WO2004047510A2 - A method of supporting electronic components and an electronic device with elastic support for an electronic component - Google Patents

A method of supporting electronic components and an electronic device with elastic support for an electronic component Download PDF

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Publication number
WO2004047510A2
WO2004047510A2 PCT/EP2003/011458 EP0311458W WO2004047510A2 WO 2004047510 A2 WO2004047510 A2 WO 2004047510A2 EP 0311458 W EP0311458 W EP 0311458W WO 2004047510 A2 WO2004047510 A2 WO 2004047510A2
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
shock
absorbing material
elastically compressible
electronic device
Prior art date
Application number
PCT/EP2003/011458
Other languages
French (fr)
Other versions
WO2004047510A3 (en
Inventor
Per Holmberg
Original Assignee
Sony Ericsson Mobile Communications Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP02388071A external-priority patent/EP1422985B1/en
Application filed by Sony Ericsson Mobile Communications Ab filed Critical Sony Ericsson Mobile Communications Ab
Priority to CN2003801035474A priority Critical patent/CN101189928B/en
Priority to BR0316301-6A priority patent/BR0316301A/en
Priority to MXPA05005356A priority patent/MXPA05005356A/en
Priority to JP2004552476A priority patent/JP4713154B2/en
Priority to AU2003294695A priority patent/AU2003294695A1/en
Publication of WO2004047510A2 publication Critical patent/WO2004047510A2/en
Publication of WO2004047510A3 publication Critical patent/WO2004047510A3/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Definitions

  • a method of supporting electronic components and an electronic device with elastic support for an electronic component is provided.
  • the invention relates to a method of providing support for an electronic component in an electronic device comprising a PCB (printed circuit board) and a structural element covering at least a part of the PCB.
  • the invention also relates to such an electronic device.
  • the cracks occur because the PCB is more flexible than the electronic component. Therefore, when an external force is applied to the electronic device it often causes a small bending of the PCB which in turn stresses the solder joints between the PCB and the electronic component.
  • the problem of crack formation occurs especially in connection with so-called Chip Scale Components and in particular of the BGA-type (Ball Grid Array) that are soldered to the PCB via a plurality of ball-shaped soldering points provided at the underside of the component.
  • the object of the invention is achieved by providing the support for the electronic components using the following steps:
  • an electronic device as mentioned in the opening paragraph in which an elastically compressible and shock-absorbing material is provided between the structural element and the electronic component in such manner that the elastically compressible and shock- absorbing material provides a pressure on the electronic component towards the PCB.
  • the electronic component is fully supported by the elastically compressible and shock-absorbing material that exerts a pressure on the electronic component towards the PCB.
  • any external force applied to the electronic device such as a key press, will to some degree be absorbed by the elastically compressible and shock-absorbing material which entails less stress on the solder joints between the electronic component and the PCB.
  • the use of an elastically compressible and shock-absorbing material in accordance with the invention has reduced the formation of solder joint cracks considerably in connection with chip scale components, both if a high force is applied to the keys of the electronic device or when keys are stroked repeatedly which generally causes fatigue failure to occur.
  • the elastically compressible and shock-absorbing material is silicone. This material is often used to create gaskets on frames or other structural parts in the electronic device and it may therefore be applied to other areas of the frames or structural parts without any significant extra cost.
  • thermoplastic elastomers that can also be applied to the structural element at low cost.
  • the elastically compressible and shock-absorbing material may be electrically conductive, whereby it is possible to let the elastically compressible and shock-absorbing material be a functional part of the electronic device.
  • the structural element is an electromagnetic shield can, and the same elastically compressible and shock-absorbing material is applied to an outer edge of the shield can in the same production step as the step in which it is applied to the shield can at an area thereof that is adapted to cover the component.
  • the electronic device is a mobile radio station, such as a mobile telephone.
  • Fig. 1 shows a partially disassembled mobile telephone provided with a PCB and an internal frame provided with means for supporting some of the electronic components on the PCB;
  • Fig. 2 shows stepwise a method according to the invention of how to provide support for an electronic component on a PCB.
  • Fig. 1 shows a partially disassembled mobile telephone 1 comprising a front cover 2, a back cover 3, a PCB 4 located in the front cover 1 , an internal frame 5 and a battery 6.
  • the PCB 4 is provided with a number of electronic components, some of which are chip scale components 7,7', e.g. of the so-called BGA type (Ball Grid Array). These types of electronic components are highly exposed to crack formation in the solder joints between the component and the PCB 4 when external forces are applied to the keys of the mobile telephone 1.
  • BGA Bit Grid Array
  • the internal frame 5 may be shaped as a shield can that shields the electronic components on the PCB against electromagnetic radiation, or it may be shaped as a structural part of the mobile telephone 1.
  • the internal frame 5 is structured in such manner that it has areas that are adapted to cover the chip scale components 7,7', and according to the invention these areas are provided with a layer of an elastically compressible and shock- absorbing material 8,8' intended to provide a back pressure on the chip scale components 7,7' when the internal frame 5 is mounted on the PCB 4.
  • the internal frame 5 may be connected to the PCB 4 by any conventional method, such as by means of screws, soldering, gluing, etc.
  • the internal frame 5 may also be indirectly connected to the PCB 4 by being firmly connected to the front cover 2 or to the back cover 6.
  • Fig. 2 shows stepwise a method according to the invention of how to provide support for a chip scale component 17 of the BGA type on a PCB 14 by means of metallic shield can 15. The method initially follows two parallel paths: a component mounting path
  • the chip scale component 17 provided with a ball grid array 19 is mounted on the PCB by any known procedure, such as a surface mounting process.
  • the chip scale component 17 is positioned on the PCB 14, preferably by means of a pick-and-place machine, and the PCB 14 is heated to provide soldering joints between the chip scale component 17 and the PCB 14 at each solder ball in the ball grid array 19.
  • Other electronic components may of course be positioned on the PCB 14, which for clarity reasons are not shown.
  • the shield can 15 which is shaped as a flat, open metal box, is provided with an elastically compressible and shock- absorbing material, which in the preferred embodiment is an electrical conductive silicone material 18,18', at the outer edge or rim 21 and at the area 22 that is adapted to cover the chip scale component 17 when the shield can 15 is assembled with the PCB 14.
  • an elastically compressible and shock- absorbing material which in the preferred embodiment is an electrical conductive silicone material 18,18', at the outer edge or rim 21 and at the area 22 that is adapted to cover the chip scale component 17 when the shield can 15 is assembled with the PCB 14.
  • the electrical conductive silicone material 18,18' is applied in a layer that, at the rim 21 of the shield can 15, ensures that there is full contact between the shield can rim 21 and the PCB 14, and in a layer at the area that is adapted to cover the chip scale component 17 that is sufficient to ensure that a back pressure is provided on the chip scale component 17 by the electrical conductive silicone material 18 when the shield can 15 is inverted and assembled with the PCB 14 as shown in the last drawing in Fig. 2.
  • the elastically compressible and shock-absorbing material can be chosen from among a number of materials that have suitable elastic properties.
  • the material is a silicone material which could be electrical conductive as described in the example above with reference to Fig. 2, or it could be normal silicone applied in a double-moulding process.
  • Other suitable materials could be thermoplastics elastomers or any other kind of rubber or rubber-like material.
  • the elastically compressible and shock-absorbing material may be applied to the structural element by any convenient method depending on the material that is used. A person skilled in the art can easily select an appropriate application method once the material to be applied is chosen.
  • the structural element to which the elastically compressible and shock- absorbing material is applied may be any structural or functional part of an electronic device.
  • the element may be an internal frame of the electronic device or a shield can protecting electronic components against electromagnetic radiation.
  • the element could also be the outer casing or cover of the electronic device.
  • the element may of course be made of any suitable material, such as metal or plastics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A method of providing support for an electronic component (17) in an electronic device comprising a PCB (printed circuit board) (14) and a structural element (15) covering at least a part of the PCB (14). The method comprises the steps of mounting the electronic component (17) on the PCB (14), applying an elastically compressible and shock-absorbing material (18) to the structural element (15) at an area (22) thereof that is adapted to cover the component (17), and assembling the PCB (14) and the structural element (15) in such manner that the elastically compressible and shock-absorbing material (18) exerts a pressure on the electronic component (17) towards the PCB (14). An electronic device comprising an elastically compressible and shock-absorbing material between the structural element and the PCB is also disclosed.

Description

Title
A method of supporting electronic components and an electronic device with elastic support for an electronic component.
Technical area
The invention relates to a method of providing support for an electronic component in an electronic device comprising a PCB (printed circuit board) and a structural element covering at least a part of the PCB. The invention also relates to such an electronic device.
Related prior art
Electronic components that are mounted on a PCB (printed circuit board) by soldering suffer from the general problem that cracks may occur in the solder joints due to dynamic forces applied to the electronic device provided with the PCB. The cracks influence the proper functioning of the electronic device since the electrical contact between the electronic component and the PCB is disrupted. The cracks typically occur when the electronic device is dropped, when a high force is applied to the keys of the electronic device or when keys are stroked repeatedly causing fatigue failure to occur.
The cracks occur because the PCB is more flexible than the electronic component. Therefore, when an external force is applied to the electronic device it often causes a small bending of the PCB which in turn stresses the solder joints between the PCB and the electronic component. The problem of crack formation occurs especially in connection with so-called Chip Scale Components and in particular of the BGA-type (Ball Grid Array) that are soldered to the PCB via a plurality of ball-shaped soldering points provided at the underside of the component.
Apart from formation of cracks in the solder joints as such, bending of the PCB may also cause formation of cracks in the electronic component itself, which also leads to malfunctioning of the electronic component and thereby of the electronic device.
Different techniques have been used to avoid crack formation in the soldering joints. One is the so-called "underfill" solution in which an epoxy- type glue is provided around the soldering joints between the PCB and the electronic component. This solution solves the problem in most cases even though situations with crack formation have still occurred. Some of the disadvantages of the underfill solution are that it is rather expensive, the PCB cannot be repaired afterwards and the use of an epoxy material is environmentally undesirable.
Another known technique used for minimising the formation of cracks in the solder joints is the so-called "overfill" solution in which an amount of hot-melt glue is positioned between the electronic component and a structural element such as a shield can or a frame that covers the electronic components. The aim of this solution is to create a rigid structure consisting of the PCB, the electronic component and structural element. This rigid structure makes the PCB less susceptible to bending when an external force is applied to the electronic device. Some disadvantages of this solution are, however, that either the hot-melt glue interconnects the structural element and the electronic component which entails that later repair is difficult, or that a small gap exists between the electronic component and the hot-melt glue which means that the component is not fully supported by the hardened hot- melt glue.
Object of the invention
Due to the disadvantages of the underfill and overfill solutions described above it is an object of the present invention to provide a new and improved method of providing support for an electronic component in an electronic device comprising a PCB and structural part, such as a shield can or a frame covering the PCB. The method should result in a product in which the problems described above are overcome and should provide full support for the electronic component on the PCB. It is also an object of the invention to provide an electronic device in which full support of the electronic component is ensured.
Summary of the invention
The object of the invention is achieved by providing the support for the electronic components using the following steps:
- mounting the electronic component on the PCB; - applying an elastically compressible and shock-absorbing material to the structural element at an area thereof that is adapted to cover the component;
- assembling the PCB and the structural element in such manner that the elastically compressible and shock-absorbing material exerts a pressure on the electronic component towards the PCB.
The object is also achieved by an electronic device as mentioned in the opening paragraph in which an elastically compressible and shock-absorbing material is provided between the structural element and the electronic component in such manner that the elastically compressible and shock- absorbing material provides a pressure on the electronic component towards the PCB.
By the method and electronic device according to the invention are obtained that the electronic component is fully supported by the elastically compressible and shock-absorbing material that exerts a pressure on the electronic component towards the PCB. This means that any external force applied to the electronic device, such as a key press, will to some degree be absorbed by the elastically compressible and shock-absorbing material which entails less stress on the solder joints between the electronic component and the PCB. It has been observed that the use of an elastically compressible and shock-absorbing material in accordance with the invention has reduced the formation of solder joint cracks considerably in connection with chip scale components, both if a high force is applied to the keys of the electronic device or when keys are stroked repeatedly which generally causes fatigue failure to occur. In a preferred embodiment the elastically compressible and shock-absorbing material is silicone. This material is often used to create gaskets on frames or other structural parts in the electronic device and it may therefore be applied to other areas of the frames or structural parts without any significant extra cost.
Other suitable materials comprise thermoplastic elastomers that can also be applied to the structural element at low cost.
The elastically compressible and shock-absorbing material may be electrically conductive, whereby it is possible to let the elastically compressible and shock-absorbing material be a functional part of the electronic device.
This is especially suitable if the structural element is an electromagnetic shield can, and the same elastically compressible and shock-absorbing material is applied to an outer edge of the shield can in the same production step as the step in which it is applied to the shield can at an area thereof that is adapted to cover the component. This reduces the manufacturing costs in comparison with a method in which two different materials are employed as the rim supporting material and the electronic component supporting material.
In a preferred embodiment the electronic device is a mobile radio station, such as a mobile telephone.
It shall be emphasised that the term "comprise/comprising" when used in this specification is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps components or groups thereof.
Description of the drawings The invention will be described in detail in the following with reference to the drawings in which
Fig. 1 shows a partially disassembled mobile telephone provided with a PCB and an internal frame provided with means for supporting some of the electronic components on the PCB; and
Fig. 2 shows stepwise a method according to the invention of how to provide support for an electronic component on a PCB.
Detailed description of an embodiment of the invention
Fig. 1 shows a partially disassembled mobile telephone 1 comprising a front cover 2, a back cover 3, a PCB 4 located in the front cover 1 , an internal frame 5 and a battery 6.
The PCB 4 is provided with a number of electronic components, some of which are chip scale components 7,7', e.g. of the so-called BGA type (Ball Grid Array). These types of electronic components are highly exposed to crack formation in the solder joints between the component and the PCB 4 when external forces are applied to the keys of the mobile telephone 1.
The internal frame 5 may be shaped as a shield can that shields the electronic components on the PCB against electromagnetic radiation, or it may be shaped as a structural part of the mobile telephone 1. The internal frame 5 is structured in such manner that it has areas that are adapted to cover the chip scale components 7,7', and according to the invention these areas are provided with a layer of an elastically compressible and shock- absorbing material 8,8' intended to provide a back pressure on the chip scale components 7,7' when the internal frame 5 is mounted on the PCB 4. The internal frame 5 may be connected to the PCB 4 by any conventional method, such as by means of screws, soldering, gluing, etc. The internal frame 5 may also be indirectly connected to the PCB 4 by being firmly connected to the front cover 2 or to the back cover 6. Fig. 2 shows stepwise a method according to the invention of how to provide support for a chip scale component 17 of the BGA type on a PCB 14 by means of metallic shield can 15. The method initially follows two parallel paths: a component mounting path and a shield can preparing path.
In the component mounting path the chip scale component 17 provided with a ball grid array 19 is mounted on the PCB by any known procedure, such as a surface mounting process. In this process the chip scale component 17 is positioned on the PCB 14, preferably by means of a pick-and-place machine, and the PCB 14 is heated to provide soldering joints between the chip scale component 17 and the PCB 14 at each solder ball in the ball grid array 19. Other electronic components may of course be positioned on the PCB 14, which for clarity reasons are not shown.
In the shield can preparing path the shield can 15, which is shaped as a flat, open metal box, is provided with an elastically compressible and shock- absorbing material, which in the preferred embodiment is an electrical conductive silicone material 18,18', at the outer edge or rim 21 and at the area 22 that is adapted to cover the chip scale component 17 when the shield can 15 is assembled with the PCB 14. The electrical conductive silicone material 18,18' is applied in a layer that, at the rim 21 of the shield can 15, ensures that there is full contact between the shield can rim 21 and the PCB 14, and in a layer at the area that is adapted to cover the chip scale component 17 that is sufficient to ensure that a back pressure is provided on the chip scale component 17 by the electrical conductive silicone material 18 when the shield can 15 is inverted and assembled with the PCB 14 as shown in the last drawing in Fig. 2.
The elastically compressible and shock-absorbing material can be chosen from among a number of materials that have suitable elastic properties. Preferably, the material is a silicone material which could be electrical conductive as described in the example above with reference to Fig. 2, or it could be normal silicone applied in a double-moulding process. Other suitable materials could be thermoplastics elastomers or any other kind of rubber or rubber-like material. The elastically compressible and shock-absorbing material may be applied to the structural element by any convenient method depending on the material that is used. A person skilled in the art can easily select an appropriate application method once the material to be applied is chosen.
The structural element to which the elastically compressible and shock- absorbing material is applied may be any structural or functional part of an electronic device. As described above with reference to Figs 1 and 2 the element may be an internal frame of the electronic device or a shield can protecting electronic components against electromagnetic radiation. The element could also be the outer casing or cover of the electronic device. The element may of course be made of any suitable material, such as metal or plastics.

Claims

Claims
1. A method of providing support for an electronic component (7,7';17) in an electronic device comprising a PCB (printed circuit board) (4; 14) and a structural element (5; 15) covering at least a part of the PCB (4; 14), said method comprising the steps of:
- mounting the electronic component (7, 7'; 17) on the PCB (4; 14);
- applying an elastically compressible and shock-absorbing material (8, 8'; 18) to the structural element (5; 15) at an area (22) thereof that is adapted to cover the component (7,7'; 17);
- assembling the PCB (4;14) and the structural element (5;15) in such manner that the elastically compressible and shock-absorbing material (8,8'; 18) exerts a pressure on the electronic component (7,7';17) towards the PCB (4;14).
2. A method according to claim 1 , characterised in that the elastically compressible and shock-absorbing material (8,8'; 18) is silicone.
3. A method according to claim 1 , characterised in that the elastically compressible and shock-absorbing material (8,8';18) is a thermoplastic elastomer.
4. A method according to any one of claims 1-3, characterised in that the elastically compressible and shock-absorbing material (8,8'; 18) is electrically conductive.
5. A method according to claim 4, characterised in that the structural element is an electromagnetic shield can (15); and that the same elastically compressible and shock-absorbing material (18,18') is applied to an outer edge (21 ) of the shield can (15) in the same production step as the step in which it is applied to the shield can (15) at an area (22) thereof that is adapted to cover the component (17).
6. An electronic device comprising a PCB (printed circuit board) (4; 14) and a structural element (5; 15) that covers at least an area of the PCB (4; 14) that is provided with an electronic component (7,7';17), characterised in that an elastically compressible and shock-absorbing material (8,8';18) is provided between the structural element (5;15) and the electronic component (7,7';17) in such manner that the elastically compressible and shock-absorbing material (8,8';18) provides a pressure on the electronic component (7,7';17) towards the PCB (4; 14).
7. An electronic device according to claim 6, characterised in that the elastically compressible and shock-absorbing material (8,8';18) is silicone.
8. An electronic device according to claim 6, characterised in that the elastically compressible and shock-absorbing material (8,8';18) is a thermoplastic elastomer.
9. An electronic device according to any one of claims 6-8, characterised in that the elastically compressible and shock-absorbing material (8,8';18) is electrically conductive.
10. An electronic device according to claim 9, characterised in that the structural element is an electromagnetic shield can (15); and that the same elastically compressible and shock-absorbing material (18,18') is applied to an outer edge (21 ) of the shield can (15) as well as to the shield can (15) at an area (22) thereof that covers the electronic component (17).
11. An electronic device according to any one of claims 6-10, characterised in that the electronic device is a mobile radio station, such as a mobile telephone (1 ).
PCT/EP2003/011458 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component WO2004047510A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2003801035474A CN101189928B (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component
BR0316301-6A BR0316301A (en) 2002-11-19 2003-10-14 Method for providing support for an electronic component in an electronic device, and, electronic device
MXPA05005356A MXPA05005356A (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component.
JP2004552476A JP4713154B2 (en) 2002-11-19 2003-10-14 Method for elastically supporting electronic components
AU2003294695A AU2003294695A1 (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP02388071.9 2002-11-19
EP02388071A EP1422985B1 (en) 2002-11-19 2002-11-19 A method of supporting electronic components and an electronic device with elestic support for an electronic component
US42837502P 2002-11-22 2002-11-22
US60/428,375 2002-11-22

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WO2004047510A2 true WO2004047510A2 (en) 2004-06-03
WO2004047510A3 WO2004047510A3 (en) 2007-12-21

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KR (1) KR20050085013A (en)
AU (1) AU2003294695A1 (en)
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MX (1) MXPA05005356A (en)
RU (1) RU2328841C2 (en)
WO (1) WO2004047510A2 (en)

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US20170325365A1 (en) 2016-05-04 2017-11-09 Samsung Electronics Co., Ltd. Hollow shielding structure for different types of circuit elements and manufacturing method thereof
US10201072B2 (en) 2016-12-12 2019-02-05 Samsung Electronics Co., Ltd. EMI shielding structure and manufacturing method thereof
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
US10531599B2 (en) 2017-09-08 2020-01-07 Samsung Electronics Co., Ltd. Electromagnetic interference shielding structure
US10566293B2 (en) 2015-03-06 2020-02-18 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
US10933505B2 (en) 2016-03-29 2021-03-02 Atlas Copco Airpower, Naamloze Vennootschap Arrangement to enclose a circuit board
CN114900950A (en) * 2022-05-25 2022-08-12 广东江粉高科技产业园有限公司 Bending crack resistant flexible circuit board and design method

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WO2016125947A1 (en) * 2015-02-06 2016-08-11 엘지전자 주식회사 Mobile terminal
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US10566293B2 (en) 2015-03-06 2020-02-18 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
US10933505B2 (en) 2016-03-29 2021-03-02 Atlas Copco Airpower, Naamloze Vennootschap Arrangement to enclose a circuit board
US20170325365A1 (en) 2016-05-04 2017-11-09 Samsung Electronics Co., Ltd. Hollow shielding structure for different types of circuit elements and manufacturing method thereof
US10477737B2 (en) 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US11445645B2 (en) 2016-05-04 2022-09-13 Samsung Electronics Co., Ltd. Hollow shielding structure for different types of circuit elements and manufacturing method thereof
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
US10201072B2 (en) 2016-12-12 2019-02-05 Samsung Electronics Co., Ltd. EMI shielding structure and manufacturing method thereof
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
US10531599B2 (en) 2017-09-08 2020-01-07 Samsung Electronics Co., Ltd. Electromagnetic interference shielding structure
CN114900950A (en) * 2022-05-25 2022-08-12 广东江粉高科技产业园有限公司 Bending crack resistant flexible circuit board and design method

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JP2011124598A (en) 2011-06-23
BR0316301A (en) 2005-09-27
JP5404667B2 (en) 2014-02-05
RU2328841C2 (en) 2008-07-10
WO2004047510A3 (en) 2007-12-21
AU2003294695A8 (en) 2004-06-15
RU2005119195A (en) 2006-01-20
MXPA05005356A (en) 2005-08-26
KR20050085013A (en) 2005-08-29
AU2003294695A1 (en) 2004-06-15

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