TWI711058B - Manufacturing method and device of electronic component and electronic component - Google Patents

Abstract

The subject of the present invention is to provide an electronic component that can uniformize the coating thickness of the conductive paste layer while preventing or suppressing defects caused by the wire drawing of the conductive paste layer that is dipped and coated on the end surface of the electronic component Manufacturing method and device and electronic components. The solution is to manufacture electronic components with: 　　The first process, which involves immersing the end surface (12) of the electronic component (10) in the impregnation layer (130) of the conductive paste (120) to form a dip coating The conductive paste layer (14) on the end surface of the electronic component; 　　The second process, which is to make the conductive paste layer of the electronic component contact the wetting formed by coating the conductive paste on the plate (100) Layer (140); 　　 the third step, which is to move the electronic component in at least one direction parallel to the surface of the plate while contacting the conductive paste layer with the wetting layer on the platen; and the fourth step, This is to separate the conductive paste layer of the electronic component from the platen side after the third step.

Description

Manufacturing method and device of electronic component and electronic component

The present invention relates to a manufacturing method and device of an electronic component and an electronic component.

The inventor of the present invention proposes an apparatus and method for dip-coating a conductive paste layer on the end surface of an electronic component body such as multilayer ceramic capacitors, inductors, and thermal varistors, and forming external electrodes on the electronic component body (Patent Document 1) . The film thickness of the conductive paste layer only after dip coating cannot be made uniform. Here, it is also proposed that the electronic component body coated with conductive paste is pulled up from the conductive paste film layer formed on the surface of the plate, and then the conductive paste formed at the end of the electronic component body The hanging part of, is in contact with the platen surface where the conductive paste film layer is removed (Patent Document 2). This process is called a blot process because the excess conductive paste on the main body of the electronic component is wiped with a platen. Through the implementation of this painting process, it is expected that a substantially uniform conductive paste layer can be formed at the end of the electronic component body. [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2002-237403 　　 [Patent Document 2] Japanese Patent Application Publication No. 63-45813

[The problem to be solved by the invention]

However, even if the painting process is carried out, after the electronic component body is pulled up from the platen, the conductive paste of the electronic component body will hang down due to its own weight. In addition, the conductive paste on the platen and the conductive paste on the main body of the electronic component may be connected to the conductive paste. Because of this phenomenon, the external electrode of the electronic component body tends to thicken in the portion near the center of the covering end surface, and thin in the portion near the periphery. Furthermore, there is a tendency for the external electrodes of the electronic component body to cover the side surfaces of the end of the electronic component body or the corners where the end surface and the side meet to become thinner.

In addition to hindering the flatness of the surface of the external electrode, such external electrodes also have uneven film thickness. In addition, when an electronic component having such external electrodes is soldered to a substrate, the soldering quality may become unstable.

In recent years, electronic components have continued to become more compact. When the conductive layer is formed at the end of this miniaturized electronic component with a predetermined shape and film thickness, the conventional method of adding a coating process to adjust the film thickness of the end surface in the dip coating method using a fixed plate has a limit. of.

In several aspects of the present invention, its purpose is to provide a method and apparatus for manufacturing an electronic component, and an electronic component, which can improve the film of the conductive layer formed at the end of the miniaturized electronic component by a new method. Thickness, or the conductive layer is formed with a predetermined film thickness. [Means to solve the problem]

(1) One aspect of the present invention is: 　　A method of manufacturing an electronic component, in which the end of at least one electronic component body includes an end surface and a side surface continuous with the end surface, and an electrode is formed at the end to manufacture electronics The method of the part includes: 　　 the first step of forming a conductive paste layer to become the electrode at the end portion; 　　 adjusting the film of the conductive paste layer formed on the end surface before the conductive paste layer is cured The second step of thickening; and the third step of adjusting the film thickness of the conductive paste layer formed on the side surface before the conductive paste layer is cured.

According to one aspect of the present invention, the conductive paste layer formed at the end of the electronic component body is adjusted to have the film thickness of the end surface and the side surface before the conductive paste layer is cured. In particular, because there is a third step of adjusting the thickness of the conductive paste layer formed on the side surface of the electronic component body, the thick portion of the unadjusted film thickness is scraped off, or the thick portion of the film thickness The function of moving to a thin portion etc. not only equalizes the film thickness of the conductive paste formed on the side surface of the electronic component body, but also ensures a predetermined thickness. The second process of adjusting the film thickness of the conductive paste layer formed on the end surface of the electronic component body can be implemented by the above-mentioned conventional painting process or the improved painting process described later. In addition, if the conductive paste layer is hardened after the first process, regardless of the order of the second process and the third process, even if the third process is before or after the second process, the second process and the The third project. Or, as described later, the first to third steps may be implemented at the same time.

(2) According to an aspect (1) of the present invention, the third step may include a step of bringing the conductive paste layer formed on the end surface into contact with a film thickness adjusting member. In this case, the thick part of the unadjusted film thickness may be cut off by the film thickness adjusting member or moved to the thin part.

(3) According to an aspect (2) of the present invention, the third step may include: using a ring-shaped wire as the film thickness adjusting member, and in the ring-shaped wire, disposing the at least one electronic component body The engineering of the aforementioned end. In this case, the film thickness of the conductive paste layer formed on the entire side surface of the end portion can be adjusted at the same time.

(4) According to an aspect (2) of the present invention, wherein the at least one electronic component body may include a plurality of electronic component bodies; wherein, the third step may include: using a mesh member in which wires contact each other at an intersection point as the In the film thickness adjusting member, a plurality of ring-shaped wires are formed on the mesh member, and the end portions of the plurality of electronic component bodies are arranged among the plurality of ring-shaped wires. In this way, the respective ends of the plurality of electronic component bodies are arranged among the plurality of ring-shaped wires in which sound waves propagate in equal directions, and the film thickness adjustment on the side surfaces of the respective ends of the plurality of electronic component bodies can be performed simultaneously.

(5) According to any one of aspects (2) to (4) of the present invention, the third step may include a step of transmitting sound waves to the film thickness adjusting member. In this case, since the vibration energy defined by the frequency and amplitude of the ultrasonic wave is given to the film thickness adjusting member such as the ring-shaped wire, the film thickness can be adjusted more efficiently. Furthermore, the excess conductive paste adhering to the mesh member is dropped due to the vibration of the sound wave, and contamination of the mesh member can be prevented.

(6) As in the aspect (5) attached to the aspect (4) of the present invention, the third step may include: transmitting the sound wave from a part of the outline of the mesh member, The other part of the aforementioned profile makes the aforementioned sound waves reflect. Since sound waves are transmitted in equal directions, sound waves can be transmitted from a part of the contour of the mesh member. Since sound waves are reflected in another part of the contour of the mesh member, the energy of the reflected waves can be used for film thickness adjustment. In addition, it is better to change the frequency of the sound wave in accordance with the arrangement pitch of the electronic component body. For example, it is better to adjust the frequency of the sound wave so that one or half wavelength of the sound wave is substantially equal to the arrangement pitch.

(7) According to an aspect (5) or (6) of the present invention, wherein the aforementioned sound wave may be an ultrasonic wave. Utilizing the high frequency of ultrasonic waves can increase the frequency-dependent energy to adjust the film thickness. In addition, by relatively moving the electronic component body and the film thickness adjustment member, the film thickness adjustment range can be covered.

(8) According to an aspect (1) of the present invention, the second step and the third step may include: accommodating the conductive paste layer formed at the end in a recess formed in the table plate And the process of hardening the conductive paste in the recess. In this case, since the conductive paste layer formed on the end surface and the side surface is cured by adjusting the film thickness in the concave portion, the second process and the third process can be simultaneously performed.

(9) According to an aspect (1) of the present invention, the first step, the second step, and the third step may include: immersing the end portion in a conductive paste filled in a recess formed in a mold plate And the process of hardening the conductive paste in the recess. In this case, the first step is implemented by inserting the end of the electronic component body into the conductive paste layer filled in the recess, and the conductive paste layer formed on the end and side surfaces is adjusted in film thickness in the recess to implement the second The third project. Therefore, the first process, the second process, and the third process can be implemented at the same time.

(10) According to one aspect (1) to (9) of the present invention, before at least one of the first process, the second process, and the third process, there may be more: The end portion of the component body is sandwiched between two wires arranged in the middle to transmit sound waves whose phase is shifted by only half a wavelength, and to core the at least one electronic component body. Because the phases of the peaks in the waveforms of the two sound waves shifted by only half a wavelength are the same, the position of the main body of the electronic component can be corrected by the contact of the two wires that transmit the sound waves. Thereby, it is possible to center the electronic component body with the offset center. As a result, the first process, the second process, and/or the third process after the centering process can be realized with higher accuracy.

(11) Another aspect of the present invention is: 　　 an electronic component manufacturing device, which is used to form an electrode on the end of at least one electronic component body, and has: 　　 in the aforementioned at least one electronic component body The end surface of the end portion and the side surface continuous with the end surface are coated with a conductive paste to form a coating portion of the conductive paste layer; 　　 is in contact with the conductive paste layer formed on the end surface to adjust the conductive paste A first film thickness adjusting member for adjusting the film thickness of the material layer; and a second film thickness adjusting member for adjusting the film thickness of the conductive paste layer in contact with the conductive paste layer formed on the side surface.

According to other aspects of the present invention, the method of manufacturing an electronic component of one aspect (1) of the present invention can be suitably implemented.

(12) According to another aspect (11) of the present invention, wherein the at least one electronic component body may include a plurality of electronic component bodies; wherein, the second film thickness adjusting member may include: a mesh member in which the wires are in contact with each other at the intersection point ; A plurality of ring-shaped wires are formed in the mesh member, and in each of the plurality of ring-shaped wires, the ends of each of the plurality of electronic component bodies are arranged. Thereby, the aspect (4) of the present invention can be suitably implemented.

(13) Another aspect (12) of the present invention may further include a sound wave generating source that transmits sound waves to the second film thickness adjusting member. Thereby, one aspect (5) or (6) of the present invention can be suitably implemented.

(14) According to another aspect (11) of the present invention, comprising: a recess formed in the platen; wherein the bottom wall of the recess is used as the first film thickness adjusting member, and the side wall of the recess is used as the second film Thick adjustment member. Thereby, the aspect (8) of the present invention can be suitably implemented.

(15) According to another aspect (11) of the present invention, comprising: a recess formed in the die plate; wherein the coating part is used as the recess for accommodating the conductive paste, and the bottom wall of the recess is the first 1 film thickness adjusting member, the side wall of the recessed portion is used as the second film thickness adjusting member. Thereby, the aspect (9) of the present invention can be suitably implemented.

(16) Still another aspect of the present invention is: 　　 an electronic component having: an electronic component body; and an end portion covering the aforementioned electronic component body; wherein, 　　 the aforementioned end portion includes: an end surface and a side surface continuous with the aforementioned end surface; 　　 aforementioned The electrode has substantially the same thickness on the end surface and the side surface.

(17) According to still another aspect (16) of the present invention, the "end" includes: a corner where the end face and the side face intersect; "the thickness of the electrode covering the corner is the same as that of the electrode covering the end face Above the thickness.

(18) According to still another aspect (16) or (17) of the present invention, the maximum depth of the surface unevenness of the aforementioned electrode may be 20 μm or less.

[Implementation form]

Hereinafter, a preferred embodiment of the present invention will be described in detail. In addition, the present embodiment described below is not intended to unduly limit the content of the present invention described in the scope of the patent application, and the entire structure described in the present embodiment is not necessarily required as a solution of the present invention.

1. Manufacturing method of electronic component 　　 is shown in FIG. 1 as an electronic component body 1 having an end 2 and an impregnated layer 3 of conductive paste formed with a uniform thickness on a platen (not shown), for example. The end surface 2 includes: an end surface 2A and a side surface 2B connected to the end surface 2A; the manufacturing method of the present embodiment of forming an electrode on the end portion 2 of the electronic component body 1 to manufacture an electronic component includes: forming on the end portion 2 of the electronic component body 1 The first step of the conductive paste layer, the second step of adjusting the film thickness of the conductive paste layer formed on the end face 2A of the electronic component body 1, before the conductive paste layer is cured, the conductive paste layer is cured Before, the third step of adjusting the film thickness of the conductive paste layer formed on the side surface 2B of the electronic component body 1.

1.1. The first embodiment 　　 Fig. 2(A)(B) and Fig. 3(A)(B) show the first process and the third process of the first embodiment. In order to make the description easier to understand, some of the members in the drawing are drawn with exaggerated dimensions. For example, the sizes and shapes of the impregnated layer 3 and the conductive paste layer 4 are enlarged compared with the sizes and shapes of other members.

In order to implement the first process, as shown in FIG. 2(A), the electronic component body 1 and the impregnated layer 3 are relatively moved (up and down), and the end 2 of the electronic component body 1 is impregnated in the impregnated layer 3. After that, as shown in FIG. 2(B), the electronic component body 1 and the impregnated layer 3 are relatively moved (up and down), and the end 2 of the electronic component body 1 is separated from the impregnated layer 3. Thereby, the conductive paste layer 4 is coated and formed on the end portion 2 of the electronic component body 1.

Figure 3 (A) (B) shows the third process. Before or after the third process, for example, the conventional painting process described in Patent Document 2 is implemented as the second process, but the second process will be described later. In order to implement the third process, as shown in FIG. 3(A), for example, a film thickness adjustment member (second film thickness adjustment member) 5A is used. The film thickness adjustment member 5A may be in contact with the conductive paste layer 4 formed on at least one side surface 2B of the entire side surface of the end portion 2 (four sides in this embodiment having a rectangular cross section). Regardless of the shape of the film thickness adjusting member 5A, it may be in line or surface contact with the side surface 2B. However, it may be a film thickness adjusting member that does not contact the conductive paste layer 4, for example, compressed air is ejected from a spray nozzle that is the film thickness adjusting member to adjust the film thickness of the conductive paste layer 4 on the side surface 2B. can.

The film thickness adjusting member is preferably a ring-shaped member. For example, if a ring-shaped wire 5A as shown in FIG. 3(A) is used, the conductive paste layer 4 formed on the entire side surface 2B of the end portion 2 can be adjusted simultaneously. The film thickness. In the third process, as shown in FIG. 3(A), the electronic component body 1 and the ring-shaped wire 5A are relatively moved (up and down), and the end 2 of the electronic component body 1 is arranged in the ring-shaped wire 5A. Thereby, since the conductive paste layer 4 formed on the side surface 2B is brought into contact with the ring member 5A, the thick portion of the film thickness of the unadjusted conductive paste layer 4 formed on the side surface 2B is covered by the ring member. 5A is removed or moved to the thin part. Then, as shown in FIG. 3(B), the electronic component body 1 and the ring-shaped wire 5A are relatively moved (up and down), and the conductive paste layer (also referred to as an electrode) whose film thickness is adjusted is provided on the side surface 2B The end 2 of 4A is separated from the ring-shaped wire 5A. Therefore, the conductive paste layer 4 at the end 2 formed in the first process can be processed into a conductive paste with the end surface 2A and the side surface 2B adjusted in thickness because the second and third processes are performed before the hardening.料层4A.

Fig. 4(A)(B) is a diagram showing the simultaneous implementation of the third process for a plurality of electronic component bodies 1 arranged in one-dimensional or two-dimensional arrangements. At this time, as the film thickness adjustment member, a one-dimensional or two-dimensional arrangement of the mesh member 5 is used for the plurality of ring-shaped wires 5A. As shown in FIG. 5, the ring-shaped wires 5A are arranged in line with the arrangement pitch d of the two electronic component bodies 1, 1 adjacent in the row or column direction. In FIG. 5, they are adjacent in the row or column direction. The two ring-shaped wires 5A do not share wires but are independent of each other. In other words, two wires are arranged between two adjacent electronic component bodies 1 and 1 in the row or column direction. Alternatively, it may be replaced by arranging a single wire shared between two adjacent electronic component bodies 1 and 1 in the row or column direction (see FIG. 7).

1.2. The second embodiment 　　 Fig. 6(A)(B) shows a second embodiment of the present invention in which the third process is implemented using a film thickness adjusting member that transmits sound waves. In FIG. 6(A)(B), the end of a film thickness adjusting member such as a mesh member 5 is connected to an ultrasonic vibration element 6 (in a broad sense, a sound wave generating source). In particular, it is preferable that the mesh member 5 is one where the wires are in contact with each other at the intersection. Moreover, it is preferable to use a wire material that easily transmits sound waves and ultrasonic waves, such as a piano wire, for the mesh member 5. Since sound waves are transmitted in equal directions, the sound waves can be extended in the row direction and column direction of the mesh member 5, and all the wires that contact at the intersection can be transmitted. As shown in FIG. 6(A), if the end 2 is arranged among the plurality of ring-shaped wires 5A formed on the mesh member 5, the ring-shaped wire 5A is given vibration energy defined by the frequency and amplitude of the ultrasonic wave , Can adjust the film thickness more efficiently. In addition, the excess conductive paste attached to the mesh member 5 is dropped due to the vibration of the sound wave, and contamination of the mesh member 5 can be prevented. After that, as shown in FIG. 6(B), the electronic component body 1 and the ring-shaped wire 5 are relatively moved (up and down), and the end 2 on the side surface 2B having the conductive paste layer 4A adjusted by the film thickness is removed from The ring-shaped wire 5A is detached.

The frequency of the sound wave transmitted through the film thickness adjusting member such as the mesh member 5 can be adjusted. Fig. 7 shows the relationship between the wavelength adjusted by the frequency of the sound wave and the distance d between the electronic component bodies 1 and 1. For example, when the pitch is set to d=5.29 mm and the sound wave transmission speed of the mesh member 5 is set to 5290 m/s, the frequency is adjusted. At this time, the frequency is 250kHz wavelength ≒4×d, 500kHz wavelength ≒2d, and 1MHz wavelength ≒d. After selecting that the wavelength of the sound wave is approximately equal to d or the frequency of 2d, the vibration energy imparted to each ring-shaped wire 5d becomes approximately equal. It is expected that the side surface 2B of each end 2 of the plural electronic component body 1 can be adjusted to an equal film thick.

In FIG. 7, the ultrasonic vibration element 6 is arranged on a part of the outline of the mesh member 5 (for example, one side of a substantially rectangular shape), and the ultrasonic vibration element 6 is arranged on another part of the outline of the mesh member 5 (for example, the other side opposite to the side of the substantially rectangular shape). ) Configure the reflective member 7. In this case, the energy of the reflected wave can also be used for film thickness adjustment. In addition, if a sound wave is an ultrasonic wave, the high frequency of the ultrasonic wave can be used to increase the frequency-dependent energy to adjust the film thickness. By relatively moving the electronic component body 1 and the film thickness adjustment member 5, the film thickness adjustment range can be covered.

In addition, in order to adjust the frequency, for example, a waveform monitor is connected to the reflection member 7 to check the length and phase of the wavelength while observing the waveform, and the drive unit connected to the ultrasonic vibration element 6 may be tuned to adjust the frequency. In addition, the vertical and horizontal wires (for example, piano wire) of the mesh member 5 shown in FIG. 7 are provided: a frame not shown in which tension is applied to maintain the mesh shape may be used. In addition, the ultrasonic vibration element 6 is arranged along one side of the mesh member 5 shown in FIG. 7, and it is not limited to those that supply ultrasonic waves to all the wires extending in the lateral direction of FIG. 7, and ultrasonic waves may be supplied to at least one wire. Because the ultrasonic waves are transmitted in the same direction, all the wires in the vertical and horizontal directions are transmitted.

1.3. The third embodiment 　　 The third embodiment of the present invention is, for example, a person who simultaneously implements the second process and the third process after the first process shown in FIG. 2(A)(B). In this third embodiment, as shown in FIG. 8(A), for example, a fixed plate (also referred to as a mold plate) 10 having at least one plurality of recesses 12 formed on the surface is prepared. The bottom wall and the side walls of the recess 12 function as the first and second film thickness adjusting members. In addition, the electronic component body 1 exposes the end portion 2 and is held by a carrier plate (clamp) 20. The carrier plate 20 can also be used in the first and second embodiments. The carrier plate 20 is formed of, for example, an elastic body. The electronic component body 1 has one end remaining and is fitted in the hole 22 to be held by the carrier plate 20.

8(B) to 8(C), the fixed plate 10 and the carrier plate 20 are moved (up and down) relative to each other. In the recess 12 of the fixed plate 10, the conductive paste layer 4 is inserted End 2. Thereby, the conductive paste layer 4 formed on the end surface 2A and the side surface 2B is filmed by the bottom wall (first film thickness adjusting member) and the side walls (second film thickness adjusting member) dividing the recess 12 Thick adjustment. In the recess 12, the conductive paste layer 4 whose film thickness has been adjusted is cured. After that, as shown in FIG. 8(D), the carrier plate 20 is relatively moved with respect to the table 10, and the conductive paste layer 4A formed on the end 2 of the electronic component body 1 is separated from the recess 12 of the table 10.

Among them, the conductive paste is a conductive material with fluidity and high viscosity, which is a suspended dispersion system. When the conductive paste layers 4 and 4A have fluidity, they are placed in the recess 12 to adjust the film thickness, and the platen 10 is heated and dried to accelerate curing in the recess 12. In addition, the amount of the conductive paste layer 4 is preferably adjusted to an amount that does not overflow from the recess 12 of the platen 10.

1.4. The fourth embodiment 　　 The fourth embodiment of the present invention is to implement the first process, the second process, and the third process at the same time. In this fourth embodiment, as shown in FIG. 9(A), the impregnated layer 3 of the conductive paste shown in FIG. 1 is formed in the recess 12 of the die plate 10. That is, in this embodiment, the recessed portion 12 functions as a coating portion in addition to the first and second film thickness adjusting members.

9(B) to 9(C), the fixed plate 10 and the carrier plate 20 are relatively moved (up and down), and the end 2 of the electronic component body 1 is immersed in the recess 12 of the die plate 10 The impregnated layer 3 formed. Thereby, the end portion 2, that is, the end surface 2A and the side surface 2B, are formed by the bottom wall (first film thickness adjusting member) and side walls (second film thickness Adjustment member) to adjust the film thickness. In the recess 12, after the conductive paste layer 4A is hardened, as shown in FIG. 9(D), the carrier plate 20 is moved relative to the die plate 10 to make the conductive paste formed on the end 2 of the electronic component body 1 The layer 4A is detached from the recess 12 of the die plate 10.

2. Manufacturing equipment used in the implementation of the first and second embodiments 2.1. Electronic component manufacturing equipment 　　 Figure 10 shows the manufacturing equipment used in the implementation of the first or second embodiment. This manufacturing device has: a carrier plate (jig) 20, a film thickness adjustment member such as the mesh member 5 shown in Figure 4 (A) (B), Figure 6 (A) (B) or Figure 7 (may be equipped with ultrasonic The vibrating element 6 or the reflector 7 may not be provided), the fixed plate 100.

The carrier plate (clamp) 20 conforms to the contour of the end portion 2 of the electronic component body 1, for example, may have a rectangular hole 22 in a plan view as shown in FIG. 11(A)(B). When the rectangular hole 22 is used, the long sides of the size L11 of the plurality of electronic component bodies 1 processed in batches are aligned with the short sides of the size L21. Therefore, the short side of the electronic component body 1 held by the jig 20 can be aligned with the X direction, for example, and the long side can be aligned with the Y direction, for example. However, the hole 22 is formed in conformity with the contour of the end portion 2 of the electronic component body 1, and is not necessarily rectangular.

When inserting the electronic component body 1 into the rectangular hole 22 of the jig 20 as shown in FIG. 11(A), the insertion guide 150 arranged to overlap the jig 20 can be used. The insertion guide 150 has a circular cone hole 152 and a rectangular hole 154 communicating therewith. The electronic component body 1 inserted into the circular cone hole 152 is guided to the rectangular hole 154 by applying vibration or the like to the insertion guide 150 to be aligned in direction. Thereafter, the electronic component body 1 is elastically fitted into the rectangular hole 22 of the rubber jig 20 by the pressing portion 160.

In FIG. 10, the carrier plate (jig) 20 which hangs down the electronic component main body 1 and hold|maintains is supported by the jig fixing plate 30 in a detachable manner. The base plate 40 is fixed above the jig fixing plate 30, and the platen 100 is arranged below, for example, a film thickness adjustment member (for example, the mesh member 5) is arranged on the side. The base plate 40 is provided with a moving mechanism 50 that moves the clamp fixing plate 30. Among them, the vertical three-axis directions are X, Y, and Z in FIG. 10. The moving mechanism 50 may include an X-axis drive unit 60, a Y-axis drive unit 70, and a Z-axis drive unit 80. The Z-axis drive unit 80 is necessary, but the X-axis drive unit 60 and the Y-axis drive unit 70 may be arbitrary. In addition, the moving mechanism 50 may be one that moves at least one of the clamp fixing plate 30 and the fixed plate 100 at least in the Z-axis direction.

The X-axis drive unit 60 can be constituted by an X stage movable in the X-axis direction relative to the base 40 along the X-axis rail 62. The Y-axis drive unit 70 can be constituted by a Y stage that is movable in the Y-axis direction relative to the X-axis drive unit 60 along the Y-axis rail 72. The Z-axis drive unit 80 is fixed to the Y-axis drive unit 70, for example, and is movable in the Z-axis direction on the Z-axis 82.

The clamp fixing plate 30 is fixed to the Z axis 82. Therefore, the jig fixing plate 30, the jig 20, and the electronic component body 1 move in the Z-axis direction relative to the platen 100 by the moving mechanism 50, and can move along the X-Y plane parallel to the surface of the platen 100. In addition, the mesh member 5 moves forward and backward in the X direction by a moving mechanism not shown. The net-like member 5 is arranged under the jig 20 when the third process is implemented, and otherwise is retracted to the position of FIG. 10.

2.2. Project 1 and Project 2 　　 The following describes the first project, the second project, and the improved second project described in the Taiwan Patent Application No. 105133284 of the applicant in this case.

2.2.1. End face adjustment process before the first process 　　 As shown in FIG. 12(A), the jig 20 holding the electronic component body 1 is fixed to the jig fixing plate 30. FIG. 12(B) shows the adjustment process of the end face height of the electronic component body 1. In FIG. 12(B), the Z-axis drive unit 80 lowers the electronic component body 1 held by the jig 20 with respect to the table 100 on which the conductive paste is not applied, so that the end surface 2A of the electronic component body 1 is brought into contact with Fixing 100. Thereby, the height of the end surface 2A of the electronic component body 1 held by the jig 20 becomes uniform.

2.2.2. The first process 　　 Figure 13 (A) ~ Figure 13 (C) show the conductive paste dip coating process (the first process). In FIG. 13(A), the blade 112 is moved horizontally by the squeegee unit 110, and an impregnated layer 130 of height h1 formed of the conductive paste 130 is formed on the table 100. In FIG. 13(B), the Z-axis drive unit 80 lowers the electronic component body 1 so that the end surface 2A of the electronic component body 1 contacts the impregnated layer 130 on the table 100. After that, as shown in FIG. 13(C), the electronic component body 1 is raised. Thereby, the conductive paste layer 4 is formed on the end 2 of the electronic component body 1.

2.2.3. The second process 　　 Figure 14 (A) ~ Figure 14 (C) show the previous painting process (the second process). In FIG. 14(A), the blade 114 in contact with the surface 101 of the platen 100 is moved horizontally by the scraper unit, and the conductive paste on the platen 100 is scraped. In FIG. 14(B), the electronic component body 1 is lowered, and the conductive paste layer 4 formed at the end 2 of the electronic component body 1 is brought into contact with the platen 100. After that, as shown in FIG. 14(C), the electronic component body 1 is raised.

2.2.4. Second process of improvement 2.2.4.1. Wet type 　　 Figure 15(A) to Figure 15(C) show the painting process performed following Figure 14(A). After the conductive paste is scraped from the table 100, the paste film layer (wetting layer) 140 of the height h2 set by the blade 114 in FIG. 15(A) is formed. That is to say, in the previous painting process, the painting process was performed using the dry plate 100 without the paste film layer, but in this embodiment, the wet state where the paste film layer (wetting layer) 140 is formed is used. Of the fixed plate 100 to implement the painting process.

Next, as shown in FIG. 15(B), the electronic component body 1 is lowered, and the conductive paste layer 4 formed at the end 2 of the electronic component body 1 is brought into contact with the paste film layer (wetting layer) 140. Furthermore, the conductive paste layer 14 is brought into contact with the paste film layer (wetting layer) 140 by the X-axis drive unit 60 and/or the Y-axis drive unit 70 of the moving mechanism 50 shown in FIG. The electronic component body 1 is relatively moved in at least one direction parallel to the surface 101 of the table 100 (for example, at least one of the X-axis direction and the Y-axis direction). After that, as shown in FIG. 15(C), the electronic component body 1 is raised. As a result, because the conductive paste layer 14 is in contact with the paste film layer (wetting layer) 140 on the platen 100 and moves at the same time, it can also make the excess conductivity that is the cause of silking while flattening. The paste is transferred to the side of the platen surface 101 and can be wiped off. The effect of transferring the excess conductive paste to the surface of the platen is comparable to that of making the electronic component in a stationary state as in Patent Document 2, and making the electronic component body 1 parallel to the platen 100 as in the embodiment of the present invention. The effect of movement is more significant.

2.2.4.2. The dry method replaces the wet method shown in FIGS. 15(A) to 15(C), and the conductive paste layer 4 of the electronic component body 1 is brought into contact with the dry without forming the paste film layer (wetting layer) 140 The surface 101 of the platen 100 is in a state, and the electronic component body 1 is relatively moved in at least one direction parallel to the surface 101 of the platen 100, preferably in two or more different directions. In particular, if it is moved in two or more different directions, the effect of transferring excess conductive paste that could not be transferred to the platen 100 side in the previous painting process to the platen 100 side can be improved. .

3. Manufacturing equipment used in the implementation of the third and fourth embodiments 3.1. Manufacturing equipment used in the implementation of the fourth embodiment 　　 Figure 16 shows a manufacturing equipment 200 used in the implementation of the fourth embodiment. In the carrier plate 20 shown in FIG. 16, for example, an elastic body such as rubber (for example, silicone rubber) 20C is arranged in a hole 20B formed in a metal base 20A, and a hole 22 for elastically holding the electronic component body 1 is formed in the elastic body 20C.

On the other hand, the mold 10 shown in FIG. 16 has a hole 10B1 formed in the mold portion 10B, a recess forming member 10B2 is arranged in the hole 10B1, and a recess 12 filled with the conductive paste 3 is formed in the recess forming member 10B2. The recessed portion forming member 10B2 is preferably formed of a material capable of forming the recessed portion 12 with high molding accuracy, such as silicone rubber. The recessed portion forming member B2 can be in contact with, for example, the temperature control portion 10C shown in FIG. 16. Thereby, heat exchange between the temperature control part 10C and the impregnated layer (conductive paste) 3 in the recessed part 12 will be performed by the recessed part forming member 10B2. The temperature control unit 10C can be configured using a heating unit such as a heater, a Peltier device that can switch heating/cooling, or the like. Hardening can be accelerated by heating the conductive paste. After the mold plate (fixed plate) 10 is cooled, the mold plate 10 may shrink, and the relatively concave portion 12 can be expanded, thereby improving the release property of the conductive paste layer 4A.

As shown in FIG. 16, the base 10A of the die plate 10 and the base 24 of the carrier plate 20 are relatively movable (up and down). Thereby, each process of FIG. 9(B)-FIG. 9(D) can be implemented. The base 10A of the die plate 10 and the base 24 of the carrier plate 20 are preferably guided by a guide member 52 when they move relative to each other. For example, the female member 52A on the side of the base 10A and the male member 52B on the side of the base 24 are centered on the recess 12 of the die plate 10 by, for example, taper fitting.

In the plan view (FIG. 17) of the mold 10 when viewed from the direction of the relative movement of the carrier plate 20 and the mold 10, the recess 12 of the mold 10 is larger than the outline (chain line) of the end 2 of the electronic component body 1 It has a large outline (solid line) and has a similar outline (solid line) to the outline (chain line) of the end 2 of the electronic component body 1. In FIG. 17, by the action of the guide member 52, the center P1 of the contour (chain line) of the end portion 2 of the electronic component body 1 coincides with the center P2 of the contour (solid line) of the recess 12.

After ensuring the centering state (P1=P2) shown in FIG. 17, at the end 2 of the electronic component body 1, the conductive paste layer (electricity) 4A is formed with the same shape and film thickness as the design. FIG. 18 shows the electronic component body 1 arranged in the recess 12. The end surface 2 of the electronic component body 1 includes an end surface 2A and a side surface 2B. On the other hand, the recess 12 of the die plate 10 includes a bottom wall 12A facing the end surface 2A, and a side wall 12B facing the side surface 2B. The distance T11L from the left side surface 2B of the electronic component body 1 to the side wall 12B of the recess 12 and the distance T11R from the right side surface 2B of the electronic component body 1 to the side wall 12B of the recess 12 can be made substantially equal. Thereby, the film thickness of the conductive layer 4 formed on the side surface 2B of the end 2 of the electronic component body 1 can be made substantially uniform.

By managing the relative movement distance between the base 10A of the mold 10 and the base 24 of the carrier plate 20, the distance T21 from the end surface 2A of the electronic component body 1 to the bottom wall 12A of the recess 12 and the distance T21 from the side surface 2B of the electronic component body 1 The distances T11R and T11L to the side wall 12B of the recess 12 can be made substantially equal.

In this way, in the end portion 2 of the electronic component body 1, it is possible to ensure that the end surface 2A and the side surface 2B have the necessary sufficient and uniform thickness of the conductive layer 4A. In the conventional dip coating method, the thickness of the conductive layer on the end surface and the side surface of the electronic component body is different due to the weight of the conductive paste layer until the conductive paste layer is lowered. Initially, the thickness of the conductive layer on the end surface 2A and the side surface 2B is substantially equal.

In FIG. 18, the contour of the first corner 12C where the bottom wall 12A of the recess 12 intersects with the side wall 12B is larger than the contour of the second corner 2C where the end surface 2A and the side surface 2B of the electronic component body 1 intersect, and is more The outline of the two corners 2C is similar. In this case, the thickness T31 of the conductive layer 4 covering the first corner 2C where the end surface 2A and the side surface 2B of the electronic component body 1 intersect can be made to be the other thicknesses T11R, T11L, and T21 or more.

3.2. Manufacturing device used in the implementation of the third embodiment The manufacturing device used in the implementation of the third embodiment is provided by: the manufacturing device shown in FIG. 10 (but the X, Y in the mesh member 5 and the moving mechanism 50 are not required) The driving parts 60, 70) are constituted by the manufacturing apparatus shown in FIG. 16 (but the impregnated layer 3 in the recess 12 is not required). The second process of coating the conductive paste layer 4 on the end 2 of the electronic component body 1 shown in FIG. 8(B) is performed by the manufacturing apparatus shown in FIG. 10. By the manufacturing apparatus shown in FIG. 16, the 2nd and 3rd process shown to FIG. 8(C)(D) can be implemented.

4. Electronic component 　　 FIG. 19 shows an electronic component 1A manufactured by the above-mentioned manufacturing method, and FIG. 20 shows a cross section of the conductive layer 4A formed on the electronic component body 1. Here, the size of the electronic component 1A to which the present invention is applied is not particularly limited, and it is suitable for the electronic component 1A that is miniaturized as the size decreases. As an ultra-small electronic component 1A, when the maximum length of one side of the rectangular (square or rectangular) cross section shown in FIG. 19 is set to L1, and the length in the direction perpendicular to the rectangular cross section is set to L2, L1=500μm or less and L2=1000μm or less. Preferably, L1=300 μm or less, L2=600 μm or less, more preferably L1=200 μm or less and L2=400 μm or less, and still more preferably L1=125 μm or less and L2=250 μm or less. In addition, the rectangle referred to here includes not only the corners where the two sides intersect, which is strictly limited to 90°, but also includes those with curved or chamfered corners. In addition, the present invention is of course also applicable to electronic components 1A other than rectangular cross-sections.

4.1. Film thickness of the electrode "In FIG. 20, the substantially uniform thickness T1 of the electrode 4A formed on the end face 2A and the substantially uniform thickness T2 of the electrode 4A formed on the side surface 2B may mean substantially T1=T2. Although this film thickness is the same as the description using FIG. 18 showing the dimensions after the film thickness adjustment of the concave portion 12 (third and fourth embodiments), the first and the first film thickness adjustment members 5A and the like other than the concave portion 12 can also be used. The second embodiment ensures. In particular, according to the third and fourth embodiments, the thickness T3 of the electrode 4A formed in the corner portion 2C can be set to T3≧T1 or T3≧T2. These film thicknesses are clearly different from those after the previous painting process.

4.2 Evaluation of flatness of electrodes 　　 Figure 21 (A) (B) shows the end surface of the electronic component 1A manufactured by the method of this embodiment. As a comparative example, FIG. 22(A)(B) shows the end surface of an electronic component manufactured by performing the painting process (only Z movement) disclosed in Patent Document 2.

By comparing Figure 21 (A) of this embodiment with Figure 22 (A) of the comparative example, it is clear that compared to Figure 21 (A), there is no threading of the conductive paste on the electrode surface. As shown in Figure 22(A), there are clear tubular marks in two places as above. The ring-shaped trace shown in FIG. 22(A) of the comparative example makes the surface of the electrode shown in FIG. 22(B) convex and hinders flatness. Cracking occurs in the trace part, and peeling also occurs. When soldering electronic components to a substrate, only the traces that are easily peeled off are soldered, and soldering quality becomes unstable.

It was found that the maximum depth of the unevenness of the electrode surface caused by the ring-shaped marks in the two places in FIG. 22(B) was 70 to 180 μm. In contrast, in the electronic component of the present embodiment shown in FIG. 21(B), since there are no ring-shaped traces on the electrode, the maximum depth of the unevenness on the electrode surface can be 20 μm or less, preferably 10 μm or less The flatness.

In addition, although the present embodiment has been described in detail as described above, those skilled in the art should understand that many changes can be made without departing from the scope of the novelty and effects of the present invention. Therefore, these modified examples are all included in the scope of the present invention. For example, in the specification or the drawings, at least once, a term that is described together with a different term that is broader or synonymous can be replaced with the different term in any part of the specification or the drawing. In addition, all combinations of the present embodiment and modification examples are included in the scope of the present invention.

Among them, for example, one of the lengths L11 and L21 of the rectangular hole 22 in FIG. 11(B), for example, the length L21 is made longer than the length of the corresponding one of the electronic component body 1, so that as shown in FIG. 11(A) The electronic component body 1 can be easily inserted into the rectangular hole 22. In this case, after the electronic component body 1 is mounted on the jig 20, centering of the electronic component body 1 (for example, positioning in the X-axis or Y-axis direction of FIG. 11(B)) is necessary.

FIG. 23(A)(B) shows the centering jig and the centering method of the electronic component body 1. This centering jig has two wires 5B and 5C which sandwich the electronic component body 1 and arrange them. As shown in FIG. 23(A), the ultrasonic vibration element 6 transmits sound waves whose phases are shifted from each other only by a half-wavelength through the two wires 5B and 5C. When the reflection member 7 is provided, the reflected energy can also be used if the transmitted sound waves are reflected without phase shifting. Because the phases between the peaks in the waveforms of the two sound waves shifted by only half a wavelength are the same, the two vibrating wires 5B and 5C are brought into contact as shown in Figure 24(B) by transmitting the sound waves, and the electrons can be corrected. The position of the component body 1. Thereby, it is possible to center the electronic component body 1 that is offset from the center.

As shown in FIG. 23(A), when there are a plurality of pairs of wires 5B and 5C, sound waves whose phases are shifted in each pair of wires 5B and 5C are supplied. At this time, if the two types of sound waves supplied to the pair of wires 5B and 5C are phase-shifted and supplied to all the other pair of wires 5B and 5C in parallel, only two ultrasonic vibration elements may be provided. Moreover, instead of the centering jig of FIG. 23(A), the mesh member 5 shown in FIG. 6(A)(B) or FIG. 7 may be used as a centering jig. Since the inner size of the ring-shaped wire 5A contained in the mesh member 5 is larger than the distance between the opposed side surfaces of the electronic component body 1, it can be used as a centering jig for the electronic component body 1 before the conductive paste layer 4 is formed. . In addition, if two types of sound waves with phase shift are transmitted to the two wires extending in the horizontal direction in FIG. 7, the two types of sound waves will cancel out in the wires extending in the vertical direction in FIG. 7. Since the wire rod extending in the longitudinal direction of FIG. 7 does not vibrate, it will not adversely affect the centering operation shown in FIG. 23(B).

This core alignment process is at least before the third process in the first and second embodiments, before at least the second and third processes in the third embodiment, and before the first to third processes in the fourth embodiment If implemented separately, the centered electronic component body 1 can be accurately arranged in the ring-shaped wire 5A or the recess 12. Therefore, the centering process may be implemented before at least one of the first process, the second process, and the third process. Thereby, the first process, the second process, and/or the third process after the centering process can be realized with higher accuracy.

In addition, the centering jig and centering method are implemented before any one of the coating process (first process), end surface film thickness adjustment process (second process), or side film thickness adjustment process (third process) It is also possible that the centering effect can be exhibited without the need to accompany the film thickness adjustment process. Therefore, a centering jig and a centering method as an electronic component body mounted on the jig can be more widely defined.

1‧‧‧Electronic component body 1A‧‧‧Electronic component2‧‧‧End 2A‧‧‧End 2B‧‧‧Side 3‧‧‧Impregnated layer 4‧‧‧Conductive paste layer 4A‧‧‧Electrode ( Conductive paste layer) 5‧‧‧Mesh member (second film thickness adjustment member) 5A‧‧‧Ring-shaped wire (second film thickness adjustment member) 5B, 5C‧‧‧Wire 6‧‧‧Sound wave source (Ultrasonic vibration element) 7‧‧‧Reflecting member 10‧‧‧Mould plate (fixing plate) 10C‧‧‧Temperature adjustment part 12‧‧‧Concave part (coating part, first and second film thickness adjustment members) 20 ‧‧‧Clamp 22‧‧‧Rectangular hole 24‧‧‧Cross hole 26‧‧‧Circular hole 30‧‧‧Fixture fixing plate 40‧‧‧Fixing plate 50‧‧‧Moving mechanism 60‧‧‧X-axis driving part 70‧‧‧Y-axis driving part 80‧‧‧Z-axis driving part 100‧‧‧Fitting plate (1st film thickness adjustment member) 101‧‧‧ Surface (fixing plate surface) 110‧‧‧Scraper unit 112, 114‧‧ ‧Blade 130‧‧‧Paste film (impregnation layer) 140‧‧‧Paste film (wetting layer) 150‧‧‧Insert guide 152‧‧‧Round cone hole 154‧‧‧Rectangular hole

[Fig. 1] A diagram schematically showing an impregnated layer of an electronic component body and a conductive paste layer used in the manufacturing method of the present invention.　　[FIG. 2] FIG. 2(A)(B) is a diagram showing the first step of the manufacturing method of the first embodiment of the present invention.　　[FIG. 3] FIG. 3(A)(B) is a diagram showing a third step of the manufacturing method of the first embodiment of the present invention.　　[Fig. 4] Fig. 4(A)(B) is a diagram showing the simultaneous implementation of the third process on multiple electronic component bodies.　　[Figure 5] The side view of the project shown in Figure 4(A).　　 [FIG. 6] FIG. 6(A)(B) is a diagram showing the third step of the manufacturing method of the second embodiment of the present invention.　　[Figure 7] A diagram showing the relationship between the wavelength adjusted by the frequency of the sound wave and the distance between the electronic component body.　　 [FIG. 8] FIGS. 8(A) to 8(D) are diagrams showing the second step and the third step of the manufacturing method of the third embodiment of the present invention.　　 [FIG. 9] FIGS. 9(A) to 9(D) are diagrams showing the first to third processes of the manufacturing method of the fourth embodiment of the present invention.　　 [FIG. 10] A diagram showing a manufacturing apparatus that implements the manufacturing methods of the first and second embodiments of the present invention.　　[Fig. 11] Fig. 11(A)(B) is a diagram showing the insertion guide and carrier plate.　　[Figure 12] Figure 12 (A) (B) is a diagram showing the jig loading process and the end face height adjustment process of electronic components.　　 [FIG. 13] FIGS. 13(A) to 13(C) are diagrams showing the dip coating process (first process) of the conductive paste.　　 [FIG. 14] FIGS. 14(A) to 14(C) are diagrams showing the outline of the conventional painting process (second process) used in the first and second embodiments of the present invention.　　 [FIG. 15] FIGS. 15(A) to 15(C) are diagrams showing an improved painting process (wet-type second process) used in the first and second embodiments of the present invention.　　 [FIG. 16] A diagram showing a manufacturing apparatus that implements the manufacturing methods of the third and fourth embodiments of the present invention.　　[Fig. 17] A diagram illustrating the similar shape between the recess of the die plate and the end surface of the electronic component body.　　[Figure 18] A diagram illustrating the size of the gap between the recess and the end of the electronic component body.　　 [FIG. 19] A schematic perspective view of the electronic component of the embodiment of the present invention.　　[FIG. 20] A diagram showing a cross-section of an electrode formed at the end of an electronic component body.　　[FIG. 21] FIG. 21(A)(B) is a front view and a side view of the external electrode formed on the end surface of the electronic component of the embodiment of the present invention.　　[FIG. 22] FIG. 22(A)(B) is a front view and a side view of the external electrode formed on the end surface of the electronic component of the comparative example.　　[Fig. 23] Fig. 23(A)(B) is a diagram showing the centering jig and the centering process of the electronic component body.

1‧‧‧Electronic component body

4‧‧‧Conductive paste layer

20‧‧‧Fixture

30‧‧‧Fixture fixing plate

82‧‧‧Z axis

100‧‧‧Fitting plate (the first film thickness adjustment member)

101‧‧‧Surface (fixed surface)

110‧‧‧Scraper unit

112‧‧‧Blade

140‧‧‧Paste film layer (wetting layer)

Claims (9)

A method of manufacturing an electronic component, comprising: a first step, which is to immerse the end surface of the electronic component in an impregnation layer of a conductive paste formed on a platen to form a conductive coating that is dip-coated on the end surface of the electronic component The second step is to remove the impregnated layer from the plate, and then contact the conductive paste layer of the electronic component to apply the conductive paste to the plate. Wetting layer; the third step, which is to move the electronic components in at least one direction parallel to the surface of the plate while contacting the conductive paste layer with the wetting layer on the platen, Transferring the excess conductive paste in the conductive paste layer to the wetting layer; and the fourth step, which is to change the conductive paste layer of the electronic component from the aforementioned setting after the third step The disc side is separated. The method for manufacturing an electronic component according to the scope of the patent application, wherein the first step is to bring the end surface of the electronic component into contact with the impregnated layer applied to the platen with a first coating thickness, and The second step is to bring the conductive paste layer of the electronic component into contact with the wetting layer applied to the platen with a second coating thickness that is thinner than the first coating thickness. A method of manufacturing an electronic component, comprising: a first step of immersing an end surface of the electronic component in an impregnation layer of a conductive paste formed on a platen, and forming a conductive paste layer on the end surface of the aforementioned electronic component; The second step is to make the conductive paste layer of the electronic component contact the surface of the table after the impregnated layer is removed from the table; the third step is to make the conductive paste layer While contacting the surface of the platen, the electronic components are relatively moved in at least one direction parallel to the surface of the platen, so that the excess conductive paste in the conductive paste layer is transferred to the lubricating oil. Wet layer; and a fourth step, which is to separate the conductive paste layer of the electronic component from the platen side after the third step. For example, the method for manufacturing an electronic component according to any one of items 1 to 3 in the scope of the patent application, wherein the third process includes: relatively moving the electronic component in a first direction parallel to the surface of the fixed plate The process; and the process of relatively moving the electronic components in the second direction parallel to the surface of the fixed plate that is different from the first direction. For example, the manufacturing method of electronic components in the fourth item of the scope of patent application, wherein, before the first step, the electronic components are held in Work of a jig; in the jig, the electronic component is arranged in such a manner that at least one of the first side of the end surface of the rectangle of the electronic component and the second side adjacent to the first side can face a certain direction, The third process includes a process of relatively moving the electronic component in the first direction parallel to the first side of the electronic component held by the clamp; and making the electronic component move in the same direction as the electronic component held by the clamp. The process of relative movement in the aforementioned second direction where the second side of the electronic component is parallel. An electronic component manufacturing apparatus having: a platen, which is a coating process for applying a conductive paste on the end surfaces of a plurality of electronic components, and a coating process for flattening the conductive paste applied on the end surfaces Engineering; jigs, which hold the plurality of electronic components each having a conductive paste layer that is dip-coated on the end surface; a first moving mechanism, which moves the jigs forward and backward relative to the surface of the platen ; And a second moving mechanism for relatively moving the clamps in at least one direction parallel to the surface of the platen, and the second moving mechanism is for contacting the conductive paste layer with the plated In the state of the wetting layer formed by applying the conductive paste, the jig is moved relatively, and the excess conductive paste in the conductive paste layer is transferred to the wetting layer to implement the Smearing works. An electronic component manufacturing apparatus having: a platen, which is a coating process for applying a conductive paste on the end surfaces of a plurality of electronic components, and a coating process for flattening the conductive paste applied on the end surfaces Engineering; jigs, which hold the plurality of electronic components each having a conductive paste layer that is dip-coated on the end surface; a first moving mechanism, which moves the jigs forward and backward relative to the surface of the platen ; And a second moving mechanism for relatively moving the clamp in at least one direction parallel to the surface of the platen, and the second moving mechanism is for making the conductive paste layer contact the surface of the platen In the state, the jig is relatively moved, and the application process is performed by transferring the excess conductive paste in the conductive paste layer to the wetting layer. An electronic component manufactured by the method described in any one of claims 1 to 6 in the scope of patent application, wherein the end surface has an external electrode formed by the conductive paste layer There are no ring-shaped traces caused by the filaments of the conductive paste that may be formed by the implementation of the fourth step on the surface of the external electrode. An electronic component manufactured by the method described in any one of claims 1 to 6 in the scope of patent application, wherein the end surface has an external electrode formed by the conductive paste layer The maximum depth of the unevenness on the surface of the external electrode is 20 μm or less.

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