JP7199507B2 - Deposition equipment and mounter - Google Patents

Description

The present disclosure relates to a film forming apparatus that forms a thin film of a viscous material, and a mounter that transfers the viscous material with the thin film formed thereon to a mounting component.

Conventionally, various techniques have been proposed for forming a thin film of a viscous material. For example, in the technique described in Patent Document 1 below, flux, conductive paste, conductive adhesive, etc. (hereinafter collectively referred to as "viscous materials") are applied to the concave surface portion for film formation formed on the upper surface of the transfer table. By moving the squeegee placed on the transfer table or the transfer table, the squeegee spreads the flux in the film-forming concave portion uniformly to form a flux film, and a bump is formed on the flux film. In a flux transfer device that transfers flux to a transfer target by immersing a transfer target such as a scraping squeegee for scraping out the used flux in the film-forming concave surface portion by being relatively moved from one side to the other side; A film-forming squeegee that spreads uniformly from one side to the other side to form a flux film, and the scraping-out squeegee is retracted upward when forming the flux film, and retracted upwardly during scraping-out of the flux. and a squeegee switching means for switching.

When this flux transfer apparatus is used, a step of supplying flux into the film-forming concave portion and uniformly spreading the flux by a film-forming squeegee to form a flux film; a step of transferring the flux onto the object to be transferred by immersing it in a flux film; It is preferable to repeat the step of scraping out the used flux from the concave portion. In this manner, no matter how many times the transfer process is repeated, the used flux remaining in the film-forming concave surface of the transfer table is scraped out from the film-forming concave surface by the scraping squeegee each time the transfer process is completed. By performing the squeegee operation of the film-forming squeegee after replacing with the new flux, it is possible to always use the new flux to form a flat, high-quality flux film without unevenness, and the bumps and the like can be formed. Flux can be uniformly transferred to the transfer target. As a result, not only the problem of conventional flux hardening, but also the problem of flux oxidation, deterioration, and deterioration of flux quality due to contamination of micro air can be solved at once. Can improve quality.

JP-A-2004-330261

However, it has been desired to more preferably improve the transfer quality of the viscous material for transfer objects other than bumps, such as a pair of electrodes of a rectangular surface mount component.

The present disclosure has been made in view of the above points, and an object of the present disclosure is to provide a film forming apparatus and a mounter suitable for transferring a viscous material to a pair of electrodes of a rectangular surface mount component. .

The present specification includes a film formation tray having a supply surface on which a viscous material is placed, a squeegee pressed against the supply surface of the film formation tray, and a pair of electrodes of a rectangular surface mount component on the supply surface of the film formation tray. The viscous material is applied to the lower surface of the pair of electrodes protruding downward from the main body of the rectangular surface-mounted component when the pair of electrodes of the rectangular surface-mounted component is moved in and out in the vertical direction. is transferred, and the viscous material removed from the supply surface of the film forming tray by the squeegee is put in by relatively moving the film forming tray and the squeegee. and a pair of recesses , wherein the shape of the opening has a size and shape corresponding to the electrodes of the rectangular surface mount component, and the pair of recesses is provided in plurality on the supply surface of the film forming tray. A film deposition apparatus is disclosed.

According to the present disclosure, the film forming apparatus and the mounter are suitable for transferring the viscous material to the pair of electrodes of the rectangular surface mount component.

It is a top view which shows a film-forming apparatus. 5 is a diagram showing a cross section of the film forming apparatus cut along a line corresponding to line II in FIG. 4; FIG. It is a top view which shows a film-forming apparatus. It is a top view which shows a film-forming apparatus. FIG. 5 is a diagram showing a cross section of the film forming apparatus and the like taken along line II in FIG. 4; FIG. 5 is a diagram showing a cross section of the film forming apparatus and the like taken along line II in FIG. 4; FIG. 5 is a diagram showing a cross section of the film forming apparatus and the like taken along line II in FIG. 4; It is a top view which shows a film-forming apparatus. It is a figure which shows a mounting machine. It is a top view which shows the example of a change of a film-forming apparatus.

Preferred embodiments of the present disclosure will be described in detail below with reference to the drawings. However, in the drawings, a part of the configuration is omitted, and the dimensional ratios of the drawn parts are not necessarily accurate.

As shown in FIG. 1, the film forming apparatus 1 includes a film forming tray 10, a pair of squeegees 30, a slide mechanism 40, and a control device . The deposition tray 10 has a supply surface 12 . The supply surface 12, on which a squeegee 30 is placed, has a generally rectangular shape. In the drawings, the X-axis direction indicates the longitudinal direction of the supply surface 12 , and the Y-axis direction indicates the lateral direction of the supply surface 12 . The Z-axis direction is a direction orthogonal to both the X-axis direction and the Y-axis direction, and indicates the vertical direction.

A pair of concave portions 14 are provided in a matrix on the supply surface 12 of the film forming tray 10 . The pair of recesses 14 is formed by recessing two recesses 14 in the vertical direction (downward) with respect to the supply surface 12 . In the pair of recesses 14, each recess 14 has a rectangular shape in plan view and is symmetrical with respect to a straight line parallel to the Y-axis direction. The short direction of each concave portion 14 coincides with the X-axis direction, and the longitudinal direction of each concave portion 14 coincides with the Y-axis direction. That is, in each recess 14, the opening width WY in the Y-axis direction is longer than the opening width WX in the X-axis direction. The pitch P between two recesses 14 in each pair of recesses 14 will be described later.

Two marks 16 are provided on the supply surface 12 of the film forming tray 10 . The two marks 16 are positioned substantially diagonally on the supply surface 12 outside the region in which the pair of recesses 14 are provided in a matrix.

The pair of squeegees 30 are generally rectangular in plan view and face each other with their longitudinal directions along the Y-axis direction. The pair of squeegees 30 are in contact with the supply surface 12 of the film forming tray 10 over the entire area in the Y-axis direction. is outside the region provided in a matrix, and the pair of recesses 14 and marks 16 do not overlap. A conductive paste 3 is placed on a film formation tray 10 between a pair of squeegees 30 .

The sliding mechanism 40 is connected to the ends of the pair of squeegees 30 in the longitudinal direction outside the film forming tray 10, and slides the pair of squeegees 30 in contact with the supply surface 12 of the film forming tray 10 in the X-axis direction. It is for sliding. Thereby, the film forming tray 10 and the pair of squeegees 30 are relatively moved. Therefore, the X-axis direction is the moving direction in which the film forming tray 10 and the pair of squeegees 30 are relatively moved. The Y-axis direction is a direction perpendicular to the movement direction. Furthermore, the slide mechanism 40 presses the pair of squeegees 30 against the supply surface 12 of the film formation tray 10 . Note that the pair of squeegees 30 may be pressed against the supply surface 12 by a height adjustment mechanism (not shown) or the like.

A control device 42 is connected to the slide mechanism 40 . Thereby, the controller 42 can slide the pair of squeegees 30 to any position in the X-axis direction on the supply surface 12 of the film forming tray 10 by controlling the slide mechanism 40 . Since the slide mechanism 40 and the control device 42 are configured by known technology, detailed description thereof will be omitted.

As shown in FIG. 2 , between the pair of squeegees 30 , the conductive paste 3 is placed on the supply surface 12 of the film forming tray 10 in a raised state. The gap between the pair of squeegees 30 widens toward the supply surface 12 of the film forming tray 10 . Therefore, even if the pair of squeegees 30 reciprocates in the X-axis direction by the control device 42 and the slide mechanism 40, the pair of squeegees 30 can push out the conductive paste 3 while scraping it from the supply surface 12 of the film forming tray 10. It is possible. In this way, when the pair of squeegees 30 move to the recess 14 on the supply surface 12 of the film forming tray 10 , part of the conductive paste 3 enters the recess 14 .

Furthermore, as shown in FIG. 3, on the supply surface 12 of the film forming tray 10, when the pair of squeegees 30 pass through the region where the pair of recesses 14 are provided in a matrix, the recesses 14 A thin film of the conductive paste 3 is formed with a film thickness equal to the depth of . Therefore, the film thickness of the conductive paste 3 is controlled by the depth of the concave portion 14 .

Since the conductive paste 3 is removed by the pair of squeegees 30 on the supply surface 12 of the film forming tray 10, the marks 16 can be imaged.

As shown in FIGS. 4 to 7, the film forming apparatus 1 is arranged such that the lower end portions of the pair of electrodes 54 provided on the body 52 of the rectangular surface mount component 50 are attached to the supply surface 12 of the film forming tray 10 by a pair of electrodes 54 . It is possible to dip into the thin film of the conductive paste 3 formed in the recess 14 of the .

Therefore, the pitch P between the two recesses 14 in each pair of recesses 14 is substantially the same as the spacing between the pair of electrodes 54 provided on the rectangular surface mount component 50 . In addition, the openings of the two recesses 14 in each pair of recesses 14 are provided in the square surface mount component 50 when the square surface mount component 50 is moved to a predetermined position above each pair of recesses 14 . The size (shape) is such that the projected plane in the Z-axis direction (up-down direction) of the pair of electrodes 54 thus formed can be accommodated.

Furthermore, when the thin film of the conductive paste 3 is formed in each recess 14 , the rectangular surface mount component 50 is held by, for example, a suction nozzle 64 provided on the flange 62 of the head 60 . The held rectangular surface mount component 50 is moved to a predetermined position above the pair of recesses 14 by the movement of the head 60, and then lowered and raised. As a result, the lower ends of the pair of electrodes 54 of the rectangular surface mount component 50 are inserted into and removed from the pair of recesses 14 in the vertical direction (Z-axis direction).

At that time, the mark 16 of the film forming tray 10 is imaged in advance by the camera 66 provided on the flange 62 of the head 60, and the image acquired by the image processing is image-processed to obtain a reference for the movement of the head 60. It is said that

In this manner, the conductive paste 3 is transferred to the lower ends of the pair of electrodes 54 of the rectangular surface mount component 50 by dipping them in the thin film of the conductive paste 3 formed in the pair of recesses 14 . be.

On the supply surface 12 of the film forming tray 10, once the transfer of the conductive paste 3 is completed, the pair of squeegees 30 shifts from the state shown in FIGS. When the provided region is passed and the state shown in FIG. 8 is reached, a thin film of the conductive paste 3 is again formed in each recess 14 with the thickness equal to the depth of the recess 14 .

As shown in FIG. 9, the film forming apparatus 1 may be provided in a mounter 58 provided with the above-described head 60, flange 62, suction nozzle 64, camera 66, and the like. In such a case, the mounter 58 moves the rectangular surface mount component 50 held by the suction nozzle 64 to the mounting position of the board 68 by moving the head 60 , and removes the rectangular surface mount component 50 from the suction nozzle 64 . By detaching, the rectangular surface mount component 50 is attached to the substrate 68 .

As described in detail above, the film forming apparatus 1 and the mounter 58 of this embodiment are suitable for transferring the conductive paste 3 to the pair of electrodes 54 of the rectangular surface mount component 50 .

Further, in the mounter 58 of the present embodiment, the rectangular surface mount component 50 is held by the suction nozzle 64 when the conductive paste 3 is transferred. At this time, unlike the present embodiment, when the main body 52 and the pair of electrodes 54 of the rectangular surface mount component 50 are dipped in the thin film of the conductive paste 3 , the rectangular surface mount component 50 is dipped into the thin film of the conductive paste 3 . As a result, the rectangular surface mount component 50 may be detached from the suction nozzle 64 and left behind on the thin film of the conductive paste 3 . However, in the mounter 58 of this embodiment, the main body 52 of the rectangular surface mount component 50 is not dipped in the thin film of the conductive paste 3, and the lower ends of the pair of electrodes 54 of the rectangular surface mount component 50 are not dipped. However, since it is dipped in the thin film of the conductive paste 3 , it is possible to prevent the above-described situation in which the rectangular surface mount component 50 is left behind in the thin film of the conductive paste 3 .

Incidentally, in this embodiment, the conductive paste 3 is an example of a viscous material. The slide mechanism 40 is an example of a driving section. The control device 42 is an example of a control section. The X-axis direction is an example of the movement direction. The Y-axis direction is an example of a direction orthogonal to the movement direction. The Z-axis direction is an example of the vertical direction.

It should be noted that the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present disclosure.

For example, as shown in FIG. 10, on the supply surface 12 of the film forming tray 10, the recesses 14 may be connected in the Y-axis direction. In such a case, in each pair of recesses 14, the opening shape of the two recesses 14 is an elongated shape like a so-called rail.

Each concave portion 14 may have a lateral direction aligned with the Y-axis direction and a longitudinal direction aligned with the X-axis direction. Further, the lateral direction and longitudinal direction of each recess 14 may not coincide with the X-axis direction and the Y-axis direction.

In the pair of recesses 14, the two recesses 14 are such that a pair of electrodes provided on a rectangular surface mount component (an object to which the conductive paste 3 is transferred) can be inserted/removed in the vertical direction (Z-axis direction). If so, it may have a circular, triangular, square, or other polygonal shape in plan view.

Instead of the conductive paste 3 , a viscous material such as solder or flux may be placed on the supply surface 12 of the film forming tray 10 .

The pair of squeegees 30 may be reciprocated in the Y-axis direction. One of the pair of squeegees 30 may be omitted.

By sliding the film forming tray 10, the film forming tray 10 and the pair of squeegees 30 may be moved relatively. Alternatively, the film forming tray 10 and the pair of squeegees 30 may be moved relatively by sliding the film forming tray 10 and the pair of squeegees 30 at the same time.

The film forming apparatus 1 may be of a so-called rotary type in which the film forming tray 10 or the pair of squeegees 30 rotate.

REFERENCE SIGNS LIST 1 film forming device 3 conductive paste 10 film forming tray 12 supply surface 14 concave portion 16 mark 30 squeegee 40 slide mechanism 42 control device 50 rectangular surface mount component 54 electrode 58 mounter 60 head 68 substrate P pitch WX opening width WY opening width

Claims (6)

a deposition tray having a supply surface on which the viscous material is placed;
a squeegee pressed against the supply surface of the deposition tray;
On the supply surface of the film formation tray, the electrodes are provided at a pitch corresponding to the space between the pair of electrodes of the square surface mount component, and the pair of electrodes of the square surface mount component are vertically inserted and removed. The film-forming tray and the squeegee are moved relatively to each other. a pair of recesses configured to receive viscous material removed from the supply surface of the deposition tray by the squeegee ,
The shape of the opening has a size and shape corresponding to the electrode of the rectangular surface mount component,
The film forming apparatus , wherein the pair of concave portions is provided in plurality on the supply surface of the film forming tray . 2. The film forming apparatus according to claim 1, wherein the opening shape of said pair of concave portions is a strip shape corresponding to a pair of electrodes of said rectangular surface mount component. 3. The film forming apparatus according to claim 1, wherein the opening width of said pair of concave portions is longer in a direction orthogonal to said moving direction than said moving direction in which said film forming tray and said squeegee are relatively moved. . 4. The apparatus according to any one of claims 1 to 3 , further comprising a mark provided on the supply surface of the film formation tray and serving as a reference when the pair of electrodes of the rectangular surface mount component is inserted and removed in the vertical direction. The film forming apparatus according to . a driving unit that reciprocates the film formation tray or the squeegee;
5. The film forming apparatus according to any one of claims 1 to 4 , further comprising a control section that controls the driving section. A film forming apparatus according to any one of claims 1 to 5 ;
The viscous material in the pair of recesses is removed by holding the square surface mount component and moving the pair of electrodes projecting downward from the main body of the square surface mount component into and out of the pair of recesses in the vertical direction. and a head for transferring onto the lower surface of a pair of electrodes of the rectangular surface-mounted component and mounting the rectangular surface-mounted component on a substrate.

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