MX2019003797A - Metodo y aparato para la fabricacion de un componente electronico, y dicho componente electronico. - Google Patents

Metodo y aparato para la fabricacion de un componente electronico, y dicho componente electronico.

Info

Publication number
MX2019003797A
MX2019003797A MX2019003797A MX2019003797A MX2019003797A MX 2019003797 A MX2019003797 A MX 2019003797A MX 2019003797 A MX2019003797 A MX 2019003797A MX 2019003797 A MX2019003797 A MX 2019003797A MX 2019003797 A MX2019003797 A MX 2019003797A
Authority
MX
Mexico
Prior art keywords
electronic component
conductive paste
paste layer
manufacturing
end section
Prior art date
Application number
MX2019003797A
Other languages
English (en)
Inventor
Sato Eiji
Sakamoto Hitoshi
Miyazawa Makoto
Ishibashi Kenichi
Original Assignee
Creative Coem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Coem Co Ltd filed Critical Creative Coem Co Ltd
Publication of MX2019003797A publication Critical patent/MX2019003797A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

Un método de fabricación para un componente electrónico incluye: un primer paso para sumergir una cara extrema 2 de un componente electrónico 1 en una capa de inmersión 130 de pasta conductora 120 para formar una capa de pasta conductora 4 aplicada por inmersión en la cara extrema del componente electrónico; un segundo paso para poner la capa de pasta conductora, sobre el componente electrónico, en contacto con una superficie 140 de una platina 100; un tercer paso para mover el componente electrónico en relación con una superficie de la platina en al menos una dirección paralela a la superficie de la platina, mientras la capa de pasta conductora está en contacto con la superficie de la platina; y un cuarto paso para retirar posteriormente, de un lado de la platina, la capa de pasta conductora del componente electrónico.
MX2019003797A 2016-10-14 2017-08-02 Metodo y aparato para la fabricacion de un componente electronico, y dicho componente electronico. MX2019003797A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105133284A TW201813724A (zh) 2016-10-14 2016-10-14 電子零件的製造方法及裝置以及電子零件
PCT/JP2017/028038 WO2018070093A1 (ja) 2016-10-14 2017-08-02 電子部品の製造方法及び装置並びに電子部品

Publications (1)

Publication Number Publication Date
MX2019003797A true MX2019003797A (es) 2019-07-04

Family

ID=61905357

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019003797A MX2019003797A (es) 2016-10-14 2017-08-02 Metodo y aparato para la fabricacion de un componente electronico, y dicho componente electronico.

Country Status (7)

Country Link
KR (1) KR20190064586A (es)
CN (1) CN109844879A (es)
IL (1) IL265925A (es)
MX (1) MX2019003797A (es)
PH (1) PH12019500813A1 (es)
TW (1) TW201813724A (es)
WO (1) WO2018070093A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11052422B2 (en) * 2018-07-10 2021-07-06 Creative Coatings Co., Ltd. Electronic component manufacturing method and apparatus
JP7382627B2 (ja) * 2019-09-30 2023-11-17 株式会社クリエイティブコーティングス 電子部品の製造装置及び製造方法
CN111272330B (zh) * 2020-02-19 2021-09-21 黑龙江大学 一种光纤气体压力传感器及其制备方法
JP7161814B2 (ja) * 2020-03-11 2022-10-27 株式会社クリエイティブコーティングス 電子部品の製造方法及び装置
JP7079511B2 (ja) * 2020-04-02 2022-06-02 株式会社クリエイティブコーティングス 電子部品の製造方法
JP7398122B2 (ja) * 2021-06-03 2023-12-14 株式会社クリエイティブコーティングス 電子部品の製造方法及びペースト塗布装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6345813A (ja) 1986-08-13 1988-02-26 株式会社村田製作所 電子部品の電極形成方法
JPH0869950A (ja) * 1994-08-30 1996-03-12 Murata Mfg Co Ltd セラミック電子部品の外部電極形成方法
JPH1022170A (ja) * 1996-07-04 1998-01-23 Murata Mfg Co Ltd チップ状電子部品及びその製造方法
JP2002237403A (ja) 2001-02-07 2002-08-23 Atc Protech Kk 電子部品素体への電極付け方法および装置
JP5160746B2 (ja) * 2006-03-29 2013-03-13 Ｔｄｋ株式会社 チップ型電子部品の製造方法
JP5509900B2 (ja) * 2010-02-12 2014-06-04 株式会社村田製作所 電極の形成方法及びこれを含む電子部品の製造方法

Also Published As

Publication number Publication date
KR20190064586A (ko) 2019-06-10
CN109844879A (zh) 2019-06-04
IL265925A (en) 2019-05-30
WO2018070093A1 (ja) 2018-04-19
PH12019500813A1 (en) 2020-01-20
TW201813724A (zh) 2018-04-16

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