JPS6345813A - Method of forming electrode of electronic parts - Google Patents
Method of forming electrode of electronic partsInfo
- Publication number
- JPS6345813A JPS6345813A JP61190198A JP19019886A JPS6345813A JP S6345813 A JPS6345813 A JP S6345813A JP 61190198 A JP61190198 A JP 61190198A JP 19019886 A JP19019886 A JP 19019886A JP S6345813 A JPS6345813 A JP S6345813A
- Authority
- JP
- Japan
- Prior art keywords
- electrode material
- electronic component
- material layer
- main body
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 17
- 239000007772 electrode material Substances 0.000 claims description 67
- 238000010586 diagram Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、円筒コンデンサや積層コンデンサ、あるいは
抵抗器などの電子部品の本体に電極を形成する方法に関
する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for forming electrodes on the body of an electronic component such as a cylindrical capacitor, a multilayer capacitor, or a resistor.
〈従来の技術〉
従来、この種電子部品の電極形成方法としては、たとえ
ば第４図に示すように、電極素材液２０中に、電子部品
本体２１の端部２１ａを浸漬して、同端部２１ａに電極
素材２０ａを付着させたのち、その電極素材２０ａを固
化させるという方法が知られている。<Prior Art> Conventionally, as shown in FIG. 4, as a method for forming electrodes of this type of electronic component, an end portion 21a of an electronic component body 21 is immersed in an electrode material liquid 20. A method is known in which an electrode material 20a is attached to 21a and then the electrode material 20a is solidified.
〈発明が解決しようとする問題点〉
しかし、上記方法では、電子部品本体２１の端部２１ａ
を電極素材液２０から引き上げた後、電極素材２０ａが
固化するまでの間、端部２１ａに付着した電極素材２０
ａは流下し、その膜厚は、第５図のように、端部２１ａ
の側面部Ａでは上から下に向かって、また、端部２１ａ
の下端部Ｂでは周縁から中央に向かってそれぞれ厚くな
る。<Problems to be Solved by the Invention> However, in the above method, the end portion 21a of the electronic component body 21
After pulling up the electrode material 20 from the electrode material liquid 20, until the electrode material 20a solidifies, the electrode material 20 attached to the end portion 21a
a flows down, and its film thickness is as shown in FIG.
From the top to the bottom in the side part A of the
At the lower end B, the thickness increases from the periphery toward the center.
このため、高価な電極素材２０ａが余計に消費され、ま
た、電極素材２０ａの固化時に無理な内部応力が発生し
て、電極素材２０ａがめくれたり端部の角で切れたりす
る、いわゆる膜めくれやエツジ切れを生じることがあっ
た。For this reason, the expensive electrode material 20a is consumed unnecessarily, and unreasonable internal stress is generated when the electrode material 20a solidifies, causing the electrode material 20a to turn over or break at the corner of the end, so-called membrane peeling. Edge breakage could occur.
さらに、この電極素材２０ａの外側にキャップを被嵌す
る場合は、該キャップの嵌着に支障が生じることかあっ
た。Furthermore, when a cap is fitted to the outside of the electrode material 20a, problems may occur in fitting the cap.
そこで、このような不都合の解決策として、前記と同様
な方法により、電子部品本体２１の端部２１ａに電極素
材２０ａを付着させたのち、第６図のように、端部２１
ａに付着した電極素材２０ａのたれ下がり部を定盤２２
の上面２２ａに接触させることにより、電極素材２０ａ
の余剰分を定盤２２に転移させることが考えられた。Therefore, as a solution to this inconvenience, after attaching the electrode material 20a to the end 21a of the electronic component main body 21 by the same method as described above, as shown in FIG.
The hanging part of the electrode material 20a attached to the surface plate 22
By contacting the upper surface 22a of the electrode material 20a,
It has been considered to transfer the surplus amount to the surface plate 22.
この方法によると、第７図のように、電極素材２０ａの
下端部Ｂの膜厚はほぼ均等となるが、側面部Ａでは依然
としである程度の膜厚勾配を残したまま、電極素材２０
ａが余分に付着するため、抜本的な解決は無理であった
。According to this method, as shown in FIG. 7, the film thickness at the lower end portion B of the electrode material 20a becomes almost uniform, but a certain degree of film thickness gradient still remains at the side surface portion A, and the electrode material 20a
Because of the excessive amount of a attached, a drastic solution was not possible.
そこで、本発明は、電子部品本体の端部の端面から周面
にわたってほぼ均等厚さの電極を形成できる電子部品の
電極形成方法を提供することを目的としている。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for forming an electrode for an electronic component that can form an electrode having a substantially uniform thickness from the end surface to the circumferential surface of the electronic component main body.
く問題点を解決するための手段〉 一
本発明ではこのような目的を達成するために、所定の厚
さレベルに設定されたペースト状の電極素材層中に電子
部品本体の端部を浸漬して、その端部に電極素材を付着
させる工程と、電極素材が付着した電子部品本体を引き
上げてその端部の下端のみを、電極素材層の表面部に接
触保持させる工程と、電子部品本体を電極素材層から引
き上げたのち、その端部に付着した電極素材のたれ下が
り部を定盤の上面に接触させる工程とを備えた。Means for Solving the Problems In the present invention, in order to achieve the above object, the end portion of the electronic component body is immersed in a paste-like electrode material layer set to a predetermined thickness level. a step of attaching an electrode material to the end of the electronic component, a step of pulling up the electronic component body to which the electrode material is attached and holding only the lower end of the end in contact with the surface of the electrode material layer; After being pulled up from the electrode material layer, the hanging portion of the electrode material attached to the end thereof is brought into contact with the upper surface of the surface plate.
〈実施例〉 以下、本発明の実施例を図面に基づいて説明する。<Example> Embodiments of the present invention will be described below based on the drawings.
第１図（ａ）〜（Ｄは本発明の一実施例にかかるチップ
型電子部品の外部電極形成方法を示すもので、この方法
は次の■〜■の工程で実施される。FIGS. 1A to 1D show a method for forming external electrodes of a chip-type electronic component according to an embodiment of the present invention, and this method is carried out in the following steps (1) to (2).
■ 第１図（ａ）のように、基板ｌの水平な上面１ａに
ペースト状の電極素材２ａを所定の厚さレベルｈで均一
に塗布して電極素材層２を形成する。この電極素材層２
は、電極素材２ａを基板１上に供給したのち、スキージ
ブレード（図示せず）によりその表面をならすことによ
り、所定の厚さｈに設定される。この厚さレベルｈは、
電子部品本体４の端部４ａに形成する外部電極（第３図
参照）２ｅの長さ寸法σに対応して設定される。電極素
材２ａは、例えば銀を主体とし、半田付は加工の際に半
田内への銀の拡散を抑止するためにパラジウムを含有し
ている。(2) As shown in FIG. 1(a), an electrode material layer 2 is formed by uniformly applying a paste-like electrode material 2a to a predetermined thickness level h on the horizontal upper surface 1a of a substrate 1. This electrode material layer 2
is set to a predetermined thickness h by supplying the electrode material 2a onto the substrate 1 and smoothing its surface with a squeegee blade (not shown). This thickness level h is
It is set corresponding to the length dimension σ of the external electrode (see FIG. 3) 2e formed on the end portion 4a of the electronic component main body 4. The electrode material 2a is mainly made of silver, for example, and contains palladium in order to suppress the diffusion of silver into the solder during soldering processing.
■ 第１図（ａ）のように、電極素材層２の上に位置さ
せた電子部品本体４の端部４ａを、第１図（ｂ）のよう
に、電極素材層２中の基板１に当たる深さまで浸漬して
、その端部４ａに電極素材２ａを付着させる。■ As shown in FIG. 1(a), the end 4a of the electronic component body 4 located on the electrode material layer 2 is brought into contact with the substrate 1 in the electrode material layer 2, as shown in FIG. 1(b). The electrode material 2a is attached to the end portion 4a by dipping to a deep depth.
■ 第１図（ｃ）のように、電子部品本体４の端部４ａ
を電極素材層２の表面部２ｂ上にいったん引きあげる。■ As shown in FIG. 1(c), the end 4a of the electronic component body 4
is once pulled up onto the surface portion 2b of the electrode material layer 2.
このとき、端部４ａに付着した電極素材２ａの膜厚は、
第５図においても説明したように、側面部Ａでは上から
下に向かって、また、下端部Ｂでは周縁から中心に向か
ってそれぞれ厚くなっている。At this time, the film thickness of the electrode material 2a attached to the end portion 4a is
As explained in FIG. 5, the thickness increases from the top to the bottom at the side surface A, and from the periphery toward the center at the bottom end B.
■ 第１図（ｄ）のように、電子部品本体４の端部４ａ
の下端４ｂを電極素材層２の他の位置、つまり電極素材
層２の平らな表面部２ｂに移し変えるとともに、第１図
（ｅ）のようにその表面部２ｂに接触させ、その状態を
一時的に保持する。その結果、端部４ａの側面部Ａに付
着した電極素材２ａが、電極素材２ａの表面張力により
電極素材層２の表面部２ｂになじんで、余分の電極素材
２ａが素材層２の側に吸収され、第１図（ｆ）のように
、上下方向にほぼ均等な膜厚となる。■ As shown in Figure 1(d), the end 4a of the electronic component body 4
Move the lower end 4b of the electrode material layer 2 to another position on the electrode material layer 2, that is, the flat surface portion 2b of the electrode material layer 2, and bring it into contact with the surface portion 2b as shown in FIG. to be maintained. As a result, the electrode material 2a attached to the side surface A of the end portion 4a adapts to the surface portion 2b of the electrode material layer 2 due to the surface tension of the electrode material 2a, and the excess electrode material 2a is absorbed into the material layer 2 side. As shown in FIG. 1(f), the film thickness is approximately uniform in the vertical direction.
ここで、電子部品本体４の下端４ａの位置は、電極素材
層２の表面部２ｂの位置と厳密に一致しな（ともよく、
第２図のように、電子部品本体４の下端４ｂと電極素材
層２の表面部２ｂとの寸法誤差Ｓは、側面部Ａでの電極
素材高さＨの２割程度なら許容される。また、第１図（
ｄ）の電極素材層２の状態は、第１図（Ｃ）の電極素材
層２を再度表面均ししたものでもよく、このものでは、
電子部品本体４の移し替えは不要となる。Here, the position of the lower end 4a of the electronic component main body 4 does not exactly match the position of the surface portion 2b of the electrode material layer 2 (also known as
As shown in FIG. 2, the dimensional error S between the lower end 4b of the electronic component main body 4 and the surface portion 2b of the electrode material layer 2 is permissible if it is about 20% of the electrode material height H at the side surface portion A. Also, Figure 1 (
The state of the electrode material layer 2 in d) may be the same as the electrode material layer 2 in FIG. 1(C) with its surface leveled again.
There is no need to transfer the electronic component main body 4.
■ 第１図（ｇ）のように、電子部品本体４を引き上げ
て、その端部４ａに付着した電極素材２ａを電極素材層
２の表面部２ｂから切り離す。この状態では、電子部品
本体４の下端４ｂにたれ下がった電極素材２ａは、依然
として周縁から中心に向かって厚くなっている。(2) As shown in FIG. 1(g), pull up the electronic component main body 4 and separate the electrode material 2a attached to the end portion 4a from the surface portion 2b of the electrode material layer 2. In this state, the electrode material 2a hanging down from the lower end 4b of the electronic component main body 4 still becomes thicker from the periphery toward the center.
■ 第１図（ｇ）の電子部品本体４を、第１図（ｈ）の
ように、定盤５の上で下降することにより、端部４ａに
付着した電極素材２のたれ下がり部２Ｃを、第１図（ｈ
）から（ｉ）のように、定盤５の水平な上面５ａに鉛直
方向に接触させる。これにより、第１図（Ｄのように、
電極素材２ａのたれ下がり部２Ｃの余剰分２ｄが定盤５
に転移され、下端４ｂでの膜厚がほぼ均等となる。なお
、■の工程は、必要に応じて２回以上繰り返す。■ By lowering the electronic component main body 4 shown in FIG. 1(g) on the surface plate 5 as shown in FIG. 1(h), the hanging portion 2C of the electrode material 2 attached to the end portion 4a is removed. , Figure 1 (h
) to (i), it is brought into contact with the horizontal upper surface 5a of the surface plate 5 in the vertical direction. As a result, as shown in Figure 1 (D),
The excess portion 2d of the hanging portion 2C of the electrode material 2a is the surface plate 5.
The film thickness at the lower end 4b becomes almost uniform. Note that step (1) is repeated two or more times as necessary.
■ 第１図（ｊ）の工程を経た電子部品本体４の電極素
材２ａを固化し、第３図のように、端部４ａの側面部Ａ
および下端部Ｂをほぼ均等に覆う外部電極２ｅを得る。■ The electrode material 2a of the electronic component main body 4 that has undergone the process shown in FIG. 1(j) is solidified, and the side surface portion A of the end portion 4a is
And an external electrode 2e that covers the lower end B almost evenly is obtained.
■ 外部電極２ｅを電子部品本体４の両端部に形成する
には、電子部品本体４の他端部に対して、前述の■〜■
の工程が実施される。■ To form the external electrodes 2e on both ends of the electronic component main body 4, the above-mentioned ■ to ■
The following steps are carried out.
なお、第１図（ｂ）の工程後、第１図（Ｃ）の工程に行
かず、（ｅ）の工程に飛ぶことができる。つまり、第１
図（ｂ）の工程の後、電子部品本体４を電極素材層２か
ら完全に離脱させずに、電子部品本体４の下端４ｂを、
第１図（ｅ）のように、電極素材層２の表面部２ｂ近く
まで引き上げてその状態を一時的に保持することによっ
ても、端部４ａの電極素材２ａを第１図（ｒ）の状態に
形成させることができる。しかし、表面のきれいな外部
電極２ｅを得るには、先゛に述べたように、（ｂ）−（
Ｃ）−（ｄ）−（ｅ）の工程を経るのがよい。Note that after the step in FIG. 1(b), it is possible to jump to the step in FIG. 1(e) without going to the step in FIG. 1(C). In other words, the first
After the process shown in FIG. 3(b), the lower end 4b of the electronic component body 4 is removed without completely separating the electronic component body 4 from the electrode material layer 2.
As shown in FIG. 1(e), the electrode material 2a at the end portion 4a can also be brought into the state shown in FIG. can be formed. However, in order to obtain the external electrode 2e with a clean surface, (b) - (
It is preferable to go through the steps of C)-(d)-(e).
なおまた、■以下の工程は複数回、繰り返してもよい。Furthermore, the steps following (1) may be repeated multiple times.
〈発明の効果〉
本発明の電子部品の電極形成方法によれば、電子部品本
体の端部に電極素材を付着させたのち、その端部の下端
を、電極素材層の表面部に接触保持させることにより、
本体端部の周面での電極素材層の膜厚をほぼ均等化し、
また、その後、本体端部に付着した電極素材のたれ下が
り部を定盤の上面に接触させることにより、本体端部の
下面での電極素材層の膜厚をほぼ均等化することができ
る。すなわち、電子部品本体の端部に、端面から周面に
わたってほぼ均等厚さの外部電極を形成できるという効
果がある。<Effects of the Invention> According to the method for forming electrodes of electronic components of the present invention, after attaching an electrode material to the end of the electronic component main body, the lower end of the end is held in contact with the surface of the electrode material layer. By this,
The thickness of the electrode material layer on the peripheral surface of the end of the main body is almost equalized,
Furthermore, by subsequently bringing the hanging portion of the electrode material attached to the end of the main body into contact with the upper surface of the surface plate, the thickness of the electrode material layer on the lower surface of the end of the main body can be approximately equalized. That is, there is an effect that an external electrode having a substantially uniform thickness can be formed at the end of the electronic component main body from the end surface to the circumferential surface.
第１図（ａ）ないしくｊ）は本発明の一実施例にかかる
電子部品の電極形成方法の工程図、第２図は第１図（ｅ
）の説明図、第３図は外部電極の説明図、第４図は従来
方法の第１説明図、第５図は第４図の従来方法に基づく
電極素材の付着状態を示す説明図、第６図は従来方法の
第２説明図、第７図は第６図の従来方法に基づく電極素
材の付着状態を示す説明図である。
２・・・電極素材層、２ａ・・・電極素材、２ｂ・・・
表面部、２Ｃ・・・たれ下がり部、４・・・電子部品本
体、４ａ・・・端部、４ｂ・・・下端、５・・・定盤、
５ａ・・・上面。FIGS. 1(a) to 1j) are process diagrams of a method for forming electrodes of electronic components according to an embodiment of the present invention, and FIG.
), FIG. 3 is an explanatory diagram of the external electrode, FIG. 4 is a first explanatory diagram of the conventional method, and FIG. 5 is an explanatory diagram showing the state of attachment of the electrode material based on the conventional method of FIG. FIG. 6 is a second explanatory diagram of the conventional method, and FIG. 7 is an explanatory diagram showing the state of attachment of the electrode material based on the conventional method of FIG. 2... Electrode material layer, 2a... Electrode material, 2b...
Surface portion, 2C... hanging portion, 4... electronic component body, 4a... end, 4b... lower end, 5... surface plate,
5a...Top surface.
Claims (1)
素材層中に電子部品本体の端部を浸漬して、その端部に
電極素材を付着させる工程と、電極素材が付着した電子
部品本体を引き上げてその端部の下端のみを、電極素材
層の表面部に接触保持させる工程と、電子部品本体を電
極素材層から引き上げたのち、その端部に付着した電極
素材のたれ下がり部を定盤の上面に接触させる工程とを
備えたことを特徴とする電子部品の電極形成方法。(1) The process of immersing the end of the electronic component body into a paste-like electrode material layer set to a predetermined thickness level and attaching the electrode material to the end, and the electronic component with the electrode material attached. There is a step of pulling up the main body and holding only the lower end of the end in contact with the surface of the electrode material layer, and a step of pulling up the electronic component main body from the electrode material layer and removing the hanging portion of the electrode material attached to the end. 1. A method for forming an electrode for an electronic component, comprising the step of bringing it into contact with the upper surface of a surface plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61190198A JPS6345813A (en) | 1986-08-13 | 1986-08-13 | Method of forming electrode of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61190198A JPS6345813A (en) | 1986-08-13 | 1986-08-13 | Method of forming electrode of electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6345813A true JPS6345813A (en) | 1988-02-26 |
| JPH0424853B2 JPH0424853B2 (en) | 1992-04-28 |
Family
ID=16254082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61190198A Granted JPS6345813A (en) | 1986-08-13 | 1986-08-13 | Method of forming electrode of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6345813A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05144660A (en) * | 1991-11-15 | 1993-06-11 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH05144661A (en) * | 1991-11-15 | 1993-06-11 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH05144662A (en) * | 1991-11-15 | 1993-06-11 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JP2007081163A (en) * | 2005-09-14 | 2007-03-29 | Murata Mfg Co Ltd | Jig for forming external electrode and method for manufacturing chip-type electronic component |
| JP2012064628A (en) * | 2010-09-14 | 2012-03-29 | Murata Mfg Co Ltd | Electronic component manufacturing device, and manufacturing method of the same |
| CN108074691A (en) * | 2016-11-11 | 2018-05-25 | 株式会社创力艾生 | The manufacturing method and apparatus and electronic unit of electronic unit |
| KR20190064586A (en) | 2016-10-14 | 2019-06-10 | 가부시키가이샤 크리에이티브 코엠 | METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC COMPONENTS |
| JP2019160992A (en) * | 2018-03-13 | 2019-09-19 | ローム株式会社 | Chip resistor, and manufacturing method of chip resistor |
| KR20200006505A (en) | 2018-07-10 | 2020-01-20 | 가부시키가이샤 크리에이티브 코팅즈 | Electronic component manufacturing method and apparatus |
| WO2021181548A1 (en) | 2020-03-11 | 2021-09-16 | 株式会社クリエイティブコーティングス | Electronic component manufacturing method and device |
| KR20240012567A (en) | 2021-06-03 | 2024-01-29 | 가부시키가이샤 크리에이티브 코팅즈 | Manufacturing method and paste application device for electronic components |
-
1986
- 1986-08-13 JP JP61190198A patent/JPS6345813A/en active Granted
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05144660A (en) * | 1991-11-15 | 1993-06-11 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH05144661A (en) * | 1991-11-15 | 1993-06-11 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JPH05144662A (en) * | 1991-11-15 | 1993-06-11 | Murata Mfg Co Ltd | Manufacture of electronic component |
| JP2981515B2 (en) * | 1991-11-15 | 1999-11-22 | 株式会社村田製作所 | Electronic component manufacturing method |
| JP2007081163A (en) * | 2005-09-14 | 2007-03-29 | Murata Mfg Co Ltd | Jig for forming external electrode and method for manufacturing chip-type electronic component |
| JP4569430B2 (en) * | 2005-09-14 | 2010-10-27 | 株式会社村田製作所 | External electrode forming jig and chip type electronic component manufacturing method. |
| JP2012064628A (en) * | 2010-09-14 | 2012-03-29 | Murata Mfg Co Ltd | Electronic component manufacturing device, and manufacturing method of the same |
| KR20190064586A (en) | 2016-10-14 | 2019-06-10 | 가부시키가이샤 크리에이티브 코엠 | METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC COMPONENTS |
| CN108074691A (en) * | 2016-11-11 | 2018-05-25 | 株式会社创力艾生 | The manufacturing method and apparatus and electronic unit of electronic unit |
| JP2019160992A (en) * | 2018-03-13 | 2019-09-19 | ローム株式会社 | Chip resistor, and manufacturing method of chip resistor |
| KR20200006505A (en) | 2018-07-10 | 2020-01-20 | 가부시키가이샤 크리에이티브 코팅즈 | Electronic component manufacturing method and apparatus |
| EP3598467A1 (en) | 2018-07-10 | 2020-01-22 | Creative Coatings Co., Ltd. | Electronic component manufacturing method and apparatus |
| KR20210030893A (en) | 2018-07-10 | 2021-03-18 | 가부시키가이샤 크리에이티브 코팅즈 | Electronic component manufacturing device |
| US11052422B2 (en) | 2018-07-10 | 2021-07-06 | Creative Coatings Co., Ltd. | Electronic component manufacturing method and apparatus |
| US11338317B2 (en) | 2018-07-10 | 2022-05-24 | Creative Coatings Co., Ltd. | Electronic component manufacturing apparatus |
| US11602766B2 (en) | 2018-07-10 | 2023-03-14 | Creative Coatings Co., Ltd. | Electronic component manufacturing method and apparatus |
| WO2021181548A1 (en) | 2020-03-11 | 2021-09-16 | 株式会社クリエイティブコーティングス | Electronic component manufacturing method and device |
| KR20220147680A (en) | 2020-03-11 | 2022-11-03 | 가부시키가이샤 크리에이티브 코팅즈 | Method and apparatus for manufacturing electronic components |
| KR20240012567A (en) | 2021-06-03 | 2024-01-29 | 가부시키가이샤 크리에이티브 코팅즈 | Manufacturing method and paste application device for electronic components |
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| Publication number | Publication date |
|---|---|
| JPH0424853B2 (en) | 1992-04-28 |
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| Date | Code | Title | Description |
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| EXPY | Cancellation because of completion of term |