PH12019500813A1 - Manufacturing method and apparatus for electronic component and such electronic component - Google Patents
Manufacturing method and apparatus for electronic component and such electronic componentInfo
- Publication number
- PH12019500813A1 PH12019500813A1 PH12019500813A PH12019500813A PH12019500813A1 PH 12019500813 A1 PH12019500813 A1 PH 12019500813A1 PH 12019500813 A PH12019500813 A PH 12019500813A PH 12019500813 A PH12019500813 A PH 12019500813A PH 12019500813 A1 PH12019500813 A1 PH 12019500813A1
- Authority
- PH
- Philippines
- Prior art keywords
- electronic component
- conductive paste
- paste layer
- manufacturing
- end section
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Disclosed is a method for manufacturing an electronic component 1A by forming an electrode 4A on an end section 2 of at least one electronic component main body 1, said end section 2 including an end surface 2A and a side surface 2B continuous from the end surface 2A. The method has: a first step for forming a conductive paste layer 4 on the end section 2; a second step for adjusting, before the conductive paste layer 4 hardens, the film thickness of the conductive paste layer 4 formed on the end surface 2A; and a third step for adjusting, before the conductive paste layer 4 hardens, the film thickness of the conductive paste layer 4 formed on the side surface 2B.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105133284A TW201813724A (en) | 2016-10-14 | 2016-10-14 | Manufacturing method and device of electric components and electric components capable of making coating thickness of conductive paste layer uniform |
PCT/JP2017/028038 WO2018070093A1 (en) | 2016-10-14 | 2017-08-02 | Method and apparatus for manufacturing electronic component, and electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12019500813A1 true PH12019500813A1 (en) | 2020-01-20 |
Family
ID=61905357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12019500813A PH12019500813A1 (en) | 2016-10-14 | 2019-04-12 | Manufacturing method and apparatus for electronic component and such electronic component |
Country Status (7)
Country | Link |
---|---|
KR (1) | KR20190064586A (en) |
CN (1) | CN109844879A (en) |
IL (1) | IL265925A (en) |
MX (1) | MX2019003797A (en) |
PH (1) | PH12019500813A1 (en) |
TW (1) | TW201813724A (en) |
WO (1) | WO2018070093A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11052422B2 (en) * | 2018-07-10 | 2021-07-06 | Creative Coatings Co., Ltd. | Electronic component manufacturing method and apparatus |
JP7382627B2 (en) * | 2019-09-30 | 2023-11-17 | 株式会社クリエイティブコーティングス | Electronic component manufacturing equipment and manufacturing method |
CN111272330B (en) * | 2020-02-19 | 2021-09-21 | 黑龙江大学 | Optical fiber gas pressure sensor and preparation method thereof |
JP7161814B2 (en) * | 2020-03-11 | 2022-10-27 | 株式会社クリエイティブコーティングス | Method and apparatus for manufacturing electronic components |
JP7079511B2 (en) * | 2020-04-02 | 2022-06-02 | 株式会社クリエイティブコーティングス | Manufacturing method of electronic parts |
JP7398122B2 (en) * | 2021-06-03 | 2023-12-14 | 株式会社クリエイティブコーティングス | Electronic component manufacturing method and paste coating device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6345813A (en) | 1986-08-13 | 1988-02-26 | 株式会社村田製作所 | Method of forming electrode of electronic parts |
JPH0869950A (en) * | 1994-08-30 | 1996-03-12 | Murata Mfg Co Ltd | Formation of outer electrode of ceramic electronic part |
JPH1022170A (en) * | 1996-07-04 | 1998-01-23 | Murata Mfg Co Ltd | Chip-like electronic part and its manufacturing method |
JP2002237403A (en) | 2001-02-07 | 2002-08-23 | Atc Protech Kk | Method and device for attaching electrode to electronic component body |
JP5160746B2 (en) * | 2006-03-29 | 2013-03-13 | Tdk株式会社 | Manufacturing method of chip-type electronic component |
JP5509900B2 (en) * | 2010-02-12 | 2014-06-04 | 株式会社村田製作所 | Electrode forming method and electronic component manufacturing method including the same |
-
2016
- 2016-10-14 TW TW105133284A patent/TW201813724A/en unknown
-
2017
- 2017-08-02 KR KR1020197010023A patent/KR20190064586A/en unknown
- 2017-08-02 WO PCT/JP2017/028038 patent/WO2018070093A1/en active Application Filing
- 2017-08-02 MX MX2019003797A patent/MX2019003797A/en unknown
- 2017-08-02 CN CN201780057640.8A patent/CN109844879A/en active Pending
-
2019
- 2019-04-08 IL IL265925A patent/IL265925A/en unknown
- 2019-04-12 PH PH12019500813A patent/PH12019500813A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
MX2019003797A (en) | 2019-07-04 |
IL265925A (en) | 2019-05-30 |
TW201813724A (en) | 2018-04-16 |
CN109844879A (en) | 2019-06-04 |
WO2018070093A1 (en) | 2018-04-19 |
KR20190064586A (en) | 2019-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PH12019500813A1 (en) | Manufacturing method and apparatus for electronic component and such electronic component | |
MX2018012535A (en) | Multilayer structure with embedded multilayer electronics. | |
MX2019001401A (en) | Vaporizer of an electronic vaping device and method of forming a vaporizer. | |
EP3483639A3 (en) | Window for display device, method for fabricating the same and display device including the same | |
MX2021002285A (en) | Electrical node, method for manufacturing an electrical node, electrical node strip or sheet, and multilayer structure comprising the node. | |
JP2015195288A5 (en) | ||
MY189095A (en) | Grain-oriented electrical steel sheet and method for manufacturing grain-oriented electrical steel sheet | |
TW201615073A (en) | Electronic component and method for manufacturing same | |
IL279380A (en) | Process for the production of an electronic component comprising a self-assembled monolayer | |
MY196018A (en) | Lead Frame and Method for Manufacturing Same | |
EP3476287A3 (en) | Catheter shaft with electrically-conductive traces | |
EP4012750A4 (en) | Substrate for electronic device and production method therefor | |
EP3422367A4 (en) | Electroconductive paste, electronic substrate, and method for manufacturing said substrate | |
PL412520A1 (en) | Method for producing graphene film with set number of graphene layers | |
WO2018084448A3 (en) | Mother plate, method for manufacturing mother plate, method for manufacturing mask, and oled pixel deposition method | |
EP2927979A3 (en) | Electronic device and manufacturing method of the same | |
GB202016137D0 (en) | A method of forming a carbon based active layer for an anode of a lead carbon battery and the active layer formed thereof | |
EP3779585A4 (en) | Substrate and manufacturing method thereof, and electronic device | |
EP3731279A4 (en) | Substrate and manufacturing method therefor, and electronic apparatus | |
WO2016060455A3 (en) | Method for manufacturing thin film transistor, and thin film transistor | |
EP3852507A4 (en) | Electronic component and method for manufacturing electronic component | |
EP3748478A4 (en) | Electronic substrate and method for manufacturing same, and electronic device | |
EP4083081A4 (en) | Actinic-ray-sensitive or radiation-sensitive resin composition, actinic-ray-sensitive or radiation-sensitive film, pattern formation method, and electronic device manufacturing method | |
EP3950982A4 (en) | Core material and method for forming electronic component and bump electrode | |
EP3316035A3 (en) | Imprint mold and manufacturing method of the same |