SE0403008L - Lodpastastencil och förfarande för att tillverka densamma - Google Patents
Lodpastastencil och förfarande för att tillverka densammaInfo
- Publication number
- SE0403008L SE0403008L SE0403008A SE0403008A SE0403008L SE 0403008 L SE0403008 L SE 0403008L SE 0403008 A SE0403008 A SE 0403008A SE 0403008 A SE0403008 A SE 0403008A SE 0403008 L SE0403008 L SE 0403008L
- Authority
- SE
- Sweden
- Prior art keywords
- stencil
- solder paste
- manufacturing
- same
- paste stencil
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H05K3/3484—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Textile Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0403008A SE527993C2 (sv) | 2004-12-10 | 2004-12-10 | Lodpastastencil och förfarande för att tillverka densamma |
PL05803699T PL1820380T3 (pl) | 2004-12-10 | 2005-11-18 | Szablon do pasty lutowniczej i sposób jego wytwarzania |
EP05803699A EP1820380B1 (en) | 2004-12-10 | 2005-11-18 | Solder paste stencil and method for producing the same |
DK05803699.7T DK1820380T3 (da) | 2004-12-10 | 2005-11-18 | Loddepasta-skabelon og fremgangsmåde til fremstilling af heraf |
PCT/SE2005/001740 WO2006062457A1 (en) | 2004-12-10 | 2005-11-18 | Solder paste stencil and method for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0403008A SE527993C2 (sv) | 2004-12-10 | 2004-12-10 | Lodpastastencil och förfarande för att tillverka densamma |
Publications (3)
Publication Number | Publication Date |
---|---|
SE0403008D0 SE0403008D0 (sv) | 2004-12-10 |
SE0403008L true SE0403008L (sv) | 2006-06-11 |
SE527993C2 SE527993C2 (sv) | 2006-08-01 |
Family
ID=33550630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0403008A SE527993C2 (sv) | 2004-12-10 | 2004-12-10 | Lodpastastencil och förfarande för att tillverka densamma |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1820380B1 (sv) |
DK (1) | DK1820380T3 (sv) |
PL (1) | PL1820380T3 (sv) |
SE (1) | SE527993C2 (sv) |
WO (1) | WO2006062457A1 (sv) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202008012829U1 (de) * | 2008-09-26 | 2008-12-04 | Nb Technologies Gmbh | Siebdruckform |
CN102712193B (zh) | 2009-09-21 | 2016-06-01 | Dtg国际有限公司 | 印刷丝网及其制造方法 |
LT5825B (lt) | 2010-09-06 | 2012-04-25 | Uab "Laser Stencil Europe", , | Trafaretas litavimo pastos arba klijų užnešimui |
CN103204013B (zh) * | 2012-01-16 | 2016-12-14 | 昆山允升吉光电科技有限公司 | 一种带有图形开口的印刷用三维立体掩模板 |
MX2018002858A (es) | 2018-03-07 | 2019-09-09 | Interlatin S De R L De C V | Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación. |
US11576266B2 (en) * | 2020-09-03 | 2023-02-07 | International Business Machines Corporation | Multilayer screen printing stencil |
DE102021123943A1 (de) * | 2021-09-16 | 2023-03-16 | Miele & Cie. Kg | Aufnahmevorrichtung zum Aufnehmen mindestens eines Schlauchs für ein Reinigungsgerät und Reinigungsgerät |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5359928A (en) * | 1992-03-12 | 1994-11-01 | Amtx, Inc. | Method for preparing and using a screen printing stencil having raised edges |
US5661086A (en) * | 1995-03-28 | 1997-08-26 | Mitsui High-Tec, Inc. | Process for manufacturing a plurality of strip lead frame semiconductor devices |
KR100301384B1 (ko) * | 1995-08-30 | 2001-10-29 | 모리시타 요이찌 | 스크린인쇄방법및스크린인쇄장치 |
US5806753A (en) * | 1995-12-22 | 1998-09-15 | International Business Machines Corporation | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier |
US6592943B2 (en) * | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6988652B2 (en) * | 2002-05-17 | 2006-01-24 | Fry's Metals, Inc. | Solder printing using a stencil having a reverse-tapered aperture |
US6878633B2 (en) * | 2002-12-23 | 2005-04-12 | Freescale Semiconductor, Inc. | Flip-chip structure and method for high quality inductors and transformers |
-
2004
- 2004-12-10 SE SE0403008A patent/SE527993C2/sv not_active IP Right Cessation
-
2005
- 2005-11-18 WO PCT/SE2005/001740 patent/WO2006062457A1/en active Application Filing
- 2005-11-18 DK DK05803699.7T patent/DK1820380T3/da active
- 2005-11-18 PL PL05803699T patent/PL1820380T3/pl unknown
- 2005-11-18 EP EP05803699A patent/EP1820380B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP1820380A1 (en) | 2007-08-22 |
EP1820380A4 (en) | 2011-06-15 |
DK1820380T3 (da) | 2013-05-06 |
WO2006062457A1 (en) | 2006-06-15 |
PL1820380T3 (pl) | 2013-06-28 |
EP1820380B1 (en) | 2013-02-13 |
SE527993C2 (sv) | 2006-08-01 |
SE0403008D0 (sv) | 2004-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |