MX2018002858A - Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación. - Google Patents

Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación.

Info

Publication number
MX2018002858A
MX2018002858A MX2018002858A MX2018002858A MX2018002858A MX 2018002858 A MX2018002858 A MX 2018002858A MX 2018002858 A MX2018002858 A MX 2018002858A MX 2018002858 A MX2018002858 A MX 2018002858A MX 2018002858 A MX2018002858 A MX 2018002858A
Authority
MX
Mexico
Prior art keywords
template
treated
paste
perforations
area
Prior art date
Application number
MX2018002858A
Other languages
English (en)
Inventor
Villalvazo Jimmy
Librado Castro Leyva Néstor
Original Assignee
Interlatin S De R L De C V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interlatin S De R L De C V filed Critical Interlatin S De R L De C V
Priority to MX2018002858A priority Critical patent/MX2018002858A/es
Priority to PCT/MX2019/000024 priority patent/WO2019172742A1/es
Priority to US16/639,743 priority patent/US11297719B2/en
Priority to CA3084321A priority patent/CA3084321A1/en
Publication of MX2018002858A publication Critical patent/MX2018002858A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/242—Backing sheets; Top sheets; Intercalated sheets, e.g. cushion sheets; Release layers or coatings; Means to obtain a contrasting image, e.g. with a carbon sheet or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Una plantilla o esténcil con perforaciones que mejora el estarcido de soldadura en pasta en un objeto, la cual tiene: una primera área tratada (5) con un polvo de precisión, en su cara laminar inferior (3), donde dicha área tratada (5) cubre al menos, el área donde se distribuyen las perforaciones (4); una segunda área tratada (6) con un polvo de precisión, en su cara laminar superior (2), donde dicha área tratada (6) circunda solamente a las perforaciones (4); y una tercera área tratada dos veces (8) con un polvo de precisión, en su cara laminar inferior (3), donde dicha área tratada (8) circunda solamente a las perforaciones (4) de la plantilla (1). Un método para la fabricación de la plantilla que mejora el estarcido de soldadura en pasta en un objeto; y un método para la aplicación mejorada de soldadura en pasta en un objeto, como una placa de circuito impreso.
MX2018002858A 2018-03-07 2018-03-07 Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación. MX2018002858A (es)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MX2018002858A MX2018002858A (es) 2018-03-07 2018-03-07 Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación.
PCT/MX2019/000024 WO2019172742A1 (es) 2018-03-07 2019-03-06 Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación
US16/639,743 US11297719B2 (en) 2018-03-07 2019-03-06 Template that improves solder-paste stenciling and production method thereof
CA3084321A CA3084321A1 (en) 2018-03-07 2019-03-06 Template that improves solder-paste stencilling and production method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MX2018002858A MX2018002858A (es) 2018-03-07 2018-03-07 Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación.

Publications (1)

Publication Number Publication Date
MX2018002858A true MX2018002858A (es) 2019-09-09

Family

ID=67847283

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018002858A MX2018002858A (es) 2018-03-07 2018-03-07 Plantilla que mejora el estarcido de soldadura en pasta, y su método de fabricación.

Country Status (4)

Country Link
US (1) US11297719B2 (es)
CA (1) CA3084321A1 (es)
MX (1) MX2018002858A (es)
WO (1) WO2019172742A1 (es)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9319070D0 (en) * 1993-09-15 1993-11-03 Ncr Int Inc Stencil having improved wear-resistance and quality consistency and method of manufacturing the same
SE527993C2 (sv) * 2004-12-10 2006-08-01 Hp Etch Ab Lodpastastencil och förfarande för att tillverka densamma
JP2007023160A (ja) * 2005-07-15 2007-02-01 Three M Innovative Properties Co コーティング剤及びメタルマスク
DE102005045350B4 (de) * 2005-09-22 2009-07-16 Siemens Ag Druckschablone eines SMT-Prozesses
CN103223768B (zh) * 2012-01-31 2015-01-14 彰绅精密工业股份有限公司 一次印刷形成不同膜厚的金属印刷模板

Also Published As

Publication number Publication date
WO2019172742A1 (es) 2019-09-12
US20200396844A1 (en) 2020-12-17
US11297719B2 (en) 2022-04-05
CA3084321A1 (en) 2019-09-12

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