ATE302542T1 - Zusammensetzung sowie verfahren zum niederschlagen von lötmittel - Google Patents

Zusammensetzung sowie verfahren zum niederschlagen von lötmittel

Info

Publication number
ATE302542T1
ATE302542T1 AT03250786T AT03250786T ATE302542T1 AT E302542 T1 ATE302542 T1 AT E302542T1 AT 03250786 T AT03250786 T AT 03250786T AT 03250786 T AT03250786 T AT 03250786T AT E302542 T1 ATE302542 T1 AT E302542T1
Authority
AT
Austria
Prior art keywords
composition
circuit board
depositing solder
phosphines
lead
Prior art date
Application number
AT03250786T
Other languages
English (en)
Inventor
Kazuki Ikeda
Hiroshi Tanaka
Original Assignee
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemicals Inc filed Critical Harima Chemicals Inc
Application granted granted Critical
Publication of ATE302542T1 publication Critical patent/ATE302542T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT03250786T 2002-02-28 2003-02-07 Zusammensetzung sowie verfahren zum niederschlagen von lötmittel ATE302542T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002052849A JP4142312B2 (ja) 2002-02-28 2002-02-28 析出型はんだ組成物及びはんだ析出方法

Publications (1)

Publication Number Publication Date
ATE302542T1 true ATE302542T1 (de) 2005-09-15

Family

ID=27750903

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03250786T ATE302542T1 (de) 2002-02-28 2003-02-07 Zusammensetzung sowie verfahren zum niederschlagen von lötmittel

Country Status (8)

Country Link
US (1) US6923875B2 (de)
EP (1) EP1342726B1 (de)
JP (1) JP4142312B2 (de)
KR (1) KR100837511B1 (de)
CN (1) CN1298491C (de)
AT (1) ATE302542T1 (de)
DE (1) DE60301286T2 (de)
TW (1) TWI229023B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4094982B2 (ja) * 2003-04-15 2008-06-04 ハリマ化成株式会社 はんだ析出方法およびはんだバンプ形成方法
JP4357940B2 (ja) * 2003-06-09 2009-11-04 パナソニック株式会社 実装基板の製造方法
US20050217757A1 (en) * 2004-03-30 2005-10-06 Yoshihiro Miyano Preflux, flux, solder paste and method of manufacturing lead-free soldered body
JP4760710B2 (ja) * 2004-08-31 2011-08-31 千住金属工業株式会社 はんだ付け用フラックス
US20060147683A1 (en) 2004-12-30 2006-07-06 Harima Chemicals, Inc. Flux for soldering and circuit board
CN101051535B (zh) * 2006-04-06 2012-09-19 日立电线株式会社 配线用导体及其制造方法、终端连接部、无铅焊锡合金
US7569164B2 (en) 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
CN101234455B (zh) * 2007-01-30 2012-03-28 播磨化成株式会社 焊锡膏组合物及焊锡预涂法
EP1952935B1 (de) * 2007-02-01 2016-05-11 Harima Chemicals, Inc. Lötpastenzusammensetzung und Lötvorbeschichtungsverfahren
KR101170640B1 (ko) * 2007-02-09 2012-08-02 하리마 카세이 가부시키가이샤 땜납 페이스트 조성물 및 땜납 프리코트법
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
US8070043B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070047B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8070044B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Polyamine flux composition and method of soldering
US8430294B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Amine, carboxylic acid flux composition and method of soldering
US8430293B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable amine, carboxylic acid flux composition and method of soldering
US8434667B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
US8434666B2 (en) 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
EP2617859B1 (de) * 2012-01-20 2016-11-30 Rohm and Haas Electronic Materials LLC Verbessertes Flussverfahren für Zinn und Zinnlegierungen
US8888984B2 (en) 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8980077B2 (en) 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
KR101401477B1 (ko) * 2012-08-02 2014-05-29 주식회사 엘지화학 이차전지용 커넥팅 부품, 이를 포함하는 배터리 모듈 및 배터리 팩
CN103635017B (zh) * 2012-08-24 2016-12-28 碁鼎科技秦皇岛有限公司 电路板及其制作方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2950184A (en) * 1957-06-06 1960-08-23 Glidden Co Process for preparing powdered silversolder compositions
DE3716640C2 (de) * 1986-05-19 1996-03-28 Harima Chemicals Inc Verfahren zur Herstellung eines Metallüberzuges auf einem Substratmetall
JPH0747233B2 (ja) * 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
JPH0692034B2 (ja) 1989-08-23 1994-11-16 ユーホーケミカル株式会社 無洗浄タイプのフラックス及びはんだペースト
US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
JP3392924B2 (ja) 1993-12-06 2003-03-31 ハリマ化成株式会社 半田組成物
WO1995015834A1 (fr) * 1993-12-06 1995-06-15 The Furukawa Electric Co., Ltd. Composition pour depot de soudure et procede d'encapsulation l'utilisant
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤
US5567553A (en) * 1994-07-12 1996-10-22 International Business Machines Corporation Method to suppress subthreshold leakage due to sharp isolation corners in submicron FET structures
JP3480634B2 (ja) 1995-11-16 2003-12-22 松下電器産業株式会社 はんだ付け用フラックス
WO1997039610A1 (en) * 1996-04-18 1997-10-23 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
JP4368946B2 (ja) * 1996-08-16 2009-11-18 ダウ・コーニング・コーポレーション 印刷可能組成物、並びにその印刷回路板の製造に用いる誘電表面への適用
US5985043A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
JP4017088B2 (ja) 1997-08-07 2007-12-05 ハリマ化成株式会社 ソルダペースト
JP3394703B2 (ja) * 1998-03-16 2003-04-07 ハリマ化成株式会社 半田用フラックス

Also Published As

Publication number Publication date
US20030159761A1 (en) 2003-08-28
CN1440854A (zh) 2003-09-10
TWI229023B (en) 2005-03-11
EP1342726B1 (de) 2005-08-17
EP1342726A1 (de) 2003-09-10
US6923875B2 (en) 2005-08-02
DE60301286T2 (de) 2006-06-01
DE60301286D1 (de) 2005-09-22
JP2003251494A (ja) 2003-09-09
JP4142312B2 (ja) 2008-09-03
KR100837511B1 (ko) 2008-06-12
CN1298491C (zh) 2007-02-07
KR20030071478A (ko) 2003-09-03
TW200303246A (en) 2003-09-01

Similar Documents

Publication Publication Date Title
DE60301286D1 (de) Zusammensetzung sowie Verfahren zum Niederschlagen von Lötmittel
EP1001054A3 (de) Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
EP1698218A4 (de) Metallstruktur-erzeugungsverfahren, dadurch erhaltene metallstruktur, leiterplatte, verfahren zur erzeugung eines leitfähigen films und dadurch erhaltener leitfähiger film
KR100594837B1 (ko) 회로기판 및 회로기판의 제조 방법
EP1780309B8 (de) Zusammensetzung und Verfahren zur Haftfähigkeitsverbesserung der polymerischen Materialien auf Kupfer- oder Kupferlegierungsoberflächen
DE60105305D1 (de) Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen
ATE129845T1 (de) Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern.
MY163049A (en) Method for reducing creep corrosion
DE60104140D1 (de) Verfahren zum herstellen einer gegen störstrahlung abgeschirmten gedruckten leiterplatte
NL187643C (nl) Werkwijze voor het door middel van elektrolyse vormen van een de hechting aan een substraat verbeterende bekledingslaag op een koperfolie.
ATA24798A (de) Verfahren zum abscheiden von verbindungen aus zinkmetallbädern
DE59009928D1 (de) Verfahren zum Beloten von Leiterplatten.
MY158861A (en) Deposition and patterning process
EP1383365A4 (de) Verdrahtungs-board und lötverfahren dafür
FR2811475B1 (fr) Procede de fabrication d'un composant electronique de puissance, et composant electronique de puissance ainsi obtenu
FI98899B (fi) Menetelmä elektroniikan komponenttien liittämiseksi juottamalla
TW200715593A (en) Functional element package and manufacturing method thereof
DE60031479D1 (de) Verfahren zur Herstellung elektrolytisch abgeschiedener Kupferfolie, elektrolytisch abgeschiedene Kupfer-Folie, kupferkaschiertes Laminat und Leiterplatte
US5358622A (en) Procedure for the production of printed circuit boards provided with pads for the insertion of SMDs
ATA7262003A (de) Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
WO2003075623A3 (en) Digital application of protective soldermask to printed circuit boards
NL179301B (nl) Werkwijze voor het vormen van een aanhechtend metaaloppervlak op een substraat.
ATE393839T1 (de) Verfahren zur gehäusebildung bei elektronischen bauteilen so wie so hermetisch verkapselte elektronische bauteile
DE59903492D1 (de) Vorrichtung zum bestücken von schaltungsträgern
DK0839440T3 (da) Kobberfolie til fremstilling af trykte kredsløb og fremgangsmåde til fremstilling af samme

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties