-11 Skärm och kylare

Publications (1)

Publication Number Publication Date
ES2120743T3 true ES2120743T3 (es) 1998-11-01

Family

ID=20393597

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95916074T Expired - Lifetime ES2120743T3 (es) 1994-04-11 1995-04-04 Una disposicion para blindar y/o refrigerar componentes electronicos montados sobre una placa de circuito impreso.

Country Status (14)

Country Link
US (1) US5541811A (es)
EP (1) EP0755619B1 (es)
JP (1) JPH09511620A (es)
KR (1) KR970702688A (es)
CN (1) CN1146273A (es)
AU (1) AU683376B2 (es)
CA (1) CA2185987A1 (es)
DE (1) DE69503231T2 (es)
DK (1) DK0755619T3 (es)
ES (1) ES2120743T3 (es)
FI (1) FI964059A0 (es)
NO (1) NO964302L (es)
SE (1) SE9401203L (es)
WO (1) WO1995028073A1 (es)

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US5761041A (en) * 1996-06-25 1998-06-02 Sun Microsystems, Inc. Mechanical heat sink attachment
US5818695A (en) * 1997-02-25 1998-10-06 Apple Computer, Inc. Heat sink and spring clip assembly
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US6071128A (en) * 1998-04-28 2000-06-06 International Business Machines Corporation Integrated circuit socket with built in EMC grounding for a heat sink
JP3619670B2 (ja) * 1998-05-27 2005-02-09 アルプス電気株式会社 電子機器
US6043983A (en) * 1998-06-17 2000-03-28 Intel Corporation EMI containment for microprocessor core mounted on a card using surface mounted clips
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6583987B2 (en) * 1999-02-26 2003-06-24 Intel Corporation Electromagnetic interference and heatsinking
US6246584B1 (en) * 1999-04-16 2001-06-12 Hon Hai Precision Ind. Co., Ltd. Heat sink
US6208516B1 (en) * 1999-05-11 2001-03-27 Apple Computer, Inc. Electromagnetic interference shield and gap filler for a circuit board
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US6243265B1 (en) * 1999-10-06 2001-06-05 Intel Corporation Processor EMI shielding
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TW452119U (en) * 1999-12-14 2001-08-21 Foxconn Prec Components Co Ltd Heat dissipation device
DE10017925A1 (de) * 2000-04-11 2001-10-25 Infineon Technologies Ag Vorrichtung zum Befestigen einer Wärmeverteilungsabdeckung auf einer Leiterplatte
WO2002041679A2 (en) * 2000-11-15 2002-05-23 Laird Technologies, Inc. Electromagnetic shielding and cooling device for printed circuit board
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US6606246B2 (en) * 2001-09-21 2003-08-12 Intel Corporation Method and apparatus for retaining cooling apparatus and bus bar
US20030106670A1 (en) * 2001-12-10 2003-06-12 Lee Hsieh Kun Clip for heat sink
KR100891994B1 (ko) * 2002-06-20 2009-04-08 삼성전자주식회사 히트싱크 고정장치
US7245896B2 (en) * 2002-06-24 2007-07-17 Lg Electronics Inc. Apparatus for improving reception sensitivity of public wave receiver by reducing noise externally-emitted in the public wave receiver
US6723917B1 (en) * 2003-05-12 2004-04-20 Gainward Co., Ltd. Protective shield for against damaging circuit board and for safeguarding chip
JP4469563B2 (ja) * 2003-06-05 2010-05-26 株式会社ソニー・コンピュータエンタテインメント 電子機器、電磁波放射抑制部材
CN100463594C (zh) * 2005-06-18 2009-02-18 鸿富锦精密工业（深圳）有限公司 具有散热功能的电磁屏蔽装置
US7400507B2 (en) * 2005-10-19 2008-07-15 Inventec Corporation Fastening structure
US7327577B2 (en) 2005-11-03 2008-02-05 International Business Machines Corporation Method and apparatus for grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
TWI316748B (en) 2006-07-17 2009-11-01 Via Tech Inc Cooling module against esd and electronic package, assembly, and system using the same
US7436673B2 (en) * 2006-11-30 2008-10-14 Inventec Corporation Heat sink fixing assembly
US20080266806A1 (en) * 2007-04-27 2008-10-30 Lakin Eric D Electronic assembly that includes a heat sink which cools multiple electronic components
US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
CN201336790Y (zh) * 2008-12-05 2009-10-28 鸿富锦精密工业（深圳）有限公司 散热装置
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
CN101636070B (zh) * 2009-08-25 2013-01-02 华为终端有限公司 固定配合结构
US8213180B2 (en) * 2010-01-21 2012-07-03 Broadcom Corporation Electromagnetic interference shield with integrated heat sink
JP2012004165A (ja) * 2010-06-14 2012-01-05 Fujitsu Ltd 実装構造、配線基板組立体及び固定方法
EP2774465A4 (en) * 2011-10-31 2015-09-09 Thomson Licensing SHIELDING STRUCTURE FOR AN ELECTRONIC DEVICE
TWI492704B (zh) * 2012-01-06 2015-07-11 大同股份有限公司 電子組件
US20130340987A1 (en) * 2012-06-21 2013-12-26 Asia Vital Components Co., Ltd. Heat-dissipating base
US9048124B2 (en) * 2012-09-20 2015-06-02 Apple Inc. Heat sinking and electromagnetic shielding structures
CN202841813U (zh) * 2012-09-20 2013-03-27 中兴通讯股份有限公司 散热器固定装置
KR20150073992A (ko) * 2012-10-19 2015-07-01 톰슨 라이센싱 히트 싱크 부착 장치 및 방법
WO2016018544A1 (en) * 2014-07-30 2016-02-04 Thomson Licensing Heatsink push pin ground/attachment method
DE102015001148B4 (de) * 2015-01-30 2019-04-11 e.solutions GmbH Anordnung und Verfahren zur elektromagnetischen Abschirmung
EP3348124B1 (en) 2015-10-16 2021-05-26 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (emi) absorbers positioned or positionable between board level shields and heat sinks
CN106304733A (zh) * 2016-10-28 2017-01-04 维沃移动通信有限公司 电子元器件的保护结构及移动终端
KR102482837B1 (ko) * 2017-11-10 2022-12-29 삼성전자주식회사 방열 구조를 포함하는 전자 장치
EP4097760A1 (en) * 2020-03-04 2022-12-07 Transport Phenomena Technologies, LLC Compliant thermal management devices, systems, and methods of fabrication thereof
JP2021174847A (ja) * 2020-04-23 2021-11-01 株式会社デンソー 電子機器

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Also Published As

Publication number Publication date
NO964302D0 (no) 1996-10-10
DK0755619T3 (da) 1999-04-12
AU683376B2 (en) 1997-11-06
CA2185987A1 (en) 1995-10-19
JPH09511620A (ja) 1997-11-18
EP0755619B1 (en) 1998-07-01
FI964059A (fi) 1996-10-10
NO964302L (no) 1996-11-05
KR970702688A (ko) 1997-05-13
WO1995028073A1 (en) 1995-10-19
SE9401203L (sv) 1995-10-12
US5541811A (en) 1996-07-30
SE9401203D0 (sv) 1994-04-11
EP0755619A1 (en) 1997-01-29
DE69503231T2 (de) 1998-12-24
DE69503231D1 (de) 1998-08-06
AU2270195A (en) 1995-10-30
FI964059A0 (fi) 1996-10-10
CN1146273A (zh) 1997-03-26

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