JPH0738248A - Solder coating method for electronic component - Google Patents

Abstract

PURPOSE:To provide a method for solder-coating an electronic component for stably soldering an electrode terminal of the component by solving a subject such as a partially thick solder, connection of electrode terminals, or further an oxide film formed on a surface of a solder tank in the method for coating the terminal of the component with the solder. CONSTITUTION:The method for solder-coating an electronic component comprises the steps of attaching the component 1a coated with flux in a solder tank 13 having a double layer of synthetic oil 14 inactive with melted solder 7, then slowly moving the layer of the melted solder 7 to the layer of the oil 14, and further slowly lifting it from the layer of the oil 14 to coat it with the solder. With the method, the solder 7 is not adhered to the terminal more than required, no oxide film is formed on the surface of the melted solder 7, and stable solder can be coated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying solder to an electronic component having an electrode terminal by applying solder to the electrode terminal using a solder bath.

[0002]

2. Description of the Related Art Conventionally, as a method of applying solder to the electrode terminals 2a to 2c of electronic components 1a to 1c as shown in FIGS. . That is, a portion of the electronic component 1a other than the electrode terminals 2a is gripped by the chuck 3 and the flux tank 4 containing the flux 5 is held.
Then, the electrode terminal 2a was applied with solder by being applied to the solder bath 6 containing the melted solder 7, and further cleaned in the cleaning bath 8 containing the cleaning liquid 9.

[0003]

However, in the above-described conventional solder coating method for electronic components, the thickness of the solder 10 applied to the electrode terminals 2a of the electronic component 1a is partially reduced as shown in FIG. 6 (a). There is a problem that the thickness becomes extremely thick, the shape becomes like an icicle, and the electrode terminals 2a of the electronic component 1a are connected by the solder 10 as shown in FIG. 6B.

Further, as shown in FIG. 7A, the electronic component 1
In the solder bath 6 for applying the solder 7 to the electrode terminal 2a of a, the melted solder 7 is always in contact with the air.
An oxide film 11 is formed on the surface of the solder, and in order to perform normal soldering, the surface of the molten solder 7 is scraped off periodically by an oxide film removing spatula 12 as shown in FIG. 7B. There was a problem that the oxide film 11 had to be removed.

The present invention solves the above-mentioned problems of the prior art, and the thickness of the solder applied to the electrode terminals of the electronic component is locally extremely thick, or the electrode terminals are connected by solder, or An object of the present invention is to provide a solder application method for an electronic component, which can prevent an oxide film from being generated on the surface of the molten solder and can stably apply the solder to an electrode terminal of the electronic component. .

[0006]

In order to solve the above-mentioned problems, a method for applying solder to electronic parts according to the present invention is to put molten solder and synthetic oil inactive even in a high temperature state in one solder bath. A double layer with a layer of inert synthetic oil floating above the layer of molten solder due to the difference in specific gravity is formed, and the electronic component equipped with electrode terminals is placed in this layer This is a manufacturing method in which solder is applied to the electrode terminals by gradually moving to an inert synthetic oil layer and pulling it up.

[0007]

According to this manufacturing method, when the electronic component is pulled up from the molten solder, the electronic component is not directly pulled up into the air, but a layer of the molten solder for passing through the inert synthetic oil once. The excessively melted solder will not adhere to the electrode terminals when it is separated from the terminal, and the thickness of the solder applied to the electrode terminals will be extremely thick in some cases, or the shape will become like an icicle. In addition, the phenomenon that the electrode terminals are connected by solder will not occur.

Further, since there is an inert synthetic oil layer on the molten solder layer, the molten solder does not come into direct contact with air, and as a result, an oxide film is generated on the surface of the molten solder. In addition, the solder application process can be made very simple.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A solder coating method for electronic parts according to an embodiment of the present invention will be described below with reference to FIGS. Figure 1
2 shows an example of a solder bath according to the same embodiment, FIG. 2 is an explanatory view showing the same solder applying step, and FIG. 3 shows an electronic component to which solder is applied according to the present embodiment.

In FIG. 1, 13 is a solder bath for heating the solder 7 to keep it at a high temperature (220 to 230 ° C.), 7 is molten solder, and 14 is synthetic oil which is inactive even in a high temperature state.

To the solder bath 13 thus formed, as shown in FIG. 2, the electronic component 1a which is gripped by the chuck 3 and coated with the flux is applied up to the layer of the molten solder 7. Further, from the layer of the melted solder 7, an inert synthetic oil 14
Slowly move to the layer. Further, it is slowly pulled up from the layer of inert synthetic oil 14. After this, electronic component 1
After cleaning a, the solder 10 can be applied to the electrode terminals 2a of the electronic component 1a as shown in FIG.

The inert synthetic oil 14 has a temperature of 250 ° C.
Any material may be used as long as it is stable and inert even at the above high temperature. Further, according to this method, it is possible to perform stable solder coating not only in the solder coating step for the electrode terminal 2a of the electronic component 1a but also in various solder coating steps.

[0013]

The solder coating method for electronic parts according to the present invention having the above-described structure has the following effects, and the industrial effects thereof are great. 1. It is possible to prevent the thickness of the solder applied to the electrode terminals of the electronic component from being partially increased, or the electrode terminals from being connected by the solder. 2. Since the molten solder does not come into direct contact with the air, it is possible to prevent the generation of an oxide film on the solder.

[Brief description of drawings]

FIG. 1 is a sectional view of a solder bath used in a solder coating method for electronic components according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a solder coating process according to the same embodiment.

FIG. 3 is a front view of an electronic component coated with solder according to the embodiment.

4A to 4C are perspective views showing electronic components.

FIG. 5 is an explanatory diagram showing a conventional solder coating process.

6A and 6B are front views of electronic components to which solder has been applied by a conventional electronic component solder applying method.

7A and 7B are cross-sectional views showing an oxide film generated in a conventional solder bath and a state in which the oxide film is removed.

[Explanation of symbols]

 1a-1c Electronic parts 2a-2c Electrode terminals 3 Chuck 7 Melted solder 13 Solder tank 14 Inactive synthetic oil

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01R 43/02 A

Claims (1)

[Claims] 1. A solder tank is charged with solder and melted, and synthetic oil which is inactive even at high temperature is charged into an upper layer portion of the melted solder, and flux is applied to the solder tank with electrode terminals. A method for applying solder to an electronic component, in which after the electronic component is dipped, the electronic component is gradually pulled up to pass through a layer of synthetic oil and then taken out of the solder bath to apply solder to the electrode terminals of the electronic component.