JPH02156695A - Method of dipping printed board - Google Patents
Method of dipping printed boardInfo
- Publication number
- JPH02156695A JPH02156695A JP31244888A JP31244888A JPH02156695A JP H02156695 A JPH02156695 A JP H02156695A JP 31244888 A JP31244888 A JP 31244888A JP 31244888 A JP31244888 A JP 31244888A JP H02156695 A JPH02156695 A JP H02156695A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- printed board
- dipping
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 12
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 101100524639 Toxoplasma gondii ROM3 gene Proteins 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はプリント基板のディップ方法に関し、特にプリ
ント基板をディップ液中に浸’ｔｒ”ｌ した後引上げ
る際における液切れ性を向」二させたディップ方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for dipping a printed circuit board, and in particular to a method for improving the drainage property when a printed circuit board is pulled up after being immersed in a dipping liquid. Regarding the dipping method.
（従来の技術）
プリント基板に防ルＡ剤等を塗布する作業は、プリント
基板から伸びた多数のリード’ＩＡ ’Ｆを保持装置に
よって保持することによって垂下させたプリント基板を
ディップ液中に浸漬することによって行なわれる。(Prior art) The work of applying anti-fouling agent A, etc. to a printed circuit board involves holding a large number of leads 'IA' F extending from the printed circuit board with a holding device, and immersing the printed circuit board in a dipping liquid. It is done by doing.
斯るディップ作業は保持装置によって多数のプリント基
板を水平に保持した状態で液中に降下させて浸漬し、浸
潤後に上界させることによって行なわれる。Such a dipping operation is performed by lowering a large number of printed circuit boards into a liquid while holding them horizontally using a holding device, immersing them in the liquid, and then allowing them to rise after soaking.
しかしながら、上記保持袋ｊＩ￥はプリント基板を終始
水゛Ｙに保持した状態で昇降させるため、ディップ液中
から引１ユげて液切りを完了したときに、プリント基板
下端縁全体に落下し切れなかった液が溜って乾燥する。However, since the above-mentioned holding bag JI\ is raised and lowered while holding the printed circuit board in water from beginning to end, when it is pulled out of the dip liquid to complete draining, it falls all over the lower edge of the printed circuit board and breaks. The remaining liquid accumulates and dries.
こうしてディップを完了したプリント基板は外観十、は
もちろん、規定寸法を長さ方向及び厚さ方向へ越えた不
良品となる。The printed circuit board that has undergone dipping in this way becomes a defective product that not only has an acceptable appearance but also exceeds the specified dimensions in the length and thickness directions.
断る問題はリード端子をハンダ槽に浸漬する場合におい
ても同様に発生ずる。The same problem occurs when the lead terminal is immersed in a solder bath.
（発明の目的）
本発明は上記に鑑みてなされたものであり、ディップ終
了後にプリント基板或はリード端子の下端に液切れし切
れなかった液が溜って固化することによる製品品質の低
下を防＋ｈすることができるディップ方法を提供するこ
とを目的としている。(Objective of the Invention) The present invention has been made in view of the above, and is intended to prevent product quality from deteriorating due to unused liquid accumulating and solidifying at the lower end of a printed circuit board or lead terminal after dipping. The purpose of the present invention is to provide a dipping method that allows for +h.
（発明の概要）
上記目的を達成するため本発明は、ディップ液に浸漬し
た少なくとも一つのプリント基板をディップ液から引上
げる際に、プリント基板を傾斜させて液切れ性を向上さ
せたことを特徴としている。(Summary of the Invention) In order to achieve the above object, the present invention is characterized in that when at least one printed circuit board immersed in a dip liquid is pulled up from the dip liquid, the printed circuit board is tilted to improve liquid drainage performance. It is said that
（実施例）
以下、添付図面に示した好適な実施例に基づいて本発明
のプリント基板のディップ方法を、仔細に説明する。(Example) Hereinafter, a method for dipping a printed circuit board of the present invention will be described in detail based on a preferred example shown in the accompanying drawings.
なお、実施例の説明に先立ち本発明の理解を助けるため
に上記従来例について少しく説明する。Before explaining the embodiments, the above-mentioned conventional example will be briefly explained in order to facilitate understanding of the present invention.
即ち、第２図に示したハイブリッドＩｃＩは。That is, the hybrid IcI shown in FIG.
セラミック、ガラスエポキシ等から成るプリント基板２
と、該プリント基板２上に配設された複数のＤ Ｉ
Ｐ （Ｄｕａｌ Ｉｎ Ｌｉｎｅ Ｐａｃｋ
ａｇｅｌ 型１ｃＲＯＭ３或はその他の部品とから成
る。このハイブリッドＩｃＩはリード端子（リード用電
橋）４を介してマザーボードのスルーホール内に接続さ
れるとともにハンダ付けによって固定されるが、プリン
ト基板２にリード端−ｆ−４を取り付ける際には多数の
リード端子４を連接片７によってｆめ櫛状に接続−・体
化しておくとともに、各リード端子４先端の二股に分岐
した支持部８でプリント基板周縁に形成した各導電パタ
ーン９を挟圧保持し、この状態で櫛状のリード端子４全
体をプリント基板のリード電極部分までハンダのディッ
プ層に浸ｈ°１シてから引き］二げることによってハン
ダ付けを完了する。このように、 一つの櫛状リードを
介して多数のプリント基板２を接続した状態で加［が行
われる。Printed circuit board 2 made of ceramic, glass epoxy, etc.
and a plurality of DIs arranged on the printed circuit board 2.
P (Dual In Line Pack
It consists of Agel type 1c ROM3 or other parts. This hybrid IcI is connected to the through hole of the motherboard via the lead terminal (electrical bridge for leads) 4 and fixed by soldering, but when attaching the lead end -f-4 to the printed circuit board 2, there are many The lead terminals 4 are connected in a comb-like manner by the connecting piece 7, and each conductive pattern 9 formed on the periphery of the printed circuit board is pinched by the bifurcated supporting part 8 at the tip of each lead terminal 4. In this state, the entire comb-shaped lead terminal 4 is immersed in a dip layer of solder up to the lead electrode portion of the printed circuit board, and then pulled out to complete the soldering. In this way, addition is performed with a large number of printed circuit boards 2 connected through one comb-shaped lead.
こうして実装及びハンダによる端子の接続を完ｒしたプ
リント基板２はその全面にフェノール液を塗布して保護
膜を形成したあとで、プリント基板２を下に向けた状態
で防湿液（パラフィン液）の槽内にディップされ、防湿
処理を施される。After the printed circuit board 2, which has been mounted and the terminals have been connected by soldering, is coated with phenol liquid to form a protective film on its entire surface, a moisture-proof liquid (paraffin liquid) is applied to the printed circuit board 2 with the printed circuit board 2 facing downward. It is dipped in a tank and subjected to moisture-proofing treatment.
ところで、上述のような溶融ハンダ、パラフィン等の液
中にリート端ｒ−、プリント基板なディップする工程に
おいては、ディップ槽中の液面に対して水平に支持した
プリント基板をそのまま所定距離上下動させて浸漬させ
ることによって自動的に所要の塗布処理を施している。By the way, in the process of dipping the lead end r- or printed circuit board in a liquid such as molten solder or paraffin as described above, the printed circuit board is supported horizontally with respect to the liquid level in the dipping tank and is moved up and down a predetermined distance. The required coating process is automatically performed by dipping the product.
しかしながら、水平姿勢を保持したままでの昇降による
浸漬方法はプリント基板或はリード端子の上端部全体に
液が溜って固化するというＥ述の問題を招来する。However, the immersion method by lifting and lowering while maintaining a horizontal position brings about the problem described in E, in which the liquid accumulates and solidifies all over the upper end of the printed circuit board or lead terminal.
第１図（ａ）（ｂ）（ｃ）は本発明方法の−・実施例を
示し、浸？Ｉ′１市の第１の工程を示す（ａ）では被浸
漬対象たるプリント基板２を保持装置ｌＯによって水平
に保持し、浸漬した状態を示す（ｂ）ではこれをそのま
まの姿勢でディップ油１３中に降下させて浸漬させる。FIGS. 1(a), (b), and (c) show examples of the method of the present invention. In (a) showing the first process of I'1, the printed circuit board 2 to be immersed is held horizontally by a holding device 10, and in (b) showing the immersed state, it is kept in that position and soaked in dip oil 13. drop into it and let it soak.
プリント基板の引上げ工程を示す（ｃ）では接続片７に
よって接続された多数のプリント基板の一端側からヒｎ
させている。プリント基板が液面から完全に離間した後
においても暫く傾斜した状態でこれを保持し、液切れを
待つ。In (c), which shows the process of pulling up printed circuit boards, a large number of printed circuit boards connected by connecting pieces 7 are pulled up from one end side.
I'm letting you do it. Even after the printed circuit board is completely separated from the liquid surface, it is held in an inclined state for a while to wait for the liquid to run out.
被浸漬対象を保持する保持装置１０としては液浸？＋’
ｌ対象を確実に保持して昇降することができるとともに
、引き十、げ時には第１図（Ｃ１に示すように一方の端
部な東上方向へ傾斜させて」１胃させることができるも
のであれば如何なる構成を有するものであっても差支え
ない。Is immersion the holding device 10 for holding the object to be immersed? +'
It must be able to hold the object securely and move it up and down, and also be able to tilt it toward the east at one end as shown in Figure 1 (C1) when lifting. It may have any configuration.
このように水８１Ｌ姿勢のままで引」−げるのではなく
１−下方向へ傾斜させて引りげることによって、各プリ
ント基１ｆＩ２に付着したディップ液を傾斜方向Ｆ側へ
向って流トさせことができる。傾斜方向を側には角部が
あるため、溜った液は容易にド方へ滴下することができ
る。このため、液切れが完全となり、液の固化後におい
ても欠品の厚等が規定値を越えることがない。In this way, instead of pulling the water 81L in the same position, by tilting it downwards, the dip liquid adhering to each printing board 1fI2 flows in the direction F of the inclination. It can be made to Since there is a corner on the side in the direction of inclination, the collected liquid can easily drip in the opposite direction. Therefore, the liquid is completely drained, and even after the liquid has solidified, the thickness of the missing item does not exceed a specified value.
上記実施例ではプリント基板を防湿液中に浸漬する場合
を例示したが、Ｊ、（板から伸びたリード端子をハンダ
槽内に浸積する場合にも同様に本考案を適用することが
できる。In the above embodiment, a case where a printed circuit board is immersed in a moisture-proof liquid is illustrated, but the present invention can be similarly applied to a case where lead terminals extending from a board are immersed in a solder bath.
また、水平に降Ｆさせて浸漬を行ったあと水平に一１ユ
イさせ、液が固化する曲に傾斜させて液切れを行う場合
も本考案の範囲に含まれるものである。Furthermore, the scope of the present invention also includes a case where the liquid is drained by lowering the temperature horizontally to perform immersion, then horizontally lowering the temperature to 11 degrees, and then tilting it in a curve where the liquid solidifies.
（発明の効果）
以上のように本発明方法は、液中に被浸漬対象をディッ
プするに当って、液中からの引き、ヒげ時に被浸漬対象
を非水平姿勢で（上下方向へ傾斜させて）上界させるよ
うにしたため、被浸漬対象の外表面に残留付着した余分
な液を傾斜下刃向へ流下させ、最終的には角部か６滴下
させることができる。(Effects of the Invention) As described above, the method of the present invention allows the object to be immersed to be held in a non-horizontal position (tilted vertically) when the object is dipped in the liquid. Since the liquid is made to flow upward, the excess liquid remaining on the outer surface of the object to be immersed can flow down toward the inclined lower blade, and finally six drops can be dropped from the corner.
第１図（ａｔ （ｂｌ （ｃｌは本発明方法による
浸漬ｆ順を示す説明図、第２図はプリント基板の構成説
明図である。
ｌ・・・ハイブリッドＩｃ ２・・・プリント基板
４・ ・ ・リード端子（リード用電極）１・・・連設
ハ １０・・・保持装置１３ ・ ・ ・ γ夜
特許出願人 東洋通信機株式会社Fig. 1 (at (bl) (cl is an explanatory diagram showing the order of dipping f according to the method of the present invention, and Fig. 2 is an explanatory diagram of the configuration of a printed circuit board. l...Hybrid Ic 2... Printed board
4. Lead terminal (lead electrode) 1... Continuous connection C 10... Holding device 13 . . . γ Patent applicant Toyo Tsushinki Co., Ltd.
Claims (1)
ディップ液から引上げる際に、プリント基板を傾斜させ
て液切れ性を向上させたことを特徴とするプリント基板
のディップ方法。1. A method for dipping a printed circuit board, characterized in that when at least one printed circuit board immersed in a dipping liquid is pulled up from the dipping liquid, the printed circuit board is tilted to improve liquid drainage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31244888A JPH02156695A (en) | 1988-12-09 | 1988-12-09 | Method of dipping printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31244888A JPH02156695A (en) | 1988-12-09 | 1988-12-09 | Method of dipping printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02156695A true JPH02156695A (en) | 1990-06-15 |
Family
ID=18029317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31244888A Pending JPH02156695A (en) | 1988-12-09 | 1988-12-09 | Method of dipping printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02156695A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013073187A (en) * | 2011-09-29 | 2013-04-22 | Seiko Epson Corp | Virtual image displaying device and manufacturing method of the same |
-
1988
- 1988-12-09 JP JP31244888A patent/JPH02156695A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013073187A (en) * | 2011-09-29 | 2013-04-22 | Seiko Epson Corp | Virtual image displaying device and manufacturing method of the same |
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