WO2018070093A1

WO2018070093A1 - Method and apparatus for manufacturing electronic component, and electronic component

Info

Publication number: WO2018070093A1
Application number: PCT/JP2017/028038
Authority: WO
Inventors: 英児佐藤; 坂本　仁志; 宮澤　誠; 健一石橋
Original assignee: 株式会社クリエゾン
Priority date: 2016-10-14
Filing date: 2017-08-02
Publication date: 2018-04-19
Also published as: CN109844879A; PH12019500813A1; IL265925A; MX2019003797A; TW201813724A; KR20190064586A

Abstract

Disclosed is a method for manufacturing an electronic component 1A by forming an electrode 4A on an end section 2 of at least one electronic component main body 1, said end section 2 including an end surface 2A and a side surface 2B continuous from the end surface 2A. The method has: a first step for forming a conductive paste layer 4 on the end section 2; a second step for adjusting, before the conductive paste layer 4 hardens, the film thickness of the conductive paste layer 4 formed on the end surface 2A; and a third step for adjusting, before the conductive paste layer 4 hardens, the film thickness of the conductive paste layer 4 formed on the side surface 2B.

Description

Electronic component manufacturing method and apparatus, and electronic component

The present invention relates to an electronic component manufacturing method and apparatus, an electronic component, and the like.

The inventor has proposed an apparatus and a method for forming an external electrode on an electronic component body by dip-coating a conductive paste layer on an end surface of the electronic component body such as a multilayer ceramic capacitor, inductor, thermistor, etc. Patent Document 1). The film thickness of the conductive paste layer that has been dip-coated is not uniform. Therefore, after pulling up the electronic component body on which the conductive paste is dip-coated from the conductive paste film layer formed on the surface plate surface, the dripping portion of the conductive paste formed on the end of the electronic component body is It has also been proposed to make contact with the surface of the platen from which the conductive paste film layer has been removed (Patent Document 2). This process is referred to as a blot process because excess conductive paste on the electronic component body side is wiped off with a surface plate. By performing this blotting process, it is expected that a substantially uniform conductive paste layer is formed at the end of the electronic component body.

JP 2002-237403 A JP-A 63-45813

However, even if the blotting process is performed, when the electronic component main body is pulled up from the surface plate, the conductive paste of the electronic component main body hangs down by its own weight. Further, a stringing phenomenon in which the conductive paste on the surface plate and the conductive paste on the electronic component main body are connected also occurs. Due to such a phenomenon, the external electrode of the electronic component main body tends to be thick in the portion covering the vicinity of the center of the end face and thin in the portion covering the periphery. Furthermore, the external electrode of the electronic component main body tends to be thinner at a portion covering the side surface of the end portion of the electronic component main body or a portion covering the corner portion where the end surface and the side surface intersect.

Such an external electrode hinders the flatness of the surface of the external electrode and causes non-uniformity in the thickness of the external electrode. Further, when an electronic component having such an external electrode is soldered to a substrate, the soldering quality becomes unstable.

In recent years, electronic components have been further miniaturized. In order to form a conductive layer with the desired shape and thickness at the end of this miniaturized electronic component, a blotting process that adjusts the thickness of the end face was added to the dip coating method using a surface plate. The conventional method has a limit.

Some aspects of the present invention may improve the thickness of the conductive layer formed at the end of an electronic component that has been particularly miniaturized by a new method, or form the conductive layer with an intended thickness. An object of the present invention is to provide an electronic component manufacturing method and apparatus and an electronic component.

(1) One aspect of the present invention is
In the method of manufacturing an electronic component by forming an electrode on the end portion, the end portion of at least one electronic component main body includes an end surface and a side surface continuing to the end surface,
A first step of forming a conductive paste layer to be the electrode at the end;
A second step of adjusting the film thickness of the conductive paste layer formed on the end face before the conductive paste layer is cured;
A third step of adjusting the thickness of the conductive paste layer formed on the side surface before the conductive paste layer is cured;
The present invention relates to a method for manufacturing an electronic component having

According to one aspect of the present invention, the conductive paste layer formed on the end portion of the electronic component main body is adjusted in thickness on the end surface and the side surface before the conductive paste layer is cured. In particular, by having a third step in which the film thickness of the conductive paste formed on the side surface of the electronic component body is adjusted, the unadjusted thick part is shaved or the thick part is removed. Due to an action such as shifting to a thin part, the film thickness of the conductive paste formed on the side surface of the electronic component main body is made uniform and a predetermined thickness is secured. The second step of adjusting the film thickness of the conductive paste layer formed on the end face of the electronic component body can be performed by the conventional blotting process described above, the improved blotting process described later, or the like. In addition, as long as it is after a 1st process and before an electroconductive paste layer is hardened, the order of a 2nd process and a 3rd process is not ask | required, even if a 3rd process is before or after a 2nd process. The second step and the third step may be performed simultaneously. Alternatively, as described later, the first to third steps can be performed simultaneously.

(2) In one aspect (1) of the present invention, the third step may include a step of bringing the conductive paste layer formed on the end face into contact with a film thickness adjusting member. If it carries out like this, the thick part which was not adjusted will be shaved by the film thickness adjusting member, or it will transfer to a thin part.

(3) In one aspect (2) of the present invention, in the third step, an annular wire is used as the film thickness adjusting member, and the end of the at least one electronic component body is disposed in the annular wire. Steps may be included. If it carries out like this, the film thickness of the electrically conductive paste layer formed in all the side surfaces of an edge part can be adjusted simultaneously.

(4) In one aspect (2) of the present invention, the at least one electronic component main body includes a plurality of electronic component main bodies, and the third step is a net-like member in which wires are in contact with each other as the film thickness adjusting member. A plurality of annular wires are formed on the mesh member, and each end of each of the plurality of electronic component bodies is disposed in each of the plurality of annular wires. In this way, the end portions of each of the plurality of electronic component bodies are arranged in the plurality of annular wires through which sound waves are propagated isotropically, and the film thickness is adjusted on the side surface of each end portion of the plurality of electronic component bodies. Can be performed simultaneously.

(5) In any one of aspects (2) to (4) of the present invention, the third step may include a step of propagating sound waves to the film thickness adjusting member. If it carries out like this, since the vibration energy defined by the frequency and amplitude of a sound wave will be given to film thickness adjustment members, such as an annular wire, film thickness adjustment will become possible more efficiently. In addition, excess conductive paste attached to the film thickness adjusting member is dropped by vibration caused by sound waves, and contamination of the film thickness adjusting member can be prevented.

(6) In aspect (5) subordinate to aspect (4) of the present invention, in the third step, the acoustic wave is propagated from a part of the outline of the mesh member, and the other outline of the mesh member is obtained. A step of reflecting the sound wave in part can be included. Since the sound wave is propagated isotropically, the sound wave can be propagated from a part of the outline of the mesh member. By reflecting the sound wave at the other part of the outline of the mesh member, the energy of the reflected wave can also be used for adjusting the film thickness. In addition, it is preferable that the frequency of the sound wave can be changed according to the arrangement pitch of the electronic component main body. For example, it is preferable to adjust the frequency of the sound wave so that one wavelength or half wavelength of the sound wave is substantially equal to the arrangement pitch.

(7) In one aspect (5) or (6) of the present invention, the sound wave may be an ultrasonic wave. The film thickness can be adjusted by increasing the frequency-dependent energy using the high frequency of ultrasonic waves. In addition, the film thickness adjustment range can be covered by relatively moving the electronic component main body and the film thickness adjustment member.

(8) In one aspect (1) of the present invention, the second step and the third step include a step of accommodating the conductive paste layer formed on the end portion in a concave portion formed on a surface plate. Curing the conductive paste in the recess. If it carries out like this, since the conductive paste layer formed in the end surface and the side surface will be hardened by adjusting the film thickness in the recess, the second step and the third step can be carried out simultaneously.

(9) In one aspect (1) of the present invention, in the first step, the second step, and the third step, the end is immersed in a conductive paste filled in a recess formed in a mold platen. And a step of curing the conductive paste in the recess. In this way, the first step is performed by inserting the end of the electronic component main body into the conductive plague filled in the recess, and the thickness of the conductive paste layer formed on the end surface and the side surface is adjusted in the recess. Then, the second and third steps are performed. Therefore, the first step, the second step, and the third step can be performed simultaneously.

(10) In one aspect (1) to (9) of the present invention, the at least one electronic component body is sandwiched before at least one of the first step, the second step, and the third step. The method may further include a step of centering the at least one electronic component body by propagating sound waves whose phases are shifted from each other by two wavelengths to the two wires. Since the phases of the peaks in the waveforms of the two types of sound waves that are out of phase with each other by a half wavelength match, the position of the electronic component body is corrected by contact with the two wires through which the sound waves propagate. Thereby, it is possible to center an electronic component body that is misaligned. As a result, the first step, the second step, and / or the third step after the centering step can be realized with higher accuracy.

(11) Another aspect of the present invention is:
In an electronic component manufacturing apparatus for manufacturing an electronic component by forming an electrode at an end of at least one electronic component main body,
An application portion that applies an electrically conductive paste to form an electrically conductive paste layer on an end surface located at the end of the at least one electronic component body and a side surface following the end surface;
A first film thickness adjusting member that is in contact with the conductive paste layer formed on the end face and adjusts the film thickness of the conductive paste layer;
A second film thickness adjusting member that is in contact with the conductive paste layer formed on the side surface and adjusts the film thickness of the conductive paste layer;
The present invention relates to an apparatus for manufacturing an electronic component.

According to another aspect of the present invention, the method of manufacturing an electronic component according to one aspect (1) of the present invention can be suitably implemented.

(12) In another aspect (11) of the present invention, the at least one electronic component main body includes a plurality of electronic component main bodies, and the second film thickness adjusting member includes a net-like member in which wires are in contact at an intersection. The mesh member is formed with a plurality of annular wires, and the ends of each of the plurality of electronic component bodies can be disposed in each of the plurality of annular wires. Thereby, 1 aspect (4) of this invention can be implemented suitably.

(13) In another aspect (12) of the present invention, it may further include a sound wave generation source for propagating sound waves to the second film thickness adjusting member. Thereby, one aspect (5) or (6) of the present invention can be suitably implemented.

(14) In another aspect (11) of the present invention, the recess includes a recess formed in a surface plate, the bottom wall of the recess is the first film thickness adjusting member, and the sidewall of the recess is the second film thickness. It may be an adjusting member. Thereby, one aspect (8) of the present invention can be suitably implemented.

(15) In another aspect (11) of the present invention, the application part includes a recess formed in the mold, the application part is the recess in which the conductive paste is accommodated, and the bottom wall of the recess is the first It may be a film thickness adjusting member, and the side wall of the recess may be the second film thickness adjusting member. Thereby, 1 aspect (9) of this invention can be implemented suitably.

(16) Still another aspect of the present invention provides:
An electronic component body;
An electrode covering an end of the electronic component body;
Have
The end includes an end surface and a side surface following the end surface;
The electrode relates to an electronic component having substantially the same thickness at the end face and the side face.

(17) In still another aspect (16) of the present invention,
The end portion includes a corner portion where the end surface and the side surface intersect,
The thickness of the said electrode which covers the said corner | angular part is an electronic component which is more than the thickness of the said electrode which covers the said end surface.

(18) In still another aspect (16) or (17) of the present invention, the maximum depth of the irregularities on the surface of the electrode may be 20 μm or less.

It is a figure which shows roughly the electronic component main body used for the manufacturing method which concerns on this invention, and the dip layer of an electrically conductive paste layer. FIGS. 2A and 2B are views showing a first step of the manufacturing method according to the first embodiment of the present invention. 3A and 3B are views showing a third step of the manufacturing method according to the first embodiment of the present invention. FIGS. 4A and 4B are views showing that the third step is simultaneously performed on a plurality of electronic component bodies. It is a side view of the process shown to FIG. 4 (A). 6A and 6B are views showing a third step of the manufacturing method according to the second embodiment of the present invention. It is a figure which shows the correlation with the wavelength adjusted with the frequency of a sound wave, and the pitch between electronic component main bodies. FIGS. 8A to 8D are views showing the second and third steps of the manufacturing method according to the third embodiment of the present invention. 9A to 9D are views showing first to third steps of the manufacturing method according to the fourth embodiment of the present invention. It is a figure which shows the manufacturing apparatus with which the manufacturing method which concerns on 1st and 2nd embodiment of this invention is enforced. 11A and 11B are views showing the insertion guide and the carrier plate. 12A and 12B are views showing a jig carrying-in step and an electronic component end face height adjusting step. FIGS. 13A to 13C are diagrams showing a dip coating process (first process) of conductive paste. FIGS. 14A to 14C are diagrams showing an outline of a conventional blotting process (second process) used in the first and second embodiments of the present invention. FIGS. 15A to 15C are diagrams showing an improved blotting process (wet method second process) used in the first and second embodiments of the present invention. It is a figure which shows the manufacturing apparatus with which the manufacturing method which concerns on 3rd and 4th embodiment of this invention is enforced. It is a figure explaining the similar shape of the recessed part of a pattern board, and the end surface of an electronic component main body. It is a figure explaining the clearance gap dimension of a recessed part and the edge part of an electronic component main body. It is a schematic perspective view of the electronic component which is embodiment of this invention. It is a figure which shows the cross section of the electrode formed in the edge part of an electronic component main body. 21A and 21B are a front view and a side view of the external electrode formed on the end face of the electronic component according to the embodiment of the present invention. 22A and 22B are a front view and a side view of an external electrode formed on an end surface of an electronic component as a comparative example. 23A and 23B are views showing a centering jig and a centering process of the electronic component main body.

Hereinafter, preferred embodiments of the present invention will be described in detail. Note that this embodiment described below does not unduly limit the contents of the present invention described in the claims, and all the configurations described in this embodiment are indispensable as means for solving the present invention. Not necessarily.

1. FIG. 1 shows an electronic component main body 1 having an end 2 and a dip layer 3 of a conductive paste formed on a surface plate (not shown), for example, with a uniform thickness. The end portion 2 includes an end surface 2A and a side surface 2B following the end surface 2A. The manufacturing method according to the present embodiment for manufacturing an electronic component by forming electrodes on the end 2 of the electronic component body 1 includes a first step of forming a conductive paste layer on the end 2 of the electronic component main body 1, The second step of adjusting the film thickness of the conductive paste layer formed on the end surface 2A of the electronic component main body 1 before the conductive paste layer is cured, and the electronic component main body 1 before the conductive paste layer is cured. And a third step of adjusting the film thickness of the conductive paste layer formed on the side surface 2B.

1.1. First Embodiment FIGS. 2A and 2B and FIGS. 3A and 3B show a first process and a third process according to the first embodiment. For ease of explanation, some members in the drawings are drawn with exaggerated dimensions. For example, the dimensions and shapes of the dip layer 3 and the conductive paste layer 4 are the same as those of other members. It is enlarged compared to the shape.

To perform the first step, as shown in FIG. 2A, the electronic component body 1 and the dip layer 3 are relatively moved (moved up and down) to dip the end 2 of the electronic component body 1. Immerse in layer 3. Thereafter, as shown in FIG. 2B, the electronic component body 1 and the dip layer 3 are relatively moved (moved up and down), and the end 2 of the electronic component body 1 is separated from the dip layer 3. Thereby, the conductive paste layer 4 is applied and formed on the end 2 of the electronic component body 1.

3A and 3B show the third step. Before or after the third step, for example, a well-known blotting process described in Patent Document 2 is performed as the second step. The second step will be described later. In order to carry out the third step, as shown in FIG. 3A, for example, a film thickness adjusting member (second film thickness adjusting member) 5A is used. The film thickness adjusting member 5 A only needs to be in contact with the conductive paste layer 4 formed on at least one side surface 2 B of all side surfaces of the end portion 2 (four side surfaces in the present embodiment having a rectangular cross section). The shape of the film thickness adjusting member 5A is not particularly limited as long as it is in line contact or surface contact with the side surface 2B. However, a film thickness adjusting member that is not in contact with the conductive paste layer 4 may be used. For example, compressed air is ejected from an ejection nozzle that is a film thickness adjusting member, so that the film thickness of the conductive paste layer 4 on the side surface 2B is increased. You may adjust it.

As the film thickness adjusting member, preferably an annular member, for example, an annular wire 5A as shown in FIG. 3A, can be used to adjust the film thickness of the conductive paste layer 4 formed on the entire side surface 2B of the end portion 2 at the same time. In the third step, as shown in FIG. 3A, the electronic component body 1 and the annular wire 5A are relatively moved (moved up and down), and the end 2 of the electronic component body 1 is moved into the annular wire 5A. Placed in. Thereby, by bringing the conductive paste layer 4 formed on the side surface 2B into contact with the annular member 5A, the thick portion of the unadjusted conductive paste layer 4 formed on the side surface 2B becomes the annular member. It is shaved by 5A or transferred to a thin part. Thereafter, as shown in FIG. 3B, the electronic component main body 1 and the annular wire 5A are relatively moved (moved up and down) to adjust the film thickness of the conductive paste layer (also referred to as an electrode) on the side surface 2B. ) The end 2 having 4A is detached from the annular wire 5A. As described above, the conductive paste layer 4 of the end portion 2 formed in the first step is subjected to the second and third steps before it is cured, so that the film thickness of the end surface 2A and the side surface 2B. Can be processed into the conductive paste layer 4A having adjusted.

4 (A) and 4 (B) show a step of simultaneously performing the third step for a plurality of electronic component bodies 1 arranged one-dimensionally or two-dimensionally. In this case, a mesh member 5 in which a plurality of annular wires 5A are arranged one-dimensionally or two-dimensionally is used as the film thickness adjusting member. As shown in FIG. 5, the annular wire 5A is arranged in accordance with the arrangement pitch d of two

electronic component bodies

1 and 1 that are adjacent in the row or column direction. In FIG. 5, they are adjacent in the row or column direction. The two annular wires 5A are independent without sharing the wire. In other words, two wires are arranged between two

electronic component bodies

1 and 1 that are adjacent in the row or column direction. Instead of this, a single wire shared by both may be disposed between two

electronic component bodies

1 and 1 that are adjacent in the row or column direction (see FIG. 7).

1.2. Second Embodiment FIGS. 6A and 6B show a second embodiment of the present invention in which the third step is performed using a film thickness adjusting member through which sound waves are propagated. 6A and 6B, the end of the film thickness adjusting member, for example, the mesh member 5, is connected to the ultrasonic transducer 6 (sound wave generation source in a broad sense). In particular, it is preferable that the wire members 5 are in contact with each other at the intersections. Moreover, it is preferable that the mesh member 5 uses a wire material that easily propagates sound waves and ultrasonic waves, such as a piano wire. Since the acoustic wave propagates isotropically, the acoustic wave can be propagated to all the wires extending in the row direction and the column direction of the mesh member 5 and contacting at the intersection. As shown in FIG. 6A, when the end portion 2 is arranged in a plurality of annular wires 5A formed on the mesh member 5, the annular wire 5A has vibration energy defined by the frequency and amplitude of the ultrasonic waves. Therefore, the film thickness can be adjusted more efficiently. In addition, excess conductive paste attached to the mesh member 5 is dropped by vibration caused by sound waves, and contamination of the mesh member 5 can be prevented. Thereafter, as shown in FIG. 6B, the electronic component body 1 and the net member 5 are relatively moved (moved up and down), and the end having the conductive paste layer 4A whose thickness is adjusted on the side surface 2B. The part 2 is detached from the annular wire 5A.

Thickness adjusting member For example, the frequency of the sound wave propagating through the mesh member 5 can be adjusted. FIG. 7 shows the correlation between the wavelength adjusted by the frequency of the sound wave and the pitch d between the adjacent

electronic component bodies

1 and 1. For example, the frequency was adjusted by setting the pitch d = 5.29 mm and the sound wave propagation speed of the mesh member 5 to 5290 m / s. In this case, one wavelength at 250 kHz≈4 × d, one wavelength at 500 kHz≈2d, and one wavelength at 1 MHz≈d. When a frequency at which one wavelength of the sound wave is approximately equal to d or 2d is selected, the vibration energy applied to each annular wire 5d is approximately equal, and is uniform on the side surface 2B of each end 2 of the plurality of electronic component bodies 1. Thickness adjustment is expected.

In FIG. 7, the ultrasonic transducer 6 is arranged on a part of the outline of the mesh member 5 (for example, one side of a substantially rectangular shape), and another part of the outline of the mesh member 5 (for example, another side facing the substantially rectangular side) The reflection member 7 is arranged on one side. In this way, the energy of the reflected wave can also be used for film thickness adjustment. If the sound wave is an ultrasonic wave, the high frequency of the ultrasonic wave can be used to increase the energy depending on the frequency to adjust the film thickness. The film thickness adjustment range can be covered by relatively moving the electronic component main body 1 and the film thickness adjusting member 5.

In order to adjust the frequency, for example, a waveform monitor is connected to the reflecting member 7, the length and phase of one wavelength are confirmed while viewing the waveform, and the drive unit connected to the ultrasonic transducer 6 is tuned. The frequency may be adjusted. Moreover, you may provide the frame which is not shown in figure which maintains tension | tensile_strength by providing tension | tensile_strength (for example, piano wire) of the mesh member 5 shown in FIG. Further, the ultrasonic transducer 6 is not limited to the one that is disposed along one side of the mesh member 5 as shown in FIG. 7 and supplies ultrasonic waves to all the wires extending in the lateral direction in FIG. You may supply an ultrasonic wave to a book wire. This is because the ultrasonic wave is propagated isotropically and propagates to all the vertical and horizontal wires.

1.3. Third Embodiment In the third embodiment of the present invention, for example, the second step and the third step are performed simultaneously after the first step shown in FIGS. In the third embodiment, as shown in FIG. 8A, a surface plate (also referred to as a platen) 10 having at least one, for example, a plurality of recesses 12 formed on the surface is prepared. The bottom wall and side wall of the recess 12 function as first and second film thickness adjusting members. The electronic component body 1 is held by a carrier plate (jig) 20 with the end 2 exposed. The carrier plate 20 can also be used in the first and second embodiments. The carrier plate 20 is formed of an elastic body, for example. The electronic component body 1 is held in the carrier plate 20 by being fitted into the hole 22 except for one end.

The platen 10 and the carrier plate 20 are relatively moved (moved up and down) so as to shift from FIG. 8B to FIG. 8C, and the conductive paste layer is formed in the recess 12 of the platen 10. Insert the end 2 on which 4 is formed. Thereby, the film thickness of the conductive paste layer 4 formed on the end surface 2A and the side surface 2B is adjusted by the bottom wall (first film thickness adjusting member) and the side wall (second film thickness adjusting member) that define the recess 12. The Within the recess 12, the conductive paste layer 4 whose film thickness has been adjusted is cured. Thereafter, as shown in FIG. 8D, the carrier plate 20 is moved relative to the surface plate 10, and the conductive paste layer 4 A formed on the end portion 2 of the electronic component body 1 is moved to the surface plate 10. Separate from the recess 12.

Here, the conductive paste is an electroconductive substance having fluidity and high viscosity, and is a suspended dispersion system. The

conductive paste layers

4, 4 A can be placed in the recess 12 while the fluidity is flowing, and the film thickness can be adjusted, and can be quickly cured in the recess 12 by heating or drying the surface plate 10. The amount of the conductive paste layer 4 is preferably adjusted so as not to overflow from the recess 12 of the surface plate 10.

1.4. 4th Embodiment 3rd Embodiment of this invention implements 1st process, 2nd process, and 3rd process simultaneously. In the fourth embodiment, as shown in FIG. 9A, the dip layer 3 of the conductive paste shown in FIG. That is, in this embodiment, the recessed part 12 functions also as an application part in addition to the first and second film thickness adjusting members.

As shown in FIG. 9B to FIG. 9C, the mold 10 and the carrier plate 20 are relatively moved so that the dip layer 3 formed in the recess 12 of the mold 10 has an electron. The end 2 of the component body 1 is immersed. As a result, the end surface 2A and the side surface 2B, which are the end portions 2, are formed with the conductive paste layer 4A, and at the same time, the bottom wall (first film thickness adjusting member) and the side wall (second film thickness adjusting member) that define the recess 12. Member) and the film thickness is adjusted. After the conductive paste layer 4A is cured in the recess 12, the carrier plate 20 is moved relative to the pattern plate 10 as shown in FIG. The formed conductive paste layer 4 A is released from the recess 12 of the mold platen 10.

2. Manufacturing apparatus used to implement the first and second embodiments 2.1. Electronic Device Manufacturing Apparatus FIG. 10 shows a manufacturing apparatus used for implementing the first or second embodiment. This manufacturing apparatus includes a carrier plate (jig) 20 and a film thickness adjusting member such as FIG. 4 (A) B), FIG. 6 (A) (B), FIG. Or the reflector 7 may or may not be provided) and the surface plate 100.

The carrier plate (jig) 20 can have a rectangular hole 22 in plan view as shown in FIGS. 11A and 11B, for example, in accordance with the contour of the end 2 of the electronic component body 1. When the rectangular hole 22 is used, the direction of the long side of the dimension L11 and the short side of the dimension L21 of the plurality of electronic component bodies 1 to be batch-processed are aligned. Therefore, the short side of the electronic component main body 1 held by the jig 20 can be matched with, for example, the X direction, and the long side can be matched with, for example, the Y direction. However, the hole 22 is formed in conformity with the contour of the end 2 of the electronic component body 1 and is not necessarily rectangular.

When the electronic component main body 1 is inserted into the rectangular hole 22 of the jig 20 shown in FIG. 11A, an insertion guide 150 arranged so as to overlap the jig 20 can be used. The insertion guide 150 has a circular tapered hole 152 and a rectangular hole 154 communicating with the circular tapered hole 152. The electronic component main body 1 that has entered the circular tapered hole 152 is guided to the rectangular hole 154 by, for example, applying vibration to the insertion guide 150, and the direction thereof is aligned. Thereafter, the electronic component main body 1 is elastically fitted into the rectangular hole 22 of the rubber jig 20 by the pressing portion 160, for example.

10, a carrier plate (jig) 20 on which the electronic component body 1 is suspended and supported is detachably supported by a jig fixing plate 30. The base plate 40 is fixed above the jig fixing platen 30, and the surface plate 100 is arranged below, for example, a film thickness adjusting member such as the net member 5 is arranged on the side. The base 40 is provided with a moving mechanism 50 that moves the jig fixing plate 30. Here, in FIG. 10, the orthogonal three-axis directions are X, Y, and Z. The moving mechanism 50 can include an X-axis drive unit 60, a Y-axis drive unit 70, and a Z-axis drive unit 80. The Z-axis drive unit 80 is essential, but the X-axis drive unit 60 and the Y-axis drive unit 70 are optional. The moving mechanism 50 only needs to move at least one of the jig fixing plate 30 and the surface plate 100 at least in the Z-axis direction.

The X-axis drive unit 60 can be configured by an X table that can move in the X-axis direction with respect to the base 40 along the X-axis guide 62. The Y-axis drive unit 70 can be configured by a Y table that can move in the Y-axis direction with respect to the X-axis drive unit 60 along the Y-axis guide 72. The Z-axis drive unit 80 is fixed to the Y-axis drive unit 70, for example, and can move the Z-axis 82 in the Z-axis direction.

The jig fixing plate 30 is fixed to the Z axis 82. Therefore, the jig fixing plate 30, the jig 20 and the electronic component main body 1 are moved in the Z-axis direction with respect to the surface plate 100 by the moving mechanism 50 and are parallel to the surface of the surface plate 100. It can move along a plane. The mesh member 5 is moved back and forth in the X direction by a moving mechanism (not shown). The net member 5 is disposed below the jig 20 when the third step is performed, and is retracted to the position shown in FIG. 10 at other times.

2.2. 1st process and 2nd process Below, the 1st process described in the Taiwan patent application 10533284 by the present applicant, the 2nd process, and the improved 2nd process are demonstrated.

2.2.1. End surface adjustment step before the first step As shown in FIG. 12A, the jig 20 holding the electronic component main body 1 is fixed to the jig fixing plate 30. FIG. 12B shows an adjustment process of the end face height of the electronic component main body 1. In FIG. 12B, the electronic component main body 1 held by the jig 20 is lowered by the Z-axis drive unit 80 with respect to the surface plate 100 on which the conductive paste is not spread, and the end surface 2A of the electronic component main body 1 is lowered. Is brought into contact with the surface plate 100. Thereby, the height of the end surface 2A of the electronic component main body 1 held by the jig 20 becomes uniform.

2.2.2. First Step FIGS. 13A) to 13C show a dip coating step (first step) of the conductive paste. In FIG. 13A, the blade 112 is moved horizontally by the squeegee unit 110 to form a dip layer 130 having a height h1 of the conductive paste 130 on the surface plate 100. In FIG. 13B, the electronic component main body 1 is lowered by the Z-axis drive unit 80 of FIG. 1, and the end surface 2 A of the electronic component main body 1 is brought into contact with the dip layer 130 on the surface plate 100. Thereafter, as shown in FIG. 13C, the electronic component main body 1 is raised. Thereby, the conductive paste layer 4 is formed on the end 2 of the electronic component body 1.

2.2.3. Second Step FIGS. 14A to 14C show a conventional blotting step (second step). In FIG. 14A, the blade 114 in contact with the surface 101 of the surface plate 100 is moved horizontally by the squeegee unit 110, and the conductive paste on the surface plate 100 is scraped off. In FIG. 15B, the electronic component body 1 is lowered and the conductive paste layer 4 formed on the end 2 of the electronic component body 1 is brought into contact with the surface plate 100. Thereafter, the electronic component main body 1 is raised as shown in FIG.

2.2.4. Improved second step 2.2.4.1. Wet Method FIGS. 15 (A) to 15 (C) show a blotting process performed subsequent to FIG. 14 (A). After scraping off the conductive paste from the surface plate 100, a paste film layer (wet layer) 140 having a height h2 set by the blade 114 in FIG. 15A is formed. That is, in the conventional blotting process, the blotting process is performed using the dry surface plate 100 without the paste film layer, but in this embodiment, the wet surface plate 100 in which the paste film layer (wet layer) 140 is formed. Perform the blotting process using.

Next, as shown in FIG. 15B, the electronic component body 1 is lowered, and the conductive paste layer 4 formed on the end 2 of the electronic component body 1 is brought into contact with the paste film layer (wet layer) 140. Further, the electronic component main body 1 is moved while the conductive paste layer 14 is in contact with the paste film layer (wet layer) 140 by the X-axis drive unit 60 and / or the Y-axis drive unit 70 of the moving mechanism 50 shown in FIG. The surface plate 100 is moved relatively in at least one direction parallel to the surface 101 of the surface plate 100 (for example, at least one of the X-axis direction and the Y-axis direction). Thereafter, the electronic component main body 1 is raised as shown in FIG. As a result, the conductive paste layer 14 is flattened by moving while in contact with the paste film layer (wet layer) 140 on the surface plate 100, and excess conductive paste that causes stringing is removed from the surface plate surface 101. Can be transferred to the side and scraped off. The effect of transferring the excess conductive paste onto the surface of the surface plate is that the electronic component main body 1 is placed in parallel with the surface plate 100 as in the embodiment of the present invention, rather than making the electronic component stationary as in Patent Document 2. It is much higher to move.

2.2.4.2. Dry Method Instead of the wet method shown in FIGS. 15A to 15C, the conductive paste of the electronic component main body 1 is formed on the surface 101 of the surface plate 100 in a dry state where the paste film layer (wet layer) 140 is not formed. The layer 4 may be brought into contact, and the electronic component body 1 may be relatively moved in at least one direction parallel to the surface 101 of the surface plate 100, preferably in two or more different directions. In particular, when moved in two or more different directions, the effect of transferring excess conductive paste, which could not be transferred to the surface plate 100 side in the conventional blotting process, to the surface plate 100 side is enhanced.

3. Manufacturing apparatus used for implementation of third and fourth embodiments 3.1. Manufacturing apparatus used for implementation of 4th Embodiment FIG. 16: shows the manufacturing apparatus 200 used for implementation of 4th Embodiment. The carrier plate 20 shown in FIG. 16 has an elastic body such as rubber (for example, silicon rubber) 20C disposed in a hole 20B formed in a base 20A made of metal, for example, and has a hole 22 in which the electronic component main body 1 is elastically held. The elastic body 20C is formed.

On the other hand, in the mold platen 10 shown in FIG. 16, a hole 10B1 is formed in the mold part 10B, a recess forming member 10B2 is arranged in the hole 10B1, and a recess 12 filled with the conductive paste 3 is formed in the recess forming member 10B2. Monkey. The recess forming member 10B2 is preferably formed of a material that can form the recess 12 with high accuracy by molding, such as silicon rubber. The recess forming member B2 can be brought into contact with the temperature adjusting unit 10C as shown in FIG. 16, for example. Thereby, heat exchange between the temperature control unit 10C and the dip layer (conductive paste) 3 in the recess 12 is performed via the recess forming member 10B2. The temperature control unit 10C can be configured as a heating unit such as a heater, or using a Beltier element or the like that can be switched between heating and cooling. Curing can be accelerated by heating the conductive paste. When the mold platen (stable plate) 10 is cooled, the mold platen 10 contracts, while the concave portion 12 can be relatively widened, thereby improving the releasability of the conductive paste layer 4A.

As shown in FIG. 16, the base 10 A of the template 10 and the base 24 of the carrier plate 20 can be relatively moved (moved up and down). Accordingly, each step of FIG. 9B to FIG. 9D can be performed. The base 10 A of the mold plate 10 and the base 24 of the carrier plate 20 are preferably guided by a centering guide member (guide member) 52 during relative movement. For example, the electronic component main body 1 is centered with respect to the concave portion 12 of the pattern board 10 by, for example, a tapered fitting between the female member 52A on the base 10A side and the male member 52B on the base 24 side, for example.

In FIG. 17, which is a plan view of the pattern board 10 viewed from the direction in which the carrier plate 20 and the pattern board 10 are relatively moved, the recess 12 of the pattern board 10 is based on the outline (dashed line) of the end 2 of the electronic component body 1. And has a contour (solid line) similar to the contour (dashed line) of the end 2 of the electronic component main body 1. In FIG. 17, due to the action of the guide member 52, the center P 1 of the contour (chain line) of the end 2 of the electronic component body 1 coincides with the center P 2 of the contour (solid line) of the recess 12.

When the centering state (P1 = P2) shown in FIG. 17 is secured, the conductive paste layer (electricity) 4A is formed at the end 2 of the electronic component body 1 with the shape and thickness as designed. FIG. 18 shows the electronic component main body 1 disposed in the recess 12. The end 2 of the electronic component body 1 includes an end surface 2A and a side surface 2B. On the other hand, the concave portion 12 of the template 10 includes a bottom wall 12A that faces the end surface 2A and a side wall 12B that faces the side surface 2B. The distance T11L from the left side surface 2B of the electronic component main body 1 to the side wall 12B of the concave portion 12 and the distance T11R from the right side surface 2B of the electronic component main body 1 to the side wall 12B of the concave portion 12 can be made substantially equal. Thereby, the film thickness of the conductive layer 4 formed on the side surface 2B of the end 2 of the electronic component body 1 can be made substantially uniform.

By managing the relative movement distance between the base 10A of the template 10 and the base 24 of the carrier plate 20, the distance T21 from the end surface 2A of the electronic component main body 1 to the bottom wall 12A of the recess 12 and the electronic component main body 1 The distances T11R and T11L from the side surface 2B to the side wall 12B of the recess 12 can be made substantially equal.

Thus, a conductive layer 4A having a necessary and sufficient thickness and uniform thickness can be secured on the end surface 2A and the side surface 2B of the end portion 2 of the electronic component body 1. In the conventional dip coating method, the thickness of the conductive layer differs between the end surface and the side surface of the end portion of the electronic component main body due to its own weight or the like before the conductive paste layer descends. In addition, the thickness of the conductive layer can be made substantially equal at the side surface 2B.

In FIG. 18, the contour of the first corner 12C where the bottom wall 12A and the side wall 12B of the recess 12 intersect is larger than the contour of the second corner 2C where the end surface 2A and the side surface 2B of the electronic component body 1 intersect, and The shape is similar to the outline of the second corner 2C. In this way, the thickness T31 of the conductive layer 4 covering the first corner 2C where the end surface 2A and the side surface 2B of the electronic component body 1 intersect can be set to other thicknesses T11R, T11L, and T21.

3.2. Manufacturing Apparatus Used for Implementation of Third Embodiment The manufacturing apparatus used for implementation of the third embodiment is the manufacturing apparatus shown in FIG. 10 (however, the mesh member 5 and the X and Y drive units 60 in the moving mechanism 50, 70) and the manufacturing apparatus shown in FIG. 16 (however, the dip layer 3 in the recess 12 is unnecessary). With the manufacturing apparatus shown in FIG. 10, the first step of applying the conductive paste layer 4 to the end 2 of the electronic component body 1 can be performed as shown in FIG. 8B. With the manufacturing apparatus shown in FIG. 16, the second and third steps shown in FIGS. 8C and 8D can be performed.

4). Electronic Component FIG. 19 shows an electronic component 1A manufactured by the above-described manufacturing method, and FIG. 20 shows a cross section of a conductive layer 4A formed on the electronic component main body 1. Here, although there is no restriction | limiting in particular in the magnitude | size of the electronic component 1A to which this invention is applied, It is suitable for the electronic component 1A miniaturized according to downsizing. As the ultra-small electronic component 1A, for example, when the maximum length of one side of a rectangular (square or rectangular) cross section shown in FIG. 19 is L1, and the length in a direction orthogonal to the rectangular cross section is L2, L1 = 500 μm or less And L2 = 1000 μm or less. Preferably, L1 = 300 μm or less and L2 = 600 μm or less, more preferably L1 = 200 μm or less and L2 = 400 μm or less, more preferably L1 = 125 μm or less and L2 = 250 μm or less. In addition, the rectangle here includes not only a corner where two sides meet exactly 90 ° but also a substantially rectangle in which the corner is curved or chamfered. Needless to say, the present invention can also be applied to the electronic component 1A having a rectangular cross section.

4.1. In FIG. 20, the substantially uniform thickness T1 of the electrode 4A formed on the end surface 2A and the substantially uniform thickness T2 of the electrode 4A formed on the side surface 2B are substantially equal to each other. T1 = T2 can be set. This film thickness is as described with reference to FIG. 18 showing the dimensions after film thickness adjustment (third and fourth embodiments) using the recess 12, but the film thickness adjusting member 5A other than the recess 12 is used. This can be ensured in the first and second embodiments. In addition, in particular, according to the third and fourth embodiments, the thickness T3 of the electrode 4A formed at the corner 2C can satisfy T3 ≧ T1 or T3 ≧ T2. These film thicknesses are clearly distinguished from those after the conventional blotting process.

4.2 Evaluation of Flatness of Electrodes FIGS. 21A and 21B show end faces of an electronic component 1A manufactured by the method of this embodiment. As a comparative example, FIGS. 9A and 9B show an end face of an electronic component manufactured by performing the blotting process (only Z movement) disclosed in Patent Document 2. FIG.

As is clear from comparison between FIG. 21A of the present embodiment and FIG. 22A of the comparative example, in FIG. 21A, an annular trace due to stringing of the conductive paste is formed on the surface of the electrode. While it does not exist, as described above, in FIG. 22A, clear tubular traces are generated in two places. The annular trace shown in FIG. 22A of the comparative example makes the surface of the electrode convex as shown in FIG. Cracks may appear in the traces and may peel off. When the electronic component is soldered to the substrate, only the trace portion that is easily peeled is soldered, and the soldering becomes unstable.

It was found that the maximum depth of irregularities on the surface of the electrode due to the two annular traces in FIG. 22B was 70 to 180 μm. On the other hand, in the electronic component of this embodiment shown in FIG. 21 (B), since there are no annular traces on the electrode, the maximum depth of the unevenness on the surface of the electrode is 20 μm or less, preferably 10 μm or less. Can have sex.

Although the present embodiment has been described in detail as described above, it will be readily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Accordingly, all such modifications are intended to be included in the scope of the present invention. For example, a term described at least once together with a different term having a broader meaning or the same meaning in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings. All combinations of the present embodiment and the modified examples are also included in the scope of the present invention.

Here, for example, one of the lengths L11 and L21 of the rectangular hole 22 in FIG. 11B, for example, the length L21 is made longer than the corresponding one of the electronic component main body 1, and is shown in FIG. The electronic component body 1 may be easily inserted into the rectangular hole 22. In such a case, after the electronic component main body 1 is mounted on the jig 20, the electronic component main body 1 needs to be centered (for example, positioning in the X-axis or Y-axis direction in FIG. 11B).

FIGS. 23A and 23B show a centering jig and a centering method of the electronic component body 1. This centering jig has two

wires

5B and 5C arranged with the electronic component main body 1 interposed therebetween. As shown in FIG. 23A, the ultrasonic transducer 6 propagates sound waves whose phases are shifted from each other by a half wavelength to the two

wires

5B and 5C. When the reflecting member 7 is provided, the reflected energy can be used if the propagated sound wave is reflected without causing a phase shift. Since the phases of the peaks in the waveforms of two types of sound waves that are out of phase with each other by a half wavelength match, the sound waves are propagated and contacted with the

book wires

5B and 5C that vibrate as shown in FIG. Thus, the position of the electronic component main body 1 is corrected. Thereby, the electronic component main body 1 that is misaligned can be centered.

As shown in FIG. 23 (A), when a plurality of pairs of

wires

5B and 5C are provided, a sound wave shifted in phase is supplied to each pair of

wires

5B and 5C. In this case, if two types of sound waves supplied to the pair of

wires

5B and 5C are supplied in parallel to all the other pairs of

wires

5B and 5C, only two ultrasonic transducers are provided. Good. Further, instead of the centering jig shown in FIG. 23A, the mesh member 5 shown in FIGS. 6A, 6B or 7 may be used as the centering jig. Since the inner dimension of the annular wire 5A included in the net-like member 5 is larger than the distance between the opposing side surfaces of the electronic component main body 1, it serves as a centering jig for the electronic component main body 1 before the conductive paste layer 4 is formed. Can be combined. Further, when two types of sound waves that are out of phase are propagated to the two wires extending in the horizontal direction in FIG. 7, the two types of sound waves are canceled out in the wire material extending in the vertical direction in FIG. 7. Since the wire extending in the vertical direction in FIG. 7 does not vibrate, there is no adverse effect on the centering operation shown in FIG.

This centering process is performed at least before the third process in the first and second embodiments, at least before the second and third processes in the third embodiment, and in the first to third processes in the fourth embodiment. If implemented before, the centered electronic component main body 1 can be placed with high accuracy in the annular wire 5A or the recess 12. Therefore, the centering step may be performed before at least one of the first step, the second step, and the third step. Thereby, the first step, the second step and / or the third step after the centering step can be realized with higher accuracy.

The centering jig and the centering method are performed before any one of the coating step (first step), the end face film thickness adjusting step (second step), or the side surface film thickness adjusting step (third step). The centering effect can be obtained without necessarily being accompanied by a film thickness adjusting step. Therefore, the electronic component main body mounted on the jig can be broadly defined as a centering jig and a centering method.

Further, the improved blotting process (wet method) described in FIGS. 15A to 15C is more effective than the conventional blotting process shown in FIGS. 14A to 14C. Excellent effect can be achieved. Therefore, an improved blotting process (wet method) can be performed as the film thickness adjusting process on the end face without necessarily performing the film thickness adjusting process on the side surface of the present invention. In the method of manufacturing an electronic component including the improved blotting process (wet method), the end 2 of the electronic component main body 1 is immersed in the dip layer 3 of the conductive paste so that the end 2 of the electronic component main body 1 is immersed. The first step of forming the conductive paste layer 4 applied to the surface and the conductive paste layer 4 of the electronic component body 1 to the wet layer 140 formed by applying the conductive paste to the surface plate 100 A second step of contacting, and moving the electronic component body 1 relative to the surface plate 100 while bringing the conductive paste layer 4 into contact with the wet layer 140 on the surface plate 100; A third step of moving the electronic component main body 1 in parallel with the surface of the surface plate 100, and then a fourth step of separating the conductive paste layer 4 of the electronic component main body 1 from the surface plate 100 side. Electronic It is defined as the production method of goods. According to the present invention, the second and third steps subsequent to the dip coating step of the first step are formed on the end surface 2A of the electronic component body 1 while preventing or suppressing stringing in the fourth step. The thickness of the conductive paste layer 4 can be made uniform.

Next, the blotting process (dry method) described as a modified example of FIGS. 15A to 15C is also higher than the conventional blotting process shown in FIGS. 14A to 14C. Excellent effect can be achieved. In the method of manufacturing an electronic component including this improved blotting process (dry method), the end 2 of the electronic component main body 1 is immersed in the dip layer 3 of the conductive paste, and the end 2 of the electronic component main body 1 is immersed. A first step of forming the conductive paste layer 4, a second step of bringing the conductive paste layer 4 of the electronic component body 1 into contact with the surface 101 of the surface plate 100, and the conductive paste layer 4 being the surface plate. The electronic component body 1 is moved relative to the surface plate 100 while being in contact with the surface 101 of the surface 100, and the electronic component body 1 is moved in parallel with the surface 101 of the surface plate 100. 3 steps, and thereafter, a fourth step of separating the conductive paste layer 4 of the electronic component body 1 from the surface plate 100 side, and the third step moves the electronic component body 1 in the first direction. (Eg in the X direction) A step of moving the defined comprising the steps of moving in the second direction (e.g., Y direction) which is different from the electronic component body 1 to the first direction, and a method of manufacturing an electronic component including. In the third step, the conductive paste layer 4 on the end surface 2A is flattened by causing the conductive paste layer 4 to move in parallel in different first and second directions while being in contact with the surface plate 100. In addition, the excess conductive paste that causes stringing in the fourth step can be transferred to the surface 101 side of the surface plate 100 and scraped off.

1 electronic component body, 1A electronic component, 2 end, 2A end surface, 2B side surface, 3 dip layer, 4 conductive paste layer, 4A electrode (conductive paste layer), 5 mesh member (second film thickness adjusting member), 5A annular wire (second film thickness adjusting member), 5B, 5C wire, 6 sound wave source (ultrasonic vibrator), 7 reflecting member, 10 platen (surface plate), 10C temperature control unit, 12 recess (application unit) , 1st, 2nd film thickness adjusting member), 20 jig, 22 rectangular hole, 24 cross hole, 26 circular hole, 30 jig fixing plate, 40 fixing plate, 50 moving mechanism, 60 X-axis drive unit, 70 Y Axis drive unit, 80 Z-axis drive unit, 100 surface plate (first film thickness adjusting member), 101 surface (surface plate surface), 110 squeegee unit, 112, 114 blade, 130 paste film layer (dip layer) 140 paste film layer (wet layer), 150 insertion guide, 152 circular tapered hole, 154 rectangular hole

Claims

In the method of manufacturing an electronic component by forming an electrode on the end portion, the end portion of at least one electronic component main body includes an end surface and a side surface continuing to the end surface,
A first step of forming a conductive paste layer to be the electrode at the end;
A second step of adjusting the film thickness of the conductive paste layer formed on the end face before the conductive paste layer is cured;
A third step of adjusting the thickness of the conductive paste layer formed on the side surface before the conductive paste layer is cured;
A method for manufacturing an electronic component, comprising:
In claim 1,
Said 3rd process is a manufacturing method of the electronic component including the process which contacts the said electroconductive paste layer formed in the said end surface with a film thickness adjusting member.
In claim 2,
The third step is an electronic component manufacturing method including a step of using an annular wire as the film thickness adjusting member and disposing the end portion of the at least one electronic component body in the annular wire.
In claim 2,
The at least one electronic component body includes a plurality of electronic component bodies;
The third step uses a mesh member in which wires are in contact with each other at the intersection as the film thickness adjusting member, a plurality of annular wires are formed on the mesh member, and the plurality of annular wires are in each of the plurality of annular wires. The manufacturing method of an electronic component including the process of arrange | positioning each said edge part of an electronic component main body.
In any one of claims 2 to 4,
The third step is a method of manufacturing an electronic component, including a step of propagating sound waves to the film thickness adjusting member.
In claim 5 dependent on claim 4,
The method of manufacturing an electronic component, wherein the third step includes a step of propagating the sound wave from a part of the contour of the mesh member and reflecting the sound wave at another part of the contour of the mesh member.
In claim 5 or 6,
The method of manufacturing an electronic component, wherein the sound wave is an ultrasonic wave.
In claim 1,
The second step and the third step are:
A step of accommodating the conductive paste layer formed at the end in the recess formed on the surface plate;
Curing the conductive paste in the recess;
A method of manufacturing an electronic component, wherein the second step and the third step are simultaneously performed.
In claim 1,
The first step, the second step, and the third step are:
A step of immersing the end in a conductive paste filled in a recess formed in the mold plate;
Curing the conductive paste in the recess;
A method of manufacturing an electronic component, wherein the first step, the second step, and the third step are simultaneously performed.
In any one of claims 1 to 9,
Prior to at least one of the first step, the second step, and the third step, the two wires arranged across the end of the at least one electronic component body have a phase of a half wavelength. An electronic component manufacturing method further comprising a step of centering the at least one electronic component body by propagating a shifted sound wave.
In an electronic component manufacturing apparatus for manufacturing an electronic component by forming an electrode at an end of at least one electronic component main body,
An application portion that applies an electrically conductive paste to form an electrically conductive paste layer on an end surface located at the end of the at least one electronic component body and a side surface following the end surface;
A first film thickness adjusting member that is in contact with the conductive paste layer formed on the end face and adjusts the film thickness of the conductive paste layer;
A second film thickness adjusting member that is in contact with the conductive paste layer formed on the side surface and adjusts the film thickness of the conductive paste layer;
An electronic component manufacturing apparatus comprising:
In claim 11,
The at least one electronic component body includes a plurality of electronic component bodies;
The second film thickness adjusting member includes a mesh member in which wires are in contact with each other at an intersection, and the mesh member is formed with a plurality of annular wires, and the plurality of electronic component main bodies in each of the plurality of annular wires. An electronic component manufacturing apparatus in which each of the end portions is arranged.
In claim 11 or 12,
An electronic component manufacturing apparatus further comprising a sound wave generation source for propagating sound waves to the second film thickness adjusting member.
In claim 11,
The manufacturing apparatus of the electronic component which contains the recessed part formed in the template, the bottom wall of the said recessed part is said 1st film thickness adjusting member, and the side wall of the said recessed part is said 2nd film thickness adjusting member.
In claim 11,
Including a recess formed in the mold platen, wherein the application portion is the recess for accommodating the conductive paste, the bottom wall of the recess is the first film thickness adjusting member, and the sidewall of the recess is the first 2. Electronic device manufacturing apparatus to be used as a film thickness adjusting member.
An electronic component body;
An electrode covering an end of the electronic component body;
Have
The end includes an end surface and a side surface following the end surface;
The electronic component is characterized in that the end surface and the side surface have substantially the same thickness.
In claim 16,
The end portion includes a corner portion where the end surface and the side surface intersect,
The thickness of the said electrode which covers the said corner | angular part is an electronic component which is more than the thickness of the said electrode which covers the said end surface.
In claim 16 or 17,
An electronic component having a maximum depth of irregularities on the surface of the electrode of 20 μm or less.