WO2020178996A1

WO2020178996A1 - Film-forming apparatus and mounting machine

Info

Publication number: WO2020178996A1
Application number: PCT/JP2019/008749
Authority: WO
Inventors: 桂資太田
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-03-06
Filing date: 2019-03-06
Publication date: 2020-09-10
Also published as: JP7199507B2; JPWO2020178996A1

Abstract

This film-forming apparatus is provided with: a film-forming tray having a feed surface on which a viscous material is to be placed; a squeegee which is to be pushed against the feed surface of the film-forming tray; and a pair of recesses that are provided to the feed surface of the film-forming tray so as to be arranged at a pitch corresponding to a pitch between a pair of electrodes of a square-surface mounting component, that have openings enabling the pair of electrodes of the square-surface mounting component to be taken in and out in the vertical direction, and that are configured to be able to receive the viscous material which is removed from the feed surface of the film-forming tray by the squeegee as a result of the film-forming tray and the squeegee being moved relative to each other.

Description

Film forming equipment and mounting machine

The present disclosure relates to a film forming apparatus that forms a thin film of a viscous material and a mounting machine that transfers the viscous material having the thin film formed thereon to a mounting component.

Conventionally, various techniques have been proposed for forming a thin film of a viscous material. For example, in the technique described in Patent Document 1 below, flux, conductor paste, conductive adhesive, etc. (hereinafter collectively referred to as “viscous material”) are formed on the film-forming concave portion formed on the upper surface of the transfer table. By supplying and moving the squeegee arranged on the transfer table or the transfer table, the flux in the concave portion for film formation is uniformly spread by the squeegee to form a flux film, and the flux film is bumped. In a flux transfer device for transferring a flux to a transfer target by immersing the transfer target such as a transfer target in one side of the film formation recessed part in contact with the bottom surface of the film formation recessed part. Squeegee for scraping out the used flux in the film-forming concave surface relative to the other side, and the flux supplied in the film-forming concave surface for the film-forming concave surface. A film forming squeegee that uniformly spreads from one side to the other side to form a flux film, and the scraping squeegee is retracted upward when forming the flux film, and the film forming squeegee is retracted upward when flux is scraped out. And a squeegee switching means for causing the change.

When this flux transfer device is used, a step of supplying flux into the film-forming concave surface portion to uniformly spread the flux with a film-forming squeegee to form a flux film, The step of transferring the flux to the transfer object by immersing it in a flux film, and the film formation by the scraping squeegee in a state where the scraping squeegee is brought into contact with the bottom surface of the film forming concave portion. It is advisable to repeat the process of scraping out the used flux in the concave surface portion. By doing this, no matter how many times the transfer process is repeated, the used flux remaining in the film-forming concave surface portion of the transfer table is scraped out of the film-forming concave surface portion by the scraping squeegee after each transfer step, By replacing the flux with a new flux and then performing the squeegee operation of the squeegee for film formation, it is possible to always use the new flux to form a flat, high-quality flux film with no irregularities. The flux can be uniformly transferred to the transfer target. As a result, not only the problems of conventional flux hardening, but also the problems of flux quality deterioration due to flux oxidation, deterioration, and micro air mixing can be solved at once, and flux transfer to a transfer target such as a bump is possible. The quality can be improved.

JP-A-2004-330261

However, it has been desired to improve the transfer quality of the viscous material more preferably for the transfer target other than the bump, for example, the pair of electrodes included in the square surface mount component.

The present disclosure has been made in view of the above points, and an object thereof is to provide a film forming apparatus and a mounting machine suitable for transferring a viscous material to a pair of electrodes included in a rectangular surface mounting component. ..

The present specification describes a film forming tray having a supply surface on which a viscous material is placed, a squeegee pressed against the supply surface of the film forming tray, and a pair of electrodes between a pair of electrodes of a square surface mount component on the supply surface of the film forming tray. The pair of electrodes of the square surface mount component, which are provided at a pitch corresponding to, have an opening shape that allows the electrodes to be taken in and out in the vertical direction, and the film formation tray and the squeegee are moved relatively to form a film with the squeegee. Disclosed is a film forming apparatus including a pair of recesses configured to receive the viscous material removed from the supply surface of the tray.

According to the present disclosure, the film forming apparatus and the mounter are suitable for transferring the viscous material to the pair of electrodes included in the rectangular surface mount component.

It is a top view which shows a film-forming apparatus. FIG. 6 is a diagram showing a cross section of the film forming apparatus taken along a line corresponding to line II of FIG. 4. It is a top view which shows a film-forming apparatus. It is a top view which shows a film-forming apparatus. It is a figure which shows the cross section which the film forming apparatus and the like were cut by the line I-I of FIG. It is a figure which shows the cross section which the film forming apparatus and the like were cut by the line I-I of FIG. FIG. 6 is a view showing a cross section of the film forming apparatus and the like taken along line II of FIG. 4. It is a top view which shows a film-forming apparatus. It is a figure which shows a mounting machine. It is a top view which shows the example of a change of a film-forming apparatus.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. However, in the drawings, a part of the configuration is omitted and drawn, and the dimensional ratios of the drawn parts are not necessarily accurate.

As shown in FIG. 1, the film forming apparatus 1 includes a film forming tray 10, a pair of squeegees 30, a slide mechanism 40, and a controller 42. The film forming tray 10 has a supply surface 12. The supply surface 12 on which the squeegee 30 is placed has a generally rectangular shape. In the drawings, the X-axis direction indicates the longitudinal direction of the supply surface 12, and the Y-axis direction indicates the lateral direction of the supply surface 12. The Z-axis direction is a direction orthogonal to both the X-axis direction and the Y-axis direction, and indicates the vertical direction.

A pair of recesses 14 are provided in a matrix on the supply surface 12 of the film forming tray 10. The pair of recesses 14 are formed by recessing two recesses 14 in the direction perpendicular to the supply surface 12 (downward). In the pair of recesses 14, each recess 14 has a rectangular shape in a plan view and is line-symmetric with respect to a straight line parallel to the Y-axis direction. The lateral direction of each recess 14 coincides with the X-axis direction, and the longitudinal direction of each recess 14 coincides with the Y-axis direction. That is, in each recess 14, the opening width WY in the Y-axis direction is longer than the opening width WX in the X-axis direction. The pitch P and the like of the two recesses 14 in each pair of recesses 14 will be described later.

Two marks 16 are provided on the supply surface 12 of the film forming tray 10. The two marks 16 are located on a substantially diagonal line of the supply surface 12 outside the region where the pair of recesses 14 are provided in a matrix.

The pair of squeegees 30 has a generally rectangular shape in a plan view, and their longitudinal directions face each other along the Y-axis direction. The pair of squeegees 30 are in contact with the supply surface 12 of the film forming tray 10 over the entire area in the Y-axis direction, and when located on the edge side of the supply surface 12 in the X-axis direction, the pair of recesses 14 are formed. Are outside the region provided in a matrix, and do not overlap the pair of recesses 14 and the marks 16. The conductive paste 3 is placed on the film forming tray 10 between the pair of squeegees 30.

The slide mechanism 40 is connected to the ends of the pair of squeegees 30 on the longitudinal direction side outside the film deposition tray 10, and the pair of squeegees 30 contacting the supply surface 12 of the film deposition tray 10 in the X-axis direction. It is a slide. As a result, the film forming tray 10 and the pair of squeegees 30 are relatively moved. Therefore, the X-axis direction is a movement direction in which the film deposition tray 10 and the pair of squeegees 30 are relatively moved. The Y-axis direction is a direction orthogonal to the moving direction. Further, the slide mechanism 40 presses the pair of squeegees 30 against the supply surface 12 of the film forming tray 10. The pair of squeegees 30 may be pressed against the supply surface 12 by a height adjusting mechanism (not shown) or the like.

The control device 42 is connected to the slide mechanism 40. Accordingly, the control device 42 can slide the pair of squeegees 30 on the supply surface 12 of the film forming tray 10 to any position in the X-axis direction by controlling the slide mechanism 40. Since the slide mechanism 40 and the control device 42 are configured by known technology, detailed description thereof will be omitted.

As shown in FIG. 2, between the pair of squeegees 30, the conductive paste 3 is placed on the supply surface 12 of the film forming tray 10 in a raised state. The distance between the pair of squeegees 30 increases toward the supply surface 12 of the film forming tray 10. Therefore, even if the pair of squeegees 30 reciprocate in the X-axis direction by the control device 42 and the slide mechanism 40, the pair of squeegees 30 can push out the conductive paste 3 while scraping the conductive paste 3 from the supply surface 12 of the film forming tray 10. It is possible. In this manner, on the supply surface 12 of the film forming tray 10, when the pair of squeegees 30 move to the recess 14, a part of the conductive paste 3 enters the recess 14.

Further, as shown in FIG. 3, on the supply surface 12 of the film forming tray 10, when the pair of squeegees 30 pass over the region where the pair of recesses 14 are provided in a matrix, the recesses 14 are formed in each recess 14. A thin film of the conductive paste 3 having a film thickness of 3 is formed. Therefore, the film thickness of the conductive paste 3 is controlled by the depth of the recess 14.

Incidentally, on the supply surface 12 of the film forming tray 10, the conductive paste 3 is removed by the pair of squeegees 30, so that the mark 16 can be imaged.

As shown in FIGS. 4 to 7, the film forming apparatus 1 includes a pair of lower end portions of a pair of electrodes 54 provided on the main body 52 of the rectangular surface mount component 50 on the supply surface 12 of the film forming tray 10. It is possible to dip the thin film of the conductive paste 3 formed in the recess 14 of the above.

Therefore, the pitch P of the two recesses 14 in each pair of recesses 14 is substantially the same as the distance between the pair of electrodes 54 provided in the square surface mount component 50. In addition, the openings of the two recesses 14 in each pair of recesses 14 are provided in the square surface mount component 50 when the square surface mount component 50 is moved to a predetermined position above each pair of recesses 14. The size (shape) is such that the projection plane of the pair of electrodes 54 in the Z-axis direction (vertical direction) can be accommodated.

Further, when a thin film of the conductive paste 3 is formed in each recess 14, the square surface mount component 50 is held by the suction nozzle 64 provided on the flange 62 of the head 60, for example. The held square surface-mounted component 50 is moved to a predetermined position above the pair of recesses 14 by the movement of the head 60, and then is lowered and raised. As a result, the lower ends of the pair of electrodes 54 included in the square surface mount component 50 are inserted into and removed from the pair of recesses 14 in the vertical direction (Z-axis direction).

At that time, the mark 16 of the film forming tray 10 is captured in advance by the camera 66 provided on the flange 62 of the head 60, and the image obtained by the image processing is subjected to image processing, whereby a reference of the movement of the head 60 is obtained. It is said that

In this way, the lower ends of the pair of electrodes 54 included in the rectangular surface mount component 50 are dipped on the thin film of the conductive paste 3 formed in the pair of recesses 14, so that the conductive paste 3 is transferred. It

On the supply surface 12 of the film forming tray 10, when the transfer of the conductive paste 3 is once completed, the pair of squeegees 30 form the pair of concave portions 14 in a matrix form from the state shown in FIGS. 3 and 4. When the state shown in FIG. 8 is reached after passing through the provided region, a thin film of the conductive paste 3 having a thickness of the depth of the recess 14 is formed again in each recess 14.

As shown in FIG. 9, the film forming apparatus 1 may be provided in a mounting machine 58 provided with the above-described head 60, flange 62, suction nozzle 64, camera 66, and the like. In such a case, the mounting machine 58 moves the square surface mount component 50 held by the suction nozzle 64 to the mounting position of the substrate 68 by moving the head 60, and the square surface mount component 50 is removed from the suction nozzle 64. The square surface mount component 50 is mounted on the substrate 68 by being detached.

As described in detail above, the film forming apparatus 1 and the mounter 58 of this embodiment are suitable for transferring the conductive paste 3 to the pair of electrodes 54 included in the square surface mount component 50.

Further, in the mounting machine 58 of this embodiment, the rectangular surface mount component 50 when the conductive paste 3 is transferred is held by the suction nozzle 64. At this time, unlike the present embodiment, when the main body 52 and the pair of electrodes 54 of the square surface mount component 50 are dipped in the thin film of the conductive paste 3, the square surface mount component 50 is changed to the thin film of the conductive paste 3. There is a possibility that the force for pulling away from the square surface mounting component 50 becomes large and the square surface mount component 50 is separated from the suction nozzle 64 and left behind in the thin film of the conductive paste 3. However, in the mounting machine 58 of the present embodiment, the main body 52 of the square surface mount component 50 is not dipped in the thin film of the conductive paste 3, and the lower end portions of the pair of electrodes 54 included in the square surface mount component 50 are included. However, since it is dipped in the thin film of the conductive paste 3, it is possible to prevent the above-mentioned situation in which the rectangular surface mount component 50 is left behind in the thin film of the conductive paste 3.

By the way, in the present embodiment, the conductive paste 3 is an example of a viscous material. The slide mechanism 40 is an example of a drive unit. The control device 42 is an example of a control unit. The X-axis direction is an example of the moving direction. The Y-axis direction is an example of a direction orthogonal to the moving direction. The Z-axis direction is an example of the vertical direction.

The present disclosure is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present disclosure.

For example, as shown in FIG. 10, on the supply surface 12 of the film forming tray 10, the recesses 14 may be continuous in the Y-axis direction. In such a case, in each pair of recesses 14, the opening shape of the two recesses 14 is a long shape like a so-called rail.

The lateral direction of each recess 14 may coincide with the Y-axis direction, and the longitudinal direction thereof may coincide with the X-axis direction. Further, the width direction and the length direction of each recess 14 may not be aligned with the X axis direction and the Y axis direction.

In the pair of recesses 14, the two recesses 14 are such that a pair of electrodes provided on the rectangular surface mount component (transfer target of the conductive paste 3) can be inserted and removed in the vertical direction (Z-axis direction). If it exists, it may have a circular, triangular, square, or other polygonal shape in a plan view.

Instead of the conductive paste 3, solder, flux, or the like may be placed on the supply surface 12 of the film forming tray 10 as a viscous material.

The pair of squeegees 30 may be reciprocated in the Y-axis direction. Of the pair of squeegees 30, any squeegee 30 may be omitted.

The film deposition tray 10 and the pair of squeegees 30 may be moved relative to each other by sliding the film deposition tray 10. Alternatively, the film deposition tray 10 and the pair of squeegees 30 may be moved relative to each other by simultaneously sliding the film deposition tray 10 and the pair of squeegees 30.

The film forming apparatus 1 may be a so-called rotary type in which the film forming tray 10 or the pair of squeegees 30 rotate.

1 Film Forming Device 3 Conductive Paste 10 Film Forming Tray 12 Supply Surface 14 Recess 16 Mark 30 Squeegee 40 Slide Mechanism 42 Control Device 50 Square Surface Mount Component 54 Electrode 58 Mounting Machine 60 Head 68 Substrate P Pitch WX Opening Width WY Opening Width

Claims

A deposition tray having a supply surface on which the viscous material is placed,
A squeegee pressed against the supply surface of the film forming tray;
On the supply surface of the film formation tray, a pair of electrodes provided in the square surface mount component is provided at a pitch corresponding to the pair of electrodes, and a pair of electrodes of the square surface mount component has an opening shape that can be taken in and out in the vertical direction. And a pair of recesses configured such that the viscous material removed from the supply surface of the film forming tray by the squeegee can be placed by moving the film forming tray and the squeegee relatively. A film forming apparatus provided.
The film forming apparatus according to claim 1, wherein the opening shape of the pair of recesses is a strip shape corresponding to the pair of electrodes included in the rectangular surface mount component.
The film forming apparatus according to claim 1, wherein the opening shape of the pair of recesses is a long shape.
The opening width of the pair of recesses is greater in a direction orthogonal to the moving direction than in a moving direction in which the film forming tray and the squeegee are relatively moved. The film forming apparatus described.
5. A mark provided on the supply surface of the film formation tray, which serves as a reference when a pair of electrodes of the rectangular surface-mounted component is taken in and out in the vertical direction. The film forming apparatus according to.
A drive unit for reciprocating the film forming tray or the squeegee,
The film forming apparatus according to claim 1, further comprising a control unit that controls the drive unit.
A film forming apparatus according to any one of claims 1 to 6,
The square surface mount component holds the square surface mount component and causes the pair of electrodes included in the square surface mount component to move in and out of the pair of recesses in the vertical direction so that the viscous material in the pair of recesses becomes A mounting machine provided with a head for transferring to a pair of electrodes, and mounting the square surface mount component on a substrate.